CN205482083U - Refrigerating and heating box - Google Patents
Refrigerating and heating box Download PDFInfo
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- CN205482083U CN205482083U CN201521140259.2U CN201521140259U CN205482083U CN 205482083 U CN205482083 U CN 205482083U CN 201521140259 U CN201521140259 U CN 201521140259U CN 205482083 U CN205482083 U CN 205482083U
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- air
- fan
- semiconductor chilling
- chilling plate
- cold
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Abstract
The utility model provides a refrigerating and heating box, include: the box sets up storing chamber and installation cavity in, one of storing chamber is served and is provided with the door body that can open and shut, air cooler, detachably are installed in the installation cavity, wherein, be provided with the conducting hole between installation cavity and the storing chamber. This technical scheme combines together refrigerating and heating box with the air cooler, when needs refrigeration or heat preservation food, can install the air cooler in the installation cavity to utilize the air cooler to carry cold volume or heat to the storing intracavity, and in the time need not refrigerating or keep warm food, can directly dismantle the air cooler come out in the installation cavity again, so that this air cooler of independent utility, thereby make this refrigerating and heating box can be used for cold -storedly or heat preservation food, can be used to the refrigeration again or heat, thereby widened refrigerating and heating box's application range. Wherein, the preferred semiconductor refrigeration piece that is provided with in this air cooler to the pa er of usable semiconductor pastes the effect and exports cold volume or heat fast, in order to reach the purpose of refrigerating, keeping warm, freezing, heating.
Description
Technical field
This utility model relates to refrigerating thermal-insulation field, more specifically, relating to a kind of cold and warm box.
Background technology
Cold and warm box, both can be with domestic for being incubated food or cold preservation, again can be as vehicle-mounted use.
But, current cold and warm box simple in construction, insulation or cold storage effect poor, meanwhile, current cold and warm box and
Air cooler is two single parts, the two use that can not combine.
Therefore, how to propose a kind of insulation or cold storage effect is preferable, and can effectively combine the cold of air cooler
Warm case becomes current problem demanding prompt solution.
Utility model content
This utility model is intended at least to solve one of technical problem present in prior art.
To this end, a purpose of the present utility model is, it is provided that a kind of cold and warm box.
For achieving the above object, the embodiment of this utility model first aspect provides a kind of cold and warm box,
Including: casing, storage chamber and installation cavity are set in described casing, one end of described storage chamber is provided with can
The door body of folding；Air cooler, is removably mounted in described installation cavity；Wherein, described installation cavity and institute
State and between storage chamber, be provided with via.
The cold and warm box that the embodiment of this utility model first aspect provides, combines air cooler with cold and warm box,
Thus when needs cold preservation or insulated food, air cooler can be arranged in installation cavity, in order to utilize air cooler
In storage chamber, carry cold or heat, thus reach the effect of cold preservation or insulated food, and need not cold preservation
Or during insulated food, can directly air cooler be taken apart in installation cavity again, in order to independent this air-conditioning of use
Fan, thus may utilize again this air cooler and realize refrigeration or the purpose heated.This kind of scheme, by cold and warm box with empty
Tune fan combines, so that this cold and warm box gets final product cold preservation or insulated food, can be used for again freezing or heating,
Thus widened the function of cold and warm box, improve the utilization rate of cold and warm box.Wherein, via is for by air-conditioning
Cold or heat that fan produces are delivered to storage chamber, in order to the food in storage chamber is carried out cold preservation or insulation.
It addition, the cold and warm box that this utility model above-described embodiment provides also has a following additional technical feature:
In technique scheme, it is preferable that be additionally provided with drawer and the first display screen on described casing.
In this technical scheme, drawer is preferably transparent drawer, thus can be easy to observe the article in drawer,
Now, this drawer can be arranged to common storage drawer, be used for depositing the article such as key, it is possible to will take out
Drawer turns on installation cavity, thus the refrigeration of available air cooler or heat-production functions, insulation or chilled food, and
First display screen can be used for showing current date, time and indoor temperature, and the various work ginseng of cold and warm box
Number, such as temperature.
In technique scheme, it is preferable that described air cooler is removably mounted on described peace by buckle
In behaveing affectedly.
In this technical scheme, realized the installation of air cooler by buckle structure, i.e. using of air cooler can be easy to
I.e. tear open, and instant dress, and then the independence being highly convenient for air cooler uses and air cooler and cold and warm box
It is used in combination.Certainly, it is possible to by the alternate manners such as screw realize between air cooler and installation cavity detachable
Install.
In technique scheme, it is preferable that described air cooler includes: semiconductor chilling plate；First air channel,
First of the first fan and described semiconductor chilling plate is included on described first air channel, wherein, described
Wind in one air channel flows through first heel row of described semiconductor chilling plate under the effect of described first fan
Go out；Second air channel, described second air channel is provided with the second fan and described semiconductor chilling plate second,
Wherein, the wind in described second air channel flows through described semiconductor chilling plate under the effect of described second fan
Discharge after second；First radiator, is arranged on first of described semiconductor chilling plate, is positioned at described
In first air channel；Second radiator, is arranged on second of described semiconductor chilling plate, is positioned at described
In two air channels；Wherein, in first of described semiconductor chilling plate and described semiconductor chilling plate second,
One side is for heating face, and another side is chill surface.
In this technical scheme, air cooler utilizes the paltie effect of quasiconductor, thus when energising, it is possible to
The two sides making quasiconductor produces temperature difference, thus can form a chill surface and and heat face, and then the first air channel
Or second air channel distinguished and admirable when this semiconductor chilling plate, on the one hand just may utilize chill surface and air cooler is discharged
Wind freeze, to realize the purpose of air cooler refrigeration, wherein, in this process of refrigerastion, can simultaneously profit
Dispel the heat with the face of heating.On the other hand, it is possible to utilize and heat in the face of the wind of air cooler discharge heats,
To realize the purpose that air cooler heats, wherein, in this heating operations, chill surface can be utilized to carry out cold simultaneously
Amount is supplemented.Specifically, this air cooler is divided into two the first independent air channels and the second air channel, the first wind
Road includes first of the first fan and semiconductor chilling plate, and the second air channel includes the second fan and quasiconductor system
Second of cold, wherein, just can be incorporated into by the rotation of the second fan by the air outside air cooler
In two air channels, and make it flow through second of semiconductor chilling plate, and enter with the second face of semiconductor chilling plate
Row heat exchanges, thus can heat or the wind of refrigeration air-conditioning fan discharge, and then i.e. may utilize semiconductor refrigerating
Second of sheet realizes the refrigeration purpose of air cooler or heats purpose, meanwhile, in refrigeration or heating operations,
By the rotation of the first fan, the air outside air cooler can be incorporated in the first air channel, and make it flow through half
First of conductor cooling piece, and carry out heat exchange with the first face of semiconductor chilling plate, thus the first wind
Road is when air cooler freezes, and available semiconductor chilling plate dispels the heat, and when air cooler heats, can profit
Cold-storage is carried out with semiconductor chilling plate.This technical scheme, utilizes the paltie effect of quasiconductor, for air cooler
Provide chill surface and heat face, from without using the low-temperature receiver such as water, ice cube, meanwhile, this technical scheme
In, be directly wind is freezed or heats after discharge, from but air-conditioning truly, additionally, should
Air cooler, by changing the polarity of the electrical current on semiconductor chilling plate, can be simply and rapidly by half
The chill surface of conductor cooling piece and heat face and be interchangeable, thus can simply and rapidly realize air cooler system
Switching between chill formula and heating mode, so can be easy to user utilize this air cooler replace air-conditioning carry out
Refrigeration or heating.This air cooler additionally can be placed on water tumbler side, thus can quickly reduce water temperature, enter
And user can be easy to and drink tea in summer, certainly, this air cooler also can be used for other occasion by user, with
Realize and heating, corresponding function of lowering the temperature.
Additionally, can improve between the first air channel and the second air channel by arranging the first radiator and the second radiator
Heat transfer, thus more heat or continuous accumulation can be distributed more by the circulation of the air in the first air channel
Many colds, the air in the second air channel then can be discharged more heat or cold, thus can be improved air cooler
Refrigeration or heating efficiency.Specifically, the first radiator is for by the heat on first of semiconductor chilling plate
Or cold is more dispersed in the first air channel, allow it to carry out maximum effect with the air in the first air channel
The heat exchange of rate, and the second radiator is for distributing the heat on second of semiconductor chilling plate or cold
In the second air channel, the air in the second air channel is carried out the refrigeration of maximal efficiency or heats, thus pass through
First radiator and the second radiator are set, refrigeration or the heating capacity of air cooler can be improved, to meet user's day
Normal refrigeration, heating needs.
Specifically, semiconductor chilling plate is the instrument of a heat transfer, specially N-type semiconductor material and
The thermocouple that one block of P-type semiconductor material is coupled to.Wherein, the paltie effect of quasiconductor refers to: when having
When electric current is by the loop of different conductor compositions, in addition to producing irreversible Joule heat, at different conductor
Can there is heat absorption, exothermic phenomenon respectively along with the difference of the sense of current in joint, therefore works as semiconductor chilling plate
(thermocouple that i.e. one block N-type semiconductor material and one block of P-type semiconductor material are coupled to) centering has electricity
Circulating out-of-date, the heat between both ends of the surface will transfer to the other end from one end, thus produces the temperature difference to be formed
Described chill surface and described heat face.
In technique scheme, it is preferable that the first radiator, the second radiator is made up of aluminium.
In technique scheme, it is preferable that described air cooler also includes: heat insulating mattress, on described heat insulating mattress
Being provided with installing hole, described semiconductor chilling plate is embedded in described installing hole, to isolate described quasiconductor system
First of cold with second of described semiconductor chilling plate.
In this technical scheme, after semiconductor chilling plate energising, can produce between the first face and second face
Temperature difference, and first of semiconductor chilling plate and the of semiconductor chilling plate can be prevented by arranging heat insulating mattress
Carry out heat exchange between two, thus can strengthen first of semiconductor chilling plate with semiconductor chilling plate
Temperature difference between second, and then can be that the second air channel provides more refrigerating capacity or heating capacity.
In technique scheme, it is preferable that described first fan is centrifugal fan, described first radiator
It is arranged on described first fan in the radial direction, and is parallel to described first fan；And/or described second
Fan is centrifugal fan, and described second radiator is arranged on described second fan in the radial direction, and parallel
In described second fan.
In this technical scheme, it is preferable that the first fan and the second fan are centrifugal fan, because, from
Heart-wind syndrome fan is less compared to noise for aerofoil fan, and meanwhile, centrifugal fan can be by axial from fan of wind
Utilize centrifugal force to be thrown out from circumferencial direction by wind after suction, thus can directly wind be expelled to parallel with fan
On the radiator arranged, to reduce the loss of wind, improve the utilization rate of wind, and then the system of air cooler can be improved
Cold or heating efficiency.Additionally, the first fan parallel is arranged with the first radiator, the second fan is parallel with second
Radiator is arranged, and that can the structure of air cooler be designed is compacter, thus can reduce the whole body of air cooler
Long-pending, improve space availability ratio, it is preferable that this air cooler can be designed to mini air conditioner fan.
In technique scheme, it is preferable that described air cooler also includes: the first air inlet, it is arranged on institute
State on the first air channel, and be positioned near described first fan；First air outlet, is arranged on described first air channel
On, and be positioned at described first radiator and be not provided with one end of described first fan；Second air inlet, is arranged
On described second air channel, and it is positioned near described second fan；Second air outlet, is arranged on described second
On air channel, and it is positioned at described second radiator and is not provided with one end of described second fan；Wherein, described
In two air channels, at described second air outlet, it is provided with flow-guiding structure.
In this technical scheme, the wind in the first air channel is imported from the first air inlet by the first fan, then with
After first radiator carries out heat exchange, the first air outlet discharging, wherein, the first fan is arranged on first and enters
At air port, in order to direct wind into the first air channel, multiple first air outlet can be set to improve first simultaneously
The rate of heat dissipation in air channel or Cool storage rate, and the wind in the second air channel is imported from the second air inlet by the second fan, so
After carrying out refrigeration cool-down afterwards with the second radiator or heating heating, the second air outlet discharge, wherein, second
Fan is arranged on the second air inlet, in order to direct wind into the second air channel.Moreover it is preferred that can be
In second air channel, at the second air outlet, flow-guiding structure is set, to direct wind into the second air outlet, thus can
Reduce the loss of the second air channel endogenous wind.
Wherein it is preferred to, flow-guiding structure is arc flow-guiding structure.
In technique scheme, it is preferable that described air cooler also includes: housing, described housing includes one
Face is the cover plate that uncovered cover body and lid seal described cover body；Dividing plate, is arranged in described housing, described dividing plate
One side surround described first air channel with described cover plate, wherein, described dividing plate is additionally provided with through hole, described
Semiconductor chilling plate is arranged in described through hole；First air duct board, is arranged on the another side of described dividing plate；
Second air duct board, is arranged on described first air duct board, and surrounds described second wind with described first air duct board
Road, described second air duct board is additionally provided with the first vent turned on described second air inlet and with described
Second vent of the second air outlet conducting；Wherein, described first fan, described first radiator are arranged on
In the one side of described dividing plate, described second fan, described second radiator are arranged on the another side of described dividing plate
On.
In this technical scheme, cover body and cover plate surround the housing of closing, and dividing plate is arranged in described housing,
To be divided into two in housing, specifically, semiconductor chilling plate is embedded in the through hole of dividing plate, quasiconductor system
First of cold surrounds the first air channel, the first fan and the second radiator with the one side of dividing plate, cover plate and installs
In the one side of dividing plate, and being positioned at the first air channel, meanwhile, the another side of dividing plate is provided with the first air duct board,
Second air duct board is installed on the first air duct board, and encloses with the second face of the second air duct board, semiconductor chilling plate
Becoming the second air channel, the second fan, the second radiator are then arranged on dividing plate through the second air duct board.This skill
Art scheme, can improve the sealing in the second air channel, to subtract by the setting of the first air duct board and the second air duct board
The loss of few wind, thus air-out rate can be improved, meanwhile, the first air duct board and the second air duct board have certain
Insulation effect, thus the refrigeration of air cooler, heating efficiency can be improved.
In technique scheme, it is preferable that described first air duct board is cystosepiment and/or described second wind
Guidance tape is cystosepiment.
In this technical scheme, the first air duct board, the second air duct board are preferably cystosepiment, because, cystosepiment
Low price, and high insulating effect, thus the cost of air cooler can be reduced, air cooler can be improved again
Refrigeration, heating efficiency.
In technique scheme, it is preferable that be additionally provided with second display screen and control key on described cover body,
Wherein, second display screen can be used for showing current date, time and indoor temperature, and air cooler is various
Running parameter, such as cryogenic temperature, gear etc.；And control key user controls the work of air cooler, such as open
Stop, gear etc..
In technique scheme, it is preferable that described cover body, described cover plate are by ABS (acrylic nitrile-butadiene two
Alkene-styrene) plastics make.
In technique scheme, it is preferable that described first air inlet is arranged on the upper end of described cover plate, institute
State the lower end that the first air outlet is arranged on the sidewall of described cover body；Described second air inlet is arranged on described cover body
The lower end of sidewall, described second air outlet is arranged on the upper end of the sidewall of described cover body.
In this technical scheme, the first air channel is for heat radiation or cold-storage, and the second air channel is correspondingly used for refrigeration
Or heat, therefore, respectively the first air inlet, the second air inlet are arranged on the two ends up and down of housing, and incite somebody to action
First air outlet, the second air outlet are arranged on the other end of housing accordingly, in just can making the first air channel
The wind direction of the wind in wind and the second air channel is relative, thus when meeting, just can carry out convective exchange, to improve
The heat transfer effect of the wind in the first air channel and the second air channel, and then refrigeration or heating efficiency can be provided.
Additionally, the first air inlet and this kind of side of setting of the second air inlet, the first air outlet and the second air outlet
Formula and the operation principle of centrifugal fan, i.e. air inlet through hollow shaft, sidewall air-out is corresponding.Meanwhile, this kind is arranged,
Make the air outlet front regional area at air cooler of air cooler, thus meet user's routine use air cooler
Custom.
In technique scheme, it is preferable that first of described semiconductor chilling plate is for heating face, described
Second of semiconductor chilling plate is chill surface.
In this technical scheme, when first of semiconductor chilling plate for heat face, the of semiconductor chilling plate
Two when being chill surface, just may utilize this air cooler and realize the purpose of refrigeration, and when the of semiconductor chilling plate
One side is chill surface, second of semiconductor chilling plate for heating face time, just may utilize this air cooler and realize making
The purpose of heat.
In technique scheme, it is preferable that described second fan, described first fan, described quasiconductor
Cooling piece can be energized simultaneously；Or described second fan can independently be energized, it may be assumed that described first fan, described half
Conductor cooling piece no power.
In this technical scheme, described second fan, described first fan, described semiconductor chilling plate are simultaneously
During energising, this air cooler can freeze or heat, and is independently energized at the second fan, the first fan,
During semiconductor chilling plate no power, air cooler can be used as a common fan and blows, thus this sky
Adjust fan can realize refrigerating function, heat-production functions, the function of conventional Ian can be realized again, and then can be improved this
The utilizability of air cooler.
Specifically, the sense of current and the electric current of semiconductor chilling plate can be controlled by arranging a controller
Break-make situation.
In technique scheme, it is preferable that a temperature detector can be arranged on the housing, with detection
Indoor temperature, thus the gear of temperature automatic control air cooler of available detection, semiconductor chilling plate
Energising direction and the various mode of operations of air cooler.
To be given in following description part according to additional aspect of the present utility model and advantage, part will
Become obvious from the following description, or recognized by practice of the present utility model.
Accompanying drawing explanation
Embodiment is retouched by above-mentioned and/or additional aspect of the present utility model and advantage from combining accompanying drawings below
Will be apparent from easy to understand in stating, wherein:
Fig. 1 is the sectional structure schematic diagram according to the cold and warm box described in an embodiment of the present utility model；
Fig. 2 is the decomposition texture schematic diagram according to the cold and warm box described in an embodiment of the present utility model；
Fig. 3 is another structural representation according to the cold and warm box described in an embodiment of the present utility model；
Fig. 4 is the sectional structure schematic diagram of the air cooler of the cold and warm box according to Fig. 1 offer；
Fig. 5 is the STRUCTURE DECOMPOSITION schematic diagram of the air cooler provided according to Fig. 4；
Fig. 6 is the part-structure decomposing schematic representation of the air cooler provided according to Fig. 5；
Fig. 7 is the structural representation of the air cooler provided according to Fig. 1.
Wherein, the corresponding relation between the reference in Fig. 1 to Fig. 7 and component names is:
100 air coolers, 1 semiconductor chilling plate, 21 first fans, 22 second fans, 31 first dissipate
Hot device, 32 second radiators, 41 first air inlets, 42 second air inlets, 51 first air outlets,
52 second air outlets, 61 cover bodies, 62 cover plates, 7 dividing plates, 8 first air duct boards, 9 second air duct boards,
10 heat insulating mattress, 200 casings, 210 installation cavitys, 220 storage chambers, 230 door body, 240 first buckles,
250 drawers, 260 first display screens, 270 handles.
Detailed description of the invention
In order to be more clearly understood that above-mentioned purpose of the present utility model, feature and advantage, knot below
Close the drawings and specific embodiments this utility model is further described in detail.Need explanation
It is that, in the case of not conflicting, the feature in embodiments herein and embodiment can be mutually combined.
Elaborate a lot of detail in the following description so that fully understanding this utility model, but
It is that this utility model can be implemented to use other to be different from mode described here, therefore, this
The protection domain of utility model is not limited by following public specific embodiment.
As shown in Figures 1 to 7, the embodiment of this utility model first aspect provides a kind of cold and warm box,
Including: casing 200, storage chamber 220 and installation cavity 210, the one of storage chamber 220 are set in casing 200
Being provided with on end can the door body 230 of folding；Air cooler 100, is removably mounted in installation cavity 210；
Wherein, it is provided with via between installation cavity 210 and storage chamber 220.
The cold and warm box that the embodiment of this utility model first aspect provides, ties with cold and warm box mutually by air cooler 100
Close, thus when needs cold preservation or insulated food, air cooler 100 can be arranged in installation cavity 210, with
Convenient in storage chamber 220, carry cold or heat with air cooler 100, thus reach cold preservation or insulated food
Effect, and when need not cold preservation or insulated food, again can be as in figure 2 it is shown, directly by air cooler 100
Take apart in installation cavity 210, in order to independent this air cooler 100 of use, thus may utilize again this air-conditioning
Fan 100 realization refrigeration or the purpose heated.This kind of scheme, combines cold and warm box with air cooler 100, from
And make this cold and warm box get final product cold preservation or insulated food, can be used for again freezing or heating, thus widened changes in temperature
The function of case, improves the utilization rate of cold and warm box.
Wherein, the arrow in Fig. 1 to Fig. 7 represents the flow direction of wind.
In technique scheme, it is preferable that as it is shown on figure 3, be additionally provided with drawer 260 on casing 200
With the first display screen 260 and handle 270, wherein, handle 270 is used for moving this cold and warm box, the first display
Screen 260 can be used for showing current date, time and indoor temperature, and the various running parameters of cold and warm box,
Such as temperature.
In this technical scheme, drawer 250 is preferably transparent drawer, thus can be easy to observe the thing in drawer
Product, now, can be arranged to this drawer common storage drawer, be used for depositing the article such as key, it is possible to
Drawer is turned on installation cavity 210, thus the refrigeration of available air cooler 100 or heat-production functions, insulation or
Chilled food.
In technique scheme, it is preferable that as in figure 2 it is shown, air cooler 100 is by buckle removably
It is arranged in installation cavity 210.Specifically, buckle includes multiple first buckles being arranged on installation cavity 210
240 and the second buckle of being arranged on air cooler 100.
In this technical scheme, realized the installation of air cooler 100 by buckle structure, air cooler can be easy to
100 instant tear open, and instant dress, and then the independence being highly convenient for air cooler 100 uses and empty
Tune fan 100 is used in combination with cold and warm box.Certainly, it is possible to realize 100 and peace by alternate manners such as screws
The detachable installation behaveing affectedly between 210.
In technique scheme, it is preferable that as shown in Figures 4 to 7, air cooler 100, including:
Semiconductor chilling plate 1；First air channel, the first air channel includes the first fan 21 and semiconductor chilling plate 1
First, wherein, the wind in the first air channel flows through semiconductor chilling plate under the effect of the first fan 21
Discharge after first of 1；Second air channel, the second air channel is provided with the second fan 22 and semiconductor refrigerating
Sheet 1 second, wherein, the wind in the second air channel flows through semiconductor refrigerating under the effect of the second fan 22
Discharge after second of sheet 1；First radiator 31, is arranged on first of semiconductor chilling plate 1,
It is positioned at the first air channel；Second radiator 32, is arranged on second of semiconductor chilling plate 1, is positioned at
In second air channel；Wherein, in first of semiconductor chilling plate 1 and semiconductor chilling plate 1 second,
One side is for heating face, and another side is chill surface.
In this technical scheme, air cooler 100 utilizes the paltie effect of quasiconductor, thus when energising,
The two sides that can make quasiconductor produces temperature difference, thus can form a chill surface and and heat face, and then first
Air channel or the second air channel distinguished and admirable when this semiconductor chilling plate 1, on the one hand just may utilize chill surface to air-conditioning
The wind of fan 100 discharge freezes, and to realize the purpose of air cooler 100 refrigeration, wherein, freezes at this
Cheng Zhong, can utilize the face of heating to dispel the heat simultaneously.On the other hand, it is possible to utilize and heat in the face of air cooler 100
The wind discharged heats, to realize the purpose that air cooler 100 heats, wherein, in this heating operations,
Chill surface can be utilized to carry out cold supplement simultaneously.Specifically, this air cooler 100 be divided into two independent
First air channel and the second air channel, the first air channel includes first of the first fan 21 and semiconductor chilling plate 1,
Second air channel includes second of the second fan 22 and semiconductor chilling plate 1, wherein, by the second fan
Air outside air cooler 100 just can be incorporated in the second air channel by the rotation of 22, and makes it flow through partly to lead
Second of body cooling piece 1, and carry out heat exchange with the second face of semiconductor chilling plate 1, thus
The wind that heating or refrigeration air-conditioning fan 100 are discharged, and then i.e. may utilize second realization of semiconductor chilling plate 1
The refrigeration purpose of air cooler 100 or heat purpose, meanwhile, in refrigeration or heating operations, can be by first
Air outside air cooler 100 is incorporated in the first air channel by the rotation of fan 21, and makes it flow through partly to lead
First of body cooling piece 1, and carry out heat exchange with the first face of semiconductor chilling plate 1, thus first
Air channel is when air cooler 100 freezes, and available semiconductor chilling plate 1 dispels the heat, and at air cooler 100
When heating, available semiconductor chilling plate 1 carries out cold-storage.This technical scheme, utilizes the Peltier of quasiconductor
Effect, provides chill surface and heat face for air cooler 100, from without using the low-temperature receiver such as water, ice cube,
Meanwhile, in this technical scheme, be directly wind is freezed or heats after discharge, from but truly
Air-conditioning, additionally, this air cooler 100, by changing the polarity of the electrical current on semiconductor chilling plate 1,
Can be simply and rapidly by the chill surface of semiconductor chilling plate 1 with heat face and be interchangeable, thus can letter
Realize the switching between air cooler 100 refrigeration mode and heating mode singly, rapidly, and then user can be easy to
This air cooler 100 is utilized to replace air-conditioning to carry out freezing or warming oneself.Additionally this air cooler 100 can be placed
On water tumbler side, thus can quickly reduce water temperature, and then user can be easy to drink tea in summer, certainly, use
This air cooler 100 also can be used for other occasion by family, to realize and heating, corresponding function of lowering the temperature.
Specifically, semiconductor chilling plate 1 is the instrument of a heat transfer, specially N-type semiconductor material
The thermocouple being coupled to one block of P-type semiconductor material.Wherein, the peltier effect of quasiconductor refers to: when
During the loop being made up of by different conductors electric current, in addition to producing irreversible Joule heat, at different conductor
Joint along with the difference of the sense of current can occur respectively heat absorption, exothermic phenomenon, therefore work as semiconductor refrigerating
Sheet 1 (thermocouple that i.e. one block N-type semiconductor material and one block of P-type semiconductor material are coupled to) centering has
When electric current passes through, the heat between both ends of the surface will transfer to the other end from one end, thus produces the temperature difference with shape
Become chill surface and heat face.
Additionally, by the first radiator 31 and the second radiator 32 can improve the first air channel and the second air channel it
Between heat transfer, thus more heat or continuous accumulation can be distributed by the circulation of the air in the first air channel
More cold, the air in the second air channel then can be discharged more heat or cold, thus can be improved air-conditioning
Fan 100 refrigeration or heating efficiency.Specifically, the first radiator 31 is for by the of semiconductor chilling plate 1
Heat or cold in one side are more dispersed in the first air channel, allow it to and the sky in the first air channel
Gas carries out the heat exchange of maximal efficiency, and the second radiator 32 is for by second of semiconductor chilling plate 1
On heat or cold be dispersed in the second air channel, the air in the second air channel to be carried out the system of maximal efficiency
Cold or heat, thus by arranging the first radiator 31 and the second radiator 32, air cooler 100 can be improved
Refrigeration or heating capacity, to meet the daily refrigeration of user, heating needs.
Wherein, in Fig. 4, the wind in the first air channel is entered from first of the top shown in Fig. 1 by the first fan 21
Air port 41 introduces, and after the first radiator 31, the first air outlet 51 flows out, and in the second air channel
Wind introduced from the second air inlet 42 of the lower section shown in Fig. 1 by the second fan 22, and through the second radiator
After 32, the second air outlet 52 flow out.
In technique scheme, it is preferable that the first radiator 31, the second radiator 32 is made up of aluminium.
In technique scheme, it is preferable that as shown in Figure 6, air cooler 100 also includes: heat insulating mattress
10, heat insulating mattress 10 is provided with installing hole, semiconductor chilling plate 1 is embedded in installing hole, with isolation half
First of conductor cooling piece 1 with second of semiconductor chilling plate 1.
In this technical scheme, after semiconductor chilling plate 1 energising, can produce between the first face and second face
Raw temperature difference, and first and quasiconductor system of semiconductor chilling plate 1 can be prevented by arranging heat insulating mattress 10
Carry out heat exchange between second of cold 1, thus first and half of semiconductor chilling plate 1 can be strengthened
Temperature difference between second of conductor cooling piece 1, so can be second air channel provide more refrigerating capacity or
Heating capacity.
In technique scheme, it is preferable that as shown in Figure 6, the first fan 21 is centrifugal fan, the
One radiator 31 is arranged on the first fan 21 in the radial direction, and is parallel to the first fan 21；And/or
Second fan 22 is centrifugal fan, and the second radiator 32 is arranged on the second fan 22 in the radial direction,
And it is parallel to the second fan 22.
In this technical scheme, it is preferable that the first fan 21 and the second fan 22 are centrifugal fan, because of
For, centrifugal fan is less compared to noise for aerofoil fan, and meanwhile, centrifugal fan can be by wind from fan
Axially suck after utilize centrifugal force to be thrown out from circumferencial direction by wind, thus can directly wind be expelled to and wind
On the radiator that fan be arranged in parallel, to reduce the loss of wind, improve the utilization rate of wind, and then air-conditioning can be improved
The refrigeration of fan 100 or heating efficiency.Additionally, the first fan 21 parallel is arranged with the first radiator 31, the
Two fans 22 are parallel to be arranged with the second radiator 32, and that can the structure of air cooler 100 be designed is compacter,
Thus the whole volume of air cooler 100 can be reduced, improve space availability ratio, it is preferable that can be by this air cooler
100 are designed to mini air conditioner fan 100.
In technique scheme, it is preferable that as shown in Fig. 4, Fig. 5, Fig. 7, air cooler 100 also wraps
Include: the first air inlet 41, be arranged on the first air channel, and be positioned near the first fan 21；First air-out
Mouthfuls 51, it is arranged on the first air channel, and is positioned at the first radiator 31 and is not provided with the one of the first fan 21
End；Second air inlet 42, is arranged on the second air channel, and is positioned near the second fan 22；Second air-out
Mouthfuls 52, it is arranged on the second air channel, and is positioned at the second radiator 32 and is not provided with the one of the second fan 22
End；Wherein, as shown in Figure 4, in the second air channel, at the second air outlet 52, it is provided with flow-guiding structure, and
This flow-guiding structure is arc flow-guiding structure.
In this technical scheme, the wind in the first air channel is imported from the first air inlet 41 by the first fan 21,
Then after carrying out heat exchange with the first radiator 31, the first air outlet 51 discharge, wherein, the first fan
21 are arranged at the first air inlet 41, in order to direct wind into the first air channel, can arrange multiple the simultaneously
One air outlet 51 is to improve rate of heat dissipation or the Cool storage rate in the first air channel, and the wind in the second air channel is by the second wind
Fan 22 imports from the second air inlet 42, then carries out refrigeration cool-down with the second radiator 32 or heats heating
After, the second air outlet 52 discharge, wherein, the second fan 22 is arranged at the second air inlet 42, with
Just direct wind into the second air channel.Moreover it is preferred that can be in the second air channel, the second air outlet 52
Place arranges flow-guiding structure, to direct wind into the second air outlet 52, thus can reduce by the second air channel endogenous wind
Loss.
In technique scheme, it is preferable that as shown in Fig. 4, Fig. 5 and Fig. 7, air cooler 100 also wraps
Including: housing, housing includes that one side is for uncovered cover body 61 and the cover plate 62 of lid sealing cover body 61；Dividing plate 7,
Being arranged in housing, the one side of dividing plate 7 and cover plate 62 surround the first air channel, wherein, dividing plate 7 also set
Being equipped with through hole, semiconductor chilling plate 1 is arranged in through hole；First air duct board 8, is arranged on the another of dividing plate 7
In one side；Second air duct board 9, is arranged on the first air duct board 8, and surrounds second with the first air duct board 8
Air channel, the second air duct board 9 is additionally provided with the first vent turned on the second air inlet 42 and with second
Second vent of air outlet 52 conducting；Wherein, first fan the 21, first radiator 31 be arranged on every
In the one side of plate 7, second fan the 22, second radiator 32 is arranged on the another side of dividing plate 7.
In this technical scheme, cover body 61 and cover plate 62 surround the housing of closing, and dividing plate 7 is arranged on shell
Internal, to be divided into two in housing, specifically, semiconductor chilling plate 1 is embedded in the through hole of dividing plate 7,
First of semiconductor chilling plate 1 surrounds the first air channel, the first fan with the one side of dividing plate 7, cover plate 62
21 and second radiator 32 be arranged in the one side of dividing plate 7, and be positioned at the first air channel, meanwhile, dividing plate
The another side of 7 is provided with the first air duct board 8, and the first air duct board 8 is provided with the second air duct board 9, and with
Second air duct board 9, the second face of semiconductor chilling plate 1 surround the second air channel, and the second fan 22, second
Radiator 32 is then arranged on dividing plate 7 through the second air duct board 9.This technical scheme, by the first air channel
The setting of plate 8 and the second air duct board 9 can improve the sealing in the second air channel, to reduce the loss of wind, thus
Can improve air-out rate, meanwhile, the first air duct board 8 and the second air duct board 9 have certain insulation effect, from
And the refrigeration of air cooler 100, heating efficiency can be improved.
In technique scheme, it is preferable that the first air duct board 8 is cystosepiment and/or the second air duct board 9
For cystosepiment.
In this technical scheme, first air duct board the 8, second air duct board 9 is preferably cystosepiment, because, bubble
The low price of foam plate, and high insulating effect, thus the cost of air cooler 100 can be reduced, can improve again
The refrigeration of air cooler 100, heating efficiency.
In technique scheme, it is preferable that as it is shown in fig. 7, be additionally provided with the second display on cover body 61
Screen and control key, wherein, second display screen can be used for showing current date, time and indoor temperature, and
The various running parameters of air cooler 100, such as cryogenic temperature, gear etc.；And control key user controls air-conditioning
The work of fan 100, such as start and stop, gear etc..Specifically, second display screen and control key are arranged on cover body
The top of 61.
In technique scheme, it is preferable that cover body 61, cover plate 62 by ABS (acrylonitrile-butadiene-
Styrene) plastics make.
In technique scheme, it is preferable that the first air inlet 41 is arranged on the upper end of cover plate 62, first
Air outlet 51 is arranged on the lower end of the sidewall of cover body 61；Second air inlet 42 is arranged on the sidewall of cover body 61
Lower end, the second air outlet 52 is arranged on the upper end of the sidewall of cover body 61.
In this technical scheme, the first air channel is for heat radiation or cold-storage, and the second air channel is correspondingly used for refrigeration
Or heat, therefore, respectively first air inlet the 41, second air inlet 42 is arranged on the two ends up and down of housing,
And first air outlet the 51, second air outlet 52 is arranged on accordingly the other end of housing, just can make
The wind direction of the wind in one air channel and the wind in the second air channel is relative, thus when meeting, just can carry out convection current friendship
Change, to improve the heat transfer effect of the wind in the first air channel and the second air channel, and then refrigeration can be provided or heat effect
Rate.
Additionally, the first air inlet 41 and the second air inlet the 42, first air outlet 51 and the second air outlet 52
The operation principle of this kind of set-up mode and centrifugal fan, i.e. air inlet through hollow shaft, sidewall air-out is corresponding.Meanwhile,
This kind is arranged so that the air outlet of air cooler 100 is at the front regional area of air cooler 100, thus meets
The custom of user's routine use air cooler 100.
In technique scheme, it is preferable that first of semiconductor chilling plate 1 for heating face, quasiconductor
Second of cooling piece 1 is chill surface.
In this technical scheme, when first of semiconductor chilling plate 1 is for heating face, semiconductor chilling plate 1
Second just may utilize this air cooler 100 and realize the purpose of refrigeration when being chill surface, and when quasiconductor system
First of cold 1 be chill surface, second of semiconductor chilling plate 1 for heating face time, just available should
Air cooler 100 realizes the purpose heated.
In technique scheme, it is preferable that second fan the 22, first fan 21, semiconductor chilling plate
1 can be energized simultaneously；Or second fan 22 can independently be energized, it may be assumed that the first fan 21, semiconductor chilling plate
1 no power.
In this technical scheme, second fan the 22, first fan 21, semiconductor chilling plate 1 are energized simultaneously
Time, this air cooler 100 can freeze or heat, and at the independent energising of the second fan 22, the first wind
When fan 21, semiconductor chilling plate 1 no power, air cooler 100 can be used as a common fan to be carried out
Air-supply, thus this air cooler 100 can realize refrigerating function, heat-production functions, can realize again conventional Ian
Function, and then the utilizability of this air cooler 100 can be improved.
Specifically, semiconductor chilling plate 1 can be controlled by arranging a controller (not shown)
The sense of current and the break-make situation of electric current.
In technique scheme, it is preferable that a temperature detector (not shown) can be set on housing,
With the temperature in sensing chamber, thus may utilize the gear of the temperature automatic control air cooler 100 of detection, partly lead
The energising direction of body cooling piece 1 and the various mode of operations of air cooler 100.
In the description of this specification, term " first ", " second " are only used for the purpose described, and can not manage
Solve as instruction or imply relative importance, unless otherwise clearly defined and limited；Term " connects ", " peace
Dress ", " fix " etc. all should be interpreted broadly, such as, " connection " can be to fix connection, it is also possible to is can
Dismounting connects, or is integrally connected；Can be to be joined directly together, it is also possible to be indirectly connected to by intermediary.
For the ordinary skill in the art, can understand that above-mentioned term is new in this practicality as the case may be
Concrete meaning in type.
In the description of this specification, term " embodiment ", " some embodiments ", " specific embodiment "
Deng description means to combine this embodiment or example describes specific features, structure, material or feature be contained in
In at least one embodiment of the present utility model or example.In this manual, schematic to above-mentioned term
Statement is not necessarily referring to identical embodiment or example.And, the specific features of description, structure, material
Or feature can combine in any one or more embodiments or example in an appropriate manner.
The foregoing is only preferred embodiment of the present utility model, be not limited to this utility model,
For a person skilled in the art, this utility model can have various modifications and variations.All in this practicality
Within novel spirit and principle, any modification, equivalent substitution and improvement etc. made, should be included in this
Within the protection domain of utility model.
Claims (10)
1. a cold and warm box, it is characterised in that including:
Casing, arranges storage chamber and installation cavity in described casing, one end of described storage chamber is provided with and can open
The door body closed；
Air cooler, is removably mounted in described installation cavity；
Wherein, it is provided with via between described installation cavity and described storage chamber.
Cold and warm box the most according to claim 1, it is characterised in that
Drawer, the first display screen and handle it is additionally provided with on described casing；
Described air cooler is removably mounted in described installation cavity by buckle.
Cold and warm box the most according to claim 1, it is characterised in that described air cooler includes:
Semiconductor chilling plate；
First air channel, described first air channel includes the first fan and the first of described semiconductor chilling plate
Face, wherein, the wind in described first air channel flows through described semiconductor refrigerating under the effect of described first fan
Discharge after first of sheet；
Second air channel, described second air channel is provided with the second fan and described semiconductor chilling plate second,
Wherein, the wind in described second air channel flows through described semiconductor chilling plate under the effect of described second fan
Discharge after second；
First radiator, is arranged on first of described semiconductor chilling plate, is positioned at described first air channel；
Second radiator, is arranged on second of described semiconductor chilling plate, is positioned at described second air channel；
Heat insulating mattress, described heat insulating mattress is provided with installing hole, and described semiconductor chilling plate is embedded in described installation
In hole, with second of first with described semiconductor chilling plate isolating described semiconductor chilling plate；
Wherein, in first of described semiconductor chilling plate and described semiconductor chilling plate second, one side is
Heating face, another side is chill surface.
Cold and warm box the most according to claim 3, it is characterised in that
Described first fan is centrifugal fan, and described first radiator is arranged on the radial direction side of described first fan
Upwards, and be parallel to described first fan；And/or
Described second fan is centrifugal fan, and described second radiator is arranged on the radial direction side of described second fan
Upwards, and be parallel to described second fan.
Cold and warm box the most according to claim 3, it is characterised in that described air cooler also includes:
First air inlet, is arranged on described first air channel, and is positioned near described first fan；
First air outlet, is arranged on described first air channel, and is positioned at described first radiator and is not provided with
State one end of the first fan；
Second air inlet, is arranged on described second air channel, and is positioned near described second fan；
Second air outlet, is arranged on described second air channel, and is positioned at described second radiator and is not provided with
State one end of the second fan；
Wherein, in described second air channel, at described second air outlet, it is provided with flow-guiding structure.
Cold and warm box the most according to claim 5, it is characterised in that also include:
Housing, described housing includes that one side seals the cover plate of described cover body for uncovered cover body and lid；
Dividing plate, is arranged in described housing, and the one side of described dividing plate and described cover plate surround described first air channel,
Wherein, described dividing plate being additionally provided with through hole, described semiconductor chilling plate is arranged in described through hole；
First air duct board, is arranged on the another side of described dividing plate；
Second air duct board, is arranged on described first air duct board, and surrounds described with described first air duct board
Two air channels, described second air duct board is additionally provided with described second air inlet conducting the first vent and with
Second vent of described second air outlet conducting；
Wherein, described first fan, described first radiator are arranged in the one side of described dividing plate, and described
Two fans, described second radiator are arranged on the another side of described dividing plate.
Cold and warm box the most according to claim 6, it is characterised in that
Described first air duct board is cystosepiment and/or described second air duct board is cystosepiment；
Second display screen and control key it is additionally provided with on described cover body.
Cold and warm box the most according to claim 6, it is characterised in that
Described first air inlet is arranged on the upper end of described cover plate, and described first air outlet is arranged on described cover body
The lower end of sidewall；
Described second air inlet is arranged on the lower end of the sidewall of described cover body, and described second air outlet is arranged on institute
State the upper end of the sidewall of cover body.
Cold and warm box the most according to any one of claim 1 to 8, it is characterised in that described partly lead
First of body cooling piece is for heating face, and second of described semiconductor chilling plate is chill surface；Or
First of described semiconductor chilling plate is chill surface, and second of described semiconductor chilling plate for heating
Face.
Cold and warm box the most according to any one of claim 1 to 8, it is characterised in that
Described second fan, described first fan, described semiconductor chilling plate can be energized simultaneously；Or
Described second fan can independently be energized, it may be assumed that described first fan, described semiconductor chilling plate no power.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521140259.2U CN205482083U (en) | 2015-12-30 | 2015-12-30 | Refrigerating and heating box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521140259.2U CN205482083U (en) | 2015-12-30 | 2015-12-30 | Refrigerating and heating box |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205482083U true CN205482083U (en) | 2016-08-17 |
Family
ID=56663328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521140259.2U Expired - Fee Related CN205482083U (en) | 2015-12-30 | 2015-12-30 | Refrigerating and heating box |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205482083U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105486018A (en) * | 2015-12-30 | 2016-04-13 | 合肥华凌股份有限公司 | Cooling and heating box |
-
2015
- 2015-12-30 CN CN201521140259.2U patent/CN205482083U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105486018A (en) * | 2015-12-30 | 2016-04-13 | 合肥华凌股份有限公司 | Cooling and heating box |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160817 Termination date: 20211230 |
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| CF01 | Termination of patent right due to non-payment of annual fee |