CN216799325U - Dehumidifier - Google Patents

Abstract

The application provides a dehumidifier includes: cooling portion, semiconductor refrigeration piece and condenser, semiconductor refrigeration piece are located between cooling portion and the condenser, and the hot face and the cooling portion contact of semiconductor refrigeration piece, the cold face and the condenser contact of semiconductor refrigeration piece. The problems of small application range and high cost of the existing dehumidification measures are solved, and the dehumidification method has the advantages of wide application range and low cost.

Description

Dehumidifier

Technical Field

The application belongs to the technical field of dehumidification heat dissipation, and particularly relates to a dehumidifier.

Background

When the laser works in a high-temperature and high-humidity environment, dew is easily generated on a water cooling plate in a laser cabinet, so that parts of devices of the laser are damaged, the laser cannot normally work, and dehumidification measures are required. The following are used in the prior art:

1) high-pressure dry gas is introduced into the laser, and high-humidity air in the laser is discharged, so that the dew point of the environment in a laser cabinet is reduced, and the condensation phenomenon is avoided, but an air compressor or a compressed gas cylinder is required to be additionally arranged by a laser integrator or a laser user, so that the cost is high, and the operation is complex;

2) the laser adopts external air conditioner, uses the air conditioner to carry out drying cooling to the inside air of laser rack, makes the dew point value in the laser rack be less than laser instrument water supply temperature, avoids the dewfall phenomenon, but the air conditioner is bulky, is not suitable for small-size laser, and application scope is little, and is with high costs.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a dehumidifier to solve the problems of small application range and high cost of the existing dehumidification measures.

In a first aspect, an embodiment of the present application provides a dehumidifier, including: cooling portion, semiconductor refrigeration piece and condenser, the semiconductor refrigeration piece is located between cooling portion and the condenser, the hot face of semiconductor refrigeration piece with the cooling portion contact, the cold face of semiconductor refrigeration piece with the condenser contact.

Optionally, the cooling device further comprises a blowing part, the blowing part is located on one side of the cooling part, and the blowing part is used for blowing air to the cooling part and the condenser.

Optionally, the dehumidifier further includes a housing, the housing is provided with an air inlet and an air outlet, the air inlet and the air outlet are arranged oppositely, the air blowing portion is located on one side of the air inlet, the housing is provided with a water outlet, and the water outlet of the condenser is communicated with the water outlet of the housing.

Optionally, the air inlet includes a first sub-air opening and a second sub-air opening, the blowing portion includes a first fan and a second fan, the first fan is disposed opposite to the first sub-air opening, and the second fan is disposed opposite to the second sub-air opening.

Optionally, the system further comprises a control system, wherein the control system comprises:

the fourth acquisition device is used for acquiring the voltage of the blowing part;

a controller connected to the fourth collection device, the controller being configured to:

presetting a voltage threshold;

and comparing the voltage of the blowing part with the preset voltage threshold, and when the voltage of the blowing part is lower than the voltage threshold, sending blowing fault information by the controller.

Optionally, the cooling portion includes water-cooling board and heat dissipation grid, heat dissipation grid set up in on the water-cooling board, the hot side of semiconductor refrigeration piece with the contact of water-cooling board, water flow channel has been arranged in the water-cooling board, water flow channel with semiconductor refrigeration piece is arranged relatively.

Optionally, the periphery of the semiconductor refrigeration piece is provided with heat insulation cotton, and the heat insulation cotton is located between the cooling part and the condenser.

Optionally, the cold surface and the hot surface of the semiconductor chilling plate are coated with heat conducting interface layers respectively.

Optionally, the system further comprises a control system, wherein the control system comprises:

the first acquisition device is used for acquiring the real-time temperature of the condenser;

the controller, first collection system with the controller is connected, the controller is used for:

presetting a first temperature threshold;

the real-time temperature of the condenser is compared with the first temperature threshold value, and when the real-time temperature of the condenser is higher than the first temperature threshold value, the controller sends alarm information.

Optionally, the control system further includes:

the third acquisition device is used for acquiring the real-time temperature of the cold surface of the semiconductor refrigeration piece;

the third acquisition device is connected with the controller, and the controller is used for:

presetting a third temperature threshold;

and comparing the real-time temperature of the cold surface of the semiconductor chilling plate with the third temperature threshold, and when the real-time temperature of the cold surface of the semiconductor chilling plate is higher than the third temperature threshold, the controller sends fault information of the semiconductor chilling plate.

The utility model provides a dehumidifier, the dehumidifier includes the cooling part, semiconductor refrigeration piece and condenser, dehumidifier simple structure, it is compact, small, to placing space size requirement low, can place the inside suitable position of sealed rack of user equipment in, the air cooling of service environment is given to condenser and cooling part, the cooling part is given the heat dissipation of the hot face of semiconductor refrigeration piece, the cold face of semiconductor refrigeration piece is given the condenser cooling, reach the dew point value that steam can condense, the delivery port discharge of condenser can be followed to the water of condensing, it is little to have overcome current dehumidification measure application scope, problem with high costs, have wide and with low costs advantage of application scope.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the application, and that other drawings can be derived from these drawings by a person skilled in the art without inventive effort.

For a more complete understanding of the present application and its advantages, reference is now made to the following descriptions taken in conjunction with the accompanying drawings. Wherein like reference numerals refer to like parts in the following description.

Fig. 1 is a top view of a laser provided in an embodiment of the present application.

Fig. 2 is a sectional view taken along line a-a of fig. 1.

Fig. 3 is a sectional view taken along line B-B in fig. 1.

FIG. 4 is a first axial view of a dehumidifier according to an embodiment of the present invention.

FIG. 5 is a second axis view of a dehumidifier according to an embodiment of the present application.

Fig. 6 is a schematic view of an internal structure of a dehumidifier according to an embodiment of the present application.

Fig. 7 is a side view of fig. 6.

Fig. 8 is a cross-sectional view taken along line C-C of fig. 7.

Fig. 9 is an exploded view of a dehumidifier according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The embodiment of the application provides a dehumidifier to solve the problems of small application range and high cost of the existing dehumidification measures. The following description will be made with reference to the accompanying drawings.

Referring to fig. 1, fig. 2 and fig. 3, fig. 1 is a schematic structural diagram of a laser provided in an embodiment of the present application, fig. 2 is a sectional view taken along a line a-a in fig. 1, and fig. 3 is a sectional view taken along a line B-B in fig. 1.

The dehumidifier that this application embodiment provided can be applied to the dehumidification of multiple equipment and use to being applied to the laser instrument and being the illustration, the laser instrument includes dehumidifier 1 and rack 2, is equipped with accommodation space 20 in the rack 2, sets up dehumidifier 1 and laser instrument subassembly 3 in accommodation space 20, and laser instrument subassembly 3 includes electricity subassembly 30, optical pumping subassembly 31 and water cooling system etc. wherein, electricity subassembly 30, optical pumping subassembly 31 and water cooling system all set up the suitable position in rack 2, do not describe in detail. The water cooling system comprises a water inlet assembly and a water outlet assembly, and the water inlet assembly and the water outlet assembly are arranged on the cabinet 2. Referring to fig. 9, the dehumidifier 1 includes a cooling portion 10, a semiconductor refrigeration sheet 11 and a condenser 12, the semiconductor refrigeration sheet 11 is located between the cooling portion 10 and the condenser 12, a hot surface of the semiconductor refrigeration sheet 11 contacts with the cooling portion 10, a cold surface of the semiconductor refrigeration sheet 11 contacts with the condenser 12, the condenser 12 and the cooling portion 10 cool air in the cabinet 2, the cooling portion 10 also dissipates heat to the hot surface of the semiconductor refrigeration sheet 11, the cold surface of the semiconductor refrigeration sheet 11 cools the condenser 12 to reach a dew point value at which water vapor can be condensed, a water outlet is arranged on the cabinet 2, a water outlet of the condenser 12 is communicated with a water outlet on the cabinet 2, and condensed water is discharged from a water outlet of the cabinet 2 to condense water generated by the condenser 12.

It can be understood that the dehumidifier 1 can meet the cooling and dehumidifying requirements of the laser operating environment, the dehumidifier 1 is simple and compact in structure, small in temporary space, simple to operate, and the laser is not locally protruded in the built-in cabinet 2, so that the dehumidifier 1 is attractive in appearance, simple in structure and low in cost. A water outlet is formed in the machine cabinet 2, the water outlet of the condenser 12 is connected with the water outlet in the machine cabinet 2 through a pipeline, condensed water is led out of the laser, and the moisture content of gas in the laser is reduced.

In some embodiments, referring to fig. 4, a fixing bracket and a fixing plate 21 are arranged in the cabinet 2, the fixing plate 21 is connected with the fixing bracket, the dehumidifier 1 is installed on one side of the fixing plate 21, and the laser assembly 3 is located on the other side of the fixing plate 21.

It can be understood that the accommodating space 20 inside the cabinet 2 is divided into two areas by the fixing plate 21, the dehumidifier 1 is installed at one side, and the laser assembly 3 is installed at the other side, so that the installation operation and the routine maintenance operation are convenient.

When the laser is in a high-temperature and high-humidity environment for a long time, the starting steps are as follows: the dehumidifier is powered on firstly, the dehumidifier is enabled to enter a first working state to work continuously for about 0.5h, after the humidity in the laser cabinet is properly reduced, a water cooler matched with the laser is started, water is supplied to a water cooling plate of the dehumidifier and each component of the laser, the dehumidifier is enabled to enter a second working state to work for about 0.5h, and then the laser is started to emit light. The first working mode is that the dehumidifier 1 is powered on and the cooling part 10 is not communicated with water, and the second working mode is that the dehumidifier 1 is powered on and the cooling part 10 is communicated with water. In order to more clearly explain the structure of the dehumidifier 1, the dehumidifier 1 will be described with reference to the accompanying drawings.

In some embodiments, referring to fig. 6, the dehumidifier 1 includes a cooling part 10, a semiconductor chilling plate 11 and a condenser 12, the semiconductor chilling plate 11 is located between the cooling part 10 and the condenser 12, a hot side of the semiconductor chilling plate 11 is in contact with the cooling part 10, and a cold side of the semiconductor chilling plate 11 is in contact with the condenser 12.

It can be understood, condenser 12 can change the vapor in the gas into liquid, the heat that produces in the condenser 12 course of operation passes through the cooling of semiconductor refrigeration piece 11, cooling portion 10 gives the cooling of the hot side cooling of semiconductor refrigeration piece 11, guarantee the refrigeration effect of semiconductor refrigeration piece 11, because the temperature of the 11 cold sides of semiconductor refrigeration piece can keep at lower level, improve the condensation effect of condenser 12, space when cabinet 2 is interior is great, under the circumstances that the dehumidification volume is not enough, can adopt the parallelly connected size that increases condenser 12 and cooling portion 10 of a plurality of semiconductor refrigeration pieces 11, reach the effect that the dehumidification ability doubles, satisfy the demand that the laser instrument dehumidified.

Illustratively, the condenser 12 includes a condensation body 120 and a water outlet portion 121, the condensation body 120 is connected to the water outlet portion 121, the top of the condensation body 120 contacts with the cold surface of the semiconductor refrigeration sheet 11, the water outlet portion 121 is funnel-shaped, a water outlet of the water outlet portion 121 is connected to a water outlet of the cabinet 2, when the damp and hot air generates condensed water on the condensation body 120, the condensed water can be collected by the water outlet portion 121, the water outlet of the water outlet portion 121 is connected to the water outlet of the cabinet 2 through a pipeline, the condensed water is led out of the cabinet 2, and the moisture content of the gas in the cabinet 2 is reduced.

In some embodiments, referring to fig. 4, the dehumidifier 1 further comprises a blowing part located at one side of the cooling part 10 for blowing air to the cooling part 10 and the condenser 12.

Specifically, as shown in fig. 4 and 5, the blowing part includes a first fan 13 and a second fan 14, the first fan 13 is located at one side of the cooling part 10, the first fan 13 is used to blow air to the cooling part 10, the second fan 14 is located at one side of the condenser 12, and the second fan 14 is used to blow air to the condenser 12.

As can be appreciated, the first fan 13 and the second fan 14 increase the air convection inside the cabinet 2, on one hand, cool down the laser module 3 inside the cabinet 2, and on the other hand, can make the air temperature and humidity distribution inside the cabinet 2 uniform at various positions. In addition, the blowing part may include only one fan or more than two fans, and the number of the fans and the power of the fans may be set according to the size of the space in the cabinet 2, so that stable air convection can be achieved. In some embodiments, referring to fig. 4 and 5, the dehumidifier 1 further includes a housing 15, the housing 15 is provided with an air inlet 150 and an air outlet 151, the air inlet 150 is disposed opposite to the air outlet 151, the first fan 13 and the second fan 14 are disposed on one side of the air inlet 150, the housing 15 is provided with a water outlet, and the water outlet of the condenser 12 is communicated with the water outlet of the cabinet 2 through the water outlet of the housing 15.

As can be understood, referring to fig. 4, 5 and 6, the cooling part 10, the semiconductor chilling plates 11 and the condenser 12 are positioned in the housing 15, so as to facilitate the overall installation and disassembly of the dehumidifier 1. In addition, the first fan 13 and the second fan 14 may be installed in the casing 15, the inlet sides of the first fan 13 and the second fan 14 are close to the air inlet 150 side, the air outlet side of the first fan 13 is close to the cooling portion 10, the air outlet side of the second fan 14 is close to the condenser 12, the air outlet side of the condenser 12 is opposite to the air outlet 151 on the casing 15, and the integration level of the dehumidifier 1 is higher. Similarly, the fan can be installed outside the housing 15, and the air outlet sides of the first fan 13 and the second fan 14 are close to the air inlet 150 in the installation structure, so that the first fan 13 and the second fan 14 can be conveniently installed and maintained.

Illustratively, referring to fig. 4 and 5, the housing 15 includes a front support plate 152 and a rear support plate 153, the front support plate 152 is disposed opposite to the rear support plate 153, the air inlet 150 is disposed on the front support plate 152, the air outlet 151 is disposed on the rear support plate 153, the first fan 13 and the second fan 14 are fixedly mounted on the front support plate 152, the first fan 13 and the second fan 14 blow air to drive air circulation, and the air is blown out from the air outlet 151 after passing through the cooling portion 10 and the condenser 12, so as to form a stable air flow field. The front support plate 152 is provided with the power connection module 17, and the power connection module 17 is partially positioned outside the shell 15, so that the influence of humidity on the voltage module is reduced.

In some embodiments, referring to fig. 7, the cooling portion 10 includes a water-cooled plate 100 and a heat dissipation grid 101, the heat dissipation grid 101 is disposed on the water-cooled plate 100, and the hot surface of the semiconductor chilling plate 11 is in contact with the water-cooled plate 100.

It can be understood that, water flow channel has in the water-cooling board 100, the water-cooling system of laser instrument can be inserted to the water-cooling board 100, the partial heat of semiconductor refrigeration piece 11 hot side is taken away to rivers in the water-cooling board 100, the water-cooling board 100 still gives the heat dissipation grid 101 with the partial heat transfer of semiconductor refrigeration piece 11 hot side, in addition, when first fan 13 blows through heat dissipation grid 101, take away the heat of heat dissipation grid 101, guarantee the operating temperature of semiconductor refrigeration piece 11, the condensation effect of condenser 12 has been ensured. In the embodiment of the application, heat dissipation grid 101 includes the heating panel 1010 that a plurality of vertical intervals set up, form heat dissipation channel 1011 between the adjacent heating panel 1010, heat dissipation grid 101's material can be the metal material, the metal material is favorable to the heat dissipation, the air-out side of first fan 13 is relative with heat dissipation channel 1011's air inlet side, heat dissipation channel 1011's air-out side is located the homonymy with air outlet 151, first fan 13 blows airscope heat dissipation channel 1011 and flows out from air outlet 151, the wind channel design is simple, the air flow resistance is little, can guarantee that a large amount of airflows cross heat dissipation channel 1011, the abundant heat exchange that carries on, the radiating effect is good.

In addition, the heat dissipation plate 1010 in the embodiment of the present application is perpendicular to the upper surface of the water cooling plate 100, the heat dissipation plate 1010 may form a certain angle with the upper surface of the water cooling plate 100, and the heat dissipation grid 101 may be provided separately from the water cooling plate 100 or integrally with the water cooling plate 100. The side of the water cooling plate 100 is attached and connected with the inside of the shell 15, so that the structural stability and the compactness are improved, the size of the dehumidifier is reduced, the internal space of the shell 15 is reduced, gas can circulate through the air inlet and the air outlet, and the high efficiency of gas circulation is ensured.

The dehumidifier 1 has two working states, the first is that the dehumidifier 1 is electrified, the cooling part 10 is not electrified, and the second is that the dehumidifier 1 is electrified and the cooling part 10 is electrified. When the dehumidifier 1 is in the first working state, the first fan 13 drives the air to flow through the heat dissipation grid 101 of the cooling part 10 to dissipate heat of the hot surface of the semiconductor refrigeration piece 11, so that the cold surface of the semiconductor refrigeration piece 11 and the condenser 12 are kept at low temperature. The second fan 14 drives the air to flow through the low-temperature condenser 12, the water vapor in the air is condensed into liquid water on the condenser 12, and the liquid water is accumulated to a certain degree, drips to the water outlet of the condenser 12 and is discharged out of the cabinet 2 through a pipeline connected to the water outlet of the condenser 12. When the dehumidifier 1 is in the second working state, the cooling water flows through the water cooling plate 100 on the hot surface of the semiconductor refrigeration piece 11, on one hand, the heat is radiated from the hot surface of the semiconductor refrigeration piece 11, so that the cold surface of the semiconductor refrigeration piece 11 and the condenser 12 keep low temperature, and on the other hand, the temperature of the heat radiation grille 101 connected with the water cooling plate 100 can be reduced. When the first fan 13 drives the air to flow through the heat dissipation grid 101, the air is cooled to a certain degree, and when the second fan 14 drives the air to flow through the low-temperature condenser 12, the water vapor in the air is condensed into liquid water on the condenser 12, and the liquid water is accumulated to a certain degree, drips to the water outlet of the condenser 12, and is discharged out of the cabinet 2 through a pipeline connected to the water outlet of the condenser 12.

In some embodiments, referring to fig. 8 and 9, the semiconductor chilling plates 11 are provided with insulation wool 16 at their peripheries, the insulation wool 16 being located between the cooling portion 10 and the condenser 12.

Referring to fig. 9, the shape of the heat insulation cotton 16 is square, a through hole for installing the semiconductor refrigeration sheet 11 is arranged in the middle of the heat insulation cotton 16, the heat insulation cotton 16 surrounds the semiconductor refrigeration sheet 11 from the periphery of the semiconductor refrigeration sheet 11, the heat insulation cotton 16 has the function of blocking heat conduction between the cold surface and the hot surface of the semiconductor refrigeration sheet 11, so that the mutual influence between the cold surface and the hot surface is reduced, the refrigeration effect of the semiconductor refrigeration sheet is prevented from radiating to the air, and the refrigeration effect of the semiconductor refrigeration sheet 11 is ensured. In addition, the heat insulation cotton 16 isolates the semiconductor refrigeration piece 11 from the air in the cabinet 2, and plays a certain dustproof and moistureproof role on the semiconductor refrigeration piece 11, thereby prolonging the service life of the semiconductor refrigeration piece 11.

In some embodiments, the cold and hot sides of the semiconductor chilling plates 11 are each coated with a thermally conductive interface layer.

It can be understood that the two surfaces of the semiconductor chilling plate 11 are coated with the heat conducting interface layers, the heat conducting interface layers arranged on the cold surfaces can reduce the interface thermal resistance between the cold surfaces of the semiconductor chilling plate 11 and the condenser 12, and the heat conducting interface layers arranged on the hot surfaces can reduce the interface thermal resistance between the semiconductor chilling plate 11 and the cooling portion 10, that is, the interface thermal resistance between the semiconductor chilling plate 11 and the water cooling plate 100. The heat conducting interface layer is made of organic silicone, and a certain gap is reserved between the semiconductor refrigeration sheet 11 and the heat insulation cotton 16 and used for containing pasty organic silicone material overflowing from the heat conducting interface layer.

In some embodiments, further comprising a control system, the control system comprising:

the first acquisition device is used for acquiring the real-time temperature of the condenser 12;

the controller, first collection system is connected with the controller, and the controller is used for:

presetting a first temperature threshold;

the real-time temperature of condenser 12 is compared with first temperature threshold, and when the real-time temperature of condenser 12 is higher than first temperature threshold, the controller sends out first overtemperature alarm information.

It can be understood that the first collecting device is a temperature sensor arranged on the condenser 12, the real-time temperature of the condenser 12 is collected through the temperature sensor, the controller compares the real-time temperature with a first temperature threshold, and when the real-time temperature of the condenser 12 is higher than the first temperature threshold, the fault of the condenser 12 is prompted or the efficacy of the dehumidifier 1 is insufficient.

In some embodiments, the control system further comprises:

the second acquisition device is used for acquiring the real-time temperature and the real-time humidity in the cabinet 2;

the controller is connected with second collection system, and the controller is used for:

presetting a second temperature threshold;

and fitting according to the real-time temperature and the real-time humidity in the cabinet 2 to obtain a dew point value, comparing the dew point value with a second temperature threshold value, and sending second overtemperature alarm information by the controller when the dew point value is higher than the second temperature threshold value. It can be understood that, the second collection system is temperature and humidity sensor, temperature and humidity sensor sets up inside 2 cabinets, detect real-time temperature and real-time humidity in the cabinet 2, when the controller sent first overtemperature alarm information or second overtemperature alarm information, whether artifical judgement laser current service environment is fit for the laser work, if uncomfortable, then need improve the operational environment situation of laser, if be fit for, then the user can need not the operation, it can below to wait for the dehumidifier to reduce the real-time temperature of condenser 12 to the first temperature threshold value.

In some embodiments, the control system further comprises:

the third acquisition device is used for acquiring the real-time temperature of the cold surface of the semiconductor refrigeration piece 11;

the third collection system is connected with the controller, and the controller is used for:

presetting a third temperature threshold;

and comparing the real-time temperature of the cold surface of the semiconductor refrigerating piece 11 with a third temperature threshold, and when the real-time temperature of the cold surface of the semiconductor refrigerating piece 11 is higher than the third temperature threshold, sending fault information of the semiconductor refrigerating piece 11 by the controller.

It can be understood that the third collecting device is a thermistor arranged on the cold surface of the semiconductor chilling plate 11, and whether the semiconductor chilling plate 11 has a fault or not is judged according to the real-time temperature of the cold surface of the semiconductor chilling plate 11 detected by the thermistor, if the fault occurs, the fault information of the semiconductor chilling plate 11 is sent, so that a user can conveniently find out the fault reason.

In addition, the hot side of the semiconductor refrigeration piece 11 can also be provided with a hot side resistor, the thermistor detects the temperature of the hot side of the semiconductor refrigeration piece 11, and when the temperature of the hot side of the semiconductor refrigeration piece 11 is lower than the water temperature in the water cooling plate 100, the controller controls the semiconductor refrigeration piece 11 to stop refrigeration, so that energy conservation and high efficiency are realized.

In some embodiments, a control system comprises: the fourth collection system for gather the voltage of portion of blowing respectively, the controller is connected with the fourth collection system, and the controller is used for:

presetting a voltage threshold;

and comparing the voltage of the blowing part with a voltage threshold, and when the voltage of the blowing part is lower than the voltage threshold, sending out the fault information of the blowing part by the controller.

It can be understood that, when the blowing part includes the first fan 13 and the second fan 14, the fourth collecting device collects the voltages of the first fan 13 and the second fan 14, respectively, compares the real-time voltage of the first fan 13 with the voltage threshold, if the real-time voltage of the first fan 13 is lower than the voltage threshold, the controller sends out the fault information of the first fan 13, compares the real-time voltage of the second fan 14 with the voltage threshold, and if the real-time voltage of the second fan 14 is lower than the voltage threshold, the controller sends out the fault information of the second fan 14, which helps the user to identify the faulty device quickly and facilitates maintenance.

In addition, when the first acquisition device fails, the controller sends out failure alarm information of the first acquisition device; when the second acquisition device fails, the controller sends out failure alarm information of the second acquisition device; and when the third acquisition device fails, the controller sends out failure alarm information of the third acquisition device. And the fault reason is prompted, so that the user can conveniently check and maintain.

The control system comprises an alarm device and a display device, the alarm device and the display device are connected with the controller, and the controller sends alarm information to the alarm device and the display device to prompt a user to check according to the alarm information, so that the control system is convenient for the user to use.

In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.

In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features.

The dehumidifier provided by the embodiment of the application is described in detail, a specific example is applied in the description to explain the principle and the implementation of the application, and the description of the embodiment is only used for helping to understand the method and the core idea of the application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims (10)

1. A dehumidifier, comprising: cooling portion, semiconductor refrigeration piece and condenser, the semiconductor refrigeration piece is located between cooling portion and the condenser, the hot face of semiconductor refrigeration piece with the cooling portion contact, the cold face of semiconductor refrigeration piece with the condenser contact.

2. The dehumidifier of claim 1, further comprising a blowing part located at one side of the cooling part, the blowing part blowing air to the cooling part and the condenser.

3. The dehumidifier of claim 2, wherein the dehumidifier further comprises a housing, the housing is provided with an air inlet and an air outlet, the air inlet and the air outlet are arranged oppositely, the air blowing part is positioned on one side of the air inlet, the housing is provided with a water outlet, and the water outlet of the condenser is communicated with the water outlet of the housing.

4. The dehumidifier of claim 3, wherein the air inlet includes a first sub-air inlet and a second sub-air inlet, the blowing part includes a first fan and a second fan, the first fan is disposed opposite to the first sub-air inlet, and the second fan is disposed opposite to the second sub-air inlet.

5. The dehumidifier of claim 2, further comprising a control system, the control system comprising:

the fourth acquisition device is used for acquiring the voltage of the blowing part;

a controller connected to the fourth collection device, the controller being configured to:

presetting a voltage threshold;

and comparing the voltage of the blowing part with the preset voltage threshold, and when the voltage of the blowing part is lower than the voltage threshold, sending blowing fault information by the controller.

6. The dehumidifier of claim 1 or 2, wherein the cooling part comprises a water-cooling plate and a heat dissipation grid, the heat dissipation grid is arranged on the water-cooling plate, the hot surface of the semiconductor refrigeration piece is in contact with the water-cooling plate, a water flow channel is arranged in the water-cooling plate, and the water flow channel is arranged opposite to the semiconductor refrigeration piece.

7. The dehumidifier of claim 1, wherein the semiconductor chilling plate is provided with heat insulation cotton around the semiconductor chilling plate, and the heat insulation cotton is located between the cooling part and the condenser.

8. The dehumidifier of claim 1, wherein the cold and hot sides of the semiconductor chilling plates are each coated with a thermally conductive interface layer.

9. The dehumidifier of claim 1, further comprising a control system, the control system comprising:

the first acquisition device is used for acquiring the real-time temperature of the condenser;

a controller, the first collection device with the controller is connected, the controller is used for:

presetting a first temperature threshold;

the real-time temperature of condenser with first temperature threshold value is compared, works as the real-time temperature of condenser is higher than first temperature threshold value, the controller sends overtemperature alarm information.

10. The dehumidifier of claim 9, wherein the control system further comprises:

the third acquisition device is used for acquiring the real-time temperature of the cold surface of the semiconductor refrigeration piece;

the third acquisition device is connected with the controller, and the controller is used for:

presetting a third temperature threshold;

and comparing the real-time temperature of the cold surface of the semiconductor chilling plate with the third temperature threshold, and when the real-time temperature of the cold surface of the semiconductor chilling plate is higher than the third temperature threshold, the controller sends fault information of the semiconductor chilling plate.

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