CN112577229A - Refrigerator with a door - Google Patents

Abstract

The invention provides a refrigerator. Wherein this refrigerator includes: the refrigerator comprises a box body, a storage box and a control device, wherein at least a first storage space and a second storage space are defined in the box body; the semiconductor refrigeration system is configured to provide cold energy to the first storage space; and the compression refrigeration system is configured to provide cold energy for the second storage space and reduce the temperature of the hot end of the semiconductor refrigeration system. According to the refrigerator, the compression refrigeration system reduces the temperature of the hot end of the semiconductor refrigeration system, and the semiconductor refrigeration system can be promoted to provide cold energy for the first storage space, so that the first storage space can realize deep refrigeration, the storage requirement of food materials is met, and the storage effect of the food materials is improved.

Description

Refrigerator with a door

Technical Field

The invention relates to the field of household appliances, in particular to a refrigerator.

Background

With the increasing development of society and the continuous improvement of living standard of people, the pace of life of people is faster and faster, and a lot of food can be purchased and stored at one time. In order to ensure the storage effect of food, a refrigerator has become one of household appliances indispensable to people's daily life.

The current refrigerators are generally classified into compression refrigeration refrigerators and semiconductor refrigeration refrigerators according to the type of a refrigeration system. The temperature regulation precision of the compression refrigeration refrigerator is lower, generally +/-3.5 ℃, and the temperature regulation precision of the semiconductor refrigeration refrigerator can reach +/-0.1 ℃. Although the temperature adjusting precision of the semiconductor refrigeration refrigerator is high, the following defects exist: the semiconductor chip in the semiconductor refrigeration system is easily influenced by the external environment temperature, and when the external environment temperature is very high, the heat dissipation of the hot end of the semiconductor chip is difficult, so that the temperature of the hot end is increased, and the refrigerating capacity is reduced. Because the efficiency of the semiconductor refrigeration system is low, the semiconductor refrigeration system can only be applied to small-volume common refrigeration products or can only be used for radiating certain key components, and low-temperature refrigeration cannot be realized.

Disclosure of Invention

The invention aims to realize deep refrigeration of a specific storage space of a refrigerator and meet the storage requirement of food materials.

A further object of the invention is to reduce energy consumption and noise and to improve the user experience.

In particular, the present invention provides a refrigerator comprising: the refrigerator comprises a box body, a storage box and a control device, wherein at least a first storage space and a second storage space are defined in the box body; the semiconductor refrigeration system is configured to provide cold energy to the first storage space; and the compression refrigeration system is configured to provide cold energy for the second storage space and reduce the temperature of the hot end of the semiconductor refrigeration system.

Optionally, the semiconductor refrigeration system comprises: the semiconductor chip is arranged between the hot heat exchanger and the cold heat exchanger, the semiconductor chip is provided with a hot end and a cold end, the hot heat exchanger is partially adhered to the hot end, and the cold heat exchanger is partially adhered to the cold end.

Optionally, the compression refrigeration system comprises: the low-temperature refrigerant absorbs heat when flowing through the heat exchanger, and the temperature of the hot end is reduced.

Optionally, the heat exchanger is connected to the capillary tube through a liquid inlet pipe and connected to the evaporator through a liquid outlet pipe, the heat exchanger is flat and provided with a groove therein, and the low-temperature refrigerant flows into the groove through the liquid inlet pipe and flows out through the liquid outlet pipe after flowing along the groove.

Optionally, the shape of the groove is a curve with a predetermined number of inflection points.

Optionally, the semiconductor refrigeration system is further configured to: after reducing the temperature of the hot end, the temperature of the cold end is reduced to the first temperature value.

Optionally, the semiconductor refrigeration system is further configured to: after the temperature of the cold end is reduced to the first temperature value, the cold quantity of the cold end is conducted to the cold heat exchanger, and the refrigerator further comprises: and the fan is arranged in the air channel of the first storage space and is configured to transmit the cold energy of the cold heat exchanger to the first storage space.

Optionally, after the cold energy of the cold heat exchanger is transmitted to the first storage space, the temperature of the first storage space is reduced to a second temperature value, wherein the first temperature value is lower than the second temperature value, and the second temperature value is-30 ℃ to-60 ℃.

Optionally, the semiconductor refrigeration system further comprises: and the heat conduction layer is made of a material with a high heat conduction coefficient, the hot heat exchanger is partially adhered to the hot end through the heat conduction layer, and the cold heat exchanger is partially adhered to the cold end through the heat conduction layer.

Optionally, the semiconductor refrigeration system further comprises: and the heat insulation layer is made of a material with low heat conductivity coefficient, is arranged at a position between the hot heat exchanger and the cold heat exchanger except the semiconductor chip and is configured to isolate the hot heat exchanger from the cold heat exchanger.

The refrigerator of the present invention includes: the refrigerator comprises a box body, a storage box and a control device, wherein at least a first storage space and a second storage space are defined in the box body; the semiconductor refrigeration system is configured to provide cold energy to the first storage space; and the compression refrigeration system is configured to provide cold energy for the second storage space and reduce the temperature of the hot end of the semiconductor refrigeration system. The compression refrigeration system reduces the temperature of the hot end of the semiconductor refrigeration system, and can promote the semiconductor refrigeration system to provide cold energy to the first storage space, so that the first storage space realizes deep refrigeration, the storage requirement of food materials is met, and the storage effect of the food materials is improved.

Further, the refrigerator absorbs heat when a low-temperature refrigerant of the compression refrigeration system flows through the hot heat exchanger, the temperature of the hot end is reduced, the temperature of the cold end is reduced to the first temperature value, and the cold quantity of the cold end is conducted to the cold heat exchanger. The refrigerator further includes: the fan is arranged in the air channel of the first storage space and is configured to transmit the cold energy of the cold heat exchanger to the first storage space, the temperature of the first storage space is reduced to a second temperature value, the first temperature value is lower than the second temperature value, and the second temperature value is-30 ℃ to-60 ℃. Combine traditional compression refrigerating system of refrigerator, take away the heat of heat exchanger fast through the low temperature refrigerant, maintain the hot junction in low temperature environment, with the help of the self difference in temperature of semiconductor chip hot junction and cold junction, realize that the cold junction temperature further descends, the strong convection current mode heat transfer of rethread fan realizes first storing space and realizes deep refrigeration, the energy consumption is low among the refrigeration process, and semiconductor refrigerating system is by electric energy direct conversion energy, effectively avoid the noise, promote user's use and experience.

The above and other objects, advantages and features of the present invention will become more apparent to those skilled in the art from the following detailed description of specific embodiments thereof, taken in conjunction with the accompanying drawings.

Drawings

Some specific embodiments of the invention will be described in detail hereinafter, by way of illustration and not limitation, with reference to the accompanying drawings. The same reference numbers in the drawings identify the same or similar elements or components. Those skilled in the art will appreciate that the drawings are not necessarily drawn to scale. In the drawings:

fig. 1 is a schematic structural view of a refrigerator according to one embodiment of the present invention;

fig. 2 is a schematic view of a connection structure of a compression refrigerating system and a semiconductor refrigerating system in a refrigerator according to an embodiment of the present invention;

FIG. 3 is a schematic diagram of a semiconductor refrigeration system in a refrigerator according to one embodiment of the present invention;

FIG. 4 is a schematic diagram of a hot heat exchanger of a semiconductor refrigeration system in a refrigerator according to one embodiment of the present invention;

FIG. 5 is an exploded view of the thermal heat exchanger shown in FIG. 4; and

fig. 6 is a schematic view of a semiconductor refrigeration system in a refrigerator according to an embodiment of the present invention providing cooling energy to a first storage space.

Detailed Description

This embodiment provides a refrigerator, can reduce the temperature of semiconductor refrigerating system's hot junction through compression refrigerating system, promotes semiconductor refrigerating system and provides cold volume to first storing space, and then makes first storing space realize the deep refrigeration, satisfies the storage requirement of eating the material, promotes the storage effect of eating the material. Fig. 1 is a schematic structural view of a refrigerator 100 according to an embodiment of the present invention, and fig. 2 is a schematic structural view of a connection structure of a compression refrigeration system 140 and a semiconductor refrigeration system 130 in the refrigerator 100 according to an embodiment of the present invention. As shown in fig. 1 and 2, the refrigerator 100 of the present embodiment may generally include: a tank 110, a semiconductor refrigeration system 130, and a compression refrigeration system 140.

Wherein at least a first storage space 111 and a second storage space 112 are defined inside the case 110. In fact, the number and structure of the storage spaces can be configured as required. And the storage space can be configured into a refrigerating space, a freezing space, a temperature changing space or a fresh-keeping space according to different purposes. Each storage space may be divided into a plurality of storage regions by a partition plate, and the articles may be stored by a rack or a drawer. As shown in fig. 1, the refrigerator 100 of the present embodiment may have four storage spaces defined inside the cabinet 110: a first storage space 111, a second storage space 112, a third storage space 113 and a fourth storage space 114. The second storage space 112 may be located at the top and may be a refrigerating space; the first storage space 111 and the third storage space 113 may be arranged below the second storage space 112 side by side, the first storage space 111 may be a deep cooling space, and the third storage space 113 may be a temperature changing space; the fourth storage space 114 may be disposed at the lowermost portion to be a freezing space.

The refrigerator 100 of the present embodiment may further include: the door 120 is pivotally disposed on a front surface of the cabinet 110, so that a user can open and close the storage space. The door bodies 120 may be disposed corresponding to the storage spaces, that is, each storage space corresponds to one or more door bodies 120. The door 120 may be opened by pivoting or may be opened by sliding, for example, the door 120 corresponding to the second storage space 112 is opened by pivoting, and the rest of the storage spaces may be opened by sliding.

The semiconductor refrigeration system 130 can be configured to provide cooling to the first storage space 111. The compression refrigeration system 140 can be configured to provide refrigeration to the second storage space 112. Since the refrigerator 100 of the present embodiment is further provided with the third storage space 113 and the fourth storage space 114 in addition to the first storage space 111 and the second storage space 112, the other storage spaces can be provided with the cooling capacity by the compression refrigeration system 140 in addition to the first storage space 111 provided with the cooling capacity by the semiconductor refrigeration system 130.

It should be noted that the compression refrigeration system 140 provides different cooling capacities to the storage spaces, so that the temperatures in the storage spaces are different. Wherein the temperature in the refrigerated space is generally between 2 ℃ and 10 ℃, preferably between 4 ℃ and 7 ℃. The temperature in the refrigerated space is typically in the range of-22 ℃ to-14 ℃. The optimal storage temperatures of different types of articles are different, and thus the storage spaces suitable for storage are also different. For example, fruits and vegetables are suitable for storage in a refrigerated space or a fresh-keeping space, while meat is suitable for storage in a refrigerated space. The temperature changing space can be internally provided with a heating device for heating food.

More importantly, the compression refrigeration system 140, in addition to providing cooling to the storage space, may be configured to: the temperature of the hot side 136 of the semiconductor refrigeration system 130 is reduced. The hot side 136 of the semiconductor refrigeration system 130 may have difficulty dissipating heat, which may cause the temperature of the hot side 136 to increase and thus reduce the cooling capacity. Compression refrigeration system 140 in time reduces the temperature of hot junction 136 of semiconductor refrigeration system 130, can promote semiconductor refrigeration system 130 to provide cold volume to first storing space 111, and then makes first storing space 111 realize deep cooling, satisfies the storage requirement of eating the material, promotes the storage effect of eating the material.

Fig. 3 is a schematic structural view of a semiconductor refrigeration system 130 in the refrigerator 100 according to an embodiment of the present invention. As shown in fig. 2 and 3, the semiconductor cooling system 130 may include: a semiconductor chip 131, a hot heat exchanger 132, and a cold heat exchanger 133. Wherein the semiconductor chip 131 is disposed between the hot heat exchanger 132 and the cold heat exchanger 133, and the semiconductor chip 131 has a hot end 136 and a cold end 137, the hot heat exchanger 132 is partially bonded to the hot end 136, and the cold heat exchanger 133 is partially bonded to the cold end 137.

In a preferred embodiment, the semiconductor refrigeration system 130 may further include: a thermally conductive layer 134 and a thermally insulating layer 135. The heat conducting layer 134 is made of a material with a high thermal conductivity coefficient, the hot heat exchanger 132 is partially adhered to the hot end 136 through the heat conducting layer 134, and the cold heat exchanger 133 is partially adhered to the cold end 137 through the heat conducting layer 134. Good heat transfer between the hot heat exchanger 132 and the hot end 136, and between the cold end 137 and the cold heat exchanger 133 is possible due to the high thermal conductivity of the thermally conductive layer 134. Specifically, the material of the heat conductive layer 134 may include, but is not limited to: heat-conducting silicone grease, liquid metal.

The thermal insulation layer 135 is made of a material with low thermal conductivity, and the thermal insulation layer 135 is disposed at a position other than the semiconductor chip 131 between the hot heat exchanger 132 and the cold heat exchanger 133, and configured to insulate the hot heat exchanger 132 and the cold heat exchanger 133. Since the semiconductor chip 131 is generally thin, the hot heat exchanger 132 and the cold heat exchanger 133 are closer to each other, and the thermal insulation layer 135 is added between the hot heat exchanger 132 and the cold heat exchanger 133 except the semiconductor chip 131, so that the heat conduction between the hot heat exchanger 132 and the cold heat exchanger 133 can be effectively prevented from affecting the cooling effect. Specifically, the material of the thermal insulation layer 135 may include, but is not limited to: foam, foaming material, PE cotton and aerogel.

As shown in fig. 2, the compression refrigeration system 140 may include: the compressor 141, the condenser 142, the capillary tube 143, and the evaporator 144, and the hot heat exchanger 132 is disposed between the capillary tube 143 and the evaporator 144, the low temperature refrigerant absorbs heat when flowing through the hot heat exchanger 132, and the temperature of the hot end 136 is reduced. Fig. 4 is a schematic structural diagram of a hot heat exchanger 132 of a semiconductor refrigeration system 130 in the refrigerator 100 according to an embodiment of the present invention, and fig. 5 is an exploded structural diagram of the hot heat exchanger 132 shown in fig. 4. As shown in fig. 2 to 5, the heat exchanger 132 is connected to the capillary tube 143 through the liquid inlet tube 151 and to the evaporator 144 through the liquid outlet tube 152.

The heat exchanger 132 is a flat plate and has a groove 155 formed therein, and a low-temperature refrigerant flows into the groove 155 through the liquid inlet pipe 151, flows along the groove 155, and flows out through the liquid outlet pipe 152. Preferably, the groove 155 is shaped as a curve with a predetermined number of inflection points, so that the flowing area of the low-temperature refrigerant inside the heat exchanger 132 can be increased, the heat exchange efficiency can be improved, and the temperature of the hot end 136 can be effectively reduced. In one embodiment, as shown in fig. 4 and 5, the heat exchanger 132 may include a cover plate 153 and a back plate 154, the back plate 154 has a groove 155, and the cover plate 153 covers the groove 155. In other embodiments, the interior of the heat exchanger 132 may also be perforated or have copper tubes or other forms for flowing the low-temperature refrigerant therein.

Fig. 6 is a schematic diagram of the semiconductor refrigeration system 130 in the refrigerator 100 for providing cold energy to the first storage space 111 according to one embodiment of the invention. The semiconductor refrigeration system 130 is further configured to: after reducing the temperature of hot end 136, the temperature of cold end 137 is reduced to a first temperature value. The refrigeration principle of the semiconductor refrigeration system 130 mainly utilizes the peltier effect: when current passes through a loop formed by different conductors, in addition to generating irreversible joule heat, heat absorption and heat release phenomena respectively occur at joints of different conductors along with different current directions. Semiconductor chip 131 creates a temperature difference between hot end 136 and cold end 137 after being powered on, so that after the temperature of hot end 136 is reduced, the temperature of cold end 137 is reduced to a first temperature value.

Further, after the temperature of cold end 137 is subsequently reduced to the first temperature value, the cold energy of cold end 137 is conducted to cold heat exchanger 133. Also, as shown in fig. 6, the refrigerator 100 may further include: and a fan 163 disposed in the air duct 160 of the first storage space 111 and configured to transfer the cold energy of the cold heat exchanger 133 to the first storage space 111. It is noted that the cold end 137 and the cold heat exchanger 133 are disposed at a side close to the first storage space 111 so as to lower the temperature of the first storage space 111. Specifically, the air duct 160 may be provided with an air supply outlet 161 at a position corresponding to the fan 163 to supply cold to the first storage space 111; the bottom of the first storage space 111 may be provided with a return air opening 162 to return the air having the increased temperature to the semiconductor refrigeration system 130, thus forming an air circulation.

In a preferred embodiment, after the cold energy of the cold heat exchanger 133 is transmitted to the first storage space 111, the temperature of the first storage space 111 is reduced to a second temperature value, wherein the first temperature value is lower than the second temperature value, and the second temperature value is-30 ℃ to-60 ℃. That is, there is a certain loss in the process of transferring the cold energy of the cold end 137 to the first storage space 111, for example, the first temperature value may be 5 ℃ lower than the second temperature value. The second temperature value of the first storage space 111 can reach-30 ℃ to-60 ℃, and the storage requirements of some special food materials can be met.

One embodiment is described below: when the compression refrigeration system 140 operates, a low-temperature refrigerant absorbs heat when flowing through the hot heat exchanger 132, the hot heat exchanger 132 and the hot end 136 are adhered through the heat conduction layer 134, the hot end 136 is cooled, the semiconductor chip 131 enables the hot end 136 and the cold end 137 to generate temperature difference due to the peltier effect when being electrified, the temperature of the cold end 137 is reduced to a first temperature value, cold of the cold end 137 is conducted to the cold heat exchanger 133 through the heat conduction layer 134, the cold of the cold heat exchanger 133 is transmitted to the first storage space 111 through the fan 163 in the air duct 160, the temperature inside the cold heat exchanger is reduced to a second temperature value, and the deep cooling function is achieved.

It should be noted that when the semiconductor chip 131 is not powered on, the compression refrigeration system 140 operates normally, the low-temperature refrigerant still flows through the hot heat exchanger 132 to cool the hot end 136, and although there is no temperature difference between the hot end 136 and the cold end 137, the cold energy may still be transmitted to the first storage space 111 through the cold end 137, the cold heat exchanger 133, and the fan 163 in sequence. Although the amount of cooling energy transmitted to the first storage space 111 is less than that when the semiconductor chip 131 is powered on, the first storage space 111 can be used as a normal freezing space without consuming extra electric energy. In addition, when the compression refrigeration system 140 stops operating, the hot end 136 and the cold end 137 can be exchanged by applying a reverse voltage to the semiconductor chip 131, so that the cold heat exchanger 133 can be heated and defrosted.

It is emphasized that the temperature difference between the hot end 136 and the cold end 137 is not constant, and in low ambient temperatures, the temperature difference may be 20 c to 30 c, and in normal ambient conditions, the temperature difference may be greater. That is, in a low temperature environment, it may be difficult to achieve a low temperature of the cold end 137, and thus it may be difficult to achieve a cryogenic function in the storage space. Refrigerator 100 of this embodiment, combine traditional compression refrigerating system 140, take away the heat of hot heat exchanger 132 fast through the cryogenic cycle, maintain hot junction 136 in low temperature environment, with the help of semiconductor chip 131's hot junction 136 and cold junction 137's self difference in temperature, realize cold junction 137 temperature further drop, the strong convection mode heat transfer of rethread fan 163, realize first storing space 111 and realize deep refrigeration, the energy consumption is low among the refrigeration process, and semiconductor refrigerating system 130 is by electric energy direct conversion energy, effectively avoid producing the noise, promote user's use and experience.

Thus, it should be appreciated by those skilled in the art that while a number of exemplary embodiments of the invention have been illustrated and described in detail herein, many other variations or modifications consistent with the principles of the invention may be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the invention. Accordingly, the scope of the invention should be understood and interpreted to cover all such other variations or modifications.

Claims (10)

1. A refrigerator, comprising:

the refrigerator comprises a box body, a storage box and a control device, wherein at least a first storage space and a second storage space are defined in the box body;

the semiconductor refrigeration system is configured to provide cold energy to the first storage space; and

and the compression refrigeration system is configured to provide cold energy for the second storage space and reduce the temperature of the hot end of the semiconductor refrigeration system.

2. The refrigerator according to claim 1,

the semiconductor refrigeration system includes: a semiconductor chip, a hot heat exchanger and a cold heat exchanger, wherein the semiconductor chip is arranged between the hot heat exchanger and the cold heat exchanger, and

the semiconductor chip has the hot side and the cold side, the hot heat exchanger is partially bonded to the hot side, and the cold heat exchanger is partially bonded to the cold side.

3. The refrigerator according to claim 2,

the compression refrigeration system includes: a compressor, a condenser, a capillary tube and an evaporator, and

the heat exchanger is arranged between the capillary tube and the evaporator, and the low-temperature refrigerant absorbs heat when flowing through the heat exchanger, so that the temperature of the hot end is reduced.

4. The refrigerator according to claim 3,

the heat exchanger is connected with the capillary tube through a liquid inlet pipe and connected with the evaporator through a liquid outlet pipe, and

the heat exchanger is flat, a groove is formed in the heat exchanger, and the low-temperature refrigerant flows into the groove from the liquid inlet pipe and flows out of the liquid outlet pipe after flowing along the groove.

5. The refrigerator according to claim 4,

the shape of the groove is a curve with a preset number of inflection points.

6. The refrigerator according to claim 3,

the semiconductor refrigeration system is further configured to: after reducing the temperature of the hot end, the temperature of the cold end is reduced to a first temperature value.

7. The refrigerator according to claim 6,

the semiconductor refrigeration system is further configured to: after the temperature of the cold end is reduced to the first temperature value, the cold energy of the cold end is conducted to the cold heat exchanger, and

the refrigerator further includes: and the fan is arranged in the air channel of the first storage space and is configured to transmit the cold energy of the cold heat exchanger to the first storage space.

8. The refrigerator according to claim 7,

after the cold energy of the cold heat exchanger is transmitted to the first storage space, the temperature of the first storage space is reduced to a second temperature value, wherein the first temperature value is lower than the second temperature value, and the second temperature value is-30 ℃ to-60 ℃.

9. The refrigerator according to claim 2,

the semiconductor refrigeration system further comprises: a heat conducting layer made of a material with high heat conductivity coefficient

The hot heat exchanger is partially adhered to the hot end by the thermally conductive layer,

the cold heat exchanger is partially adhered to the cold end through the thermally conductive layer.

10. The refrigerator according to claim 2,

the semiconductor refrigeration system further comprises: a heat insulation layer made of low heat conductivity material

The heat insulation layer is arranged at a position between the hot heat exchanger and the cold heat exchanger, except for the semiconductor chip, and is configured to insulate the hot heat exchanger from the cold heat exchanger.

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