CN218358374U - Dehumidification module and storage equipment - Google Patents

Abstract

The utility model discloses a dehumidification module, which comprises a shell and a dehumidification device; the shell is provided with a heat dissipation cavity and a condensation cavity, and the heat dissipation cavity and the condensation cavity are both provided with heat exchange ports communicated with the outside; the dehumidification device comprises a semiconductor refrigerator, a cold-end heat exchanger arranged on the cold-end side of the semiconductor refrigerator and a hot-end heat exchanger arranged on the hot-end side of the semiconductor refrigerator; the cold end heat exchanger is arranged in the condensation cavity, the hot end heat exchanger is arranged in the heat dissipation cavity, and the semiconductor refrigerator is positioned at the separation position between the heat dissipation cavity and the condensation cavity. The utility model discloses do not need the compressor, consequently can realize the high-efficient dehumidification of initiative under the silence environment, have silence, high-efficient, small, portable and can the advantage of overlength use. The utility model also discloses a storing equipment.

Description

Dehumidification module and storage equipment

Technical Field

The utility model relates to a dehumidification technology field especially relates to a dehumidification module and storing equipment.

Background

The wardrobe is cabinet furniture for storing clothes, the clothes are made of stainless steel, solid wood, toughened glass and hardware fittings, the wardrobe body, a door plate and silent wheels are generally used as components, and the wardrobe is internally provided with clothes hanging rods, a trousers rack, a pull basket, a disinfection lamp and other fittings.

The cabinet is a platform for storing kitchenware and cooking operation in a kitchen. The color collocation with higher lightness is used and consists of five major components: the cabinet body, door plant, hardware, mesa and electrical apparatus. The integral cabinet is also called as integral kitchen, and refers to a cabinet combination formed by four parts of a cabinet, an electric appliance, a gas appliance and a kitchen functional appliance. There is also a need for dehumidification as the cabinet is located in the wet environment of the kitchen.

Currently, common dehumidification methods include: two dehumidification modes of compressor refrigeration dehumidification and drying bag adsorption dehumidification. For the refrigeration and dehumidification mode of the compressor, the compressor is used as the most important equipment, the size is large, a large wardrobe or cabinet space is occupied, the utilization rate of the wardrobe and the cabinet is influenced, and the noise is large when the compressor works. Because the compressor can vibrate when working, therefore can only fix in waiting to install the position through the fastener, be unfavorable for reforming transform current wardrobe and cupboard. The drying bag adopts an adsorption dehumidification mode, the dehumidification effect is not obvious, the volume is increased after moisture absorption, and the service life is short.

Therefore, how to realize active dehumidification in a silent environment, and the setting position can be changed at will, and the device can be used for a long time is a technical problem that needs to be solved by those skilled in the art at present.

SUMMERY OF THE UTILITY MODEL

In view of the above, an object of the present invention is to provide a dehumidification module, which can realize active dehumidification in a silent environment, can change the setting position at will, and can be used for a long time;

another object of the utility model is to provide a storing equipment with above-mentioned dehumidification module.

In order to achieve the above object, the utility model provides a following technical scheme:

a dehumidification module comprising a housing and a dehumidification device;

the shell is provided with a heat dissipation cavity and a condensation cavity, and the heat dissipation cavity and the condensation cavity are both provided with heat exchange ports communicated with the outside;

the dehumidification device comprises a semiconductor refrigerator, a cold-end heat exchanger arranged on the cold-end side of the semiconductor refrigerator and a hot-end heat exchanger arranged on the hot-end side of the semiconductor refrigerator;

the cold end heat exchanger is arranged in the condensation cavity, the hot end heat exchanger is arranged in the heat dissipation cavity, and the semiconductor refrigerator is located at the separation position between the heat dissipation cavity and the condensation cavity.

Optionally, in the dehumidification module, the heat dissipation cavity and the condensation cavity are separated by a thermal insulation plate, and an embedding groove for embedding the semiconductor refrigerator is formed in the thermal insulation plate.

Optionally, in the dehumidification module, the heat dissipation chamber includes a heat dissipation chamber frame and a top plate, the top plate is disposed on a side of the heat dissipation chamber frame away from the heat insulation plate, and the heat insulation plate, the top plate and the heat dissipation chamber frame together enclose the heat dissipation chamber.

Optionally, in the dehumidification module, a heat dissipation air duct surrounded by a heat dissipation air duct partition plate is arranged in the heat dissipation cavity frame, and the hot-end heat exchanger is arranged in the heat dissipation air duct;

the heat exchange port of the heat dissipation cavity at least comprises a heat dissipation air inlet and a heat dissipation air outlet, one end of the heat dissipation air channel is communicated with the heat dissipation air inlet, and the other end of the heat dissipation air channel is communicated with the heat dissipation air outlet;

and a fan is arranged in the heat dissipation air duct to drive airflow to enter the heat dissipation air duct from the heat dissipation air inlet and discharge the airflow out of the heat dissipation air duct through the heat dissipation air outlet.

Optionally, in the dehumidification module, the heat dissipation air inlet and the heat dissipation air outlet are disposed on a side plate on the same side of the heat dissipation cavity frame.

Optionally, in the dehumidification module, the condensation chamber includes a condensation chamber frame and a bottom plate, the bottom plate is disposed on a side of the condensation chamber frame away from the heat insulation plate, and the heat insulation plate, the bottom plate and the condensation chamber frame together enclose the condensation chamber.

Optionally, in the dehumidification module, a condensation air duct enclosed by a condensation air duct partition is arranged in the condensation cavity frame, and the cold end heat exchanger is arranged in the condensation air duct;

the heat exchange port of the condensation cavity at least comprises a condensation air inlet and a condensation air outlet, one end of the condensation air channel is communicated with the condensation air inlet, and the other end of the condensation air channel is communicated with the condensation air outlet;

and a fan is arranged in the condensation air duct to drive airflow to enter the condensation air duct from the condensation air inlet and discharge the airflow out of the condensation air duct through the condensation air outlet.

Optionally, in the dehumidification module, the fan in the heat dissipation air duct and the fan in the condensation air duct are the same fan, a part of the fan is located in the heat dissipation air duct, and the other part of the fan penetrates through the thermal insulation plate and extends into the condensation air duct; alternatively, the first and second electrodes may be,

the fans in the heat dissipation air channel and the condensation air channel are different fans.

Optionally, in the dehumidification module, the heat exchange fins of the cold-end heat exchanger are vertically arranged, and a water receiving box for collecting condensed water is arranged below the cold-end heat exchanger in the condensation chamber.

Optionally, in the dehumidification module, a heating and evaporating device is disposed on the water receiving box; and/or the presence of a gas in the gas,

a drainage pipeline for draining condensed water is arranged on the water receiving box; and/or the presence of a gas in the gas,

and a drainage pipeline for draining the condensed water to the hot-end heat exchanger is arranged on the water receiving box.

Optionally, in the dehumidification module, a super-hydrophilic coating is coated on the heat exchange fins of the cold-end heat exchanger; and/or the presence of a gas in the atmosphere,

a heat-conducting silicone grease layer or a heat-conducting fin is arranged between the semiconductor refrigerator and the cold-end heat exchanger; and/or the presence of a gas in the gas,

a heat-conducting silicone grease layer or a heat-conducting fin is arranged between the semiconductor refrigerator and the hot-end heat exchanger; and/or the presence of a gas in the gas,

the base plates and the heat exchange fins of the cold end heat exchanger and the hot end heat exchanger are integrated into a whole through heat conducting glue or welding; and/or the presence of a gas in the gas,

and the fastener for fixing the cold end heat exchanger and the hot end heat exchanger is a plastic fastener.

Optionally, in the dehumidification module, the hot-end heat exchanger is a phase change heat exchanger, and the hot-end heat exchanger is arranged in the heat dissipation cavity in an inclined manner along the horizontal direction;

the hot end heat exchanger is provided with an evaporation section and a condensation section, the semiconductor refrigerator is attached to the evaporation section of the hot end heat exchanger, and the vertical height of the condensation section of the hot end heat exchanger is higher than that of the evaporation section of the hot end heat exchanger.

The utility model provides a dehumidification module sets up dehydrating unit in the shell, and the shell sets up independent heat dissipation chamber and condensation chamber, and dehydrating unit provides the cold source by semiconductor cooler, for strengthening semiconductor cooler's cold and hot end heat transfer, prevents that semiconductor cooler's hot junction high temperature from being burnt out, is equipped with cold junction heat exchanger and hot junction heat exchanger respectively in cold and hot end side and strengthens the heat transfer with increase heat transfer area. The cold end heat exchanger sets up in the condensation intracavity, and the hot junction heat exchanger sets up in the heat dissipation intracavity. The cold energy that its cold end side produced of semiconductor cooler in the course of the work for the temperature of cold end heat exchanger is showing and is being less than ambient temperature, and the gaseous water in the ambient air deposits out liquid comdenstion water on cold end heat exchanger surface under the condensation, reduces the humidity in the ambient air then. The heat generated by the hot end of the semiconductor refrigerator can be accelerated to exchange heat with the surrounding environment through the hot end heat exchanger, and the semiconductor refrigerator has a certain drying effect on the surrounding environment. The utility model discloses do not need the compressor, consequently can realize the high-efficient dehumidification of initiative under the silence environment, have silence, high efficiency, small, portable and can the advantage of overlength use.

The storage device comprises a device body and further comprises the dehumidification module arranged in the device body and used as any one of the dehumidification modules.

Optionally, in the above storage device, the device body is provided with at least one dehumidification module installation groove, and the dehumidification module is arranged in the dehumidification module installation groove.

Optionally, in the storage device, a through ventilation hole is formed in the bottom wall of the dehumidification module mounting groove, and the heat exchange port of the condensation cavity is correspondingly communicated with the ventilation hole.

Optionally, in the storage apparatus, the apparatus body is a wardrobe or a cabinet.

The utility model discloses a storing equipment owing to have above-mentioned dehumidification module, consequently has all technological effects of above-mentioned dehumidification module concurrently, and this text is no longer repeated here.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a housing of a dehumidification module disclosed in an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a dehumidifying apparatus disclosed in an embodiment of the present invention;

fig. 3 is an exploded view of a housing disclosed in an embodiment of the present invention;

fig. 4 is a schematic view of an internal structure of a heat dissipation chamber disclosed in an embodiment of the present invention;

fig. 5 is a schematic structural view of a heat dissipation chamber under a heat insulation plate according to an embodiment of the present invention;

fig. 6 is a schematic view of an internal structure of a dehumidification module according to an embodiment of the present invention;

fig. 7 is an external structural view of a dehumidification module according to an embodiment of the present invention;

fig. 8 is a schematic structural view of the dehumidifying module detached from the storage device disclosed in the embodiment of the present invention;

fig. 9 is a schematic structural view of a sliding device body according to an embodiment of the present invention;

fig. 10 is a schematic structural view of a dehumidifying module installed on a storage device according to an embodiment of the present invention;

fig. 11 is a schematic structural view of a dehumidifying module installed on a storage device according to another embodiment of the present invention.

The meaning of the individual reference numerals in fig. 1 to 11 is as follows:

10 is a dehumidification module, 20 is an equipment body, 21 is a dehumidification module mounting groove, and 22 is a vent hole;

100 is a shell, 110 is a heat dissipation cavity, 111 is a top plate, 112 is a heat dissipation cavity frame, 1121 is a heat dissipation air duct, 1122 is a heat dissipation air inlet, 1123 is a heat dissipation air outlet, 120 is a condensation cavity, 121 is a condensation cavity frame, 122 is a bottom plate, 1221 is a condensation air inlet, 1222 is a condensation air outlet, and 130 is a heat insulation plate;

200 is a dehumidifying device, 210 is a hot-end heat exchanger, 220 is a cold-end heat exchanger, 230 is a semiconductor refrigerator, 240 is a water receiving box, 250 is a supporting plate, and 260 is an aluminum base;

300 is a fan.

Detailed Description

The core of the utility model is to provide a dehumidification module to realize active dehumidification in a silent environment, and the setting position can be changed at will and the dehumidification module can be used for a long time;

another core of the present invention is to provide a storage device having the above dehumidification module.

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 1 and 2, an embodiment of the present invention discloses a dehumidification module, which includes a housing 100 and a dehumidification device 200.

The casing 100 has a heat dissipation chamber 110 and a condensation chamber 120, and the heat dissipation chamber 110 and the condensation chamber 120 each have a heat exchange port communicating with the outside to communicate with the ambient environment at the dehumidification module installation position.

Dehumidification device 200 includes a semiconductor chiller 230 and a cold-side heat exchanger 220 disposed on the cold-side of semiconductor chiller 230 and a hot-side heat exchanger 210 disposed on the hot-side of semiconductor chiller 230. The semiconductor cooler 230 does not require any refrigerant, can continuously operate, has no pollution source, has no rotating part, does not generate a rotation effect, has no sliding part, is a solid piece, has no vibration and noise during operation, has long service life, and is easy to install.

The cold-side heat exchanger 220 is arranged in the condensation cavity 120, the hot-side heat exchanger 210 is arranged in the heat dissipation cavity 110, the cold-side heat exchanger 220 and the hot-side heat exchanger 210 are respectively arranged in two cavities of the shell 100, heat neutralization of the cold-side heat exchanger 220 and the hot-side heat exchanger 210 is reduced, and condensation efficiency is improved. Semiconductor cooler 230 is located at the separation between heat dissipation chamber 110 and condensation chamber 120.

The utility model provides a dehumidification module sets up dehydrating unit 200 in the shell, and the shell sets up independent heat dissipation chamber 110 and condensation chamber 120, and dehydrating unit 200 provides the cold source by semiconductor cooler 230, for strengthening semiconductor cooler 230's cold and hot end heat transfer, prevents that semiconductor cooler 230's hot junction high temperature from being burnt out, is equipped with cold junction heat exchanger 220 and hot junction heat exchanger 210 respectively at cold and hot end side and strengthens the heat transfer in order to increase heat transfer area. The cold side heat exchanger 220 is disposed in the condensation chamber 120, and the hot side heat exchanger 210 is disposed in the heat dissipation chamber 110. Cold energy generated at the cold end of the semiconductor refrigerator 230 during operation significantly lowers the temperature of the cold-end heat exchanger 220 to be lower than the ambient temperature, and gaseous water in the ambient air deposits liquid condensate water on the surface of the cold-end heat exchanger 220 under the condensation effect, thereby lowering the humidity in the ambient air. The heat generated by the hot side of the semiconductor cooler 230 can be accelerated to exchange heat with the surrounding environment through the hot side heat exchanger 210, and has a certain drying effect on the surrounding environment. The utility model discloses do not need the compressor, consequently can realize the high-efficient dehumidification of initiative under the silence environment, have silence, high-efficient, small, portable and can the advantage of overlength use.

As shown in fig. 6, in order to further reduce the cold-heat amount neutralization between the cold-side heat exchanger 220 and the hot-side heat exchanger 210, in this embodiment, the heat dissipation chamber 110 and the condensation chamber 120 are separated by an insulation board 130, a caulking groove for embedding the semiconductor refrigerator 230 is opened on the insulation board 130, and the semiconductor refrigerator 230 is fixed in the caulking groove. The insulation board 130 has a plate-shaped structure having a certain insulation capability, if it is made of plastic or wood.

As shown in fig. 3, in the present embodiment, the heat dissipation chamber 110 includes a heat dissipation chamber frame 112 and a top plate 111, and the top plate 111 is disposed on a side of the heat dissipation chamber frame 112 away from the heat insulation board 130. The top plate 111 is a portion of the housing 100 located at the top when the dehumidification module is normally installed. The top plate 111 and the heat dissipation chamber frame 112 may be an integral structure or a detachable structure. The heat insulation board 130, the top plate 111 and the heat dissipation chamber frame 112 together enclose the heat dissipation chamber 110, and at least one of the heat insulation board 130 and the top plate 111 needs to be a detachable structure with the heat dissipation chamber frame 112, so that the dehumidifying apparatus 200 can be conveniently installed in the casing 100.

As shown in fig. 4, in order to accelerate heat exchange with the surrounding environment, a heat dissipation air duct 1121 surrounded by heat dissipation air duct partitions is disposed in the heat dissipation cavity frame 112, and the heat dissipation air duct partitions and the heat dissipation cavity frame 112 may be in an assembly structure or may be designed into an integral structure. Taking the case 100 as a plastic material, the heat dissipation duct partition and the heat dissipation chamber frame 112 can be directly injection molded into an integral structure.

Hot side heat exchanger 210 is disposed inside heat dissipation duct 1121, and in principle, hot side heat exchanger 210 may be disposed at any position of heat dissipation duct 1121, but considering smooth airflow, hot side heat exchanger 210 may be as close to the middle position of the entire path of heat dissipation duct 1121 as possible.

The heat exchanging port of the heat dissipating cavity 110 at least includes a heat dissipating air inlet 1122 and a heat dissipating air outlet 1123, one end of the heat dissipating air duct 1121 is communicated with the heat dissipating air inlet 1122, and the other end is communicated with the heat dissipating air outlet 1123. A fan 300 is disposed in the heat dissipation air duct 1121 to drive airflow from the heat dissipation air inlet 1122 into the heat dissipation air duct 1121, and the airflow is discharged out of the heat dissipation air duct 1121 through the heat dissipation air outlet 1123. Under the action of the fan 300, the heat exchange between the air in the heat dissipation chamber 110 and the air in the external environment can be accelerated, and the cooling effect of the cold end side of the semiconductor cooler 230 can be ensured.

In an embodiment of the present invention, the heat dissipating air inlet 1122 and the heat dissipating air outlet 1123 are disposed on the side plate of the same side of the heat dissipating cavity frame 112. Because the heat dissipation air inlet 1122 and the heat dissipation air outlet 1123 are located on the same plane, the heat dissipation air duct 1121 has a semi-annular structure, and air entering from the heat dissipation air inlet 1122 surrounds the heat dissipation air duct 1121 and is then discharged through the heat dissipation air outlet 1123. In this embodiment, after the dehumidification module is installed in a storage device such as a wardrobe, a cabinet, or a shoe cabinet, the heat dissipation air inlet 1122 and the heat dissipation air outlet 1123 may be disposed facing a door of the storage device, which is helpful for discharging high-temperature gas heated by the hot-end heat exchanger 210 to the outside of the storage device as soon as possible.

As shown in fig. 3, in the present embodiment, the condensing chamber 120 includes a condensing chamber frame 121 and a bottom plate 122, and the bottom plate 122 is disposed at a side of the condensing chamber frame 121 far from the heat insulation plate 130. The bottom plate 122 is a portion of the housing 100 located at the bottom when the dehumidification module is normally installed. The bottom plate 122 and the condensation chamber frame 121 may be an integrated structure or a detachable structure. The insulation panel 130, the bottom plate 122 and the condensing chamber frame 121 together define the condensing chamber 120, and at least one of the insulation panel 130 and the bottom plate 122 and the condensing chamber frame 121 is required to be a detachable structure so that the dehumidifying apparatus 200 can be conveniently installed in the casing 100.

As shown in fig. 4, in order to improve the dehumidification efficiency, a condensation air duct surrounded by condensation air duct partition plates is disposed in the condensation chamber frame 121, and the condensation air duct partition plates and the condensation chamber frame 121 may be assembled or designed to be an integrated structure. Taking the case 100 made of plastic as an example, the condensation duct partition and the condensation chamber frame 121 can be directly injection molded into an integrated structure.

Cold end heat exchanger 220 sets up in the condensation wind channel, and cold end heat exchanger 220 can set up in the optional position in condensation wind channel in principle, nevertheless considers the smooth and easy of air current flow, can be close to the intermediate position in the whole route in condensation wind channel as far as possible with cold end heat exchanger 220.

As shown in fig. 7, the heat exchanging port of the condensing chamber 120 at least includes a condensing air inlet 1221 and a condensing air outlet 1222, one end of the condensing air duct is communicated with the condensing air inlet 1221, the other end is communicated with the condensing air outlet 1222, and the condensing air inlet 1221 and the condensing air outlet 1222 can be disposed on the bottom plate 122. A fan 300 is disposed in the condensation air duct to drive the air flow from the condensation air inlet 1221 into the condensation air duct and out of the condensation air duct through the condensation air outlet 1222. Under fan 300's effect, the air in the environment gets into the condensation wind channel through condensation air intake 1221 to through the moisture in cold junction heat exchanger 220 in order to condense out the air, along with the circulation with higher speed of air, accelerate with ambient air's condensation rate, improved dehumidification effect.

In order to reduce the cost of the dehumidification module, the fan 300 in the cooling air duct 1121 and the fan 300 in the condensation air duct are the same fan 300, a part of the fan 300 is located in the cooling air duct 1121, and the other part of the fan passes through the insulation board 130 and extends into the condensation air duct. In this embodiment, only one fan 300 is used to drive the air to flow from the condensation inlet 1221 to the condensation outlet 1222 and from the heat sink inlet 1122 to the heat sink outlet 1123. The fan 300 may be a structure with two fan blades of one motor, where the two fan blades are respectively located in the condensation air duct and the heat dissipation air duct 1121, or only one fan blade passes through the condensation air duct and the heat dissipation air duct 1121.

It should be noted that the fans 300 may also be disposed in the condensation air duct and the heat dissipation air duct 1121 respectively. Condensation wind channel and heat dissipation wind channel 1121 set up independent fan respectively for there is not the interference between condensation wind channel and the heat dissipation wind channel 1121, if: in order to rapidly lower the temperature of the cold-end heat exchanger, the fan in the condensation air duct should have a low air volume, or the fan in the condensation air duct should not be started, and in order to ensure that the semiconductor cooler 230 is not burned down during normal operation, the hot-end heat exchanger 210 needs to have enough air volume, and the fan in the heat dissipation air duct 1121 needs to be operated all the time, and has a large air volume.

As shown in fig. 5-7, in an embodiment of the present invention, the heat exchange fins of the cold end heat exchanger 220 are vertically arranged, that is, the heat exchange fins of the cold end heat exchanger 220 are perpendicular to the bottom plate 122, when the dehumidification module is to be disposed of dehumidification, the bottom plate 122 is generally in a horizontal state, and since the heat exchange fins of the cold end heat exchanger 220 are perpendicular to the bottom plate 122, the heat exchange fins of the cold end heat exchanger 220 are in a vertical state.

A water receiving box 240 for collecting condensed water is arranged below the cold-end heat exchanger 220 in the condensation chamber 120. Because the heat exchange fins of the cold-end heat exchanger 220 are vertical after the dehumidification module is installed, condensed water drops on the cold-end heat exchanger 220 can fall into the water receiving box 240 under the action of gravity to be collected, and the phenomenon that the clothes are wetted due to the fact that the condensed water drops at will is avoided.

Further, a heating evaporation device may be disposed on the water receiving box 240, and when there is not much condensed water in the water receiving box 240, the condensed water in the water receiving box 240 may be evaporated under the heating effect of the heating evaporation device. When the humidity in the environment is low, the condensed water in the water receiving box 240 can be heated by the heating and evaporating device, so that the condensed water is evaporated to humidify the air. The heating and evaporating device can be a thermistor heater or a heating wire and the like.

It should be noted that, a drainage pipeline for guiding the condensed water to the hot-end heat exchanger 210 may also be disposed on the water receiving box 240, and the condensed water is evaporated in real time by using the heat of the hot-end heat exchanger 210 and then may be discharged out of the machine body along with the heat dissipation air duct 1121. The heat of the hot-end heat exchanger 210 can be utilized to reduce the consumption of electric heating, and the cold energy of the condensed water can be utilized to cool the hot-end heat exchanger 210.

Generally, articles stored in storage equipment such as a wardrobe, a shoe cabinet and a cupboard need a proper humidity environment, a humidity sensor can be arranged in the environment, the humidity of the environment is detected by the humidity sensor, and when the humidity of the environment exceeds a preset upper limit of humidity, the dehumidification module can be controlled to be powered on to work so as to perform dehumidification treatment; when the ambient humidity is between the preset lower humidity limit and the preset upper humidity limit, the dehumidification module can be closed. When the ambient humidity is lower than the preset lower humidity limit, the heating evaporation device may be turned on to evaporate the condensed water in the water receiving box 240 to humidify the air.

In regions with high humidity in south China, because the humidity of ambient air is high, the amount of condensed water in the water receiving box 240 is usually high, a drainage pipeline for draining away the condensed water can be arranged on the water receiving box 240, and the condensed water in the water receiving box 240 is drained through the drainage pipeline so as to prevent the overflow of the excessive condensed water in the water receiving box 240. The drainage pipeline can be provided with a corresponding control valve to control the time of draining the condensed water.

In an embodiment of the present invention, the heat exchange fins of the cold-end heat exchanger 220 are coated with super-hydrophilic coating, which facilitates the downward flow of the condensed water. A layer of thermally conductive silicone or heat conducting fins may be provided between semiconductor cooler 230 and cold side heat exchanger 220 on the cold side to reduce the thermal contact resistance between semiconductor cooler 230 and cold side heat exchanger 220. A heat conductive silicone layer or heat conductive sheet may be disposed between semiconductor cooler 230 and hot side heat exchanger 210 to reduce the thermal contact resistance between semiconductor cooler 230 and hot side heat exchanger 210. The base plates and heat exchange fins of the cold-side heat exchanger 220 and the hot-side heat exchanger 210 can be bonded into a whole through heat-conducting glue or welding so as to ensure that the contact surfaces are closely and efficiently transferred.

The fasteners used to secure the cold side heat exchanger 220 and the hot side heat exchanger 210 may be plastic fasteners. After the plastic fasteners pass through the heat shield 130 from the hot side heat exchanger 210, the plastic fasteners are fixed on the base plate of the cold side heat exchanger 220, and the plastic fasteners are used for preventing the cold quantity of the cold side heat exchanger 220 and the hot side heat exchanger 210 from being neutralized by the fasteners.

As shown in fig. 6, the hot side heat exchanger 210 is preferably a phase-change heat exchanger, and the hot side heat exchanger 210 is disposed in the heat dissipation chamber 110 to be inclined in a horizontal direction, and the inclination of the hot side heat exchanger 210 may be implemented by a support plate 250 and an aluminum base 260.

The hot-side heat exchanger 210 has an evaporation section and a condensation section, the semiconductor refrigerator 230 is attached to the evaporation section of the hot-side heat exchanger 210, and the vertical height of the condensation section of the hot-side heat exchanger 210 is higher than that of the evaporation section of the hot-side heat exchanger 210.

The phase change radiator has the characteristics of high heat transfer capacity, high heat conductivity coefficient and light weight. The phase change radiator can ensure high temperature environment (such as environment temperature above 35 ℃), and the dehumidification module can still normally work and can still work in severe weather. The phase change radiator is obliquely arranged, and can flow back under the action of gravity, so that the heat dissipation capacity can be further improved. During operation, heat at the hot end of the semiconductor cooler 230 is rapidly transferred to the entire phase change heat sink according to the heat pipe principle, and then the heat is taken away through convection heat transfer. The phase change heat radiator is not limited to the forms of an expansion plate, a heat radiator groove embedded VC plate/flat plate micro-channel heat pipe/sintered heat pipe and the like. The phase change radiator array fins increase the heat exchange area and can play a role in strengthening heat exchange.

The cold side heat exchanger 220 may be an aluminum extruded heat exchanger, but is not limited to this type of aluminum extruded heat exchanger, and may be other suitable heat exchanger types.

In order to realize rapid dehumidification, the refrigerating capacity of the semiconductor refrigerator 230 can be increased, so that water vapor in the air is directly frosted on the surface of the cold-end heat exchanger 220, then the current direction is changed, the cold end and the hot end are exchanged, the cold-end heat exchanger 220 is heated to be defrosted, and the purpose of rapid dehumidification can be achieved.

As shown in fig. 8-11, the embodiment of the present invention discloses a storage device, which comprises a device body 20 and a dehumidification module 10 disposed in the device body 20. The device body 20 may be a wardrobe, a shoe cabinet, or a cabinet. Since the dehumidification module 10 is provided, all technical effects of the dehumidification module 10 are achieved, and are not described herein again.

At least one dehumidification module installation groove 21 may be provided in the apparatus body 20, and the dehumidification module 10 is disposed in the dehumidification module installation groove 21. The dehumidification module mounting groove 21 can be an interlayer arranged on the equipment body 20, the dehumidification module 10 is directly inserted into the interlayer, the mounting and dismounting modes are similar to those of a drawer, the heat dissipation air inlet 1122 and the heat dissipation air outlet 1123 are required to be ensured to be positioned on the front side face of the dehumidification module 10 aiming at the embedded type, and the heat exchange air is enabled to advance and advance out by utilizing the air channel structure.

The bottom wall of the dehumidification module installation groove 21 is provided with a through ventilation hole 22, and the heat exchange port of the condensation cavity 120 is correspondingly communicated with the ventilation hole 22, that is, the condensation air inlet 1221 and the condensation air outlet 1222 are correspondingly communicated with the ventilation hole 22, so as to ensure air circulation between the condensation air duct and the equipment body 20, and meanwhile, corresponding sealing treatment can be performed between the condensation air inlet 1221 and the condensation air outlet 1222 and the ventilation hole 22.

It should be noted that, in this specification, each embodiment is described in a progressive manner, and each embodiment focuses on differences from other embodiments, and portions that are the same as and similar to each other in each embodiment may be referred to.

As used in this application and the appended claims, the terms "a," "an," "the," and/or "the" are not intended to be inclusive in the singular, but rather are intended to be inclusive in the plural unless the context clearly dictates otherwise. In general, the terms "comprises" and "comprising" merely indicate that steps and elements are included which are explicitly identified, that the steps and elements do not form an exclusive list, and that a method or apparatus may include other steps or elements. An element defined by the phrase "comprising a … …" does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.

In the following, the terms "first", "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

The principles and embodiments of the present invention have been explained herein using specific examples, and the above descriptions of the embodiments are only used to help understand the core concepts of the present invention. It should be noted that, for those skilled in the art, without departing from the principle of the present invention, the present invention can be further modified and modified, and such modifications and modifications also fall within the protection scope of the appended claims.

Claims (16)

1. A dehumidification module comprising a housing (100) and a dehumidification device (200);

the shell (100) is provided with a heat dissipation cavity (110) and a condensation cavity (120), and the heat dissipation cavity (110) and the condensation cavity (120) are both provided with heat exchange ports communicated with the outside;

the dehumidification device (200) comprises a semiconductor refrigerator (230), a cold-end heat exchanger (220) arranged on the cold-end side of the semiconductor refrigerator (230) and a hot-end heat exchanger (210) arranged on the hot-end side of the semiconductor refrigerator (230);

the cold-end heat exchanger (220) is arranged in the condensation cavity (120), the hot-end heat exchanger (210) is arranged in the heat dissipation cavity (110), and the semiconductor refrigerator (230) is positioned at the separation position between the heat dissipation cavity (110) and the condensation cavity (120).

2. The dehumidification module according to claim 1, wherein the heat dissipation chamber (110) and the condensation chamber (120) are separated by a heat insulation plate (130), and the heat insulation plate (130) is provided with a caulking groove for embedding the semiconductor refrigerator (230).

3. Dehumidification module according to claim 2, wherein the heat dissipation chamber (110) comprises a heat dissipation chamber frame (112) and a top plate (111), the top plate (111) being arranged at a side of the heat dissipation chamber frame (112) remote from the heat insulation plate (130), the top plate (111) and the heat dissipation chamber frame (112) together enclosing the heat dissipation chamber (110).

4. A dehumidification module according to claim 3, wherein a heat dissipation air duct (1121) enclosed by a heat dissipation air duct partition is arranged in the heat dissipation cavity frame (112), and the hot-end heat exchanger (210) is arranged in the heat dissipation air duct (1121);

the heat exchange port of the heat dissipation cavity (110) at least comprises a heat dissipation air inlet (1122) and a heat dissipation air outlet (1123), one end of the heat dissipation air channel (1121) is communicated with the heat dissipation air inlet (1122), and the other end of the heat dissipation air channel is communicated with the heat dissipation air outlet (1123);

a fan (300) is arranged in the heat dissipation air duct (1121) to drive airflow to enter the heat dissipation air duct (1121) from the heat dissipation air inlet (1122) and to be discharged out of the heat dissipation air duct (1121) through the heat dissipation air outlet (1123).

5. The dehumidification module according to claim 4, wherein the heat dissipation air inlet (1122) and the heat dissipation air outlet (1123) are disposed on a side plate of the same side of the heat dissipation chamber frame (112).

6. A dehumidification module according to claim 4, wherein the condensation chamber (120) comprises a condensation chamber frame (121) and a bottom plate (122), the bottom plate (122) is arranged on a side of the condensation chamber frame (121) remote from the heat insulation plate (130), and the heat insulation plate (130), the bottom plate (122) and the condensation chamber frame (121) together enclose the condensation chamber (120).

7. The dehumidification module according to claim 6, wherein a condensation air duct enclosed by a condensation air duct partition is arranged in the condensation chamber frame (121), and the cold end heat exchanger (220) is arranged in the condensation air duct;

the heat exchange port of the condensation cavity (120) at least comprises a condensation air inlet (1221) and a condensation air outlet (1222), one end of the condensation air channel is communicated with the condensation air inlet (1221), and the other end of the condensation air channel is communicated with the condensation air outlet (1222);

a fan (300) is arranged in the condensation air duct to drive air flow to enter the condensation air duct from the condensation air inlet (1221) and to be discharged out of the condensation air duct through the condensation air outlet (1222).

8. The dehumidification module according to claim 7, wherein the fan (300) in the cooling air duct (1121) and the fan (300) in the condensation air duct are the same fan (300), and a part of the fan (300) is located in the cooling air duct (1121) and another part of the fan extends into the condensation air duct through the insulation board (130); alternatively, the first and second electrodes may be,

the fan (300) in the heat dissipation air duct (1121) and the fan (300) in the condensation air duct are different fans.

9. Dehumidification module according to any of claims 1 to 8, wherein the heat exchange fins of the cold side heat exchanger (220) are arranged vertically and a water trap (240) for collecting condensed water is provided in the condensation chamber (120) below the cold side heat exchanger (220).

10. A dehumidification module according to claim 9, wherein the water-receiving box (240) is provided with a heating and evaporation device; and/or the presence of a gas in the gas,

a drainage pipeline used for draining condensed water is arranged on the water receiving box (240); and/or the presence of a gas in the gas,

and a drainage pipeline for draining condensed water to the hot end heat exchanger (210) is arranged on the water receiving box (240).

11. Dehumidification module according to any of claims 1 to 8, wherein the heat exchange fins of the cold side heat exchanger (220) are coated with a super hydrophilic coating; and/or the presence of a gas in the gas,

a heat-conducting silicone layer or a heat-conducting fin is arranged between the semiconductor refrigerator (230) and the cold-end heat exchanger (220); and/or the presence of a gas in the gas,

a heat-conducting silicone grease layer or a heat-conducting fin is arranged between the semiconductor refrigerator (230) and the hot-end heat exchanger (210); and/or the presence of a gas in the gas,

the base plates and the heat exchange fins of the cold-end heat exchanger (220) and the hot-end heat exchanger (210) are jointed into a whole through heat conducting glue or welding; and/or the presence of a gas in the gas,

the fasteners for fixing the cold side heat exchanger (220) and the hot side heat exchanger (210) are plastic fasteners.

12. The dehumidification module according to any of claims 1 to 8, wherein the hot side heat exchanger (210) is a phase change heat exchanger, and the hot side heat exchanger (210) is arranged obliquely in a horizontal direction in the heat dissipation chamber (110);

the hot-end heat exchanger (210) is provided with an evaporation section and a condensation section, the semiconductor refrigerator (230) is attached to the evaporation section of the hot-end heat exchanger (210), and the vertical height of the condensation section of the hot-end heat exchanger (210) is higher than that of the evaporation section of the hot-end heat exchanger (210).

13. A storage device comprising a device body (20), characterized by further comprising a dehumidification module (10) according to any one of claims 1 to 12 disposed inside the device body (20).

14. Storage device according to claim 13, characterized in that at least one dehumidification module installation slot (21) is provided in said device body (20), said dehumidification module (10) being provided in said dehumidification module installation slot (21).

15. The storage equipment as claimed in claim 14, wherein a through vent hole (22) is formed in the bottom wall of the dehumidification module mounting groove (21), and the heat exchange port of the condensation cavity (120) is correspondingly communicated with the vent hole (22).

16. Storage device according to claim 13, characterized in that said device body (20) is a wardrobe, a shoe chest or a cupboard.

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