CN210220360U - Refrigerator with a door - Google Patents
Refrigerator with a door Download PDFInfo
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- CN210220360U CN210220360U CN201920263731.3U CN201920263731U CN210220360U CN 210220360 U CN210220360 U CN 210220360U CN 201920263731 U CN201920263731 U CN 201920263731U CN 210220360 U CN210220360 U CN 210220360U
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- refrigerator
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- evaporator
- cold
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Abstract
The utility model provides a refrigerator. The method comprises the following steps: the refrigerator comprises a refrigerator body, a storage compartment and a door, wherein at least one storage compartment is defined in the refrigerator body; the evaporator is used for exchanging heat with gas flowing through the evaporator to provide cooling air flow for at least one storage compartment; the semiconductor refrigeration assembly is provided with a cold end and a hot end, and the cold end is thermally connected with one or more storage compartments in at least one storage compartment so as to transfer cold energy of the cold end to the one or more storage compartments; and the heat conduction device is internally provided with a heat conduction working medium, is thermally connected with the hot end and is thermally connected with the evaporator so as to transfer the heat of the hot end to the evaporator. The refrigeration is carried out by adopting a common air cooling and semiconductor mixed refrigeration mode, a compressor is adopted for refrigeration during the normal operation of the refrigerator, the semiconductor refrigeration is started during the defrosting of the refrigerator, the refrigeration at the cold end of the semiconductor is utilized to maintain the constant temperature in the room, and the heat at the hot end of the semiconductor is circulated to the evaporator through a low-melting-point liquid working medium for defrosting of the evaporator.
Description
Technical Field
The utility model relates to a refrigeration plant field especially relates to a refrigerator.
Background
The ordinary air-cooled refrigerator is refrigerated through the evaporator, the cold energy of the evaporator is blown to the compartment through the fan to cool the compartment, the return air of the compartment contains more moisture, the return air is blown to the fins of the evaporator to frost on the surface of the evaporator, and the refrigerator can start automatic defrosting after running for a certain period. When the refrigerator automatically defrosts, the compressor stops working, the refrigerator stops refrigerating, the defrosting heating wire starts to heat the evaporator, the heating wire stops working after defrosting is finished, and the compressor starts to refrigerate.
When the common air-cooled refrigerator defrosts, the refrigerator stops refrigerating, and the heat of the defrosting heating wire can also enter the compartment through a fan or a heat conduction mode to cause the temperature of the compartment to rise. And electric heating wire efficiency is not high, generally can stop heating when the evaporimeter reaches higher temperature for guaranteeing not to remain residual frost, has both caused the rising of refrigerator energy consumption like this, also can bring adverse effect to the fresh-keeping of refrigerator compartment.
SUMMERY OF THE UTILITY MODEL
The utility model discloses an aim at overcoming at least one defect of prior art, provide a refrigerator, its heat and cold volume that produces through semiconductor refrigeration subassembly's hot junction and cold junction defrost, restrain the temperature fluctuation of storing compartment respectively to the evaporimeter of refrigerator, reduced the total energy consumption of refrigerator defrosting.
Therefore, on the one hand, the utility model provides a refrigerator, it includes:
the refrigerator comprises a refrigerator body, a storage compartment and a door, wherein at least one storage compartment is defined in the refrigerator body;
the evaporator is used for exchanging heat with gas flowing through the evaporator to provide cooling air flow for the at least one storage compartment;
the semiconductor refrigeration assembly is provided with a cold end and a hot end, and the cold end is thermally connected with one or more storage compartments in the at least one storage compartment so as to transfer cold energy of the cold end to the one or more storage compartments; and
and the heat conduction device is internally provided with a heat conduction working medium, is thermally connected with the hot end and is thermally connected with the evaporator so as to transfer the heat of the hot end to the evaporator.
Optionally, the heat conducting device includes a heat dissipating pipeline disposed in the evaporator.
Optionally, the heat conducting device further comprises:
a liquid cooled plate in contact against the hot end;
the first pipeline is connected with the outlet of the liquid cooling plate and the inlet of the heat dissipation pipeline;
the second pipeline is connected with the inlet of the liquid cooling plate and the outlet of the heat dissipation pipeline; and
a pump disposed on the first pipeline or the second pipeline.
Optionally, the evaporator includes a refrigerant pipeline and a heat dissipation fin disposed on the refrigerant pipeline;
the radiating fins are also provided with first through holes for penetrating through the radiating pipelines.
Optionally, each of the heat dissipation fins extends in a vertical direction, and a second through hole for passing through the refrigerant pipeline is further formed in each of the heat dissipation fins;
the first through holes on each radiating fin are in a row and are arranged in the middle of the radiating fin;
the second through holes on each radiating fin are two rows and are arranged on two sides of the first through holes in one row.
Optionally, the liquid cooling plate includes a heat conducting plate and a heat absorbing pipeline disposed on one side of the heat conducting plate.
Optionally, a semiconductor refrigeration chamber is further arranged in the box body and is communicated with the at least one storage chamber through at least one cold-end air return inlet and at least one cold-end air outlet;
the cold end is arranged in the semiconductor refrigerating chamber; and is
And an air supply fan is also arranged in the semiconductor refrigeration chamber.
Optionally, the semiconductor refrigeration assembly further includes a cold dissipation plate installed at the cold end, and a cold dissipation fin disposed on a side of the cold dissipation plate away from the cold end.
The utility model discloses an in the refrigerator, adopt the mode that semiconductor refrigeration and ordinary forced air cooling combined together, can effectively solve the problem of changing the room temperature rise during the frost to utilize semiconductor hot junction heat to change the frost for the evaporimeter, can solve and change frost heater strip heating efficiency low, the consumption is big, the problem that the room temperature rises. The refrigeration is carried out by adopting a common air cooling and semiconductor mixed refrigeration mode, a compressor is adopted for refrigeration during the normal operation of the refrigerator, the semiconductor refrigeration is started during the defrosting of the refrigerator, the refrigeration at the cold end of the semiconductor is utilized to maintain the constant temperature in the room, and the heat at the hot end of the semiconductor is circulated to the evaporator through a low-melting-point liquid working medium for defrosting of the evaporator.
The above and other objects, advantages and features of the present invention will become more apparent to those skilled in the art from the following detailed description of specific embodiments thereof, taken in conjunction with the accompanying drawings.
Drawings
Some specific embodiments of the present invention will be described in detail hereinafter, by way of illustration and not by way of limitation, with reference to the accompanying drawings. The same reference numbers in the drawings identify the same or similar elements or components. Those skilled in the art will appreciate that the drawings are not necessarily drawn to scale. In the drawings:
fig. 1 is a schematic structural view of a refrigerator according to an embodiment of the present invention;
fig. 2 is a schematic enlarged view of a partial structure in the refrigerator shown in fig. 1;
FIG. 3 is a schematic block diagram of a liquid cold plate of the refrigerator of FIG. 1;
FIG. 4 is a schematic front view of an evaporator in the refrigerator shown in FIG. 1;
fig. 5 is a schematic side view of an evaporator in the refrigerator shown in fig. 1.
Detailed Description
Fig. 1 is a schematic structural view of a refrigerator according to an embodiment of the present invention. As shown in fig. 1, and referring to fig. 2 to 5, an embodiment of the present invention provides a refrigerator including a cabinet 10, an evaporator 20, a semiconductor refrigeration assembly 30 having a cold end and a hot end, and a heat conduction device 40. At least one storage compartment is defined within the housing 10. The evaporator 20 is adapted to exchange heat with the gas flowing therethrough to provide a cooling gas flow to the at least one storage compartment. The cold end of the semiconductor refrigeration assembly 30 is thermally coupled to one or more of the at least one storage compartment to transfer cold from the cold end to the one or more storage compartments. A heat conducting working medium is arranged in the heat conducting device 40. The heat-conducting device 40 is thermally connected to the hot side and to the evaporator 20 to transfer heat of the hot side to the evaporator 20.
Because the utility model discloses a refrigerator has semiconductor refrigeration subassembly 30, and the heat in the hot junction of semiconductor refrigeration subassembly 30 can transmit to the evaporimeter 20 of refrigerator, and the cold volume of the cold junction of semiconductor refrigeration subassembly 30 can transmit to the storing room of refrigerator, and the heat in consequently usable hot junction is to evaporimeter 20 defrost, the cold volume of usable cold junction suppresses the temperature fluctuation of room during evaporimeter 20 defrosting simultaneously between the storing. The energy of both the cold and hot sides of the semiconductor cooling module 30 can be effectively used, and the power of the heater wire for heating the evaporator 20 can be reduced or omitted, thereby reducing the total energy consumption when the refrigerator is defrosted. The heat conducting working medium is preferably a low melting point liquid.
In some embodiments of the present invention, the heat conducting device 40 includes a liquid cooling plate 41, a heat dissipating pipe 42, a first pipe, a second pipe, and a pump 43. The liquid cooled plate 41 is in contact against the hot end. The heat dissipation pipe 42 may be disposed in the evaporator 20 to utilize the heat released from the heat dissipation pipe 42 as efficiently as possible. The first pipe connects the outlet of the liquid-cooled plate 41 and the inlet of the heat dissipation pipe 42. A second pipe connects the inlet of the liquid cooling plate 41 and the outlet of the heat radiating pipe 42. The pump 43 may be disposed on the first line or the second line, and preferably, the pump 43 is disposed on the first line.
In some embodiments of the present invention, the evaporator 20 includes a refrigerant pipeline 21 and a heat dissipation fin 22 disposed on the refrigerant pipeline 21. The heat dissipating fin 22 is further provided with a first through hole for passing through the heat dissipating pipe 42. Each of the heat dissipating fins 22 extends in a vertical direction, and each of the heat dissipating fins 22 is further provided with a second through hole for passing through the refrigerant pipeline 21. The first through holes of each heat dissipating fin 22 are arranged in a row and are disposed in the middle of the heat dissipating fin 22. The second through holes of each heat dissipating fin 22 are two rows and are disposed on two sides of the first through holes in one row.
In some embodiments of the present invention, the liquid cooling plate 41 includes a heat conducting plate 44, and a heat absorbing pipe 45 disposed on one side of the heat conducting plate 44. Both the heat absorption line 45 and the heat dissipation line 42 may extend in a serpentine shape.
In some embodiments of the present invention, a semiconductor refrigeration chamber is further disposed in the box body 10, and the semiconductor refrigeration chamber is communicated with the at least one storage chamber via at least one cold-end air return opening and at least one cold-end air outlet. The cold end is arranged in the semiconductor refrigerating chamber; and an air supply fan 50 is also arranged in the semiconductor refrigeration chamber. Furthermore, the semiconductor refrigeration assembly 30 further includes a cold plate mounted at the cold end, and a cold fin disposed at a side of the cold plate away from the cold end.
In some embodiments of the present disclosure, the semiconductor cooling assembly 30 may include a semiconductor cooling plate. The semiconductor chilling plate may include a block of N-type semiconductor material and a block of P-type semiconductor material coupled as a galvanic couple. When the semiconductor refrigerating plate is electrified with direct current, energy transfer can be generated. The current flows from the N-type semiconductor material to the P-type semiconductor material and absorbs heat to become the cold end of the couple pair, and the cold end is the refrigerating surface of the semiconductor refrigerating sheet; and the current flows from the P-type semiconductor material to the N-type semiconductor material and releases heat to become a hot end of the couple pair, and the hot end is the heating surface of the semiconductor refrigerating sheet. The heat released by the heating surface is equal to the sum of the heat absorbed by the refrigerating surface and the electric energy introduced into the semiconductor refrigerating sheet, the heat released by the heating surface can be completely used for defrosting the evaporator 20, no energy waste is caused, and the defrosting effect is more energy-saving than defrosting by only using a heater. The cold energy generated by the refrigerating surface is transmitted to one or more storage compartments through the air supply fan 50, the cold end air return inlet and the cold end air outlet.
In some embodiments of the present invention, the refrigerator further comprises a blower 60 for driving the air to circulate between the storage compartment and the evaporator 20. In order to avoid incomplete or uneven defrosting of evaporator 20 by semiconductor cooling assembly 30 alone, the refrigerator further includes a heater for defrosting evaporator 20 to assist semiconductor cooling assembly 30 in removing frost from evaporator 20 more completely. A heater may be provided at the bottom of the evaporator 20 to controllably assist the semiconductor refrigeration assembly 30 in defrosting the evaporator 20.
The refrigerator has a defrost mode of operation for defrosting its evaporator 20 and a cool mode of operation for providing a cooling airflow to the compartment of the refrigerator. In the defrosting operation mode, the refrigeration system of the refrigerator is in a non-operation state, that is, the compressor, the evaporator 20, and the like of the refrigerator are in a non-operation state. In the cooling operation mode, the semiconductor cooling module 30 of the refrigerator is in a non-operating state, that is, the cold end of the semiconductor cooling module 30 transmits cold energy to the storage compartment only in the defrosting mode of the refrigerator, so as to prevent the temperature in the storage compartment from rising in the defrosting process.
That is to say, the utility model discloses utilize ordinary forced air cooling and semiconductor refrigeration mixed refrigeration's mode to guarantee the invariant of refrigerator room indoor temperature. The cold end of the semiconductor is used for refrigerating and maintaining the indoor temperature of the refrigerator room to be constant, and the heat of the hot end of the semiconductor is used for defrosting of the evaporator. The heat of the semiconductor hot end is conveyed to the evaporator fins for defrosting in a mode of conveying circulating low-melting-point liquid by the liquid circulating pump 43, so that the heat exchange efficiency is improved, and the efficiency of the semiconductor is improved. The cold end of the semiconductor is conveyed to the chamber by using a cooling fan, and the cold end and the hot end of the semiconductor are insulated and sealed by using a heat insulating material, so that heat transfer is reduced as much as possible. The semiconductor hot end is directly attached to a metal plate with the circulating low-melting-point liquid embedded inside, the circulating liquid absorbs heat at the semiconductor hot end, and the heat is conveyed to the evaporator fins through the circulation of the liquid circulating pump 43 for defrosting.
It should be understood by those skilled in the art that the refrigerator of the present invention may be an air-cooled refrigerator. The "refrigerator" of the present invention is not limited to a refrigerator having a refrigerating chamber and a freezing chamber in a general sense and used for storing food, and may be other devices having refrigerating and/or freezing functions, such as a freezer, a wine cabinet, a refrigerating tank, etc.
It should also be understood by those skilled in the art that, without being particularly described, terms used to represent orientation or positional relationship such as "upper", "lower", "front", "rear", "top", "bottom", "vertical", "lateral", and the like in the embodiments of the present invention are used with reference to the refrigerator in its normal use state, and are used merely for convenience of description and understanding of the technical solutions of the present invention, and do not indicate or imply that the device referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
Thus, it should be appreciated by those skilled in the art that while a number of exemplary embodiments of the invention have been shown and described in detail herein, many other variations and modifications can be made, consistent with the principles of the invention, which are directly determined or derived from the disclosure herein, without departing from the spirit and scope of the invention. Accordingly, the scope of the present invention should be understood and interpreted to cover all such other variations or modifications.
Claims (7)
1. A refrigerator, characterized by comprising:
the refrigerator comprises a refrigerator body, a storage compartment and a door, wherein at least one storage compartment is defined in the refrigerator body;
the evaporator is used for exchanging heat with gas flowing through the evaporator to provide cooling air flow for the at least one storage compartment;
the semiconductor refrigeration assembly is provided with a cold end and a hot end, and the cold end is thermally connected with one or more storage compartments in the at least one storage compartment so as to transfer cold energy of the cold end to the one or more storage compartments; and
the heat conduction device is internally provided with a heat conduction working medium, is thermally connected with the hot end and is thermally connected with the evaporator so as to transfer the heat of the hot end to the evaporator; the heat conducting device comprises a heat dissipation pipeline which is arranged in the evaporator.
2. The refrigerator according to claim 1, wherein the heat transfer device further comprises:
a liquid cooled plate in contact against the hot end;
the first pipeline is connected with the outlet of the liquid cooling plate and the inlet of the heat dissipation pipeline;
the second pipeline is connected with the inlet of the liquid cooling plate and the outlet of the heat dissipation pipeline; and
a pump disposed on the first pipeline or the second pipeline.
3. The refrigerator as claimed in claim 1, wherein the evaporator includes a refrigerant pipe and a heat dissipating fin disposed on the refrigerant pipe; and is
The radiating fins are also provided with first through holes for penetrating through the radiating pipelines.
4. The refrigerator according to claim 3,
each radiating fin extends along the vertical direction, and a second through hole for penetrating through the refrigerant pipeline is formed in each radiating fin;
the first through holes on each radiating fin are in a row and are arranged in the middle of the radiating fin;
the second through holes on each radiating fin are two rows and are arranged on two sides of the first through holes in one row.
5. The refrigerator according to claim 2,
the liquid cooling plate comprises a heat conducting plate and a heat absorbing pipeline arranged on one side of the heat conducting plate.
6. The refrigerator according to claim 1,
a semiconductor refrigerating chamber is further arranged in the box body and is communicated with the at least one storage chamber through at least one cold-end air return inlet and at least one cold-end air outlet;
the cold end is arranged in the semiconductor refrigerating chamber; and is
And an air supply fan is also arranged in the semiconductor refrigeration chamber.
7. The refrigerator of claim 6 wherein the semiconductor refrigeration assembly further comprises a cold plate mounted at the cold end and a cold dissipating fin disposed on a side of the cold plate remote from the cold end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920263731.3U CN210220360U (en) | 2019-03-01 | 2019-03-01 | Refrigerator with a door |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920263731.3U CN210220360U (en) | 2019-03-01 | 2019-03-01 | Refrigerator with a door |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210220360U true CN210220360U (en) | 2020-03-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920263731.3U Active CN210220360U (en) | 2019-03-01 | 2019-03-01 | Refrigerator with a door |
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| Country | Link |
|---|---|
| CN (1) | CN210220360U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113865154A (en) * | 2021-10-12 | 2021-12-31 | 珠海格力电器股份有限公司 | Finned evaporator, defrosting control method and device thereof and refrigeration equipment |
-
2019
- 2019-03-01 CN CN201920263731.3U patent/CN210220360U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113865154A (en) * | 2021-10-12 | 2021-12-31 | 珠海格力电器股份有限公司 | Finned evaporator, defrosting control method and device thereof and refrigeration equipment |
| CN113865154B (en) * | 2021-10-12 | 2022-05-31 | 珠海格力电器股份有限公司 | Finned evaporator, defrosting control method and device thereof and refrigeration equipment |
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