CN211120196U - Refrigerator with a door - Google Patents

Abstract

The utility model provides a refrigerator, include: the refrigerator comprises a box body, a first storage liner and a second storage liner, wherein the box body comprises at least one first storage liner and at least one second storage liner; the semiconductor refrigeration system is arranged in the first storage liner and is provided with a semiconductor chip and a liquid running pipe; the compression refrigeration system is arranged in the second storage liner and is configured to cool the hot end of the semiconductor chip by the refrigerant of the compression refrigeration system flowing through the liquid running pipe; and the connecting piece is provided with a through hole and is arranged between the first storage inner container and the second storage inner container, and the liquid walking pipe penetrates out of the first storage inner container, penetrates through the through hole, penetrates into the second storage inner container and then is connected with the compression refrigeration system. The refrigerator of the utility model utilizes the refrigerant of the compression refrigeration system to reduce the temperature of the hot end of the semiconductor refrigeration system, and can promote the semiconductor refrigeration system to provide cold energy for the deep cooling chamber; meanwhile, a connecting piece is arranged between the first storage inner container and the second storage inner container to facilitate the wiring of the liquid flowing pipe.

Description

Refrigerator with a door

Technical Field

The utility model relates to a household electrical appliances field especially relates to a refrigerator.

Background

With the increasing development of society and the continuous improvement of living standard of people, the pace of life of people is faster and faster, and a lot of food can be purchased and stored at one time. In order to ensure the storage effect of food, a refrigerator has become one of household appliances indispensable to people's daily life.

The current refrigerators are generally classified into compression refrigeration refrigerators and semiconductor refrigeration refrigerators according to the type of a refrigeration system. The temperature regulation precision of the compression refrigeration refrigerator is lower, generally +/-3.5 ℃, and the temperature regulation precision of the semiconductor refrigeration refrigerator can reach +/-0.1 ℃. Although the temperature adjusting precision of the semiconductor refrigeration refrigerator is high, the following defects exist: the semiconductor chip in the semiconductor refrigeration system is easily influenced by the external environment temperature, and when the external environment temperature is very high, the heat dissipation of the hot end of the semiconductor chip is difficult, so that the temperature of the hot end is increased, and the refrigerating capacity is reduced. Because the efficiency of the semiconductor refrigeration system is low, the semiconductor refrigeration system can only be applied to small-volume common refrigeration products or can only be used for radiating certain key components, and low-temperature refrigeration cannot be realized.

SUMMERY OF THE UTILITY MODEL

The utility model discloses an aim at realizes the degree of depth refrigeration of the specific storing compartment of refrigerator, satisfies the storage requirement of eating the material.

The utility model discloses a further purpose makes the tube coupling of refrigerator more convenient.

Particularly, the utility model provides a refrigerator, include:

the refrigerator comprises a box body, a first storage liner and a second storage liner, wherein the box body comprises at least one first storage liner and at least one second storage liner;

the semiconductor refrigeration system is arranged in the first storage liner and is provided with a semiconductor chip and a liquid running pipe;

the compression refrigeration system is arranged in the second storage liner and is configured to cool the hot end of the semiconductor chip by the refrigerant of the compression refrigeration system flowing through the liquid flowing pipe; and

the connecting piece is provided with a through hole and is arranged between the first storage inner container and the second storage inner container, and the liquid running pipe penetrates out of the first storage inner container, penetrates through the through hole and penetrates into the second storage inner container and then is connected with the compression refrigeration system.

Optionally, the connecting member has a main body portion, a first positioning portion disposed above the main body portion, and a second positioning portion disposed below the main body portion; wherein the main part is provided with a through hole, the first positioning part is used for fixing the connecting piece and the first storage liner, and the second positioning part is used for fixing the connecting piece and the second storage liner.

Optionally, the main body portion is disposed obliquely downward and forward from the first positioning portion.

Optionally, the main body portion is angled from 5 ° to 15 ° from the vertical.

Optionally, the liquid feeding pipe has a gap with the inner surface of the main body when passing through the through hole, and the gap is filled with a thermal insulation material.

Optionally, the outer surface of the first storage liner is provided with at least two positioning protrusions;

the first positioning part is provided with at least two positioning holes;

the positioning hole and the positioning bulge are correspondingly arranged, and the connecting piece is fixed by matching the positioning hole with the positioning bulge.

Optionally, the first positioning portion is configured to have a shape that conforms to an outer surface of the first storage bladder;

the second positioning portion is configured to have a shape that conforms to an outer surface of the second storage bladder.

Optionally, a sponge is arranged between the first positioning portion and the first storage liner to prevent the cold energy of the first storage liner from dissipating.

Optionally, the semiconductor refrigeration system further comprises: a hot heat exchanger bonded at least partially to the hot end;

the liquid flowing pipe is communicated with the heat exchanger and comprises a liquid inlet pipe and a liquid outlet pipe, so that the low-temperature refrigerant absorbs heat when entering the heat exchanger from the liquid inlet pipe to reduce the temperature of the hot end.

Optionally, the semiconductor refrigeration system further comprises: a cold heat exchanger at least partially bonded to the cold end of the semiconductor chip.

The refrigerator of the utility model utilizes the refrigerant of the compression refrigeration system to reduce the temperature of the hot end of the semiconductor refrigeration system, and can promote the semiconductor refrigeration system to provide cold energy for the deep cooling chamber; meanwhile, the compression refrigeration system and the semiconductor refrigeration system are arranged in different storage inner containers, and the connecting piece is arranged between the first storage inner container and the second storage inner container to facilitate wiring of the liquid flowing pipe, so that the structure is ingenious, the process is simple, and the cost is low.

Further, the utility model discloses a main part of connecting piece of refrigerator inclines forward downwards from first locating part and sets up, and the through hole of this kind of tilting makes the poling process more convenient.

Further, the utility model discloses a refrigerator sets up the locating protrusion through setting up the location on first storing inner bag, sets up the locating hole on first locating part, can guarantee the accurate installation of connecting piece.

The above and other objects, advantages and features of the present invention will become more apparent to those skilled in the art from the following detailed description of specific embodiments thereof, taken in conjunction with the accompanying drawings.

Drawings

Some specific embodiments of the present invention will be described in detail hereinafter, by way of illustration and not by way of limitation, with reference to the accompanying drawings. The same reference numbers in the drawings identify the same or similar elements or components. Those skilled in the art will appreciate that the drawings are not necessarily drawn to scale. In the drawings:

fig. 1 is a front view schematically illustrating a refrigerator according to an embodiment of the present invention.

Fig. 2 is a front view of the first and second storage liners of the refrigerator shown in fig. 1.

Fig. 3 is a schematic connection diagram of a compression refrigeration system and a semiconductor refrigeration system of the refrigerator shown in fig. 1.

Fig. 4 is a schematic structural view of a semiconductor cooling system of the refrigerator shown in fig. 1.

Fig. 5 is a perspective view of the combination of the first storage container, the second storage container and the connecting member of the refrigerator shown in fig. 1.

Fig. 6 is an exploded view of the first storage bladder, the second storage bladder, and the connecting member of the refrigerator shown in fig. 5.

Fig. 7 is a schematic structural view of a connecting member of the refrigerator shown in fig. 5.

Fig. 8 is a schematic structural view of a hot heat exchanger of the semiconductor cooling system of the refrigerator shown in fig. 1.

Fig. 9 is an exploded schematic view of the thermal heat exchanger shown in fig. 8.

Fig. 10 is a schematic view of the semiconductor refrigeration system of the refrigerator shown in fig. 1 providing cooling energy to the first storage compartment.

Detailed Description

Fig. 1 is a schematic front view of a refrigerator 100 according to an embodiment of the present invention. Fig. 2 is a front schematic view of the first and second storage liners 301, 302 of the refrigerator 100 shown in fig. 1. Fig. 3 is a schematic connection diagram of the compression refrigeration system 140 and the semiconductor refrigeration system 130 of the refrigerator 100 shown in fig. 1. Fig. 4 is a schematic structural view of the semiconductor cooling system 130 of the refrigerator 100 shown in fig. 1. The refrigerator 100 of the embodiment of the present invention may generally include: a tank 110, a semiconductor refrigeration system 130, a compression refrigeration system 140, and a connection 200.

The refrigerator 100 of the embodiment of the present invention has a box body 110 including a housing (not numbered in the figure) and a storage container disposed inside the housing, wherein a foaming layer (not shown in the figure) is disposed between the housing and the storage container, and a storage compartment is defined inside the storage container. The number, structure and positional relationship of the storage compartments of the refrigerator 100 may be configured as required. For example, the storage compartment may be configured as a refrigerating compartment, a freezing compartment, a temperature-changing compartment, a fresh-keeping compartment, a deep-cooling compartment, and the like, depending on the purpose. Each storage compartment can be divided into a plurality of storage areas by the partition plate, or a drawer is arranged in each storage compartment to store articles, or the storage compartments are arranged into a pull-out type storage device. In the refrigerator 100 shown in fig. 1 and 2, there are defined inside a casing: a second storage bladder 302 positioned lowermost, a first 301 and a third 303 storage bladder juxtaposed above the second storage bladder 302, and a fourth 304 storage bladder positioned uppermost. The second storage bladder 302 defines the second storage compartment 112, which is a freezer compartment; the first storage liner 301 defines a first storage compartment 111, which is a deep cooling compartment; the third storage liner 303 defines a third storage compartment 113, which is a temperature-changing compartment; fourth storage bladder 304 defines fourth storage compartment 114, which is a refrigeration compartment. The refrigerator 100 of the embodiment of the present invention may further include a door 120 pivotally disposed on the front surface of the box body 110 for the user to open and close the storage chamber. Each storage compartment may correspond to one or more door bodies 120. In the refrigerator 100 shown in fig. 1, the door 120 corresponding to the fourth storage compartment 114 is a pivoting door, and the rest of the storage compartments are drawer-type doors.

The utility model discloses in refrigerator 100, semiconductor refrigeration system 130 sets up in first storing inner bag 301, configures to and provides cold volume to first storing compartment 111, has semiconductor chip 131 and walks liquid pipe 150. The compression refrigeration system 140 is disposed in the second storage container 302, and configured to provide cooling energy to the second storage compartment 112, and the refrigerant of the compression refrigeration system 140 flows through the liquid flowing pipe 150 to cool the hot end 136 of the semiconductor chip 131. The cooling capacity of the third storage compartment 113 and the fourth storage compartment 114 may also be provided by a compression refrigeration system 140. The connecting element 200 has a through opening 220 and is arranged between the first storage bladder 301 and the second storage bladder 302. A through hole (not shown) is respectively formed on the first storage liner 301 and the second storage liner 302. The liquid outlet pipe 150 penetrates out of the first storage inner container 301, penetrates through the through hole 220, penetrates into the second storage inner container 302, and then is connected with the compression refrigeration system 140. The difficulty in dissipating heat from the hot side 136 of the semiconductor refrigeration system 130 may cause the temperature of the hot side 136 to increase, resulting in a decrease in cooling capacity. The refrigerator 100 of the embodiment of the present invention utilizes the refrigerant of the compression refrigeration system 140 to timely reduce the temperature of the hot end 136 of the semiconductor refrigeration system 130, and can promote the semiconductor refrigeration system 130 to provide cold energy to the first storage chamber 111, so that the first storage chamber 111 is more easily implemented with deep refrigeration, thereby satisfying the storage requirement of food materials and improving the storage effect of food materials; meanwhile, considering that the compression refrigeration system 140 and the semiconductor refrigeration system 130 are located in different storage inner containers, the connecting piece 200 is arranged between the first storage inner container 301 and the second storage inner container 302 to facilitate the routing of the liquid-flowing pipe 150, and the structure is ingenious, the process is simple, and the cost is low.

As shown in fig. 3 and 4, the compression refrigeration system 140 includes: a compressor 141, a condenser 142, a capillary tube 143, and an evaporator 144. The semiconductor refrigeration system 130 includes: a semiconductor chip 131, a hot heat exchanger 132, and a cold heat exchanger 133. Semiconductor chip 131 is disposed between hot heat exchanger 132 and cold heat exchanger 133, having hot end 136 and cold end 137. The hot heat exchanger 132 is at least partially bonded to the hot end 136. The liquid outlet pipe 150 is in communication with the heat exchanger 132 and includes a liquid inlet pipe 151 and a liquid outlet pipe 152. The cold heat exchanger 133 is at least partially bonded to the cold end 137. The heat exchanger 132 is connected to the capillary tube 143 via an inlet pipe 151 and to the evaporator 144 via an outlet pipe 152. The low temperature refrigerant absorbs heat when entering the heat exchanger 132 from the inlet pipe 151, thereby lowering the temperature of the hot end 136.

As shown in fig. 5, 6 and 7, in some embodiments, the connecting member 200 has a main body portion 202, a first positioning portion 201 disposed above the main body portion 202, and a second positioning portion 203 disposed below the main body portion 202; the main body 202 is provided with a through hole 220, the first positioning portion 201 is used for fixing the connecting piece 200 and the first storage liner 301, and the second positioning portion 203 is used for fixing the connecting piece 200 and the second storage liner 302. The connector 200 may be made of plastic such as ABS, PS, etc. or metal.

In a preferred embodiment, the main body portion 202 is disposed to be inclined downward and forward from the first positioning portion 201. More preferably, the body portion 202 is angled from 5 to 15 from vertical. When the semiconductor refrigeration system 130 is installed, because the space of the first storage compartment 111 is limited, the whole semiconductor refrigeration system 130 is horizontally placed at the rear part of the first storage liner 301, then turned over by a certain angle to enable the liquid inlet pipe 151 and the liquid outlet pipe 152 to be obliquely inserted into the through hole 220 of the connecting piece 200, and then the liquid inlet pipe 151 and the liquid outlet pipe 152 are introduced into the second storage liner 302 to be connected with the capillary and the evaporator. The main body 202 of the connecting member 200 of the refrigerator 100 of the embodiment of the present invention is inclined downwards and forwards from the first positioning portion 201, and the through hole 220 of this inclined type facilitates the pipe passing process of the liquid inlet pipe 151 and the liquid outlet pipe 152.

In some embodiments, liquid inlet tube 151 and liquid outlet tube 152 have a gap with the inner surface of body portion 202 when passing through-hole 220, and the gap is filled with a thermal insulation material (not shown). The insulating material is not limited to foam. The utility model discloses refrigerator 100 fills insulation material through the clearance at the internal surface of feed liquor pipe 151 and drain pipe 152 and main part 202, can guarantee that the cold volume of first storing compartment 111 can not transmit second storing compartment 112 through connecting piece 200.

In some embodiments, the first storage bladder 301 has at least two locating projections 310 disposed on an outer surface thereof; the first positioning portion 201 is provided with at least two positioning holes 210; the positioning hole 210 and the positioning protrusion 310 are correspondingly disposed, and the positioning hole 210 and the positioning protrusion 310 are adapted to fix the connector 200. As shown in fig. 6, two positioning projections 310 are provided on the rear wall 311 of the first storage bladder 301. The utility model discloses refrigerator 100 sets up locating hole 210 through setting up location arch 310 on first storing inner bag 301 on first locating part 201, can guarantee the accurate installation of connecting piece 200.

In some embodiments, the first positioning portion 201 is configured to have a shape that conforms to an outer surface of the first storage bladder 301; the second locator 203 is configured to have a shape that conforms to the outer surface of the second storage bladder 302. As shown in fig. 7, the first positioning portion 201 forms an arc structure to cooperate with the first storage liner 301; the second positioning portion 203 is formed with an arc structure to cooperate with the second storage liner 302. Preferably, a sponge (not shown in the figures) is further disposed between the first positioning portion 201 and the first storage liner 301, so that the cold energy of the first storage compartment 111 can be prevented from being dissipated through the through hole on the first storage liner 301.

Fig. 8 is a schematic structural view of the hot heat exchanger 132 of the semiconductor cooling system 130 of the refrigerator 100 shown in fig. 1. Fig. 9 is an exploded schematic view of the thermal heat exchanger 132 shown in fig. 8. The heat exchanger 132 is a flat plate, and includes a cover plate 153 and a back plate 154, a groove 155 is formed in the back plate 154, and the cover plate 153 covers the groove 155. The low-temperature refrigerant flows into the groove 155 from the liquid inlet pipe 151, flows along the groove 155, and flows out through the liquid outlet pipe 152. Preferably, the groove 155 is shaped as a curve with a predetermined number of inflection points, so that the flowing area of the low-temperature refrigerant inside the heat exchanger 132 can be increased, the heat exchange efficiency can be improved, and the temperature of the hot end 136 can be effectively reduced. In other embodiments, the interior of the heat exchanger 132 may also be perforated or have copper tubes or other forms for flowing the low-temperature refrigerant therein.

As shown in fig. 4, in some embodiments, the semiconductor refrigeration system 130 further comprises: a thermally conductive layer 134 and a thermally insulating layer 135. The heat conductive layer 134 is made of a material with high thermal conductivity, and the hot heat exchanger 132 is partially adhered to the hot end 136 through the heat conductive layer 134, and the cold heat exchanger 133 is partially adhered to the cold end 137 through the heat conductive layer 134. Good heat transfer between the hot heat exchanger 132 and the hot end 136, and between the cold end 137 and the cold heat exchanger 133 is possible due to the high thermal conductivity of the thermally conductive layer 134. The material of the heat conductive layer 134 may be heat conductive silicone grease, liquid metal, or the like. The thermal insulation layer 135 is made of a material with low thermal conductivity, and the thermal insulation layer 135 is disposed at a position other than the semiconductor chip 131 between the hot heat exchanger 132 and the cold heat exchanger 133, and configured to insulate the hot heat exchanger 132 and the cold heat exchanger 133. Since the semiconductor chip 131 is generally thin, the hot heat exchanger 132 and the cold heat exchanger 133 are closer to each other, and the thermal insulation layer 135 is added between the hot heat exchanger 132 and the cold heat exchanger 133 except the semiconductor chip 131, so that the heat conduction between the hot heat exchanger 132 and the cold heat exchanger 133 can be effectively prevented from affecting the cooling effect. Specifically, the material of the thermal insulation layer 135 may be selected from foam, foaming material, PE cotton, aerogel, and the like.

The refrigeration principle of the semiconductor refrigeration system 130 mainly utilizes the peltier effect: when current passes through a loop formed by different conductors, in addition to generating irreversible joule heat, heat absorption and heat release phenomena respectively occur at joints of different conductors along with different current directions. Semiconductor chip 131 creates a temperature difference between hot end 136 and cold end 137 after being powered on, so that after the temperature of hot end 136 is reduced, the temperature of cold end 137 is reduced to a first temperature value.

Further, the semiconductor refrigeration system 130 is configured to: after the temperature of cold end 137 is subsequently reduced to the first temperature value, the cold at cold end 137 is conducted to cold heat exchanger 133. As shown in fig. 10, the refrigerator 100 further includes: and a fan 163 disposed in the air duct 160 of the first storage compartment 111 and configured to transfer the cold energy of the cold heat exchanger 133 to the first storage compartment 111. It is noted that the cold end 137 and the cold heat exchanger 133 are disposed at a side close to the first storage compartment 111 in order to lower the temperature of the first storage compartment 111. Specifically, the air duct 160 may be provided with an air supply outlet 161 at a position corresponding to the fan 163 to supply cold to the first storage compartment 111; the bottom of the first storage compartment 111 may be provided with an air return opening 162 to return the air with the increased temperature to the semiconductor refrigeration system 130, thus forming an air circulation. In some preferred embodiments, after the cold energy of the cold heat exchanger 133 is transferred to the first storage compartment 111, the temperature of the first storage compartment 111 is decreased to a second temperature value, wherein the first temperature value is lower than the second temperature value, and the second temperature value is-30 ℃ to-60 ℃. That is, there is some loss in the conduction of cold from the cold end 137 to the first storage compartment 111, for example the first temperature value may be 5 ℃ lower than the second temperature value. The second temperature value of the first storage chamber 111 can reach-30 ℃ to-60 ℃, and the storage requirements of some special food materials can be met.

The work flow of the compression refrigeration system 140 and the semiconductor refrigeration system 130 is briefly described below. When the compression refrigeration system 140 operates, a low-temperature refrigerant absorbs heat when flowing through the hot heat exchanger 132, the hot heat exchanger 132 and the hot end 136 are adhered through the heat conduction layer 134, the hot end 136 is cooled, the semiconductor chip 131 enables the hot end 136 and the cold end 137 to generate temperature difference due to the peltier effect when being electrified, the temperature of the cold end 137 is reduced to a first temperature value, cold of the cold end 137 is conducted to the cold heat exchanger 133 through the heat conduction layer 134, the cold of the cold heat exchanger 133 is transmitted to the first storage compartment 111 through the fan 163 in the air duct 160, the temperature inside the cold heat exchanger is reduced to a second temperature value, and the cryogenic function is achieved. When the semiconductor chip 131 is not powered on, the compression refrigeration system 140 operates normally, the low-temperature refrigerant still flows through the hot heat exchanger 132 to cool the hot end 136, and although there is no temperature difference between the hot end 136 and the cold end 137, the cold energy can still be transmitted to the first storage compartment 111 through the cold end 137, the cold heat exchanger 133 and the fan 163 in sequence. Although the amount of cooling transmitted to the first storage compartment 111 is smaller than that when the semiconductor chip 131 is energized, the first storage compartment 111 can be used as a normal freezing compartment without consuming extra power. In addition, when the compression refrigeration system 140 stops operating, the hot end 136 and the cold end 137 can be exchanged by applying a reverse voltage to the semiconductor chip 131, so that the cold heat exchanger 133 can be heated and defrosted.

The temperature difference between hot end 136 and cold end 137 is not fixed and may be 20 c to 30 c in low temperature environments and greater in normal environmental conditions. That is, in a low temperature environment, it may be difficult to achieve a low temperature of the cold end 137, and thus, it may be difficult to achieve a cryogenic function of the storage compartment. The utility model discloses refrigerator 100 combines traditional compression refrigerating system 140, take away the heat of hot heat exchanger 132 fast through the low temperature refrigerant, maintain hot junction 136 in low temperature environment, with the help of semiconductor chip 131's hot junction 136 and cold junction 137's self difference in temperature, realize cold junction 137 temperature further drop, the strong convection mode heat transfer of rethread fan 163, realize first storing compartment 111 and realize deep cooling, the energy consumption is low in the refrigeration process, and semiconductor refrigerating system 130 is by electric energy direct conversion energy, effectively avoid the noise, promote user's use and experience.

Thus, it should be appreciated by those skilled in the art that while a number of exemplary embodiments of the invention have been shown and described in detail herein, many other variations and modifications can be made, consistent with the principles of the invention, which are directly determined or derived from the disclosure herein, without departing from the spirit and scope of the invention. Accordingly, the scope of the present invention should be understood and interpreted to cover all such other variations or modifications.

Claims (10)

1. A refrigerator, characterized by comprising:

the refrigerator comprises a box body, a first storage liner and a second storage liner, wherein the box body comprises at least one first storage liner and at least one second storage liner;

the semiconductor refrigeration system is arranged in the first storage liner and is provided with a semiconductor chip and a liquid running pipe;

the compression refrigeration system is arranged in the second storage liner and is configured to cool the hot end of the semiconductor chip by the refrigerant of the compression refrigeration system flowing through the liquid running pipe; and

and the connecting piece is provided with a through hole and is arranged between the first storage inner container and the second storage inner container, and the liquid walking pipe penetrates out of the first storage inner container, penetrates through the through hole, penetrates into the second storage inner container and then is connected with the compression refrigeration system.

2. The refrigerator according to claim 1,

the connecting piece is provided with a main body part, a first positioning part arranged above the main body part and a second positioning part arranged below the main body part; the main body part is provided with the through hole, the first positioning part is used for fixing the connecting piece and the first storage inner container, and the second positioning part is used for fixing the connecting piece and the second storage inner container.

3. The refrigerator according to claim 2,

the main body portion is disposed obliquely downward and forward from the first positioning portion.

4. The refrigerator according to claim 3,

the main body part and the vertical surface form an included angle of 5-15 degrees.

5. The refrigerator according to claim 3,

when the liquid feeding pipe passes through the through opening, a gap is formed between the liquid feeding pipe and the inner surface of the main body, and a heat insulating material is filled in the gap.

6. The refrigerator according to claim 2,

the outer surface of the first storage inner container is provided with at least two positioning bulges;

the first positioning part is provided with at least two positioning holes;

the positioning hole and the positioning bulge are correspondingly arranged, and the connecting piece is fixed by matching the positioning hole with the positioning bulge.

7. The refrigerator according to claim 2,

the first positioning part is configured to be in a shape fitting with the outer surface of the first storage liner;

the second positioning portion is configured to have a shape that conforms to an outer surface of the second storage bladder.

8. The refrigerator according to claim 7,

sponge is arranged between the first positioning part and the first storage inner container to prevent the cold quantity of the first storage inner container from dissipating.

9. The refrigerator according to claim 1,

the semiconductor refrigeration system further comprises: a hot heat exchanger bonded at least partially to the hot end;

the liquid flowing pipe is communicated with the heat exchanger and comprises a liquid inlet pipe and a liquid outlet pipe, so that low-temperature refrigerant absorbs heat when entering the heat exchanger from the liquid inlet pipe to reduce the temperature of the hot end.

10. The refrigerator of claim 9, wherein,

the semiconductor refrigeration system further comprises: a cold heat exchanger at least partially bonded to the cold end of the semiconductor chip.

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