CN105486018A - Cooling and heating box - Google Patents
Cooling and heating box Download PDFInfo
- Publication number
- CN105486018A CN105486018A CN201511029234.XA CN201511029234A CN105486018A CN 105486018 A CN105486018 A CN 105486018A CN 201511029234 A CN201511029234 A CN 201511029234A CN 105486018 A CN105486018 A CN 105486018A
- Authority
- CN
- China
- Prior art keywords
- air
- fan
- semiconductor chilling
- chilling plate
- air channel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D23/00—General constructional features
- F25D23/12—Arrangements of compartments additional to cooling compartments; Combinations of refrigerators with other equipment, e.g. stove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60N—SEATS SPECIALLY ADAPTED FOR VEHICLES; VEHICLE PASSENGER ACCOMMODATION NOT OTHERWISE PROVIDED FOR
- B60N3/00—Arrangements or adaptations of other passenger fittings, not otherwise provided for
- B60N3/10—Arrangements or adaptations of other passenger fittings, not otherwise provided for of receptacles for food or beverages, e.g. refrigerated
- B60N3/104—Arrangements or adaptations of other passenger fittings, not otherwise provided for of receptacles for food or beverages, e.g. refrigerated with refrigerating or warming systems
Abstract
The invention provides a cooling and heating box. The cooling and heating box comprises a box body and an air conditioner fan, wherein a storage cavity and an installation cavity are formed in the box body, a door body capable of being opened or closed is arranged at one end of the storage cavity, the air conditioner fan is detachably installed in the installation cavity, and a communication hole is formed between the installation cavity and the storage cavity. According to the technical scheme, the cooling and heating box and the air conditioner fan are combined, the air conditioner fan can be installed in the installation cavity so as to transmit the cold energy or the heat energy into the storage cavity when there is food needing to be refrigerated or preserved and can be directly detached from the installation cavity so as to be independently used when there is no food needing to be refrigerated or preserved, and therefore the cooling and heating box can be used for refrigerating or preserving the food and can be used for cooling or heating, and the use range of the cooling and heating box is expanded. Semiconductor chilling plates are preferentially arranged in the air conditioner fan, and therefore the cold energy or the heat energy can be fast output through the Peltier effect of semiconductors, and the purposes of cold storage, heat preservation, refrigeration and heat supply can be realized.
Description
Technical field
The present invention relates to refrigerating thermal-insulation field, more specifically, relate to a kind of cold and warm box.
Background technology
Cold and warm box is used for being incubated food or refrigerating, both can family expenses, again can as vehicle-mounted use.But current cold and warm box structure is simple, insulation or cold storage effect poor, meanwhile, current cold and warm box and air cooler are two independent parts, the two use that can not combine.
Therefore, how a kind of insulation is proposed or cold storage effect good, and effectively can become current problem demanding prompt solution in conjunction with the cold and warm box of air cooler.
Summary of the invention
The present invention is intended at least to solve one of technical problem existed in prior art.
For this reason, one object of the present invention is, provides a kind of cold and warm box.
For achieving the above object, the embodiment of first aspect present invention provides a kind of cold and warm box, comprising: casing, arranges storage chamber and installation cavity in described casing, and one end of described storage chamber is provided with can the door body of folding; Air cooler, is removably mounted in described installation cavity; Wherein, via is provided with between described installation cavity and described storage chamber.
The cold and warm box that the embodiment of first aspect present invention provides, air cooler is combined with cold and warm box, thus when needs refrigeration or insulated food, can air cooler be arranged in installation cavity, to utilize air cooler to carry cold or heat in storage chamber, thus reach the effect of refrigeration or insulated food, and when not needing refrigeration or insulated food, directly air cooler can be taken apart in installation cavity again, use this air cooler so that independent, from and the object that this air cooler can be utilized to realize refrigeration or heat.This kind of scheme, combines cold and warm box with air cooler, thus this cold and warm box can be refrigerated or insulated food, can be used for again refrigeration or heats, thus having widened the function of cold and warm box, improve the utilization rate of cold and warm box.Wherein, via be used for by air cooler produce cold or heat delivery to storage chamber, to refrigerate the food in storage chamber or to be incubated.
In addition, the cold and warm box that the above embodiment of the present invention provides also has following additional technical feature:
In technique scheme, preferably, described casing is also provided with drawer and the first display screen.
In this technical scheme, drawer is preferably transparent drawer, thus can be convenient to observe the article in drawer, now, this drawer can be arranged to common storage drawer, for article such as storing keys, also by drawer and installation cavity conducting, thus refrigeration or the heat-production functions of air cooler can be utilized, insulation or chilled food, and the first display screen can be used for display current date, time and indoor temperature and the various running parameters of cold and warm box, such as temperature.
In technique scheme, preferably, described air cooler is removably mounted in described installation cavity by buckle.
In this technical scheme, realized the installation of air cooler by buckle structure, the instant of air cooler can be convenient to and tear open, and instant dress, and then the independence being convenient to very much air cooler uses and being combined of air cooler and cold and warm box.Certainly, also the detachable installation between air cooler and installation cavity is realized by alternate manners such as screws.
In technique scheme, preferably, described air cooler comprises: semiconductor chilling plate; First air channel, described first air channel includes the first surface of the first fan and described semiconductor chilling plate, and wherein, the wind in described first air channel is discharged after the first surface of described semiconductor chilling plate at the flows by action of described first fan; Second air channel, described second air channel is provided with the second fan and described semiconductor chilling plate second, and wherein, the wind in described second air channel is discharged after second of described semiconductor chilling plate at the flows by action of described second fan; First radiator, is arranged on the first surface of described semiconductor chilling plate, is positioned at described first air channel; Second radiator, is arranged on second of described semiconductor chilling plate, is positioned at described second air channel; Wherein, in the first surface and described semiconductor chilling plate second of described semiconductor chilling plate, one side is for heating face, and another side is chill surface.
In this technical scheme, air cooler utilizes the paltie effect of semiconductor, thus when being energized, the two sides of semiconductor can being made to produce temperature difference, thus a chill surface and can be formed heat face, and then first air channel or the second air channel distinguished and admirable when this semiconductor chilling plate, just chill surface can be utilized to freeze to the wind that air cooler is discharged on the one hand, to realize the object of air cooler refrigeration, wherein, in this process of refrigerastion, can the face of heating be utilized to dispel the heat simultaneously.On the other hand, the wind heated in the face of air cooler discharge also can be utilized to heat, to realize the object that air cooler heats, wherein, in this heating operations, chill surface can be utilized simultaneously to carry out cold and supplement.Particularly, this air cooler is divided into two independently the first air channel and the second air channels, first air channel comprises the first surface of the first fan and semiconductor chilling plate, second air channel comprises second of the second fan and semiconductor chilling plate, wherein, just can the air of air cooler outside be incorporated in the second air channel by the rotation of the second fan, and make it flow through second of semiconductor chilling plate, and carry out exchange heat with the second face of semiconductor chilling plate, thus can heat or refrigeration air-conditioning fan discharge wind, and then second of semiconductor chilling plate can be utilized to realize the refrigeration object of air cooler or heat object, simultaneously, in refrigeration or heating operations, the air of air cooler outside is incorporated in the first air channel by the rotation by the first fan, and make it flow through the first surface of semiconductor chilling plate, and carry out exchange heat with the first surface of semiconductor chilling plate, thus the first air channel is when air cooler freezes, semiconductor chilling plate can be utilized to dispel the heat, and when air cooler heats, semiconductor chilling plate can be utilized to carry out cold-storage.This technical scheme, utilize the paltie effect of semiconductor, provide chill surface for air cooler and heat face, thus do not need to use water, the low-temperature receivers such as ice cube, simultaneously, in this technical scheme, directly wind is carried out freezing or heat rear discharge, from but air-conditioning truly, in addition, this air cooler, by changing the polarity of the electrical current on semiconductor chilling plate, can be simple, rapidly by the chill surface of semiconductor chilling plate with heat face and exchange, thus can be simple, realize the switching between air cooler refrigeration mode and heating mode rapidly, and then can be convenient to user utilize this air cooler replace air-conditioning carry out freezing or warming oneself.This air cooler can be placed on water tumbler side in addition, thus can reduce water temperature fast, and then can be convenient to user and drink tea in summer, certainly, this air cooler also can be used for other occasion by user, with realize to heat, corresponding function of lowering the temperature.
In addition, heat trnasfer between the first air channel and the second air channel can be improved by arranging the first radiator and the second radiator, thus more heat or the more cold of continuous accumulation can be distributed by the circulation of the air in the first air channel, the air in the second air channel then can discharge more heat or cold, thus can improve air cooler refrigeration or heating efficiency.Particularly, first radiator is for being more dispersed in the first air channel by the heat on the first surface of semiconductor chilling plate or cold, so that the heat exchange of maximal efficiency can be carried out with the air in the first air channel, and the second radiator is used for the heat on second of semiconductor chilling plate or cold to be dispersed in the second air channel, to carry out the refrigeration of maximal efficiency to the air in the second air channel or to heat, thus by arranging the first radiator and the second radiator, refrigeration or the heating capacity of air cooler can be improved, to meet the daily refrigeration of user, heating needs.
Particularly, semiconductor chilling plate is the instrument of a heat trnasfer, is specially the thermocouple that N-type semiconductor material and one block of P-type semiconductor material are coupled to.Wherein, the paltie effect of semiconductor refers to: when the loop consisted of different conductors electric current, except the irreversible Joule heat of generation, in the joint of different conductor along with heat absorption, exothermic phenomenon can appear in the difference of the sense of current respectively, therefore when semiconductor chilling plate (i.e. one block of N-type semiconductor material and one block of P-type semiconductor material are coupled to thermocouple) centering has electric current to pass through, heat between both ends of the surface will transfer to the other end from one end, thus produces the temperature difference to form described chill surface and describedly to heat face.
In technique scheme, preferably, the first radiator, the second radiator is made up of aluminium.
In technique scheme, preferably, described air cooler also comprises: heat insulating mattress, and described heat insulating mattress is provided with installing hole, described semiconductor chilling plate is embedded in described installing hole, with second of the first surface and described semiconductor chilling plate of isolating described semiconductor chilling plate.
In this technical scheme, after semiconductor chilling plate energising, temperature difference can be produced between the first face and second face, and can prevent from carrying out between the first surface of semiconductor chilling plate and second of semiconductor chilling plate exchange heat by arranging heat insulating mattress, thus the temperature difference that can strengthen between the first surface of semiconductor chilling plate and second of semiconductor chilling plate, and then can be the second air channel more refrigerating capacity or heating capacity are provided.
In technique scheme, preferably, described first fan is centrifugal fan, and described first radiator is arranged on described first fan in the radial direction, and is parallel to described first fan; And/or described second fan is centrifugal fan, described second radiator is arranged on described second fan in the radial direction, and is parallel to described second fan.
In this technical scheme, preferably, first fan and the second fan are centrifugal fan, because centrifugal fan is less compared to aerofoil fan noise, simultaneously, wind can utilize centrifugal force to be thrown out from circumferencial direction by wind by centrifugal fan after the axis of fan sucks, thus can be directly expelled to by wind on the radiator that be arranged in parallel with fan, to reduce the loss of wind, improve the utilization rate of wind, and then refrigeration or the heating efficiency of air cooler can be improved.In addition, the first fan is parallel to be arranged with the first radiator, the second fan is parallel is arranged with the second radiator, can compacter by the structural design of air cooler, thus the whole volume of air cooler can be reduced, improve space availability ratio, preferably, this air cooler can be designed to mini air conditioner fan.
In technique scheme, preferably, described air cooler also comprises: the first air inlet, is arranged on described first air channel, and is positioned near described first fan; First air outlet, is arranged on described first air channel, and is positioned at one end that described first radiator is not provided with described first fan; Second air inlet, is arranged on described second air channel, and is positioned near described second fan; Second air outlet, is arranged on described second air channel, and is positioned at one end that described second radiator is not provided with described second fan; Wherein, in described second air channel, described second air outlet place is provided with flow-guiding structure.
In this technical scheme, wind in first air channel is imported from the first air inlet by the first fan, then after carrying out heat exchange with the first radiator, discharged by the first air outlet, wherein, first fan is arranged on the first air inlet, wind is directed in the first air channel, multiple first air outlet can be set to improve rate of heat dissipation or the Cool storage rate in the first air channel simultaneously, and the wind in the second air channel is imported from the second air inlet by the second fan, then refrigeration cool-down is carried out with the second radiator or after heating heating, discharged by the second air outlet, wherein, second fan is arranged on the second air inlet, wind is directed in the second air channel.In addition, preferably, can in the second air channel, the second air outlet place arranges flow-guiding structure, so that wind is directed into the second air outlet, thus can reduce the loss of wind in the second air channel.
Wherein, preferably, flow-guiding structure is arc flow-guiding structure.
In technique scheme, preferably, described air cooler also comprises: housing, and described housing comprises the cover plate that one side is cover body described in uncovered cover body and cap seal; Dividing plate, is arranged in described housing, and one side and the described cover plate of described dividing plate surround described first air channel, wherein, described dividing plate are also provided with through hole, and described semiconductor chilling plate is arranged in described through hole; First air duct board, is arranged on the another side of described dividing plate; Second air duct board, be arranged on described first air duct board, and surround described second air channel with described first air duct board, described second air duct board is also provided with and the first ventilating opening of described second air inlet conducting and the second ventilating opening with described second air outlet conducting; Wherein, described first fan, described first radiator are arranged in the one side of described dividing plate, and described second fan, described second radiator are arranged on the another side of described dividing plate.
In this technical scheme, cover body and cover plate surround closed housing, and dividing plate is arranged in described housing, to be divided into two in housing, particularly, semiconductor chilling plate is embedded in the through hole of dividing plate, the first surface of semiconductor chilling plate and the one side of dividing plate, cover plate surrounds the first air channel, first fan and the second radiator are arranged in the one side of dividing plate, and be positioned at the first air channel, simultaneously, the another side of dividing plate is provided with the first air duct board, first air duct board is provided with the second air duct board, and with the second air duct board, second face of semiconductor chilling plate surrounds the second air channel, and the second fan, second radiator is then arranged on dividing plate through the second air duct board.This technical scheme, can improve the sealing in the second air channel, to reduce the loss of wind by the setting of the first air duct board and the second air duct board, thus air-out rate can be improved, meanwhile, the first air duct board and the second air duct board have certain insulation effect, thus can improve refrigeration, the heating efficiency of air cooler.
In technique scheme, preferably, described first air duct board is cystosepiment and/or described second air duct board is cystosepiment.
In this technical scheme, the first air duct board, the second air duct board are preferably cystosepiment, because the low price of cystosepiment, and high insulating effect, thus the cost that can reduce air cooler, can improve again the refrigeration of air cooler, heating efficiency.
In technique scheme, preferably, described cover body is also provided with second display screen and operating key, wherein, second display screen can be used for display current date, time and indoor temperature, and the various running parameters of air cooler, such as cryogenic temperature, gear etc.; And operating key user controls the work of air cooler, such as start and stop, gear etc.
In technique scheme, preferably, described cover body, described cover plate are made up of ABS (acrylonitrile-butadiene-styrene (ABS)) plastics.
In technique scheme, preferably, described first air inlet is arranged on the upper end of described cover plate, and described first air outlet is arranged on the lower end of the sidewall of described cover body; Described second air inlet is arranged on the lower end of the sidewall of described cover body, and described second air outlet is arranged on the upper end of the sidewall of described cover body.
In this technical scheme, first air channel is used for heat radiation or cold-storage, and the second air channel is accordingly for freezing or heating, therefore, respectively the first air inlet, the second air inlet are arranged on the two ends up and down of housing, and the first air outlet, the second air outlet are arranged on accordingly the other end of housing, just the wind in the first air channel can be made relative with the wind direction of the wind in the second air channel, thus when meeting, just convective exchange can be carried out, to improve the heat transfer effect of the wind in the first air channel and the second air channel, and then refrigeration or heating efficiency can be provided.
In addition, this kind of set-up mode of the first air inlet and the second air inlet, the first air outlet and the second air outlet and the operation principle of centrifugal fan, i.e. air inlet through hollow shaft, sidewall air-out is corresponding.Meanwhile, this kind is arranged, and makes the air outlet of air cooler at the front regional area of air cooler, thus meets the custom of user's routine use air cooler.
In technique scheme, preferably, the first surface of described semiconductor chilling plate is for heating face, and second of described semiconductor chilling plate is chill surface.
In this technical scheme, when the first surface of semiconductor chilling plate be heat face, second of semiconductor chilling plate for chill surface time, just this air cooler can be utilized to realize the object of refrigeration, and when the first surface of semiconductor chilling plate be chill surface, second of semiconductor chilling plate for heating face time, this air cooler just can be utilized to realize the object heated.
In technique scheme, preferably, described second fan, described first fan, described semiconductor chilling plate can be energized simultaneously; Or described second fan can independently be energized, that is: described first fan, described semiconductor chilling plate no power.
In this technical scheme, when described second fan, described first fan, described semiconductor chilling plate are energized simultaneously, this air cooler can carry out freezing or heating, and be independently energized at the second fan, when the first fan, semiconductor chilling plate no power, namely air cooler can be used as a common fan and blows, thus this air cooler can realize refrigerating function, heat-production functions, the function of conventional Ian can be realized again, and then the utilizability of this air cooler can be improved.
Particularly, by arranging a controller, control the sense of current of semiconductor chilling plate and the break-make situation of electric current.
In technique scheme, preferably, can a temperature detector be set on the housing, with the temperature in sensing chamber, thus the various mode of operations of the gear of the temperature automatic control air cooler of detection, the energising direction of semiconductor chilling plate and air cooler can be utilized.
Provide in description part below according to additional aspect of the present invention and advantage, part will become obvious from the following description, or be recognized by practice of the present invention.
Accompanying drawing explanation
Above-mentioned and/or additional aspect of the present invention and advantage will become obvious and easy understand from accompanying drawing below combining to the description of embodiment, wherein:
Fig. 1 is the sectional structure schematic diagram of cold and warm box described according to one embodiment of present invention;
Fig. 2 is the decomposition texture schematic diagram of cold and warm box described according to one embodiment of present invention;
Fig. 3 is another structural representation of cold and warm box described according to one embodiment of present invention;
Fig. 4 is the sectional structure schematic diagram of the air cooler of the cold and warm box provided according to Fig. 1;
Fig. 5 is the STRUCTURE DECOMPOSITION schematic diagram of the air cooler provided according to Fig. 4;
Fig. 6 is the part-structure decomposing schematic representation of the air cooler provided according to Fig. 5;
Fig. 7 is the structural representation of the air cooler provided according to Fig. 1.
Wherein, the Reference numeral in Fig. 1 to Fig. 7 and the corresponding relation between component names are:
100 air coolers, 1 semiconductor chilling plate, 21 first fans, 22 second fans, 31 first radiators, 32 second radiators, 41 first air inlets, 42 second air inlets, 51 first air outlets, 52 second air outlets, 61 cover bodies, 62 cover plates, 7 dividing plates, 8 first air duct boards, 9 second air duct boards, 10 heat insulating mattress, 200 casings, 210 installation cavitys, 220 storage chambers, 230 bodies, 240 first buckles, 250 drawers, 260 first display screens, 270 handles.
Detailed description of the invention
In order to more clearly understand above-mentioned purpose of the present invention, feature and advantage, below in conjunction with the drawings and specific embodiments, the present invention is further described in detail.It should be noted that, when not conflicting, the feature in the embodiment of the application and embodiment can combine mutually.
Set forth a lot of detail in the following description so that fully understand the present invention; but; the present invention can also adopt other to be different from mode described here to implement, and therefore, protection scope of the present invention is not by the restriction of following public specific embodiment.
As shown in Figures 1 to 7, the embodiment of first aspect present invention provides a kind of cold and warm box, comprising: casing 200, arranges storage chamber 220 and installation cavity 210 in casing 200, and one end of storage chamber 220 is provided with can the door body 230 of folding; Air cooler 100, is removably mounted in installation cavity 210; Wherein, via is provided with between installation cavity 210 and storage chamber 220.
The cold and warm box that the embodiment of first aspect present invention provides, air cooler 100 is combined with cold and warm box, thus when needs refrigeration or insulated food, can air cooler 100 be arranged in installation cavity 210, to utilize air cooler 100 to carry cold or heat in storage chamber 220, thus reach the effect of refrigeration or insulated food, and when not needing refrigeration or insulated food, again can be as shown in Figure 2, directly air cooler 100 is taken apart in installation cavity 210, use this air cooler 100 so that independent, from and the object that this air cooler 100 can be utilized to realize refrigeration or heat.This kind of scheme, combines cold and warm box with air cooler 100, thus this cold and warm box can be refrigerated or insulated food, can be used for again refrigeration or heats, thus having widened the function of cold and warm box, improve the utilization rate of cold and warm box.
Wherein, the arrow in Fig. 1 to Fig. 7 represents the flow direction of wind.
In technique scheme, preferably, as shown in Figure 3, casing 200 is also provided with drawer 260 and the first display screen 260 and handle 270, wherein, handle 270 is for this cold and warm box mobile, and the first display screen 260 can be used for display current date, time and indoor temperature, and the various running parameters of cold and warm box, such as temperature.
In this technical scheme, drawer 250 is preferably transparent drawer, thus can be convenient to observe the article in drawer, now, this drawer can be arranged to common storage drawer, for article such as storing keys, also can by drawer and installation cavity 210 conducting, thus refrigeration or the heat-production functions of air cooler 100 can be utilized, insulation or chilled food.
In technique scheme, preferably, as shown in Figure 2, air cooler 100 is removably mounted in installation cavity 210 by buckle.Particularly, buckle comprises multiple first buckle 240 being arranged on installation cavity 210 and the second buckle be arranged on air cooler 100.
In this technical scheme, realized the installation of air cooler 100 by buckle structure, the instant of air cooler 100 can be convenient to and tear open, and instant dress, and then the independence being convenient to very much air cooler 100 uses and being combined of air cooler 100 and cold and warm box.Certainly, also the detachable installation between 100 and installation cavity 210 is realized by alternate manners such as screws.
In technique scheme, preferably, as shown in Figures 4 to 7, air cooler 100, comprising: semiconductor chilling plate 1; First air channel, the first air channel includes the first surface of the first fan 21 and semiconductor chilling plate 1, and wherein, the wind in the first air channel is discharged after the first surface of semiconductor chilling plate 1 at the flows by action of the first fan 21; Second air channel, the second air channel is provided with the second fan 22 and semiconductor chilling plate 1 second, and wherein, the wind in the second air channel is discharged after second of semiconductor chilling plate 1 at the flows by action of the second fan 22; First radiator 31, is arranged on the first surface of semiconductor chilling plate 1, is positioned at the first air channel; Second radiator 32, is arranged on second of semiconductor chilling plate 1, is positioned at the second air channel; Wherein, in the first surface and semiconductor chilling plate 1 second of semiconductor chilling plate 1, one side is for heating face, and another side is chill surface.
In this technical scheme, air cooler 100 utilizes the paltie effect of semiconductor, thus when being energized, the two sides of semiconductor can being made to produce temperature difference, thus a chill surface and can be formed heat face, and then first air channel or the second air channel distinguished and admirable when this semiconductor chilling plate 1, just chill surface can be utilized to freeze to the wind that air cooler 100 is discharged on the one hand, to realize the object that air cooler 100 freezes, wherein, in this process of refrigerastion, can the face of heating be utilized to dispel the heat simultaneously.On the other hand, the wind heated in the face of air cooler 100 discharge also can be utilized to heat, to realize the object that air cooler 100 heats, wherein, in this heating operations, chill surface can be utilized simultaneously to carry out cold and supplement.Particularly, this air cooler 100 is divided into two independently the first air channel and the second air channels, first air channel comprises the first surface of the first fan 21 and semiconductor chilling plate 1, second air channel comprises second of the second fan 22 and semiconductor chilling plate 1, wherein, just can the air of air cooler 100 outside be incorporated in the second air channel by the rotation of the second fan 22, and make it flow through second of semiconductor chilling plate 1, and carry out exchange heat with the second face of semiconductor chilling plate 1, thus can heat or refrigeration air-conditioning fan 100 discharge wind, and then second of semiconductor chilling plate 1 can be utilized to realize the refrigeration object of air cooler 100 or heat object, simultaneously, in refrigeration or heating operations, the air of air cooler 100 outside is incorporated in the first air channel by the rotation by the first fan 21, and make it flow through the first surface of semiconductor chilling plate 1, and carry out exchange heat with the first surface of semiconductor chilling plate 1, thus the first air channel is when air cooler 100 freezes, semiconductor chilling plate 1 can be utilized to dispel the heat, and when air cooler 100 heats, semiconductor chilling plate 1 can be utilized to carry out cold-storage.This technical scheme, utilize the paltie effect of semiconductor, provide chill surface for air cooler 100 and heat face, thus do not need to use water, the low-temperature receivers such as ice cube, simultaneously, in this technical scheme, directly wind is carried out freezing or heat rear discharge, from but air-conditioning truly, in addition, this air cooler 100, by changing the polarity of the electrical current on semiconductor chilling plate 1, can be simple, rapidly by the chill surface of semiconductor chilling plate 1 with heat face and exchange, thus can be simple, realize the switching between air cooler 100 refrigeration mode and heating mode rapidly, and then user can be convenient to utilize this air cooler 100 to replace air-conditioning to carry out freezing or warming oneself.This air cooler 100 can be placed on water tumbler side in addition, thus can reduce water temperature fast, and then can be convenient to user and drink tea in summer, certainly, this air cooler 100 also can be used for other occasion by user, with realize to heat, corresponding function of lowering the temperature.
Particularly, semiconductor chilling plate 1 is the instrument of a heat trnasfer, is specially the thermocouple that N-type semiconductor material and one block of P-type semiconductor material are coupled to.Wherein, the peltier effect of semiconductor refers to: when the loop consisted of different conductors electric current, except the irreversible Joule heat of generation, in the joint of different conductor along with heat absorption, exothermic phenomenon can appear in the difference of the sense of current respectively, therefore when semiconductor chilling plate 1 (i.e. one block of N-type semiconductor material and one block of P-type semiconductor material are coupled to thermocouple) centering has electric current to pass through, heat between both ends of the surface will transfer to the other end from one end, thus produces the temperature difference to form chill surface and to heat face.
In addition, the heat trnasfer between the first air channel and the second air channel can be improved by the first radiator 31 and the second radiator 32, thus more heat or the more cold of continuous accumulation can be distributed by the circulation of the air in the first air channel, the air in the second air channel then can discharge more heat or cold, thus can improve air cooler 100 and freeze or heating efficiency.Particularly, first radiator 31 is for being more dispersed in the first air channel by the heat on the first surface of semiconductor chilling plate 1 or cold, so that the heat exchange of maximal efficiency can be carried out with the air in the first air channel, and the second radiator 32 is for being dispersed in the second air channel by the heat on second of semiconductor chilling plate 1 or cold, to carry out the refrigeration of maximal efficiency to the air in the second air channel or to heat, thus by arranging the first radiator 31 and the second radiator 32, refrigeration or the heating capacity of air cooler 100 can be improved, to meet the daily refrigeration of user, heating needs.
Wherein, wind in Fig. 4 in the first air channel is introduced by first air inlet 41 of the first fan 21 from the top shown in Fig. 1, and after the first radiator 31, flowed out by the first air outlet 51, and the wind in the second air channel is introduced by second air inlet 42 of the second fan 22 from the below shown in Fig. 1, and after the second radiator 32, flowed out by the second air outlet 52.
In technique scheme, preferably, the first radiator 31, second radiator 32 is made up of aluminium.
In technique scheme, preferably, as shown in Figure 6, air cooler 100 also comprises: heat insulating mattress 10, heat insulating mattress 10 is provided with installing hole, and semiconductor chilling plate 1 is embedded in installing hole, with second of the first surface of isolation of semiconductor cooling piece 1 and semiconductor chilling plate 1.
In this technical scheme, after semiconductor chilling plate 1 is energized, temperature difference can be produced between the first face and second face, and can prevent from carrying out between the first surface of semiconductor chilling plate 1 and second of semiconductor chilling plate 1 exchange heat by arranging heat insulating mattress 10, thus the temperature difference that can strengthen between the first surface of semiconductor chilling plate 1 and second of semiconductor chilling plate 1, and then can be the second air channel more refrigerating capacity or heating capacity are provided.
In technique scheme, preferably, as shown in Figure 6, the first fan 21 is centrifugal fan, and the first radiator 31 is arranged on the first fan 21 in the radial direction, and is parallel to the first fan 21; And/or second fan 22 be centrifugal fan, the second radiator 32 is arranged on the second fan 22 in the radial direction, and is parallel to the second fan 22.
In this technical scheme, preferably, first fan 21 and the second fan 22 are centrifugal fan, because centrifugal fan is less compared to aerofoil fan noise, simultaneously, wind can utilize centrifugal force to be thrown out from circumferencial direction by wind by centrifugal fan after the axis of fan sucks, thus can be directly expelled to by wind on the radiator that be arranged in parallel with fan, to reduce the loss of wind, improve the utilization rate of wind, and then refrigeration or the heating efficiency of air cooler 100 can be improved.In addition, first fan 21 is parallel to be arranged with the first radiator 31, the second fan 22 is parallel is arranged with the second radiator 32, can compacter by the structural design of air cooler 100, thus the whole volume of air cooler 100 can be reduced, improve space availability ratio, preferably, this air cooler 100 can be designed to mini air conditioner fan 100.
In technique scheme, preferably, as shown in Fig. 4, Fig. 5, Fig. 7, air cooler 100 also comprises: the first air inlet 41, is arranged on the first air channel, and is positioned near the first fan 21; First air outlet 51, is arranged on the first air channel, and is positioned at one end that the first radiator 31 is not provided with the first fan 21; Second air inlet 42, is arranged on the second air channel, and is positioned near the second fan 22; Second air outlet 52, is arranged on the second air channel, and is positioned at one end that the second radiator 32 is not provided with the second fan 22; Wherein, as shown in Figure 4, in the second air channel, the second air outlet 52 place is provided with flow-guiding structure, and this flow-guiding structure is arc flow-guiding structure.
In this technical scheme, wind in first air channel is imported from the first air inlet 41 by the first fan 21, then after carrying out heat exchange with the first radiator 31, discharged by the first air outlet 51, wherein, first fan 21 is arranged on the first air inlet 41 place, wind is directed in the first air channel, multiple first air outlet 51 can be set to improve rate of heat dissipation or the Cool storage rate in the first air channel simultaneously, and the wind in the second air channel is imported from the second air inlet 42 by the second fan 22, then refrigeration cool-down is carried out with the second radiator 32 or after heating heating, discharged by the second air outlet 52, wherein, second fan 22 is arranged on the second air inlet 42 place, wind is directed in the second air channel.In addition, preferably, can in the second air channel, the second air outlet 52 place arranges flow-guiding structure, wind to be directed into the second air outlet 52, thus can reduce the loss of wind in the second air channel.
In technique scheme, preferably, as shown in Fig. 4, Fig. 5 and Fig. 7, air cooler 100 also comprises: housing, and housing comprises the cover plate 62 that one side is uncovered cover body 61 and cap seal cover body 61; Dividing plate 7, is arranged in housing, and the one side of dividing plate 7 surrounds the first air channel with cover plate 62, and wherein, dividing plate 7 is also provided with through hole, semiconductor chilling plate 1 is arranged in through hole; First air duct board 8, is arranged on the another side of dividing plate 7; Second air duct board 9, is arranged on the first air duct board 8, and surrounds the second air channel with the first air duct board 8, the second air duct board 9 is also provided with and the first ventilating opening of the second air inlet 42 conducting and the second ventilating opening with the second air outlet 52 conducting; Wherein, the first fan 21, first radiator 31 is arranged in the one side of dividing plate 7, and the second fan 22, second radiator 32 is arranged on the another side of dividing plate 7.
In this technical scheme, cover body 61 and cover plate 62 surround closed housing, and dividing plate 7 is arranged in housing, to be divided into two in housing, particularly, semiconductor chilling plate 1 is embedded in the through hole of dividing plate 7, the first surface of semiconductor chilling plate 1 and the one side of dividing plate 7, cover plate 62 surrounds the first air channel, first fan 21 and the second radiator 32 are arranged in the one side of dividing plate 7, and be positioned at the first air channel, simultaneously, the another side of dividing plate 7 is provided with the first air duct board 8, first air duct board 8 is provided with the second air duct board 9, and with the second air duct board 9, second face of semiconductor chilling plate 1 surrounds the second air channel, and the second fan 22, second 32, radiator is arranged on dividing plate 7 through the second air duct board 9.This technical scheme, the sealing in the second air channel can be improved by the setting of the first air duct board 8 and the second air duct board 9, to reduce the loss of wind, thus air-out rate can be improved, simultaneously, first air duct board 8 and the second air duct board 9 have certain insulation effect, thus can improve refrigeration, the heating efficiency of air cooler 100.
In technique scheme, preferably, the first air duct board 8 is cystosepiment and/or the second air duct board 9 is cystosepiment.
In this technical scheme, the first air duct board 8, second air duct board 9 is preferably cystosepiment, because the low price of cystosepiment, and high insulating effect, thus the cost that can reduce air cooler 100, can improve again the refrigeration of air cooler 100, heating efficiency.
In technique scheme, preferably, as shown in Figure 7, cover body 61 is also provided with second display screen and operating key, and wherein, second display screen can be used for display current date, time and indoor temperature, and the various running parameters of air cooler 100, such as cryogenic temperature, gear etc.; And operating key user controls the work of air cooler 100, such as start and stop, gear etc.Particularly, second display screen and operating key are arranged on the top of cover body 61.
In technique scheme, preferably, cover body 61, cover plate 62 are made up of ABS (acrylonitrile-butadiene-styrene (ABS)) plastics.
In technique scheme, preferably, the first air inlet 41 is arranged on the upper end of cover plate 62, and the first air outlet 51 is arranged on the lower end of the sidewall of cover body 61; Second air inlet 42 is arranged on the lower end of the sidewall of cover body 61, and the second air outlet 52 is arranged on the upper end of the sidewall of cover body 61.
In this technical scheme, first air channel is used for heat radiation or cold-storage, and the second air channel is accordingly for freezing or heating, therefore, respectively the first air inlet 41, second air inlet 42 is arranged on the two ends up and down of housing, and the first air outlet 51, second air outlet 52 is arranged on accordingly the other end of housing, just the wind in the first air channel can be made relative with the wind direction of the wind in the second air channel, thus when meeting, just convective exchange can be carried out, to improve the heat transfer effect of the wind in the first air channel and the second air channel, and then refrigeration or heating efficiency can be provided.
In addition, the first air inlet 41 and the second air inlet 42, first air outlet 51 and this kind of set-up mode of the second air outlet 52 and the operation principle of centrifugal fan, i.e. air inlet through hollow shaft, sidewall air-out is corresponding.Meanwhile, this kind is arranged, and makes the air outlet of air cooler 100 at the front regional area of air cooler 100, thus meets the custom of user's routine use air cooler 100.
In technique scheme, preferably, the first surface of semiconductor chilling plate 1 is for heating face, and second of semiconductor chilling plate 1 is chill surface.
In this technical scheme, when the first surface of semiconductor chilling plate 1 be heat face, second of semiconductor chilling plate 1 for chill surface time, just this air cooler 100 can be utilized to realize the object of refrigeration, and when the first surface of semiconductor chilling plate 1 be chill surface, second of semiconductor chilling plate 1 for heating face time, this air cooler 100 just can be utilized to realize the object heated.
In technique scheme, preferably, the second fan 22, first fan 21, semiconductor chilling plate 1 can be energized simultaneously; Or second fan 22 can independently be energized, that is: the first fan 21, semiconductor chilling plate 1 no power.
In this technical scheme, when second fan 22, first fan 21, semiconductor chilling plate 1 are energized simultaneously, this air cooler 100 can carry out freezing or heating, and in the independent energising of the second fan 22, when the first fan 21, semiconductor chilling plate 1 no power, namely air cooler 100 can be used as a common fan and blows, thus this air cooler 100 can realize refrigerating function, heat-production functions, the function of conventional Ian can be realized again, and then the utilizability of this air cooler 100 can be improved.
Particularly, by arranging a controller (not shown), control the sense of current of semiconductor chilling plate 1 and the break-make situation of electric current.
In technique scheme, preferably, one temperature detector (not shown) can be set on housing, with the temperature in sensing chamber, thus the various mode of operations of the gear of the temperature automatic control air cooler 100 of detection, the energising direction of semiconductor chilling plate 1 and air cooler 100 can be utilized.
In the description of this description, term " first ", " second " object only for describing, and instruction or hint relative importance can not be interpreted as, unless otherwise clearly defined and limited; Term " connection ", " installation ", " fixing " etc. all should be interpreted broadly, and such as, " connection " can be fixedly connected with, and also can be removably connect, or connects integratedly; Can be directly be connected, also indirectly can be connected by intermediary.For the ordinary skill in the art, above-mentioned term concrete meaning in the present invention can be understood as the case may be.
In the description of this description, specific features, structure, material or feature that the description of term " embodiment ", " some embodiments ", " specific embodiment " etc. means to describe in conjunction with this embodiment or example are contained at least one embodiment of the present invention or example.In this manual, identical embodiment or example are not necessarily referred to the schematic representation of above-mentioned term.And the specific features of description, structure, material or feature can combine in an appropriate manner in any one or more embodiment or example.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. a cold and warm box, is characterized in that, comprising:
Casing, arranges storage chamber and installation cavity in described casing, one end of described storage chamber is provided with can the door body of folding;
Air cooler, is removably mounted in described installation cavity;
Wherein, via is provided with between described installation cavity and described storage chamber.
2. cold and warm box according to claim 1, is characterized in that,
Described casing is also provided with drawer, the first display screen and handle;
Described air cooler is removably mounted in described installation cavity by buckle.
3. cold and warm box according to claim 1, is characterized in that, described air cooler comprises:
Semiconductor chilling plate;
First air channel, described first air channel includes the first surface of the first fan and described semiconductor chilling plate, and wherein, the wind in described first air channel is discharged after the first surface of described semiconductor chilling plate at the flows by action of described first fan;
Second air channel, described second air channel is provided with the second fan and described semiconductor chilling plate second, and wherein, the wind in described second air channel is discharged after second of described semiconductor chilling plate at the flows by action of described second fan;
First radiator, is arranged on the first surface of described semiconductor chilling plate, is positioned at described first air channel;
Second radiator, is arranged on second of described semiconductor chilling plate, is positioned at described second air channel;
Heat insulating mattress, described heat insulating mattress is provided with installing hole, and described semiconductor chilling plate is embedded in described installing hole, with second of the first surface and described semiconductor chilling plate of isolating described semiconductor chilling plate;
Wherein, in the first surface of described semiconductor chilling plate and described semiconductor chilling plate second, one side is for heating face, and another side is chill surface.
4. cold and warm box according to claim 3, is characterized in that,
Described first fan is centrifugal fan, and described first radiator is arranged on described first fan in the radial direction, and is parallel to described first fan; And/or
Described second fan is centrifugal fan, and described second radiator is arranged on described second fan in the radial direction, and is parallel to described second fan.
5. cold and warm box according to claim 3, is characterized in that, described air cooler also comprises:
First air inlet, is arranged on described first air channel, and is positioned near described first fan;
First air outlet, is arranged on described first air channel, and is positioned at one end that described first radiator is not provided with described first fan;
Second air inlet, is arranged on described second air channel, and is positioned near described second fan;
Second air outlet, is arranged on described second air channel, and is positioned at one end that described second radiator is not provided with described second fan;
Wherein, in described second air channel, described second air outlet place is provided with flow-guiding structure.
6. cold and warm box according to claim 5, is characterized in that, also comprises:
Housing, described housing comprises the cover plate that one side is cover body described in uncovered cover body and cap seal;
Dividing plate, is arranged in described housing, and one side and the described cover plate of described dividing plate surround described first air channel, wherein, described dividing plate are also provided with through hole, and described semiconductor chilling plate is arranged in described through hole;
First air duct board, is arranged on the another side of described dividing plate;
Second air duct board, be arranged on described first air duct board, and surround described second air channel with described first air duct board, described second air duct board is also provided with and the first ventilating opening of described second air inlet conducting and the second ventilating opening with described second air outlet conducting;
Wherein, described first fan, described first radiator are arranged in the one side of described dividing plate, and described second fan, described second radiator are arranged on the another side of described dividing plate.
7. cold and warm box according to claim 6, is characterized in that,
Described first air duct board is cystosepiment and/or described second air duct board is cystosepiment;
Described cover body is also provided with second display screen and operating key.
8. cold and warm box according to claim 6, is characterized in that,
Described first air inlet is arranged on the upper end of described cover plate, and described first air outlet is arranged on the lower end of the sidewall of described cover body;
Described second air inlet is arranged on the lower end of the sidewall of described cover body, and described second air outlet is arranged on the upper end of the sidewall of described cover body.
9. cold and warm box according to any one of claim 1 to 8, is characterized in that, the first surface of described semiconductor chilling plate is for heating face, and second of described semiconductor chilling plate is chill surface; Or
The first surface of described semiconductor chilling plate is chill surface, and second of described semiconductor chilling plate for heating face.
10. cold and warm box according to any one of claim 1 to 8, is characterized in that,
Described second fan, described first fan, described semiconductor chilling plate can be energized simultaneously; Or
Described second fan can independently be energized, that is: described first fan, described semiconductor chilling plate no power.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511029234.XA CN105486018A (en) | 2015-12-30 | 2015-12-30 | Cooling and heating box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511029234.XA CN105486018A (en) | 2015-12-30 | 2015-12-30 | Cooling and heating box |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105486018A true CN105486018A (en) | 2016-04-13 |
Family
ID=55673160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511029234.XA Pending CN105486018A (en) | 2015-12-30 | 2015-12-30 | Cooling and heating box |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105486018A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107901811A (en) * | 2017-12-14 | 2018-04-13 | 江西创迪科技有限公司 | A kind of Vehicular refrigeration equipment |
| CN109185975A (en) * | 2018-10-15 | 2019-01-11 | 刘华有 | A kind of temperature-controlled package and its temperature-adjusting device |
| CN109425169A (en) * | 2017-08-30 | 2019-03-05 | 青岛海高设计制造有限公司 | Refrigeration equipment and its control method |
| CN110250808A (en) * | 2019-08-01 | 2019-09-20 | 北京三快在线科技有限公司 | Counter and vending machine |
| CN110966822A (en) * | 2019-12-31 | 2020-04-07 | 北京理工亘舒科技有限公司 | Portable insulation can |
| CN114456920A (en) * | 2021-09-27 | 2022-05-10 | 南京江岛环境科技研究院有限公司 | Preparation facilities of functional microbial inoculum for water treatment |
| CN115177125A (en) * | 2022-07-19 | 2022-10-14 | 青岛海容商用冷链股份有限公司 | Semiconductor cold and hot display cabinet and control method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2322184A (en) * | 1997-02-15 | 1998-08-19 | Acrokool Limited | Heating and cooling units |
| CN2310292Y (en) * | 1997-09-12 | 1999-03-10 | 孔繁志 | Semiconductor refrigerating/heating box |
| CN201044556Y (en) * | 2007-06-18 | 2008-04-02 | 深圳锦天乐防雷技术有限公司 | Equipment box with air conditioner |
| CN203734986U (en) * | 2013-12-30 | 2014-07-23 | 天津市研翔电子科技有限公司 | Outdoor constant temperature cabinet capable of improving heat exchange efficiency |
| CN204268591U (en) * | 2014-11-24 | 2015-04-15 | 广东美的制冷设备有限公司 | The refrigerating box of air-conditioner and the indoor set of air-conditioner |
| CN205482083U (en) * | 2015-12-30 | 2016-08-17 | 合肥华凌股份有限公司 | Refrigerating and heating box |
-
2015
- 2015-12-30 CN CN201511029234.XA patent/CN105486018A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2322184A (en) * | 1997-02-15 | 1998-08-19 | Acrokool Limited | Heating and cooling units |
| CN2310292Y (en) * | 1997-09-12 | 1999-03-10 | 孔繁志 | Semiconductor refrigerating/heating box |
| CN201044556Y (en) * | 2007-06-18 | 2008-04-02 | 深圳锦天乐防雷技术有限公司 | Equipment box with air conditioner |
| CN203734986U (en) * | 2013-12-30 | 2014-07-23 | 天津市研翔电子科技有限公司 | Outdoor constant temperature cabinet capable of improving heat exchange efficiency |
| CN204268591U (en) * | 2014-11-24 | 2015-04-15 | 广东美的制冷设备有限公司 | The refrigerating box of air-conditioner and the indoor set of air-conditioner |
| CN205482083U (en) * | 2015-12-30 | 2016-08-17 | 合肥华凌股份有限公司 | Refrigerating and heating box |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109425169A (en) * | 2017-08-30 | 2019-03-05 | 青岛海高设计制造有限公司 | Refrigeration equipment and its control method |
| CN107901811A (en) * | 2017-12-14 | 2018-04-13 | 江西创迪科技有限公司 | A kind of Vehicular refrigeration equipment |
| CN109185975A (en) * | 2018-10-15 | 2019-01-11 | 刘华有 | A kind of temperature-controlled package and its temperature-adjusting device |
| CN110250808A (en) * | 2019-08-01 | 2019-09-20 | 北京三快在线科技有限公司 | Counter and vending machine |
| CN110966822A (en) * | 2019-12-31 | 2020-04-07 | 北京理工亘舒科技有限公司 | Portable insulation can |
| CN114456920A (en) * | 2021-09-27 | 2022-05-10 | 南京江岛环境科技研究院有限公司 | Preparation facilities of functional microbial inoculum for water treatment |
| CN115177125A (en) * | 2022-07-19 | 2022-10-14 | 青岛海容商用冷链股份有限公司 | Semiconductor cold and hot display cabinet and control method thereof |
| CN115177125B (en) * | 2022-07-19 | 2024-03-22 | 青岛海容商用冷链股份有限公司 | Semiconductor cold and hot display cabinet and control method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105486018A (en) | Cooling and heating box | |
| CN105465931A (en) | Air conditioning fan | |
| WO2020253252A1 (en) | Air-conditioning all-in-one machine for kitchen | |
| CN105258423B (en) | Ice maker | |
| CN205481472U (en) | Air -conditioning fan | |
| CN104930787A (en) | Refrigerator | |
| WO2017071322A1 (en) | Refrigerator compartment, and refrigerator having same | |
| WO2020253253A1 (en) | All-in-one kitchen air conditioner | |
| CN204806773U (en) | Refrigerator | |
| KR101821097B1 (en) | Refrigerator | |
| WO2008077288A1 (en) | A multi-functional semiconductor cold-storage and heat-storage two purpose box | |
| CN211084550U (en) | Refrigerator with a door | |
| CN205482083U (en) | Refrigerating and heating box | |
| CN107228434B (en) | A kind of mini air-conditioning based on semiconductor chilling plate | |
| CN205939925U (en) | Constant temperature adjusting device and have this constant temperature adjusting device's removal thermostated container | |
| CN202547237U (en) | Refrigeration module of refrigerator | |
| CN205209042U (en) | Drawer -type refrigerator | |
| JP2000274913A (en) | Storage chamber | |
| CN209214192U (en) | Refrigerator and its evaporator fin component | |
| CN219141254U (en) | Refrigerator with a refrigerator body | |
| CN201992940U (en) | Wine storage freezer with improved air duct | |
| CN110513961A (en) | Refrigeration cold insulation can be provided simultaneously and heat the incubator and its temperature control method of thermal protection | |
| CN204730555U (en) | A kind of air channel structure and be provided with the wine cabinet of this structure | |
| CN216481803U (en) | Refrigerator | |
| CN219063626U (en) | Novel cold and hot control device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160413 |