CN218495423U - Evaporator, refrigerating system and refrigerator - Google Patents

Abstract

The utility model provides a refrigerator evaporimeter and refrigerating system and refrigerator. Relates to the technical field of refrigeration. The evaporator comprises a semiconductor refrigeration piece and two evaporation parts. The two evaporation parts are respectively arranged at two sides of the semiconductor refrigeration piece, so that one side of the semiconductor refrigeration piece, which generates heat, heats the corresponding evaporation part. The semiconductor refrigeration piece is embedded in the middle of the evaporator, and the polarity of the voltage applied to the semiconductor refrigeration piece is controlled, so that the heating surface defrosts one evaporation part and the refrigerating surface provides cold for the other evaporation part while the semiconductor refrigeration is realized. The cold quantity of the semiconductor refrigerating sheet can be fully utilized, the temperature difference during defrosting of the refrigerator is reduced, and the energy consumption during refrigerating of the refrigerator is reduced.

Description

Evaporator, refrigerating system and refrigerator

Technical Field

The utility model relates to a refrigeration technology field especially relates to an evaporimeter, refrigerating system and refrigerator.

Background

The ordinary refrigerator refrigerates through the evaporimeter, utilizes the fan to make the air circulate between refrigeration compartment and evaporimeter, because the moisture that contains in the air is more, can frost on the evaporimeter surface when the air passes through the evaporimeter, can start automatic defrosting after the refrigerator operation a period. When the refrigerator automatically defrosts, the refrigeration is stopped, and the heating wire is started to heat the evaporator so as to melt the frost of the evaporator. The manner of defrosting by heating the evaporator and the ambient air thereof can increase the temperature of the cooling chamber, so that the temperature of the storage chamber can be quickly increased, the storage of food is not facilitated, and the energy consumption is increased when the refrigerator is cooled again.

SUMMERY OF THE UTILITY MODEL

In view of the above problem, the present invention has been made in order to provide an evaporator and a refrigerating system of a refrigerator and a refrigerator which overcome the above problems or at least partially solve the above problems, which can solve the problem that the temperature of a storage compartment rapidly rises when the refrigerator is defrosted, and the problem that the energy consumption is large when the refrigeration is restarted.

Specifically, the utility model provides an evaporator which is characterized in that comprises a refrigerating and heating device and two evaporation parts, wherein one side of the refrigerating and heating device is used for refrigerating and the other side of the heating device is used for heating.

The two evaporation parts are respectively arranged at two sides of the refrigerating and heating device, so that the side surface of the refrigerating and heating device which generates heat heats the corresponding evaporation part.

Optionally, the cooling and heating device is a semiconductor cooling plate.

Optionally, the evaporator further comprises two heat exchange plates. The semiconductor refrigerating plate is one or more and is arranged between the two heat exchange plates. The two evaporation parts are arranged on two sides of the two heat exchange plates.

Each evaporation part comprises a refrigerant pipeline and at least one radiating fin arranged on the refrigerant pipeline. At least one of the heat radiating fins of each of the evaporation portions is in contact with one of the heat exchange plates.

Optionally, a heat insulation device is arranged between the two evaporation portions, and the refrigeration and heating device is arranged on the heat insulation device. The heat insulation device is a heat insulation plate which is arranged between the two evaporation parts. The heat insulation plate is provided with a mounting through hole. The semiconductor refrigerating sheet is installed on the installation through hole.

The utility model also provides a refrigerating system, including any one of the aforesaid evaporimeter.

Optionally, the refrigeration system further comprises a valve assembly configured to operate both of the evaporators simultaneously, to stop simultaneously or alternatively. The valve assembly comprises a first valve, the first valve is provided with two outlets, and the two outlets of the first valve are respectively communicated with the inlets of the two evaporation parts.

Optionally, the refrigeration system further includes two throttling devices, and the two throttling devices are respectively disposed on a pipeline between the two outlets of the first valve and the inlets of the two evaporation portions.

The valve assembly further comprises a bypass pipeline and a second valve, the bypass pipeline is arranged between the outlets of the two throttling devices, and the second valve is arranged on the bypass pipeline.

Optionally, the utility model also provides a refrigerator, including at least one storing room, still include any one of the aforesaid refrigerating system, the evaporimeter is used for to same the storing room provides cold volume, perhaps two evaporation department respectively to two the storing room provides cold volume.

Optionally, the refrigerator further comprises: and the water receiving discs are arranged on the lower sides of the two evaporation parts. And the pressure sensor is arranged on the water receiving tray. The heating module is arranged on the water receiving tray. And the two defrosting temperature sensors are respectively arranged on the two evaporation parts.

Optionally, the refrigerator further comprises: a cooling chamber, a damper and a fan. The evaporator is arranged in the cooling chamber. At least one storing compartment includes first storing compartment and second storing compartment, the cooling chamber passes through air supply wind path and return air wind path and first storing compartment circulation intercommunication. The cooling chamber is circularly communicated with the second storage chamber. The damper is configured to controllably open or close the supply air passage. The fan is configured to cause airflow to circulate between the first storage compartment and the cooling compartment, and to cause airflow to circulate between the second storage compartment and the cooling compartment.

The utility model discloses an among the evaporimeter, through inlaying the semiconductor refrigeration piece in the middle of the evaporimeter to the control of semiconductor refrigeration piece applied voltage polarity, realize in the refrigerated while of semiconductor, the face of generating heat is for one of them evaporation department defrosting, and the refrigeration face provides cold volume for one of them evaporation department. The cold quantity that can make full use of semiconductor refrigeration piece like this sets up, reduces the temperature rise in the cooling chamber when the refrigerator defrosting, reduces the energy consumption when the refrigerator refrigerates.

Further, the utility model discloses an among the refrigerating system, control two evaporation departments simultaneously through setting up valve member and throttling arrangement and open, close simultaneously or the alternative is opened/is closed. The two evaporation parts can be respectively refrigerated by the arrangement, and the cold quantity can be more reasonably distributed in the normal refrigeration process, so that the energy-saving effect is realized.

The above and other objects, advantages and features of the present invention will become more apparent to those skilled in the art from the following detailed description of specific embodiments thereof, taken in conjunction with the accompanying drawings.

Drawings

Some specific embodiments of the present invention will be described in detail hereinafter, by way of illustration and not by way of limitation, with reference to the accompanying drawings. The same reference numbers in the drawings identify the same or similar elements or components. Those skilled in the art will appreciate that the drawings are not necessarily drawn to scale. In the drawings:

FIG. 1 is a schematic block diagram of an evaporator according to one embodiment of the present invention;

fig. 2 is a partial enlarged view of an evaporator at a according to an embodiment of the present invention;

fig. 3 is a schematic block diagram of a refrigeration system according to an embodiment of the present invention;

fig. 4 is a schematic structural view of a refrigerator according to an embodiment of the present invention.

Detailed Description

A refrigerator evaporator, a refrigeration system, and a refrigerator according to embodiments of the present invention will be described with reference to fig. 1 to 4. In the description of the present embodiments, it is to be understood that the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature, i.e. one or more such features. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise. When a feature "comprises or comprises" a or some of its intended features, this indicates that other features are not excluded and that other features may be further included, unless expressly stated otherwise.

Unless expressly stated or limited otherwise, the terms "disposed," "mounted," "connected," "secured," and "coupled" and the like are intended to be inclusive and mean, for example, that is, permanently connected, removably connected, or integral. Either mechanically or electrically. They may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. Those skilled in the art should understand the specific meaning of the above terms in the present invention according to specific situations.

Further, in the description of the present embodiments, the first feature being "on" or "under" the second feature may include the first and second features being in direct contact, and may also include the first and second features not being in direct contact but being in contact via another feature therebetween. That is, in the description of the present embodiment, the first feature being "on", "above" and "over" the second feature includes the first feature being directly above and obliquely above the second feature, or merely means that the first feature is higher in level than the second feature. A first feature "under," "beneath," or "beneath" a second feature may be directly under or obliquely under the first feature, or simply mean that the first feature is at a lesser elevation than the second feature.

In the description of the present embodiments, reference to the description of "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Fig. 1 is a schematic structural view of an evaporator according to an embodiment of the present invention, as shown in fig. 1, the present invention provides an evaporator 1, which includes a cooling and heating device having a side surface for cooling and another side surface for heating and two evaporation portions 10, wherein the two evaporation portions 10 are respectively disposed at two sides of the cooling and heating device, so that the side surface of the cooling and heating device generating heat heats the corresponding evaporation portion 10. For example, the cooling and heating device is a semiconductor cooling plate, or a structure including a semiconductor cooling plate. The two evaporation parts may be a first evaporation part 11 and a second evaporation part 12, and the first evaporation part 11 is disposed at one side of the semiconductor chilling plate and is thermally connected. The second evaporation part 12 is disposed at the other side of the semiconductor chilling plate and thermally connected.

As shown in fig. 1, a positive voltage is applied to the semiconductor cooling plate, one side of the semiconductor cooling plate heats, and the first evaporation part 11 is defrosted; the other side of the semiconductor refrigerating sheet refrigerates and compensates the cold quantity for the second evaporation part 12. And negative voltage is applied to the semiconductor refrigerating sheet, one side of the semiconductor refrigerating sheet is refrigerated, and the refrigerating capacity is compensated for the first evaporation part 11. The other side of the semiconductor refrigeration sheet heats and defrosts the second evaporation part 12. The cold quantity of the semiconductor refrigerating sheet can be fully utilized, the temperature rise of the cooling chamber when the refrigerator 3 is defrosted is reduced, heat is reduced to enter the corresponding storage chamber, and the energy consumption of the refrigerator 3 during refrigeration is reduced.

In some embodiments of the present invention, the evaporator 1 further comprises two heat exchange plates 15. One or more semiconductor refrigerating fins are arranged between the two heat exchange plates 15. The first evaporation part 11 and the second evaporation part 12 are disposed at both sides of the two heat exchange plates 15. When positive voltage or negative voltage is applied to each semiconductor chilling plate, heat generated by one side of each semiconductor chilling plate is distributed on one heat exchange plate 15, and cold generated by the other side of each semiconductor chilling plate is distributed on the other heat exchange plate 15. The heating or refrigeration is uniform, and the heat or the cold generated by the semiconductor refrigeration piece is fully utilized.

In some embodiments of the present invention, each evaporation portion 10 includes a refrigerant pipe 13 and at least one heat dissipation fin 14 disposed on the refrigerant pipe 13. At least one heat radiating fin 14 of each evaporation portion 10 is in contact with one of the heat exchange plates 15. When the semiconductor chilling plate heats and defrosts one of the evaporation parts 10, the generated heat is transferred to the heat dissipation fins 14 of the corresponding evaporation part 10 through the heat exchange plate 15, so that the temperature of the heat dissipation fins 14 is increased, and the frosting slides off the heat dissipation fins 14 without being completely melted. This arrangement improves the defrosting efficiency of the refrigerator 3.

In some embodiments of the present invention, a heat insulation device is disposed between two evaporation portions 10, and the cooling and heating device is disposed on the heat insulation device. The heat insulation device is a heat insulation plate 30, and the heat insulation plate 30 is a thin-wall sealed shell and is internally vacuum. The heat insulation plate 30 is disposed between the two evaporation parts 10, that is, the heat insulation plate 30 is disposed between the first evaporation part 11 and the second evaporation part 12. Further, the insulation board 30 has a mounting through-hole thereon. The semiconductor refrigeration piece is arranged in the mounting through hole. Two heat exchange plates 15 are respectively installed at both sides of the insulation plate 30. The vacuum in the heat insulation board 30 can isolate the cold or heat generated at the two sides of the semiconductor refrigeration piece, can prevent the two evaporation parts from influencing each other, and can improve the refrigeration or defrosting efficiency of the refrigerator 3.

As shown in fig. 3, the embodiment of the present invention further provides a refrigeration system 2, including the evaporator 1 in any of the above embodiments.

For example, in some embodiments, the refrigeration system 2 further comprises a compressor 20, a condenser 21 and a dry filter 22, and a throttling device, the compressor 20, the condenser 21 and the dry filter 22, and the throttling device being thermally connected in series with the two evaporation sections of the evaporator 1 in any of the above embodiments. The two evaporation sections of the evaporator 1 are connected in parallel with each other.

In some embodiments of the present invention, the refrigeration system 2 further comprises a valve assembly configured to operate both evaporators 10 simultaneously, simultaneously or alternatively. The valve assembly includes a first valve 23, the first valve 23 having two outlets, and the two outlets of the first valve 23 are respectively communicated with the inlets of the two evaporation parts 10. Specifically, the first valve 23 may be a three-way solenoid valve or a three-way valve.

In some embodiments of the present invention, the refrigeration system 2 further includes two throttling devices, and the two throttling devices are respectively disposed on the pipeline between the two outlets of the first valve 23 and the inlets of the two evaporation portions 10. Specifically, the two throttling devices may be a first capillary tube 24 and a second capillary tube 25 with different tube diameters, so as to make the flow rates of the flowing refrigerants different.

In some embodiments of the present invention, the valve assembly further comprises a bypass line 27 and a second valve 26, the bypass line 27 is disposed between the outlets of the two throttling devices, and the second valve 26 is disposed on the bypass line 27. For example, the second valve 26 may be a solenoid valve.

Referring to fig. 1 to 4, the embodiment of the present invention further provides a refrigerator 3, which includes one or more storage compartments and the refrigeration system 2 in any one of the above embodiments.

In some embodiments, two evaporation portions 10 provide cold to two storage compartments, respectively.

In some preferred embodiments, the evaporator 1 is used to provide cold to the same storage compartment, i.e. both evaporation portions 10 provide cold to the same storage compartment. For example, the refrigerator 3 further includes a cooling chamber in which the evaporator 1 is disposed, a damper, and a blower fan 28. The refrigerator 3 further includes at least one storage compartment including a first storage compartment 31 and a second storage compartment 32, and the cooling compartment is in circulation communication with the first storage compartment 31 through a supply air path and a return air path. The cooling chamber is in circulation communication with the second storage compartment 32. The damper is configured to controllably open or close the air supply passage. The fan 28 is configured to cause airflow to flow from the air inlet side of the first evaporation portion 11 and the second evaporation portion 12 to the air outlet side of the first evaporation portion 11 and the second evaporation portion 12, and to cause airflow to circulate between the first storage compartment 31 and the cooling compartment, and to cause airflow to circulate between the second storage compartment 32 and the cooling compartment. In this embodiment, when two evaporation portions 10 work simultaneously, the first storage compartment 31 may be provided with cooling energy at the same time, or the second storage compartment 32 may be provided with cooling energy at the same time, which may be said to be that two evaporation portions 10 provide cooling energy to the same storage compartment.

In some embodiments of the present invention, when the refrigerator 3 is started to defrost, it is determined whether the compressor 20 is stopped.

If yes, firstly, the semiconductor refrigerating sheet generates heat at one side corresponding to the first evaporation part 11 so as to heat the first evaporation part 11 and defrost the first evaporation part 11. Then, the other side of the semiconductor refrigeration piece generates heat to heat the second evaporation part 12, so as to defrost the second evaporation part 12, delay a period of time for starting the compressor 20, and refrigerate the first evaporation part 11. After a period of time, the blower 28 is turned on.

If not, the first evaporation part 11 is cooled first, the fan 28 continues to operate, and one side of the semiconductor cooling sheet corresponding to the second evaporation part 12 generates heat to heat the second evaporation part 12, so as to defrost the second evaporation part 12. The fan 28 is turned off to generate heat from the other side of the semiconductor cooling fin to heat the first evaporation portion 11, defrost the first evaporation portion 11, and cool the second evaporation portion 12. And when the first evaporation part 11 and the second evaporation part 12 are defrosted, the defrosting is stopped.

In some embodiments of the present invention, when only the first storage compartment 31 needs to be cooled, the compressor 20 is operated according to the first preset frequency, and the first capillary tube 24 is utilized to throttle the refrigerant entering the first evaporation portion 11.

When only the second storage compartment 32 needs to be cooled, the compressor 20 is operated at the second preset frequency, and the refrigerant entering the second evaporation part 12 is throttled by the second capillary tube 25.

When the first storage compartment 31 and the second storage compartment 32 both need to be refrigerated, and when the difference between the temperature of the first storage compartment 31 and the starting point temperature of the first storage compartment 31 is greater than or equal to a first preset difference, it is determined whether the difference between the temperature of the second storage compartment 32 and the starting point temperature of the second storage compartment 32 is greater than or equal to a second preset difference. If yes, the compressor 20 is operated according to a third preset frequency, and the refrigerant is throttled by the first capillary tube 24 and then is divided into the first evaporation part 11 and the second evaporation part 12. In particular, the first preset difference may be 3 ℃ to 7 ℃, preferably 5 ℃. The second predetermined difference may be 3 ℃ to 7 ℃, preferably 5 ℃.

When the first storage compartment 31 and the second storage compartment 32 both need to be cooled, it is determined whether a difference between the temperature of the first storage compartment 31 and the starting point temperature of the first storage compartment 31 is smaller than a first preset difference, or whether a difference between the temperature of the second storage compartment 32 and the starting point temperature of the second storage compartment 32 is smaller than a second preset difference. If so, the compressor 20 is operated at a fourth preset frequency, and the refrigerant is throttled by the second capillary tube 25 and then is divided into the first evaporation part 11 and the second evaporation part 12.

The third preset frequency is greater than the fourth preset frequency, the fourth preset frequency is greater than the first preset frequency, and the first preset frequency is greater than the second preset frequency. Specifically, the third predetermined frequency is the rated frequency of the compressor 20, the fourth predetermined frequency is ninety percent of the rated frequency, the first predetermined frequency is eighty percent of the rated frequency of the compressor 20, and the second predetermined frequency is seventy percent of the rated frequency of the compressor 20.

The flow rate of the first capillary 24 is greater than the flow rate of the second capillary 25. Specifically, the flow rate of the first capillary 24 is 7L/min to 10L/min, preferably 7L/min. The flow rate of the second capillary 25 is 4L/min to 6L/min, preferably 5L/min. The two capillaries have different tube diameters to achieve different throttling capabilities.

The arrangement can realize the defrosting by dividing the surface, can also provide more reasonable cold quantity distribution in the normal refrigeration process, and realizes the energy-saving effect.

As shown in fig. 1, in some embodiments of the present invention, the refrigerator 3 further includes a water pan 33, a pressure sensor, a heating module, and two defrosting temperature sensors 16.

The drain pan 33 is provided below the two evaporation units 10. The pressure sensor is arranged on the water pan 33. The heating module is arranged on the water receiving tray 33 and can heat the water receiving tray 33. The two defrosting temperature sensors 16 are respectively provided on the two evaporation portions 10.

The frost falls into water collector 33 after sliding from radiating fin 14, and output signal to heating module after pressure sensor on water collector 33 detects pressure variation, heats water collector 33 behind the heating module received signal to frost melts in the water collector, flows out from the opening below water collector 33 after the frost melts into water. The arrangement avoids frost from falling into the water receiving tray to block the water receiving tray.

In some embodiments of the utility model, in the refrigerator start-up defrosting to the defrosting end and a period of time after the end, the power of heating module changes according to time and the pressure that the water collector receives, and after the refrigerator finishes defrosting, and when the pressure that the water collector received was 0, heating module stop heating.

Thus, it should be appreciated by those skilled in the art that while a number of exemplary embodiments of the invention have been shown and described in detail herein, many other variations and modifications can be made, consistent with the principles of the invention, which are directly determined or derived from the disclosure herein, without departing from the spirit and scope of the invention. Accordingly, the scope of the present invention should be understood and interpreted to cover all such other variations or modifications.

Claims (10)

1. An evaporator is characterized by comprising a refrigerating and heating device and two evaporation parts, wherein one side surface of the refrigerating and heating device refrigerates, and the other side surface of the heating device heats;

the two evaporation parts are respectively arranged at two sides of the refrigerating and heating device, so that the side surface of the refrigerating and heating device which generates heat heats the corresponding evaporation part.

2. An evaporator according to claim 1 wherein the cooling and heating means are semiconductor cooling fins.

3. An evaporator according to claim 2 further comprising two heat exchange plates; one or more semiconductor refrigerating sheets are arranged between the two heat exchange plates; the two evaporation parts are arranged on two sides of the two heat exchange plates;

each evaporation part comprises a refrigerant pipeline and at least one radiating fin arranged on the refrigerant pipeline; at least one of the heat radiating fins of each of the evaporation portions is in contact with one of the heat exchange plates.

4. An evaporator according to claim 2 or 3,

a heat insulation device is arranged between the two evaporation parts, and the refrigerating and heating device is arranged on the heat insulation device;

the heat insulation device is a heat insulation plate, and the heat insulation plate is arranged between the two evaporation parts; the heat insulation plate is provided with an installation through hole; the semiconductor refrigeration piece is arranged in the mounting through hole.

5. A refrigeration system comprising the evaporator of any one of claims 1 to 4.

6. The refrigerant system as set forth in claim 5, further comprising a valve assembly configured to operate both of said evaporators simultaneously, simultaneously stop or alternatively;

the valve assembly comprises a first valve, the first valve is provided with two outlets, and the two outlets of the first valve are respectively communicated with the inlets of the two evaporation parts.

7. The refrigeration system according to claim 6, further comprising two throttling devices respectively disposed on the pipelines between the two outlets of the first valve and the inlets of the two evaporation portions;

the valve assembly further comprises a bypass pipeline and a second valve, the bypass pipeline is arranged between the outlets of the two throttling devices, and the second valve is arranged on the bypass pipeline.

8. A refrigerator comprising at least one storage compartment and further comprising a refrigeration system according to any one of claims 5 to 7, said evaporator being adapted to provide refrigeration to the same storage compartment or two of said evaporator portions providing refrigeration to two of said storage compartments, respectively.

9. The refrigerator according to claim 8, further comprising:

the water receiving tray is arranged at the lower sides of the two evaporation parts;

the pressure sensor is arranged on the water receiving tray;

the heating module is arranged on the water pan;

and the two defrosting temperature sensors are respectively arranged on the two evaporation parts.

10. The refrigerator of claim 8, further comprising a cooling chamber, a damper, and a fan;

the evaporator is arranged in the cooling chamber;

at least one storage chamber comprises a first storage chamber and a second storage chamber,

the cooling chamber is circularly communicated with the first storage compartment through the air supply air path and the air return air path; the cooling chamber is communicated with the second storage chamber in a circulating manner;

the air door is configured to controllably open or close the air supply air path;

the fan is configured to cause airflow to circulate between the first storage compartment and the cooling compartment, and to cause airflow to circulate between the second storage compartment and the cooling compartment.

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