CN114947575A - Thermal insulation rice box - Google Patents
Thermal insulation rice box Download PDFInfo
- Publication number
- CN114947575A CN114947575A CN202210580273.2A CN202210580273A CN114947575A CN 114947575 A CN114947575 A CN 114947575A CN 202210580273 A CN202210580273 A CN 202210580273A CN 114947575 A CN114947575 A CN 114947575A
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- CN
- China
- Prior art keywords
- heat
- water
- piece
- rice
- preservation
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J47/00—Kitchen containers, stands or the like, not provided for in other groups of this subclass; Cutting-boards, e.g. for bread
- A47J47/02—Closed containers for foodstuffs
- A47J47/04—Closed containers for foodstuffs for granulated foodstuffs
- A47J47/06—Closed containers for foodstuffs for granulated foodstuffs with arrangements for keeping fresh
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
- F25D17/04—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
- F25D17/06—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection by forced circulation
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Food Science & Technology (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention discloses a heat preservation rice bin, which comprises a shell assembly, a semiconductor refrigeration piece, a water collecting piece and a water absorbing piece, wherein the shell assembly is provided with a heat preservation cavity, the side wall of the heat preservation cavity is provided with a mounting hole, the semiconductor refrigeration piece is accommodated in the mounting hole and connected with the shell assembly, the cold end of the semiconductor refrigeration piece faces the heat preservation cavity, the hot end of the semiconductor refrigeration piece is opposite to the heat preservation cavity, the water collecting piece is connected with the shell assembly, the water collecting piece is provided with a water collecting tank for collecting condensed water, the water collecting tank is communicated with the heat preservation cavity, the water absorbing piece comprises a water absorbing area and a processing area, the water absorbing area is accommodated in the water collecting tank, the processing area is corresponding to the hot end of the semiconductor refrigeration piece, the water absorbing area is used for absorbing the condensed water and guiding the condensed water to the processing area, the cold end of the semiconductor refrigeration piece can refrigerate air in the heat preservation cavity, the condensed water drops into the water collecting tank under the action of gravity, and the hot end of the semiconductor refrigeration piece can heat evaporate the processing area, the condensed water can be automatically removed, and the use by a user is facilitated.
Description
Technical Field
The invention relates to the technical field of intelligent home furnishing, in particular to a heat preservation rice bin.
Background
The existing heat preservation rice box generally refrigerates the heat preservation rice box through a semiconductor refrigerating sheet so as to maintain the rice in the rice box at a preset temperature and prolong the storage time of the rice. When the rice case refrigerates, the cold junction of semiconductor refrigeration piece will produce the comdenstion water, and the user need regularly clear up the comdenstion water, and inconvenient user uses.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides the heat preservation rice bin which can automatically clean condensed water.
The heat preservation rice bin comprises a shell assembly, a semiconductor refrigeration piece, a water collecting piece and a water absorbing piece, wherein the shell assembly is provided with a heat preservation cavity, the side wall of the heat preservation cavity is provided with a mounting hole, the semiconductor refrigeration piece is accommodated in the mounting hole and connected with the shell assembly, the cold end of the semiconductor refrigeration piece faces the heat preservation cavity, the hot end of the semiconductor refrigeration piece faces away from the heat preservation cavity, the water collecting piece is arranged on the shell assembly, the water collecting piece is provided with a water collecting tank used for collecting condensed water, the water collecting tank is communicated with the heat preservation cavity, the water absorbing piece comprises a water absorbing area and a processing area, the water absorbing area is accommodated in the water collecting tank, the processing area is arranged corresponding to the hot end of the semiconductor refrigeration piece, and the water absorbing area is used for absorbing the condensed water and guiding the condensed water to the processing area.
The heat preservation rice bin provided by the embodiment of the invention at least has the following beneficial effects:
when heat preservation rice case used, semiconductor refrigeration piece circular telegram work, the cold junction of semiconductor refrigeration piece can refrigerate the air of heat preservation intracavity, so that casing assembly maintains and predetermineeing the temperature, the comdenstion water that the cold junction of semiconductor refrigeration piece produced is under the effect of gravity, drip to the water catch bowl in, the comdenstion water guide to the treatment area in the piece that absorbs water can the water catch bowl, the hot junction of semiconductor refrigeration piece can act on the treatment area, in order to carry out the heating evaporation to the treatment area, can clear away the comdenstion water automatically, in order to avoid producing ponding, the user need not regularly to clear up the comdenstion water, convenience of customers uses.
According to some embodiments of the invention, the refrigerator further comprises a first heat exchange assembly, the first heat exchange assembly comprises a first heat exchanger and a cold end fan, the first heat exchanger is connected with the cold end of the semiconductor refrigeration sheet, and the cold end fan is arranged on a heat exchange path of the first heat exchanger.
According to some embodiments of the present invention, the first heat exchange assembly further includes a fixing frame, the fixing frame is accommodated in the heat preservation cavity and connected to the housing assembly, the fixing frame is provided with a mounting groove, the bottom wall of the mounting groove is provided with an air inlet, the side wall of the mounting groove is provided with an air outlet, the air outlet is arranged corresponding to the first heat exchanger, and the cold-end fan is accommodated in the mounting groove.
According to some embodiments of the invention, the semiconductor refrigeration sheet is provided with two, the first heat exchangers are correspondingly provided with two, and the cold-side fan is positioned between the two first heat exchangers.
According to some embodiments of the invention, the heat exchanger further comprises a second heat exchange assembly, the second heat exchange assembly comprises a second heat exchanger and a hot end fan, the second heat exchanger is connected with the hot end of the semiconductor refrigeration piece, the hot end fan is accommodated in the mounting hole, and the second heat exchanger is arranged between the semiconductor refrigeration piece and the hot end fan.
According to some embodiments of the present invention, the side wall of the mounting hole is provided with a heat dissipation hole, the heat dissipation hole is disposed corresponding to the heat exchange path of the second heat exchanger, and the treatment area of the water absorbing member is accommodated in the heat dissipation hole.
According to some embodiments of the invention, the housing assembly comprises a housing and a rice storage member, the housing is provided with a receiving cavity, the rice storage member is received in the receiving cavity, and the heat preservation cavity is formed between the housing and the rice storage member.
According to some embodiments of the invention, the side wall of the accommodating cavity is provided with a positioning strip, the positioning strip is arranged along the circumferential direction of the accommodating cavity, and the rice storage piece is connected with the positioning strip.
According to some embodiments of the invention, the positioning strip is provided with a wind guiding groove.
According to some embodiments of the invention, the absorbent member is provided with a plurality of through holes.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic structural view of an insulated rice bin according to an embodiment of the present invention;
FIG. 2 is an exploded view of the rice bin according to the embodiment of the present invention;
FIG. 3 is an assembly view of the rice bin according to the embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a housing according to an embodiment of the present invention;
FIG. 5 is a schematic structural view of a water absorbing member according to an embodiment of the present invention;
fig. 6 is a schematic structural view of a fixing frame according to an embodiment of the invention.
Reference numerals:
the heat preservation device comprises a shell assembly 100, a heat preservation cavity 101, a mounting hole 102, a heat dissipation hole 103, a shell 110, a containing cavity 111, a positioning strip 112, an air guide groove 113, a rice storage piece 120, a rice storage cavity 121, a semiconductor chilling plate 200, a water collecting piece 300, a water collecting tank 310, a water absorbing piece 400, a water absorbing area 410, a processing area 420, a through hole 430, a first heat exchanger 510, a cold-end fan 520, a fixing frame 530, a mounting groove 531, an air inlet 532, an air outlet 533, a second heat exchanger 610 and a hot-end fan 620.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and larger, smaller, larger, etc. are understood as excluding the number, and larger, smaller, inner, etc. are understood as including the number. If there is a description of first and second for the purpose of distinguishing technical features only, this is not to be understood as indicating or implying a relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of technical features indicated.
In the description of the present invention, unless otherwise specifically limited, terms such as set, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention by combining the specific contents of the technical solutions.
Referring to fig. 1 to 3, the heat preservation rice bin according to the embodiment of the invention comprises a shell assembly 100, a semiconductor refrigeration piece 200, a water collection piece 300 and a water absorption piece 400, wherein the shell assembly 100 is provided with a heat preservation cavity 101, the side wall of the heat preservation cavity 101 is provided with a mounting hole 102, the semiconductor refrigeration piece 200 is accommodated in the mounting hole 102 and is connected with the shell assembly 100, the cold end of the semiconductor refrigeration piece 200 faces the heat preservation cavity 101, the hot end of the semiconductor refrigeration piece 200 is opposite to the heat preservation cavity 101, the water collection piece 300 is arranged on the shell assembly 100, the water collection piece 300 is provided with a water collection tank 310 for collecting condensed water, the water collection tank 310 is communicated with the heat preservation cavity 101, the water absorption piece 400 comprises a water absorption area 410 and a treatment area 420, the water absorption area 410 is accommodated in the water collection tank 310, the treatment area 420 is arranged corresponding to the hot end of the semiconductor refrigeration piece 200, the water absorption area 410 is used for absorbing the condensed water and guiding the condensed water to the treatment area 420, and can automatically absorb and evaporate the condensed water, in order to avoid producing ponding, the user need not regularly to clear up the comdenstion water, and convenience of customers uses.
Specifically, when heat preservation rice case used, semiconductor refrigeration piece 200 circular telegram work, the cold junction of semiconductor refrigeration piece 200 can refrigerate the air in heat preservation chamber 101, so that casing assembly 100 maintains and predetermineeing the temperature, the comdenstion water that the cold junction of semiconductor refrigeration piece 200 produced is under the effect of gravity, drip to the water catch bowl 310 in, piece 400 that absorbs water can the comdenstion water guide to treatment area 420 in the water catch bowl 310, the hot junction of semiconductor refrigeration piece 200 can act on treatment area 420, in order to carry out the heating evaporation to treatment area 420, can clear away the comdenstion water automatically, in order to avoid producing ponding, the user need not regularly to clear up the comdenstion water, convenience of customers uses.
Referring to fig. 2 and 3, in some embodiments of the present invention, the semiconductor refrigeration device further includes a first heat exchange assembly, the first heat exchange assembly includes a first heat exchanger 510 and a cold-end fan 520, the first heat exchanger 510 is connected to the cold end of the semiconductor refrigeration sheet 200, and the cold-end fan 520 is disposed on a heat exchange path of the first heat exchanger 510, so that the heat exchange efficiency of the semiconductor refrigeration sheet 200 can be improved.
Specifically, first heat exchanger 510 is laminated with the cold junction of semiconductor refrigeration piece 200, is provided with the first heat transfer groove that a plurality of intervals set up on first heat exchanger 510, and cold junction fan 520 can the inhaled air to discharge air to first heat transfer groove, can increase the area of contact of the cold junction of semiconductor refrigeration piece 200 and air, in order to improve the refrigeration efficiency of semiconductor refrigeration piece 200.
It should be noted that the extending direction of the first heat exchange groove is a heat exchange path of the first heat exchanger 510.
Referring to fig. 3 and 6, in some embodiments of the present invention, the first heat exchange assembly further includes a fixing frame 530, the fixing frame 530 is accommodated in the heat preservation chamber 101 and connected to the housing assembly 100, the fixing frame 530 is provided with a mounting groove 531, a bottom wall of the mounting groove 531 is provided with an air inlet 532, a side wall of the mounting groove 531 is provided with an air outlet 533, the air outlet 533 is arranged corresponding to the first heat exchanger 510, and the cold-end fan 520 is accommodated in the mounting groove 531, so as to facilitate installation of the cold-end fan 520.
Specifically, the fixing frame 530 is connected to the housing assembly 100 by bolting, and the cold-end fan 520 is accommodated in the mounting groove 531, so that the cold-end fan 520 can be circumferentially positioned, so as to mount the cold-end fan 520.
It can be understood that the cold-side fan 520 can suck air from the air inlet 532 and exhaust air from the air outlet 533, and the air outlet 533 faces the first heat exchange groove, so as to improve the heat exchange efficiency of the semiconductor chilling plate 200.
Referring to fig. 2 and 3, in some embodiments of the present invention, two semiconductor cooling fins 200 are provided, two first heat exchangers 510 are correspondingly provided, and a cold-side fan 520 is located between the two first heat exchangers 510, so as to improve the heat preservation effect of the heat preservation rice bin.
Specifically, two semiconductor refrigeration pieces 200 are arranged along the vertical direction, the air outlets 533 are correspondingly configured with two air outlets, the two air outlets 533 are arranged along the vertical direction, the cold-end fans 520 can suck air, the air is discharged to the first heat exchanger 510 located above and the heat exchanger located below, two cold-end fans 520 do not need to be configured, the manufacturing cost of the heat-preservation rice box can be reduced, and the heat-preservation effect of the heat-preservation rice box can be improved.
Referring to fig. 2 and 3, in some embodiments of the present invention, the heat exchanger further includes a second heat exchange assembly, the second heat exchange assembly includes a second heat exchanger 610 and a hot-end fan 620, the second heat exchanger 610 is connected to the hot end of the semiconductor chilling plate 200, the hot-end fan 620 is accommodated in the mounting hole 102, and the second heat exchanger 610 is disposed between the semiconductor chilling plate 200 and the hot-end fan 620.
Specifically, the second heat exchanger 610 is attached to the hot end of the semiconductor chilling plate 200, the second heat exchanger 610 is provided with a plurality of second heat exchange grooves arranged at intervals, the hot end fan 620 can suck air and discharge the air to the second heat exchange grooves, the contact area between the hot end of the semiconductor chilling plate 200 and the air can be increased, and the heat dissipation efficiency of the semiconductor chilling plate 200 is improved.
It should be noted that the extending direction of the second heat exchange groove is a heat exchange path of the second heat exchanger 610.
Referring to fig. 4, in some embodiments of the present invention, the side wall of the mounting hole 102 is provided with heat dissipation holes 103, the heat dissipation holes 103 are disposed corresponding to the heat exchange path of the second heat exchanger 610, and the treatment area 420 of the water absorbing member 400 is accommodated in the heat dissipation holes 103, so as to facilitate heating and evaporation of the treatment area 420 of the water absorbing member 400, so that the heat preservation rice bin can automatically remove the condensed water.
Specifically, the louvre 103 disposes two, and two louvres 103 set up along the circumference of mounting hole 102 is relative, and the second heat transfer groove is located between two louvres 103, and the treatment area 420 holding of piece 400 that absorbs water is in louvre 103 for the heat of the hot junction of semiconductor refrigeration piece 200 can heat the evaporation to the treatment area 420 of piece 400 that absorbs water, so that the rice case that keeps warm can the automatic clear comdenstion water.
Referring to fig. 2 and 3, in some embodiments of the present invention, the housing assembly 100 includes a housing 110 and an rice storage member 120, the housing 110 has a receiving cavity 111, the rice storage member 120 is received in the receiving cavity 111, and a heat preservation cavity 101 is formed between the housing 110 and the rice storage member 120 to facilitate heat preservation of rice.
Specifically, store up rice piece 120 and be equipped with the rice chamber 121 that stores up that is used for depositing the rice, the cold junction of semiconductor refrigeration piece 200 can refrigerate the air that holds in the chamber 111, and refrigerated air and the contact of storing up rice piece 120 can transmit cold volume to storing up rice chamber 121 to rice in the chamber 121 keeps warm.
Referring to fig. 4, in some embodiments of the present invention, the sidewall of the accommodating chamber 111 is provided with a positioning strip 112, the positioning strip 112 is disposed along the circumference of the accommodating chamber 111, and the rice storage 120 is connected to the positioning strip 112 to facilitate assembly of the rice storage 120.
In particular, the rice storage 120 is connected with the positioning strip 112, which can circumferentially position the rice storage 120 to facilitate assembly of the rice storage 120.
It should be noted that the rice storage member 120 can also be connected to the housing 110 by means of a positioning pin and a shaft hole, which are not described in detail herein.
Referring to fig. 4, in some embodiments of the present invention, the positioning bar 112 is provided with an air guiding groove 113, which can guide air in the heat preservation cavity 101, so that the heat preservation rice box can preserve heat of rice in all directions.
Referring to fig. 5, in some embodiments of the present invention, a plurality of through holes 430 are formed in the water absorbing member 400 to facilitate evaporation of the condensed water, so as to rapidly remove the condensed water.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The present embodiment has been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above-described embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the spirit of the present invention.
Claims (10)
1. A heat preservation rice bin, its characterized in that includes:
the shell assembly (100) is provided with a heat preservation cavity (101), and the side wall of the heat preservation cavity (101) is provided with a mounting hole (102);
the semiconductor refrigeration piece (200) is accommodated in the mounting hole (102) and is connected with the shell assembly (100), the cold end of the semiconductor refrigeration piece (200) faces the heat preservation cavity (101), and the hot end of the semiconductor refrigeration piece (200) is opposite to the heat preservation cavity (101);
the water collecting piece (300) is arranged on the shell assembly (100), the water collecting piece (300) is provided with a water collecting groove (310) used for collecting condensed water, and the water collecting groove (310) is communicated with the heat preservation cavity (101);
the water absorbing piece (400) comprises a water absorbing area (410) and a processing area (420), the water absorbing area (410) is contained in the water collecting tank (310), the processing area (420) is arranged corresponding to the hot end of the semiconductor refrigerating sheet (200), and the water absorbing area (410) is used for absorbing condensed water and guiding the condensed water to the processing area (420).
2. The heat-insulating rice bin as claimed in claim 1, further comprising a first heat exchange assembly, wherein the first heat exchange assembly comprises a first heat exchanger (510) and a cold-end fan (520), the first heat exchanger (510) is connected with the cold end of the semiconductor chilling plate (200), and the cold-end fan (520) is arranged on a heat exchange path of the first heat exchanger (510).
3. The heat-preservation rice bin as claimed in claim 2, wherein the first heat exchange assembly further comprises a fixing frame (530), the fixing frame (530) is accommodated in the heat-preservation chamber (101) and connected with the housing assembly (100), the fixing frame (530) is provided with a mounting groove (531), the bottom wall of the mounting groove (531) is provided with an air inlet (532), the side wall of the mounting groove (531) is provided with an air outlet (533), the air outlet (533) is arranged corresponding to the first heat exchanger (510), and the cold-end fan (520) is accommodated in the mounting groove (531).
4. The rice bin as claimed in claim 2, wherein the number of the semiconductor chilling plates (200) is two, the number of the first heat exchangers (510) is two, and the cold-side fan (520) is located between the two first heat exchangers (510).
5. The heat-preservation rice bin as claimed in claim 1, further comprising a second heat exchange assembly, wherein the second heat exchange assembly comprises a second heat exchanger (610) and a hot-end fan (620), the second heat exchanger (610) is connected with the hot end of the semiconductor chilling plate (200), the hot-end fan (620) is accommodated in the mounting hole (102), and the second heat exchanger (610) is arranged between the semiconductor chilling plate (200) and the hot-end fan (620).
6. The heat-preservation rice bin as claimed in claim 5, wherein heat dissipation holes (103) are formed in the side walls of the mounting holes (102), the heat dissipation holes (103) are arranged corresponding to the heat exchange paths of the second heat exchanger (610), and the treatment area (420) of the water absorbing member (400) is accommodated in the heat dissipation holes (103).
7. The rice-insulated container according to claim 1, characterized in that the housing assembly (100) comprises a housing (110) and a rice-storing member (120), the housing (110) is provided with a receiving cavity (111), the rice-storing member (120) is received in the receiving cavity (111), and the heat-insulated cavity (101) is formed between the housing (110) and the rice-storing member (120).
8. The heat-preservation rice bin as claimed in claim 7, wherein a positioning strip (112) is arranged on the side wall of the accommodating cavity (111), the positioning strip (112) is arranged along the circumferential direction of the accommodating cavity (111), and the rice storage piece (120) is connected with the positioning strip (112).
9. The heat-preservation rice bin as claimed in claim 8, wherein the positioning strip (112) is provided with a wind guide groove (113).
10. The heat-insulating rice bin as claimed in claim 1, wherein the water absorbing member (400) is provided with a plurality of through holes (430).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202210580273.2A CN114947575A (en) | 2022-05-26 | 2022-05-26 | Thermal insulation rice box |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202210580273.2A CN114947575A (en) | 2022-05-26 | 2022-05-26 | Thermal insulation rice box |
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CN114947575A true CN114947575A (en) | 2022-08-30 |
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Family Applications (1)
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CN202210580273.2A Pending CN114947575A (en) | 2022-05-26 | 2022-05-26 | Thermal insulation rice box |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116769591A (en) * | 2023-08-28 | 2023-09-19 | 四川杰莱美科技有限公司 | Real-time fluorescence quantitative PCR instrument |
-
2022
- 2022-05-26 CN CN202210580273.2A patent/CN114947575A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116769591A (en) * | 2023-08-28 | 2023-09-19 | 四川杰莱美科技有限公司 | Real-time fluorescence quantitative PCR instrument |
CN116769591B (en) * | 2023-08-28 | 2023-10-31 | 四川杰莱美科技有限公司 | Real-time fluorescence quantitative PCR instrument |
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