CN204944014U - A kind of refrigerator - Google Patents
A kind of refrigerator Download PDFInfo
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- CN204944014U CN204944014U CN201520575557.8U CN201520575557U CN204944014U CN 204944014 U CN204944014 U CN 204944014U CN 201520575557 U CN201520575557 U CN 201520575557U CN 204944014 U CN204944014 U CN 204944014U
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- storing
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Abstract
The utility model relates to a kind of refrigerator, comprises the semiconductor refrigerating assembly that inside is limited with the casing of room between at least one storing, evaporimeter and has cold junction and hot junction.Evaporator arrangement becomes carries out heat exchange with the gas flowing through it, thinks that between at least one storing, room provides cooling blast.Between the one or more storings between the cold junction of at least part of semiconductor refrigerating assembly and at least one storing in room, room is thermally coupled, so that the cold of cold junction is passed to room between one or more storing, its hot junction and evaporimeter thermally coupled, so that the heat in hot junction is passed to evaporimeter.Thus, while the utility model can utilize the hot junction of semiconductor refrigerating assembly to defrost to evaporimeter, utilize the cold junction of semiconductor refrigerating assembly to suppress temperature fluctuation indoor between storing, neither take or exceed the storage space taking refrigerator, having the total energy consumption reducing defroster.
Description
Technical field
The utility model relates to freezing and refrigeration technology, particularly relates to a kind of refrigerator.
Background technology
After existing refrigerator (particularly wind cooling refrigerator) runs a period of time, can frosting on evaporimeter.When frosting degree acquires a certain degree, need to stop the compressor of refrigerator to defrost to evaporimeter.Current refrigerator mainly utilizes electrical heating wire to carry out heating defrosting to evaporimeter, and to shut down and electrical heating wire generates heat the impact of these two factors owing to being compressed machine, between the storing of refrigerator, the temperature of indoor can produce fluctuation.Further, the live load needed when freeze in room when between the storing that compressor starts refrigerator again becomes large.Visible, utilize heater strip not only can increase the energy consumption of refrigerator to evaporator defrost in prior art, but also can be unfavorable to food indoor between storing preservation.
In order to solve the problems of the technologies described above, in prior art, reduce the temperature fluctuation of room during evaporator defrost between storing by placement cold storage box indoor between storing.But cold storage box occupies effective storage space of refrigerator, and the agent for storage of coldness in cold storage box is after evaporator defrost, still need compressor to provide cold to carry out cooling storage cold, therefore the total energy consumption of refrigerator does not reduce.
Utility model content
An object of the present utility model is intended at least one defect overcoming prior art, a kind of refrigerator is provided, the heat that its hot junction by semiconductor refrigerating assembly and cold junction produce and cold defrost to the evaporimeter of refrigerator, suppress the temperature fluctuation of room between storing respectively, thus do not take or exceed the storage space taking refrigerator, the total energy consumption reducing defroster.
Another object of the present utility model improves the utilization rate of heat that the hot junction of semiconductor refrigerating assembly and cold junction produce and cold.
Another object of the present utility model improves the operating efficiency of semiconductor refrigerating assembly.
To achieve these goals, the utility model provides a kind of refrigerator, comprising:
Casing, is limited with room between at least one storing in it;
Gas for flowing through it carries out heat exchange, thinks that between at least one storing described, room provides the evaporimeter of cooling blast; With
There is the semiconductor refrigerating assembly in cold junction and hot junction, between the one or more storings between described cold junction and at least one storing described in room, room is thermally coupled, so that the cold of described cold junction is passed to room between described one or more storing, described hot junction and described evaporimeter thermally coupled, so that the heat in described hot junction is passed to described evaporimeter.
Alternatively, described semiconductor refrigerating assembly comprises:
Semiconductor chilling plate, it has the refrigeration surface of automatically controlled alternating temperature and heats surface;
Form the cool guiding block of the cold junction of described semiconductor refrigerating assembly, it is connected with the refrigeration surface heat of described semiconductor chilling plate, the cold that described refrigeration surface produces is passed to room between described one or more storing by described cool guiding block; With
Form the radiator in the hot junction of described semiconductor refrigerating assembly, it is connected with the surface heat that heats of described semiconductor chilling plate, the described heat heating surface generation is passed to described evaporimeter by described radiator.
Alternatively, in described casing, be also limited with at least one evaporator room, in each described evaporator room, be provided with described evaporimeter and at least part of described semiconductor refrigerating assembly.
Alternatively, between at least one storing described, room comprises freezing compartment, and at least one evaporator room described comprises and is positioned at an evaporator room below of described freezing compartment, and described evaporator room and described freezing compartment are separated by dividing plate.
Alternatively, described cool guiding block is arranged in described evaporator room, and the end face back to described refrigeration surface of described cool guiding block is attached on described dividing plate, and the side of described cool guiding block is separated by heat insulating member and described evaporator room.
Alternatively, described cool guiding block is positioned at described freezing compartment, is exposed in described freezing compartment back to the described end face on refrigeration surface and the side of described cool guiding block to make described cool guiding block.
Alternatively, between at least one storing described, room comprises room between multiple storing, and at least one evaporator room described comprises the multiple evaporator room be communicated with room one_to_one corresponding between described multiple storing.
Alternatively, described refrigerator also comprises:
Blower fan, to be arranged in described evaporator room and to be positioned at the downstream of described evaporimeter, to drive described in the air flow direction through described evaporator cools room between at least one storing.
Alternatively, described radiator has multiple radiating fin extended towards described evaporimeter, heat is passed to described evaporimeter by described radiating fin.
Alternatively, described refrigerator also comprises:
Heater, is arranged at the bottom of described evaporimeter, defrosts to described evaporimeter with controllably auxiliary described semiconductor refrigerating assembly.
In refrigerator of the present utility model, because refrigerator has semiconductor refrigerating assembly, and the heat in the hot junction of semiconductor refrigerating assembly can be passed to the evaporimeter of refrigerator, room between the storing that the cold of the cold junction of semiconductor refrigerating assembly can be passed to refrigerator, therefore can utilize the heat in hot junction to defrost to evaporimeter, the cold of cold junction can be utilized simultaneously to suppress the temperature fluctuation of room during evaporator defrost between storing.Because at least part of semiconductor refrigerating assembly is arranged in the evaporator room of refrigerator, therefore can not take or seldom take the storage space of refrigerator.The energy in semiconductor refrigerating assembly cold junction and hot junction can both effectively utilize, and can reduce the power of the heater strip that evaporimeter heats or save heater strip, thus total energy consumption when reducing defroster.
Further, in refrigerator of the present utility model, because semiconductor refrigerating assembly comprises semiconductor chilling plate, with the refrigeration of the semiconductor chilling plate hot linked cool guiding block in surface and with semiconductor chilling plate heat surperficial hot linked radiator, room between the storing that the cold that therefore the refrigeration surface of semiconductor chilling plate produces can be passed to refrigerator by cool guiding block, the heat heating surface generation of semiconductor chilling plate can by heat sink to evaporimeter, to reduce the loss in energy transfer process, improve the energy transfer efficiency of semiconductor refrigerating assembly, and then improve the utilization rate of the cold junction of semiconductor refrigerating assembly and the energy in hot junction.
Further, in refrigerator of the present utility model, because the radiator forming semiconductor refrigerating assembly hot junction is positioned at evaporator room, the temperature of evaporator room is relatively low, therefore can improve the efficiency that radiator dispels the heat to evaporimeter, thus improve the operating efficiency of semiconductor refrigerating assembly.
According to hereafter by reference to the accompanying drawings to the detailed description of the utility model specific embodiment, those skilled in the art will understand above-mentioned and other objects, advantage and feature of the present utility model more.
Accompanying drawing explanation
Hereinafter describe specific embodiments more of the present utility model with reference to the accompanying drawings by way of example, and not by way of limitation in detail.Reference numeral identical in accompanying drawing denotes same or similar parts or part.It should be appreciated by those skilled in the art that these accompanying drawings may not be drawn in proportion.In accompanying drawing:
Fig. 1 is the schematic diagram of the refrigerator according to the utility model embodiment;
Fig. 2 is the schematic structure exploded view of the semiconductor refrigerating assembly according to the utility model embodiment;
Fig. 3 is the indicative flowchart of the Defrost method of refrigerator according to the utility model embodiment;
Fig. 4 is the indicative flowchart of the Defrost method of refrigerator according to another embodiment of the utility model.
Detailed description of the invention
Fig. 1 is the schematic diagram of the refrigerator according to the utility model embodiment, and refrigerator 1 comprises casing 10, evaporimeter 20 and has the semiconductor refrigerating assembly 30 in cold junction and hot junction.Room between at least one storing is limited with in casing 10.Evaporimeter 20, for carrying out heat exchange with the gas flowing through it, thinks that between at least one storing, room provides cooling blast.Between the one or more storings between the cold junction of semiconductor refrigerating assembly 30 and at least one storing in room, room is thermally coupled, so that the cold of this cold junction is passed to room between one or more storing, hot junction and the evaporimeter 20 of semiconductor refrigerating assembly 30 are thermally coupled, so that the heat in this hot junction is passed to evaporimeter 20.
Because refrigerator 1 of the present utility model has semiconductor refrigerating assembly 30, and the heat in the hot junction of semiconductor refrigerating assembly 30 can be passed to the evaporimeter 20 of refrigerator 1, room between the storing that the cold of the cold junction of semiconductor refrigerating assembly 30 can be passed to refrigerator 1, therefore can utilize the heat in hot junction to defrost to evaporimeter 20, the cold of cold junction can be utilized simultaneously to suppress the temperature fluctuation of room during evaporimeter 20 defrosts between storing.The energy in semiconductor refrigerating assembly 30 cold junction and hot junction can both effectively utilize, and can reduce the power of the heater strip that evaporimeter 20 heats or save heater strip, thus reducing total energy consumption when refrigerator 1 defrosts.That is, in embodiments more of the present utility model, evaporimeter 20 can not need independent heater strip to defrost to it.
Fig. 2 is the schematic structure exploded view of the semiconductor refrigerating assembly according to the utility model embodiment.See Fig. 1 and Fig. 2, semiconductor refrigerating assembly 30 can comprise semiconductor chilling plate 31, form the radiator 33 in the hot junction of the cool guiding block 32 of the cold junction of semiconductor refrigerating assembly 30 and formation semiconductor refrigerating assembly 30.
Particularly, semiconductor chilling plate 31 can comprise one block of N-type semiconductor material and one block of P-type semiconductor material, and this N-type semiconductor material and P-type semiconductor material are connected into galvanic couple pair.After passing into DC current for semiconductor chilling plate 31, just can energy-producing transfer.Electric current is absorbed heat by N-type semiconductor flow of material become the right cold junction of galvanic couple to P-type semiconductor material, and this cold junction is the refrigeration surface 31a of semiconductor chilling plate 31; Electric current is by P-type semiconductor flow of material to N-type semiconductor material and release heat becomes the right hot junction of galvanic couple, and what this hot junction was semiconductor chilling plate 31 heats surperficial 31b.This heats heat that surperficial 31b discharges and to equal to freeze the summation of heat that surperficial 31a absorbs and the electric energy that passes into semiconductor chilling plate 31, the heat heating surperficial 31b release can all for defrosting to evaporimeter 20, can not cause the waste of energy, and the effect of defrosting is more more energy-conservation with heater defrost than simple.
Cool guiding block 32 is thermally coupled with the refrigeration surface 31a of semiconductor chilling plate 31, the cold that surperficial for refrigeration 31a produces is passed to room between one or more storing by cool guiding block 32.Radiator 33 and semiconductor chilling plate 31 to heat surperficial 31b thermally coupled, to be passed to evaporimeter 20 by radiator 33 by heating the heat that surperficial 31b produces.Thus, room between the storing that the cold that the refrigeration surface 31a of semiconductor chilling plate 31 produces can be passed to refrigerator 1 by cool guiding block 32, the heat heating surperficial 31b generation of semiconductor chilling plate 31 can be passed to evaporimeter 20 by radiator 33, thus the loss decreased in energy transfer process, improve the energy transfer efficiency of semiconductor refrigerating assembly 30, and then improve the utilization rate of the cold junction of semiconductor refrigerating assembly 30 and the energy in hot junction.
In embodiments more of the present utility model, be also limited with at least one evaporator room in casing 10, each evaporator room is provided with evaporimeter 20 and at least part of semiconductor refrigerating assembly 30.That is, all corresponding evaporimeter of each evaporator room and a semiconductor refrigerating assembly, this evaporimeter is positioned at evaporator room, this semiconductor refrigerating assembly 30 be positioned at evaporator room at least partially.
That is, in embodiments more of the present utility model, semiconductor refrigerating assembly 30 can be positioned at the evaporator room of its correspondence completely or fully.In other embodiments of the present utility model, part semiconductor cooling assembly 30 is positioned at the evaporator room of its correspondence, remainder semiconductor refrigerating assembly 30 is positioned between one or more storing indoor.The hot junction of such as semiconductor refrigerating assembly 30 can be positioned at evaporator room, and cold junction can be positioned between one or more storing indoor.Because at least part of semiconductor refrigerating assembly 30 is arranged in the evaporator room of refrigerator 1, therefore can not take or seldom take the storage space of refrigerator.Further, evaporimeter 20 can be the heat-exchanger rig of evaporimeter on ordinary meaning or other types.
Further, between at least one storing, room can comprise freezing compartment 12, and at least one evaporator room comprises and is positioned at an evaporator room 11 below of freezing compartment 12, and evaporator room 11 and freezing compartment 12 are separated by dividing plate 13.In other embodiment of the utility model, between at least one storing, room also can comprise refrigerator room, and refrigerator room is positioned at above freezing compartment 12.That is, when refrigerator normally uses, be disposed adjacent before and after freezing compartment 12 and evaporator room 11, the neighbouring setting in refrigerator room and freezing compartment 12.
In embodiments more of the present utility model, in embodiments more of the present utility model, semiconductor refrigerating assembly 30 is positioned at evaporator room 11, and the cold junction of semiconductor refrigerating assembly 30 towards refrigerator 1 one or more storings between room, the hot junction of semiconductor refrigerating assembly 30 is towards evaporimeter 20.Thus, the cold can being convenient to cold junction is passed to room between storing, and suppress temperature indoor between storing to rise, the heat being also convenient to hot junction is passed to evaporimeter 20, thus defrosts to evaporimeter 20.
Particularly, cool guiding block 32 to be arranged in evaporator room 11 and cool guiding block 32 be attached on dividing plate 13 back to the freeze end face of surperficial 31a of semiconductor chilling plate 31, with make refrigeration surface 31a by cool guiding block 32 and dividing plate 13 thermally coupled with freezing compartment 12, thus the cold that surperficial for refrigeration 31a produces is passed to freezing compartment 12 by cool guiding block 32 and dividing plate 13 successively.The side of cool guiding block 32 is separated with evaporator room 11 by heat insulating member 34, to avoid the cold of cool guiding block 32 to be distributed in evaporator room 11, affects the defrosting to evaporimeter 20.The side of cool guiding block 32 is its other surfaces except the end face towards semiconductor chilling plate 31 and the end face back to semiconductor chilling plate 31.The radiator 33 forming semiconductor refrigerating assembly hot junction is also positioned at evaporator room 11, and the temperature of evaporator room 11 is relatively low, therefore can improve the efficiency that radiator 33 dispels the heat to evaporimeter 20, thus improves the operating efficiency of semiconductor refrigerating assembly 30.
Room between storing is more effectively passed in order to make the cold on cool guiding block 32, in other embodiments of the utility model, cool guiding block 32 can be positioned at freezing compartment 12, be exposed in freezing compartment 12 to make cool guiding block 32 back to the refrigeration end face of surperficial 31a and the side of cool guiding block 32, to reduce the bang path of cold, improve its transmission efficiency, thus the temperature rising of room 12 during evaporimeter 20 defrosts between freezing-inhibiting effectively.
It will be understood by those skilled in the art that in other embodiment of the utility model, between at least one storing, room also can to comprise between alternating temperature room between multiple storing with different function of containing articles such as room, ice-making compartment.The cool guiding block 32 of semiconductor refrigerating assembly 30 can simultaneously and between one or more storing room thermally coupled, to provide cold to room between this one or more storing simultaneously, suppress its temperature fluctuation during evaporimeter 20 defrosts.
In other embodiments of the present utility model, between at least one storing, room can comprise room between multiple storing, and at least one evaporator room can comprise the multiple evaporator room be communicated with room one_to_one corresponding between multiple storing.That is, for the refrigerator of room between many storings, between each storing, room all has an evaporimeter to provide cooling blast for it, i.e. all corresponding evaporator room in room between each storing, and between the storing of evaporimeter chambers contain promising correspondence, room provides the evaporimeter of cooling blast.
It will be understood by those skilled in the art that the transfer principle of heat and cold is roughly the same, the material that therefore cool guiding block 32 and radiator 33 can be heat conductivility good is made.Cool guiding block 32 can in block, sheet or other shapes, and its installed surface is covered on the surperficial 31a of refrigeration, and back to the end face of semiconductor chilling plate 31, the end face namely deviating from installed surface is towards room between storing.Radiator 33 can comprise being covered in and heats heat sink 331 on surperficial 31b and multiple radiating fin 332 extended to evaporimeter 20 by heat sink, heat is passed to evaporimeter 20 by radiating fin 332.Radiating fin 332 can be one or more in heat transfer, thermal convection current and heat radiation to the mode of evaporimeter 20 transferring heat.
In embodiments more of the present utility model, the blower fan 60 that refrigerator 1 also comprises compressor 50 and circulates for driving gas.In order to avoid utilizing separately semiconductor refrigerating assembly 30 pairs of evaporimeters 20 to defrost not thorough or uneven, refrigerator 1 also comprises the heater 40 for defrosting for evaporimeter 20, removes the solidifying frost on evaporimeter 20 with semiconductor-assisted cooling assembly 30 more all sidedly.Heater 40 can be arranged on the bottom of evaporimeter 20, defrosts with controllably semiconductor-assisted cooling assembly 30 pairs of evaporimeters 20.Heater 40 is relative with the groove 14 be positioned at bottom evaporator room 11, flows into the water spilage tray 16 be arranged in bottom casing 10 to make the defrosting water produced during defrosting by the drainpipe 15 be communicated with groove 14.Water spilage tray 16 is arranged on compressor 50, and when compressor 50 works operation, the heat produced by it is by the water evaporates in water spilage tray 16.Blower fan 60 to be arranged in evaporator room 11 and to be positioned at the downstream of evaporimeter 20, to drive room between at least one storing of air flow direction of cooling through evaporimeter 20.
Refrigerator 1 has the defrosting mode of operation for defrosting to its evaporimeter 20 and provides the refrigeration work pattern of cooling blast for room between the storing to refrigerator 1.Under defrosting mode of operation, the refrigeration system of refrigerator 1 is in off working state, and that is, the compressor, evaporimeter etc. of refrigerator 1 are in off working state.Under refrigeration work pattern, the semiconductor refrigerating assembly 30 of refrigerator 1 is in off working state, that is, the cold junction of semiconductor refrigerating assembly 30 only under the defrosting mode of refrigerator 1 to indoor transmission cold between storing, rise in defrost process to avoid temperature indoor between storing.
Fig. 3 is the indicative flowchart of the Defrost method of refrigerator according to the utility model embodiment.Defroster method comprises:
Generate according to the working status parameter of refrigerator 1 and be used to indicate the defrosting signal that the evaporimeter 20 of refrigerator 1 is defrosted, enter defrosting mode of operation to make refrigerator 1;
Start the semiconductor refrigerating assembly 30 of refrigerator 1, make the cold junction of semiconductor refrigerating assembly 30 and hot junction produce corresponding cold and heat respectively; With
Room between the one or more storings cold of cold junction being passed to refrigerator 1, to suppress temperature fluctuation indoor between one or more storing, and is passed to evaporimeter 20 by the heat in hot junction, to carry out defrost operation to evaporimeter 20.
Further, the working status parameter of refrigerator 1 compressor 50 that comprises refrigerator 1 from last defrosting terminate in temperature indoor between the temperature of refrigeration working medium in the duration of rear continuous service, evaporimeter 20 or the storing of refrigerator 1 one or more.Generally, refrigerator 1 has certain defrosting cycle, that is, when after the duration that the refrigeration work mode operation of refrigerator 1 is default, that is to say that compressor 50 is after last defrosting terminates the default duration of rear continuous service, refrigerator 1 can enter defrosting mode of operation automatically.Here the duration that compressor 50 continuous service mentioned is preset means the accumulative duration run at a refrigeration work cycle inner compressor 50 of refrigerator, and this accumulative duration is within a refrigeration work cycle, the duration summation of compressor more than 50 startup optimization.In the embodiment that the utility model is other, also determine that evaporimeter 20 is the need of defrosting, optionally to generate defrosting signal by indoor temperature between the temperature of refrigeration working medium in detection evaporimeter 20 and/or the storing of refrigerator 1.In the other embodiment of the utility model, can jointly determine that evaporimeter 20 is the need of defrosting, optionally to generate defrosting signal in conjunction with temperature indoor between the temperature of refrigeration working medium in the operation duration scope of compressor 50, evaporimeter 20 and the storing of refrigerator 1.That is, it is one or more that the temperature of the refrigeration working medium that the signal that defrosts can transfinite in signal, evaporimeter 20 more than the time of the first preset duration from the duration that last defrosting terminates rear continuous service for compressor 50 reaches whether indoor temperature between the temperature over-range signal of the first preset temperature or storing reach in the temperature over-range signal of the second preset temperature.
The step starting the semiconductor refrigerating assembly 30 of refrigerator 1 for providing operating voltage to semiconductor refrigerating assembly 30, such as, can pass into direct current.
Fig. 4 is the indicative flowchart of the Defrost method of refrigerator according to another embodiment of the utility model, and in embodiments more of the present utility model, Defrost method also comprises:
When the time of defrosting to evaporimeter 20 reaches predetermined duration, make semiconductor refrigerating assembly 30 out of service, to terminate the defrost operation to evaporimeter 20, and start the compressor 50 of refrigerator 1, enter its refrigeration work pattern to make refrigerator 1.When the defrosting mode of operation of refrigerator 1 carries out the duration subscribed, the solidifying frost on evaporimeter 20 is removed, and now refrigerator 1 stops providing operating voltage to semiconductor refrigerating assembly 30, namely stops powering to semiconductor refrigerating assembly 30, to make it out of service.Refrigerator 1 enters refrigeration work pattern, and compressor 50 starts, and provides cooling blast to continue room between storing.
It will be understood by those skilled in the art that, the surperficial 31b that heats that the heat that above-mentioned semiconductor refrigerating assembly 30 hot junction produces means semiconductor chilling plate 31 produces and the heat being passed to cool guiding block 32 place, and the refrigeration surface 31a that the cold that above-mentioned semiconductor refrigerating assembly 30 cold junction produces means semiconductor chilling plate 31 produces and is passed to the cold of radiator 33.
It will be understood by those skilled in the art that refrigerator 1 of the present utility model can be wind cooling refrigerator." refrigerator " alleged by the utility model is not defined as having refrigerator room and freezing compartment and for the refrigerator of storage food, can also be that other have the device of refrigeration and/or freezing function, such as refrigerator-freezer, wine cabinet, cold-storage jar etc. in general sense.
Those skilled in the art will also be understood that, in case of no particular description, alleged by the utility model embodiment " on ", D score, " front ", " afterwards ", " top ", " end ", " vertically ", " transverse direction " etc. for represent the term in orientation or position relationship with refrigerator 1 under its normal operating condition for benchmark, these terms be only for convenience of description with understand the technical solution of the utility model, instead of the device of instruction or hint indication or lose and must have specific orientation, with specific azimuth configuration and operation, therefore can not be interpreted as restriction of the present utility model.
So far, those skilled in the art will recognize that, although multiple exemplary embodiment of the present utility model is illustrate and described herein detailed, but, when not departing from the utility model spirit and scope, still can directly determine or derive other modification many or amendment of meeting the utility model principle according to content disclosed in the utility model.Therefore, scope of the present utility model should be understood and regard as and cover all these other modification or amendments.
Claims (10)
1. a refrigerator, is characterized in that, comprising:
Casing, is limited with room between at least one storing in it;
Gas for flowing through it carries out heat exchange, thinks that between at least one storing described, room provides the evaporimeter of cooling blast; With
There is the semiconductor refrigerating assembly in cold junction and hot junction, between the one or more storings between described cold junction and at least one storing described in room, room is thermally coupled, so that the cold of described cold junction is passed to room between described one or more storing, described hot junction and described evaporimeter thermally coupled, so that the heat in described hot junction is passed to described evaporimeter.
2. refrigerator according to claim 1, is characterized in that, described semiconductor refrigerating assembly comprises:
Semiconductor chilling plate, it has the refrigeration surface of automatically controlled alternating temperature and heats surface;
Form the cool guiding block of the cold junction of described semiconductor refrigerating assembly, it is connected with the refrigeration surface heat of described semiconductor chilling plate, the cold that described refrigeration surface produces is passed to room between described one or more storing by described cool guiding block; With
Form the radiator in the hot junction of described semiconductor refrigerating assembly, it is connected with the surface heat that heats of described semiconductor chilling plate, the described heat heating surface generation is passed to described evaporimeter by described radiator.
3. refrigerator according to claim 2, is characterized in that,
Also be limited with at least one evaporator room in described casing, in each described evaporator room, be provided with described evaporimeter and at least part of described semiconductor refrigerating assembly.
4. refrigerator according to claim 3, is characterized in that,
Between at least one storing described, room comprises freezing compartment, and at least one evaporator room described comprises and is positioned at an evaporator room below of described freezing compartment, and described evaporator room and described freezing compartment are separated by dividing plate.
5. refrigerator according to claim 4, is characterized in that,
Described cool guiding block is arranged in described evaporator room, and the end face back to described refrigeration surface of described cool guiding block is attached on described dividing plate, and the side of described cool guiding block is separated by heat insulating member and described evaporator room.
6. refrigerator according to claim 4, is characterized in that,
Described cool guiding block is positioned at described freezing compartment, is exposed in described freezing compartment back to the described end face on refrigeration surface and the side of described cool guiding block to make described cool guiding block.
7. refrigerator according to claim 3, is characterized in that,
Between at least one storing described, room comprises room between multiple storing, and at least one evaporator room described comprises the multiple evaporator room be communicated with room one_to_one corresponding between described multiple storing.
8. refrigerator according to claim 3, is characterized in that, also comprises:
Blower fan, to be arranged in described evaporator room and to be positioned at the downstream of described evaporimeter, to drive described in the air flow direction through described evaporator cools room between at least one storing.
9. refrigerator according to claim 2, is characterized in that,
Described radiator has multiple radiating fin extended towards described evaporimeter, heat is passed to described evaporimeter by described radiating fin.
10. refrigerator according to claim 1, is characterized in that, also comprises:
Heater, is arranged at the bottom of described evaporimeter, defrosts to described evaporimeter with controllably auxiliary described semiconductor refrigerating assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520575557.8U CN204944014U (en) | 2015-07-31 | 2015-07-31 | A kind of refrigerator |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201520575557.8U CN204944014U (en) | 2015-07-31 | 2015-07-31 | A kind of refrigerator |
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| CN204944014U true CN204944014U (en) | 2016-01-06 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106403442A (en) * | 2015-07-31 | 2017-02-15 | 青岛海尔智能技术研发有限公司 | Refrigerator and defrosting method thereof |
| CN106958962A (en) * | 2017-02-13 | 2017-07-18 | 合肥美的电冰箱有限公司 | Semiconductor defrosting heater and refrigeration plant |
-
2015
- 2015-07-31 CN CN201520575557.8U patent/CN204944014U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106403442A (en) * | 2015-07-31 | 2017-02-15 | 青岛海尔智能技术研发有限公司 | Refrigerator and defrosting method thereof |
| CN106958962A (en) * | 2017-02-13 | 2017-07-18 | 合肥美的电冰箱有限公司 | Semiconductor defrosting heater and refrigeration plant |
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