CN215260686U - Refrigerating cabinet - Google Patents
Refrigerating cabinet Download PDFInfo
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- CN215260686U CN215260686U CN202120034798.7U CN202120034798U CN215260686U CN 215260686 U CN215260686 U CN 215260686U CN 202120034798 U CN202120034798 U CN 202120034798U CN 215260686 U CN215260686 U CN 215260686U
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Abstract
The utility model discloses a freezer is equipped with semiconductor dehumidification module in the walk-in, and semiconductor dehumidification module includes the semiconductor refrigeration piece, and the cold junction of semiconductor refrigeration piece is equipped with the fin, and the hot junction of semiconductor refrigeration piece is equipped with the water-cooling head, and the water-cooling head passes through circulation water route and radiator tank intercommunication. This application utilizes the cold junction of semiconductor refrigeration piece to dehumidify the walk-in, utilize the hot junction of water-cooled mode to semiconductor refrigeration piece to dispel the heat, reduce the refrigeration consumption of freezer, improve the heat preservation time of freezer, improve the storage security of medicine or bacterin, the temperature decline when semiconductor refrigeration piece hot junction dehumidifies the walk-in simultaneously plays certain temperature compensation effect, the temperature in avoiding the walk-in is crossed lowly.
Description
Technical Field
The utility model relates to a refrigeration plant technical field especially relates to a freezer.
Background
At present, the requirement of users on humidity-controllable vaccines or medicine cabinets is higher and higher, and the requirement is also higher and higher, on one hand, the storage environment of some medicines needs to be in a specified low-temperature and low-humidity environment; on the other hand, the high relative humidity is helpful for mold growth on the surfaces of the refrigerating chamber and on storage containers for medicines, vaccines and the like, and brings health risks to health personnel and patients; high relative humidity can also cause flooding and damage to vaccine bottle labels and secondary packaging.
For dehumidification of the refrigerating chamber, two common methods are currently used, one is semiconductor dehumidification, and the other is compressor refrigeration evaporator dehumidification.
The semiconductor dehumidification structure comprises the following specific structures: the semiconductor hot end is fixed with a heat sink closely, this heat sink is called the hot end heat sink, the cold junction is fixed closely with another heat sink of suitable size, this heat sink is called the cold junction heat sink, the installation mode is generally that the hot end heat sink is outside the fridge box, and utilize the blower to dispel the heat it, the cold junction heat sink is in the fridge, utilize the cold energy that the semiconductor cold junction transmitted to reach the purpose of dehumidification. The temperature difference between the cold end and the hot end of the semiconductor is constant, that is, the lower the temperature of the hot end is, the lower the temperature of the cold end is. The ideal dehumidification temperature is 3-5 ℃ lower than the dew point temperature, if the temperature in the refrigerator is 4 ℃ and the humidity is lower than 55%, the dew point temperature is-3.61 ℃, so the ideal dehumidification temperature is-8.6-6.6 ℃, namely the temperature of the cooling fin at the cold end needs to reach-8.6-6.6 ℃, and in the heat zone areas such as Africa and the like, the use environment temperature of the refrigerator is about 40-50 ℃, and under the condition, the cold end hardly reaches the ideal dehumidification temperature; on the other hand, this kind of semiconductor hot junction fin can lead to the case outside heat to pass through the semiconductor to the incasement transmission outside the box, the mounting means of cold junction fin in the box outside the box, and is first, has increased the refrigeration consumption of machine, and the second has shortened the heat preservation time of machine, increases the risk that medicine or bacterin damaged.
The compressor refrigeration evaporator dehumidification utilizes refrigeration cycle and utilizes the low temperature of the evaporator to perform dehumidification. To achieve this function, there are three ways: firstly, on the basis of a refrigerating system of the machine, a set of dehumidification refrigerating system is added, so that the refrigeration and the dehumidification are not interfered with each other, but the cost of the whole machine is greatly increased; the second, on the basis of refrigerating system of machine itself, increase a refrigeration branch for the dehumidification, this kind of mode can influence refrigerating system's of machine itself cold-storage speed, under the unstable condition of electric power, can influence the machine heat preservation time, two kinds of modes above moreover all can increase the cold volume of incasement in the dehumidification stage, influence the homogeneity of incasement temperature, have the risk of freezing bad bacterin even. In this case, the machine needs to be equipped with a heating device separately: heating wires or PTC heating modules, which in turn bring disturbing factors to the uniformity of the temperature in the machine cabinet; thirdly, dehumidification is performed by using the low temperature of the evaporator when the refrigeration system of the machine works, but in this case, the temperature of the refrigerating chamber is generally guaranteed preferentially, and the humidity cannot be effectively controlled.
The above information disclosed in this background section is only for enhancement of understanding of the background of the application and therefore it may comprise prior art that does not constitute known to a person of ordinary skill in the art.
Disclosure of Invention
To the problem pointed out in the background art, the utility model provides a freezer utilizes semiconductor dehumidification module to dehumidify the walk-in, arranges whole semiconductor dehumidification module in the walk-in, reduces the refrigeration consumption of freezer, improves the heat preservation time of freezer, improves the storage security of medicine or bacterin, and the temperature decline when the partly heat in semiconductor refrigeration piece hot junction dehumidifies the walk-in simultaneously plays certain temperature compensation effect, avoids the temperature in the walk-in to hang down excessively.
In order to realize the purpose of the utility model, the utility model adopts the following technical scheme to realize:
the utility model provides a refrigerated cabinet, include:
a cabinet body in which a refrigerating chamber is formed;
the semiconductor dehumidification module is arranged in the refrigerating chamber and comprises a semiconductor refrigeration piece, a cooling fin is arranged at the cold end of the semiconductor refrigeration piece, and a water cooling head is arranged at the hot end of the semiconductor refrigeration piece;
and the water cooling head is communicated with the heat radiation water tank through a circulating water path.
In some embodiments of the present application, a water pump is disposed on the circulating water path.
In some embodiments of this application, the bottom of the cabinet body is equipped with the cabin, the heat dissipation water tank with the water pump is located in the cabin.
In some embodiments of the present application, a flow rate of the water pump is adjusted according to a dew point temperature of the refrigerating compartment.
In some embodiments of the present application, the semiconductor dehumidification module further has a heating function, and when the temperature in the refrigerating chamber is lower than a system temperature threshold value, the semiconductor dehumidification module starts the heating function, the water pump is turned off, and the current in the semiconductor refrigeration sheet is reversed.
In some embodiments of the present application, when the semiconductor dehumidification module performs dehumidification, the directions of currents in the semiconductor cooling fins are alternated.
In some embodiments of the present application, the semiconductor dehumidification module is located at a position below the refrigerating compartment.
In some embodiments of the present application, a water receiving cover is disposed at the bottom of the refrigerating chamber, and a drain pipe is disposed on the water receiving cover.
In some embodiments of this application, connect the water cover to be the taper type, the drain pipe with connect the lowest end of water cover to be connected.
In some embodiments of this application, the bottom of the cabinet body is equipped with the cabin, be equipped with the water receiving box in the cabin, the drain pipe with water receiving box intercommunication.
Compared with the prior art, the utility model discloses an advantage is with positive effect:
the utility model discloses be provided with semiconductor dehumidification module and heat radiation water tank in the freezer, wherein semiconductor dehumidification module locates in the freezer, and it includes the semiconductor refrigeration piece, and the cold junction of semiconductor refrigeration piece is equipped with the fin, and the hot junction of semiconductor refrigeration piece is equipped with the water-cooling head, and the water-cooling head is through circulation water route and heat radiation water tank intercommunication. According to the semiconductor refrigeration device, the cold end of the semiconductor refrigeration piece is used for dehumidifying the refrigerating chamber, and the hot end of the semiconductor refrigeration piece is cooled in a water cooling mode, so that on the one hand, the influence of the external temperature on the dehumidification temperature of the cold end of the semiconductor refrigeration piece is fundamentally avoided, and the dehumidification effect is improved; in the second aspect, the environment heat outside the refrigerated cabinet is fundamentally prevented from being conducted into the refrigerated chamber through the semiconductor refrigeration sheet, the refrigeration power consumption of the refrigerated cabinet is reduced, the heat preservation time of the refrigerated cabinet is prolonged, and the storage safety of medicines or vaccines is improved; and in the third aspect, a part of heat of the hot end of the semiconductor refrigerating sheet plays a certain temperature compensation role in temperature reduction during dehumidification of the refrigerating chamber, the temperature in the refrigerating chamber is prevented from being too low, and the A-level anti-freezing requirement is met.
Other features and advantages of the present invention will become more apparent from the following detailed description of the invention when read in conjunction with the accompanying drawings.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive labor.
FIG. 1 is a schematic diagram of a refrigerated case according to an embodiment;
fig. 2 is a schematic structural diagram of a semiconductor dehumidification module according to an embodiment.
Reference numerals:
10-cabinet, 11-refrigerating chamber, 12-cabin;
20-a semiconductor dehumidification module, 21-a semiconductor refrigeration piece, 211-a first end, 212-a second end, 22-a cooling piece and 23-a water cooling head;
30-a circulating water path;
40-a water pump;
50-a water receiving cover;
60-a water receiving box;
70-a drain pipe;
80-radiating water tank.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that in the description of the present invention, the terms of direction or positional relationship indicated by the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, which are merely for convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Referring to fig. 1 and 2, the refrigerator in the present embodiment includes a cabinet 10, and a refrigerating chamber 11 is formed inside the cabinet 10.
Be equipped with semiconductor dehumidification module 20 in the walk-in 11, semiconductor dehumidification module 20 includes semiconductor refrigeration piece 21, and the cold junction (being marked as first end 211) of semiconductor refrigeration piece 21 is equipped with fin 22, and the hot junction (being marked as second end 212) of semiconductor refrigeration piece 21 is equipped with water-cooling head 23, and water-cooling head 23 passes through circulating water 30 and communicates with radiator tank 80.
When the temperature in the refrigerating chamber 11 is higher than a system temperature threshold (for example, 2 ℃) and the humidity in the refrigerating chamber 11 is higher than a system humidity threshold (for example, 55%), the semiconductor dehumidifying module 20 starts the dehumidifying function, the semiconductor chilling plates 21 are energized, the current in the semiconductor chilling plates 21 flows in a first direction, the cold ends (first ends 211) of the semiconductor chilling plates 21 generate cold, and the hot ends (second ends 212) of the semiconductor chilling plates 21 generate heat. The cold of the cold end (first end 211) is released into the refrigeration compartment 11 through the heat sink 22 to dehumidify the refrigeration compartment 11. The heat of the hot end (the second end 212) is brought into the radiating water tank 80 through the water cooling head 23 and the liquid flowing in the circulating water path 30, and the heat of the hot end (the second end 212) is radiated in a water cooling mode.
In the application, the semiconductor dehumidification module 20 is integrally arranged in the refrigerating chamber 11, the refrigerating chamber 11 is dehumidified by cold energy generated by the cold end (the first end 211) of the semiconductor refrigeration piece 21, and the heat dissipation water tank 80 is used for carrying out water-cooling heat dissipation on the hot end (the second end 212) of the semiconductor refrigeration piece 21 through the water cooling head 23 and the circulating water path 30; in the second aspect, the heat preservation device can fundamentally prevent the environmental heat outside the refrigerated cabinet from being conducted into the refrigerated chamber 11 through the semiconductor refrigeration sheet 21, reduce the refrigeration power consumption of the refrigerated cabinet, improve the heat preservation time of the refrigerated cabinet and improve the storage safety of medicines or vaccines; in the third aspect, a part of heat at the hot end of the semiconductor refrigeration sheet 21 plays a certain temperature compensation role in temperature reduction during dehumidification of the refrigerating chamber 11, the temperature in the refrigerating chamber 11 is prevented from being too low, and the grade-A anti-freezing requirement is met.
The heat sink 22 and the cold end (first end 211) of the semiconductor chilling plate 21, and the water cooling head 23 and the hot end (second end 212) of the semiconductor chilling plate 21 must be tightly attached to each other, so as to improve the heat exchange efficiency.
It should be noted that, the above-mentioned "cold end (first end 211) of the semiconductor chilling plate" and "hot end (second end 212) of the semiconductor chilling plate" are relative to the case where the semiconductor dehumidification module 20 performs the dehumidification function, and the current in the semiconductor chilling plate 21 flows in the first direction. When the current in the semiconductor chilling plate 21 flows in the second direction, which is opposite to the first direction, the cold end of the semiconductor chilling plate 21 and the hot end of the semiconductor chilling plate 21 are exchanged, that is, the first end 211 of the semiconductor chilling plate becomes the hot end and the second end 212 becomes the cold end at this time.
In some embodiments of the present application, when the semiconductor dehumidification module 20 performs dehumidification, the current directions in the semiconductor refrigeration sheet 21 are alternated, that is, the current in the semiconductor refrigeration sheet during dehumidification is firstly in the first direction working time t1, and then the current is reversed, the current in the semiconductor refrigeration sheet 21 is in the second direction working time t2, because after the cold end (the first end 211) of the semiconductor refrigeration sheet 21 is used for dehumidification for a period of time, the cold end (the first end 211) of the semiconductor refrigeration sheet 21 can frost, which affects the dehumidification effect, and after the current is reversed, the frost end (the first end 211) becomes the hot end to achieve defrosting.
In some embodiments of the present application, the semiconductor dehumidifying module 20 further has a heating function, when the temperature in the refrigerating chamber 11 is lower than the system temperature threshold, the semiconductor dehumidifying module 20 starts the heating function, at this time, the current in the semiconductor chilling plate 21 is reversed, that is, the current in the semiconductor chilling plate 21 flows in the second direction, the first end 211 of the semiconductor chilling plate 21 becomes the hot end, the second end 212 becomes the cold end, the heat emitted by the first end 211 is released into the refrigerating chamber 11 through the heat dissipating fin 22, so as to increase the temperature in the refrigerating chamber 11, and avoid the temperature in the refrigerating chamber 11 from being too low.
In some embodiments of the present disclosure, the water pump 40 is disposed on the water circulation path 30 to provide circulation power for the liquid flowing between the heat dissipation water tank 80, the water circulation path 30 and the water cooling head 23.
When the semiconductor dehumidification module 20 dehumidifies the refrigerating chamber 11, the water pump 40 is turned on; when the semiconductor dehumidification module 20 heats the refrigerating chamber 11, the water pump 40 is turned off.
The cabinet 10 has a cabin 12 at the bottom thereof, and the heat dissipation water tank 80 and the water pump 40 are disposed in the cabin so as not to affect the refrigerating space of the refrigerating compartment 11.
The flow rate of the water pump 40 is adjusted according to the dew point temperature of the refrigerating chamber 11, specifically, the higher the dew point temperature is, the larger the flow rate of the water pump 40 is, the lower the dew point temperature is, the smaller the flow rate of the water pump 40 is, so that the cold end (the first end 211) of the semiconductor refrigerating sheet 21 reaches a proper dehumidification temperature, and the dehumidification effect is improved.
In some embodiments of the present application, the semiconductor dehumidification module 20 is located at a position below the refrigerating chamber 11, on one hand, the refrigerating space in the refrigerating chamber 11 is not affected, and on the other hand, because the cool air sinks, the humidity at the bottom of the refrigerating chamber 11 is larger, and the semiconductor dehumidification module 20 is arranged below, which helps to improve the dehumidification efficiency.
In some embodiments of the present invention, a water receiving cover 50 is disposed at the bottom of the refrigerating chamber 11, a drain pipe 70 is disposed on the water receiving cover 50, and condensed water in the refrigerating chamber 11 falls on the water receiving cover 50 and is then drained through the drain pipe 70.
The water receiving cover 50 is tapered, and the drain pipe 70 is connected to the lowest end of the water receiving cover 50, so that the condensed water can be conveniently discharged.
A water receiving box 60 is arranged in the engine room 12, and a water discharge pipe 70 is communicated with the water receiving box 60.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (10)
1. A refrigerated case comprising:
a cabinet body in which a refrigerating chamber is formed;
it is characterized by also comprising:
the semiconductor dehumidification module is arranged in the refrigerating chamber and comprises a semiconductor refrigeration piece, a cooling fin is arranged at the cold end of the semiconductor refrigeration piece, and a water cooling head is arranged at the hot end of the semiconductor refrigeration piece;
and the water cooling head is communicated with the heat radiation water tank through a circulating water path.
2. A refrigerated cabinet according to claim 1,
and a water pump is arranged on the circulating water path.
3. A refrigerated cabinet according to claim 2,
the bottom of the cabinet body is provided with a cabin, and the heat dissipation water tank and the water pump are arranged in the cabin.
4. A refrigerated cabinet according to claim 2,
the flow rate of the water pump is adjusted according to the dew point temperature of the refrigerating chamber.
5. A refrigerated cabinet according to claim 2,
the semiconductor dehumidification module also has a heating function, when the temperature in the refrigerating chamber is lower than a system temperature threshold value, the semiconductor dehumidification module starts the heating function, the water pump is turned off, and the current in the semiconductor refrigeration piece is reversed.
6. A refrigerated cabinet according to claim 1,
when the semiconductor dehumidification module dehumidifies, the current directions in the semiconductor refrigeration pieces are alternated.
7. Refrigerated cabinet according to any of the claims 1 to 6,
the semiconductor dehumidification module is located at a position lower than the refrigerating chamber.
8. Refrigerated cabinet according to any of the claims 1 to 6,
and a water receiving cover is arranged at the bottom of the refrigerating chamber, and a drain pipe is arranged on the water receiving cover.
9. A refrigerated cabinet according to claim 8,
the water receiving cover is in a conical shape, and the drain pipe is connected with the lowest end of the water receiving cover.
10. A refrigerated cabinet according to claim 8,
the bottom of the cabinet body is provided with a cabin, a water receiving box is arranged in the cabin, and the drain pipe is communicated with the water receiving box.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120034798.7U CN215260686U (en) | 2021-01-07 | 2021-01-07 | Refrigerating cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120034798.7U CN215260686U (en) | 2021-01-07 | 2021-01-07 | Refrigerating cabinet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215260686U true CN215260686U (en) | 2021-12-21 |
Family
ID=79489685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120034798.7U Active CN215260686U (en) | 2021-01-07 | 2021-01-07 | Refrigerating cabinet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215260686U (en) |
-
2021
- 2021-01-07 CN CN202120034798.7U patent/CN215260686U/en active Active
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