CN110857800A - Portable air conditioner based on semiconductor refrigerating sheet - Google Patents
Portable air conditioner based on semiconductor refrigerating sheet Download PDFInfo
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- CN110857800A CN110857800A CN201810973108.7A CN201810973108A CN110857800A CN 110857800 A CN110857800 A CN 110857800A CN 201810973108 A CN201810973108 A CN 201810973108A CN 110857800 A CN110857800 A CN 110857800A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F1/00—Room units for air-conditioning, e.g. separate or self-contained units or units receiving primary air from a central station
- F24F1/02—Self-contained room units for air-conditioning, i.e. with all apparatus for treatment installed in a common casing
- F24F1/04—Arrangements for portability
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/30—Arrangement or mounting of heat-exchangers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
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- Engineering & Computer Science (AREA)
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- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Devices For Blowing Cold Air, Devices For Blowing Warm Air, And Means For Preventing Water Condensation In Air Conditioning Units (AREA)
Abstract
The invention relates to a portable air conditioner based on a semiconductor refrigerating sheet, which comprises an airtight shell, an airtight shell cover, a battery pack, a single chip microcomputer, a semiconductor refrigerating sheet and an air conditioning assembly, wherein the single chip microcomputer is electrically connected with the battery pack and the semiconductor refrigerating sheet; the air conditioning assembly comprises an air conditioning end and a temperature diffusion end, the air conditioning end and the temperature diffusion end are respectively connected to two sides of the semiconductor refrigerating sheet, and the air conditioning end comprises a micro high-pressure fan, a heat exchanger, a heat insulation ventilating duct and an air recirculator. The beneficial effects are as follows: the portable air conditioner has the characteristics of remarkable air conditioning efficiency, reasonable structural design, convenient use and easy carrying, is suitable for being used in global non-extreme climate areas, and is particularly suitable for people needing to be outdoors for a long time. The air-conditioning clothes can effectively adjust the cold and hot temperature of air, has small volume which is about the size of the palm of an adult, has the weight of only about 800 g, and can be easily hung on the waist to blow air into the clothes.
Description
Technical Field
The invention relates to an air conditioning device, in particular to a portable air conditioner based on a semiconductor refrigerating sheet.
Background
Including central air conditioning system and domestic air conditioner among the current air conditioning equipment, generally adopt compressor and freon or other refrigerants to refrigerate, its structure is complicated, power consumption is big, can only fix a point the installation, and installation and dismantlement are very inconvenient, and freon's use destroys greatly to environmental pollution, is unfavorable for the environmental protection. Both central air conditioning systems and domestic air conditioners cool or heat entire rooms or entire buildings with high energy consumption, while local cooling/heating systems (LCHS) can reduce the energy demand for cooling/heating, and they only regulate the ambient temperature around the user's body, not the ambient temperature of the whole building, so they are favored and advocated by many people in regions that are not particularly cold or hot, on the premise that the comfort of the user feeling the temperature is not lost.
In addition, in hot summer, heat stroke can result; in cold winter, low-temperature symptoms can be caused, people who need to be in the outdoor environment for a long time have absolute requirements on regulating body temperature comfort level, the adoption of the existing air conditioner inevitably causes great waste, the existing air conditioner needs to be installed in a fixed place, has high power consumption, overlarge volume and overlarge weight and is not suitable for being used in the outdoor environment, and as for the adoption of a fan for cooling, only air is blown to flow, the cooling effect is very limited, and when the temperature is very high, the cooling effect of the fan is very little; when the temperature is low, it is not useful. The portable water cooling fans and portable atomizing fans that have appeared in the current day buildings claim to reduce the temperature to 6 to 8 degrees. The principle of the water cooling fan is that a water pumping motor or a water absorbing material is utilized, and water is distributed on a filter material through the internal structure design to form a water curtain. When air is sucked into the water cooling fan, the air is subjected to heat exchange through the water curtain, so that the temperature of the air is reduced, the humidity of the air is increased, and the processed air is blown out by the fan. When the treated air is blown to the surface of the skin, partial heat on the surface of the skin can be taken away by high-humidity cool wind, and people feel that the temperature is reduced. The principle of the portable spray fan is similar, but the spray evaporation cooling technology is used instead, heat exchange is carried out on small water points of air through evaporation, heat is absorbed, and the treated air is blown out. However, through practical tests, the product can blow cool air which is about 2 to 5 degrees lower than the room temperature under the environment that the temperature is lower than 28 ℃ and the relative humidity is lower than 60 percent. In high temperature and high humidity environment, the product has no utility. There is a great need for a portable air conditioning device for outdoor environments or some indoor spaces where no air conditioner is installed.
At present, a semiconductor refrigerating wafer capable of heating and refrigerating appears, and the principle is that when an N-type semiconductor material and a P-type semiconductor material are connected into a galvanic couple pair, energy transfer can be generated by electrifying direct current, the current can absorb heat from a joint flowing from the N-type to the P-type to become a cold end, and if the heat is released from the joint flowing from the P-type to the N-type, the current becomes a hot end. If the current direction is reversed, the cold and hot ends are switched. The size of the absorbed heat and the released heat is determined by the current, and the characteristic of the thermoelectric refrigerating device and the high-efficiency heat exchange system can be applied to portable air-conditioning equipment. Patent CN103423814A discloses a portable air conditioning device, which includes a semiconductor cooling sheet, two leads of the semiconductor cooling sheet are respectively connected with the positive pole and the negative pole of a power supply; the two sides of the semiconductor refrigerating sheet are respectively provided with a heat absorbing sheet and a heat radiating sheet, the upper surface of the semiconductor refrigerating sheet is provided with a mask, and the mask is provided with a tying belt. Heat-conducting silicone grease is filled between the semiconductor refrigerating sheet and the heat absorbing sheet and between the semiconductor refrigerating sheet and the heat radiating sheet, and the face mask is provided with ventilation holes. Patent CN203810612U discloses a small semiconductor air conditioner, which comprises an electric cabinet, an air inlet, a fan, a semiconductor chip, and heat exchangers and air outlets located on two sides of the semiconductor chip from bottom to top in sequence. The air conditioner is a desktop cabinet type small semiconductor air conditioner, and utilizes a semiconductor chip to refrigerate and provide cold air, and adopts a heat storage agent to suck away the hot air. Patent CN2198546Y discloses a cooling and heating device using peltier elements, which is a heat shield equipped with peltier elements, the cooling and heating surfaces of which are respectively disposed on two sides of the heat shield, the heating surface is equipped with a radiator, the cooling surface is equipped with an energy storage diffuser and is externally equipped with a shielding case, one end of the shielding case is an air inlet, the other end is equipped with a ventilator and an air outlet, and the peltier elements are connected with a reversing switch and are connected with a direct current power supply. However, in the technical solutions of the above three patents, because of the defects of cold-end ventilation and heat exchanger design or poor heat dissipation system design, the semiconductor refrigeration sheets with the same power are used, and the air can only be cooled to about 3-4 ℃ at low efficiency, if the semiconductor refrigeration sheets with higher power are replaced, the power consumption is greatly increased, and the semiconductor refrigeration sheets are inconvenient to carry and use outdoors, so that the actual use requirements cannot be met, and no product with similar purposes appears in the market.
Therefore, it is the initiative of the present invention to provide a portable air conditioner based on semiconductor cooling sheet, which has reasonable structure design, can be used easily at any time and place, can be carried about, has light weight, low noise, simple manufacture and low cost, and can effectively regulate the air temperature.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a portable air conditioner based on a semiconductor refrigerating sheet, which has reasonable structural design, can be simply and easily used anytime and anywhere, can be carried about, has light weight, low noise, simple manufacture and low cost and can effectively regulate the air temperature.
The invention provides a portable air conditioner based on a semiconductor refrigerating sheet, which adopts the technical scheme that:
a portable air conditioner based on a semiconductor refrigerating sheet comprises an airtight shell, an airtight shell cover, a battery pack, a single chip microcomputer, a semiconductor refrigerating sheet and an air conditioning assembly, wherein the battery pack, the single chip microcomputer, the semiconductor refrigerating sheet and the air conditioning assembly are arranged in the airtight shell; the air conditioning assembly comprises an air conditioning end and a temperature diffusion end, the air conditioning end and the temperature diffusion end are respectively connected to two sides of the semiconductor refrigerating sheet, the air conditioning end comprises a micro high-pressure fan, a heat exchanger, a heat insulation ventilation pipeline and an air recirculator, the heat exchanger is arranged in the heat insulation ventilation pipeline, the micro high-pressure fan is used for providing circulation power for air, and the air recirculator can guide part of processed air back to the heat exchanger to adjust the air temperature again.
Preferably, the temperature diffusion end comprises a heat storage fin, a heat conduction pipe, a small high-flow fan and a heat radiation fin, the heat storage fin is connected with one surface of the semiconductor cooling fin, the other surface of the semiconductor cooling fin is connected with the heat exchanger, one end of the heat conduction pipe is connected with the heat storage fin, the other end of the heat conduction pipe is connected with the heat radiation fin, and the small high-flow fan is arranged at the bottom of the heat radiation fin.
Preferably, the heat conduction pipe is welded with the heat storage fin and the radiating fin into a whole, and the heat conduction pipe is internally provided with the conduction liquid.
Preferably, a temperature sensor is arranged at an untreated air inlet, and the temperature sensor transmits the temperature measured in real time to the single chip microcomputer; the singlechip is arranged on the top of the airtight shell cover.
Preferably, the heat-insulating ventilation pipeline is provided with dew drainage holes, and the dew drainage holes are connected to the dew collector.
Preferably, the dew-water drainage holes are arranged on the rear side wall of the heat-insulating ventilation pipeline.
Preferably, the heat conducting paste is filled between the semiconductor chilling plate and the air conditioning end.
Preferably, the wires of the micro high-voltage fan, the semiconductor refrigerating sheet and the small high-flow fan are respectively connected with the corresponding power output ports of the singlechip.
Preferably, a heat conducting paste is filled between the semiconductor chilling plate and the temperature diffusion end.
Preferably, the heat-insulating ventilation duct has an air inlet and an air outlet and is configured to accommodate a heat exchanger, and the air recirculator is a micro air circulation fan installed at a bottom of the heat-insulating ventilation duct or a duct connecting the air inlet port with the air outlet port.
The implementation of the invention comprises the following technical effects:
the portable air conditioner based on the semiconductor refrigerating sheet directly blows the processed air to the human body, so that the heat transfer is not influenced by the size of the space, the temperature sensing comfort degree is quickly improved, and compared with the conventional air conditioner, the portable air conditioner based on the semiconductor refrigerating sheet has the advantages that the power consumption is reduced, and the purposes of energy conservation and environmental protection are realized. The whole set of system device disclosed by the invention combines a mains supply (power frequency alternating current) and a lithium battery charging power supply, is not limited by the power supply during working, can be used at any time when being charged, is convenient to carry, does not need maintenance, can normally work when being placed in any non-extreme climate and non-closed space, and has the advantages of strong impact resistance and shock resistance, light weight, low noise, simplicity in manufacturing, low cost, safety and reliability.
The portable semiconductor air conditioner of the invention is tested, and can reduce the temperature by 10 ℃ in a refrigeration mode. And the clothes have small volume which is about the size of the palm of an adult, the weight is only about 800 g, and the clothes can be easily hung on the waist to blow wind into the clothes.
The air conditioning end of the invention is composed of a micro high-pressure fan, a heat exchanger, a heat insulation ventilating duct and an air recirculator which are specially designed and distributed, so that air is sucked into the air conditioning end by a high-speed fan at high temperature, the heat exchanger in the ventilating duct can effectively reduce the air temperature and humidity under the condition of refrigeration, part of treated air is led to the front end of the ventilating duct by the air recirculator to be mixed with untreated air, and the rest of treated air is blown to a human body through an air outlet, so that the refrigeration and heating effects of the air conditioner are more obvious; the single chip microcomputer performs circuit conversion at low temperature to enable the positive and negative power supply of the semiconductor refrigerating sheet to be exchanged, so that heating can be realized, and after the semiconductor refrigerating sheet is subjected to cold-hot conversion, the air temperature is effectively increased and then the air is blown to a human body by the same mechanism. The temperature diffusion end is composed of a heat storage sheet, a heat conduction pipe, a small high-flow fan and a heat radiating sheet which are designed and arranged, and the hot end effectively radiates heat during the operation of the semiconductor refrigerating sheet so as to ensure the refrigerating efficiency of the cold end.
The portable air conditioner has the characteristics of remarkable air conditioning efficiency, reasonable structural design, convenience in use and easiness in carrying, is suitable for being used in non-extreme climate areas of the world, is particularly suitable for people needing to be outdoors for a long time, and has obvious improvement effect on the air temperature and humidity in clothes of users.
Drawings
Fig. 1 is a schematic perspective view of a portable air conditioner based on a semiconductor cooling sheet according to an embodiment of the present invention.
Fig. 2 is another schematic perspective view of a portable air conditioner based on a semiconductor cooling sheet according to an embodiment of the present invention.
Fig. 3 is a schematic view of the three-dimensional structure of the portable air conditioner with the cover opened.
Fig. 4 is a schematic view of the internal structure of the portable air conditioner based on the semiconductor cooling sheet according to the embodiment of the present invention.
Fig. 5 is a schematic side view of the portable air conditioner with the airtight casing opened.
Fig. 6 is an exploded view of a part of the portable air conditioner.
Fig. 7 is an exploded view of the air conditioning module.
Fig. 8 is a schematic diagram of the explosion structure of the portable air conditioner.
Fig. 9 is a plan view of air flow and air circulation at the air conditioning end.
FIG. 10 is a schematic view of the sectional structure A-A of FIG. 9.
Fig. 11 is a schematic flow chart of air flow at the air conditioning end.
In the figure: 1. an airtight enclosure; 2. an airtight housing cover; 3. a battery pack; 4. a single chip microcomputer; 5. a semiconductor cooling sheet; 51. A cold end; 52. a hot end; 6. a thermal insulation layer; 7. an air conditioning terminal; 71. a micro high-pressure fan; 72. a heat exchanger; 73. a heat-insulating ventilation duct; 74. a micro air circulation fan; 75. an untreated air inlet; 76. a treated air outlet; 77. an air mixing point; 8. a temperature diffusion end; 81. a heat storage sheet; 82. a heat conducting pipe; 83. a small high flow fan; 84. a heat sink; 9. a dew collector; 10. dew drainage holes.
Detailed Description
The present invention will be described in detail below with reference to embodiments and drawings, it being noted that the described embodiments are only intended to facilitate the understanding of the present invention, and do not limit it in any way.
It should be noted that the terms "front/back", "up/down", "left/right", "vertical/horizontal", "inside/outside", etc. indicating the orientation or positional relationship may appear in the description of the present invention based on the orientation or positional relationship shown in the drawings only for the convenience of describing the present invention and simplifying the description, but not for indicating or implying that the referred device or component must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. For convenience of description, the terms "left", "right", "up" and "down" used hereinafter are the same as the left, right, up and down directions of the drawings themselves, but do not limit the structure of the present invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; the two components can be directly connected or indirectly connected through an intermediate medium, and the two components can be communicated with each other. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1 to 8, the present embodiment aims to improve the comfort level of the sensible temperature of a user in cold and hot weather conditions, and provides an air conditioning device that has a reasonable structural design, can be simply and easily used anytime and anywhere, and can be carried about, under the limitation of limited volume and weight, and can reduce the high air temperature and humidity at high temperature, blow out cool air, and prevent heatstroke; the low temperature can raise the temperature of the air, and keep warm and dispel cold. Specifically, fig. 1 and 2 are schematic views of a three-dimensional structure of the portable air conditioner based on the semiconductor cooling sheet of the present embodiment, fig. 3 is a schematic view of a three-dimensional structure of the portable air conditioner after the cover is opened, fig. 4 is a schematic view of an internal structure of the portable air conditioner based on the semiconductor cooling sheet of the present embodiment, fig. 5 is a schematic view of a side structure of the portable air conditioner after the airtight housing is opened, and fig. 6 to 7 are schematic views of an explosion structure of the portable air conditioner. The portable air conditioner based on the semiconductor refrigerating sheet 5 provided by the embodiment comprises an airtight shell 1, an airtight shell cover 2, a battery pack 3, a single chip microcomputer 4, a semiconductor refrigerating sheet 5 and an air conditioning assembly, wherein the battery pack 3, the single chip microcomputer 4, the semiconductor refrigerating sheet 5 and the air conditioning assembly are arranged in the airtight shell 1, the airtight shell cover 2 is arranged at the top of the airtight shell 1, and the single chip microcomputer 4 is electrically connected with the battery pack 3 and the semiconductor refrigerating sheet 5 respectively; the air conditioning assembly comprises an air conditioning end 7 and a temperature diffusion end 8, the air conditioning end 7 and the temperature diffusion end 8 are respectively arranged on two sides of the semiconductor refrigerating sheet 5, the air conditioning end 7 comprises a micro high-pressure fan 71, a heat exchanger 72, a heat insulation ventilation pipeline 73 and an air recirculator, the heat exchanger 72 is arranged in the heat insulation ventilation pipeline 73, the air recirculator can guide a part of processed air back to the heat exchanger for regulating the air temperature again, preferably, the micro high-pressure fan 71 is arranged at an unprocessed air inlet 75 to provide circulation power for the air, and as can be known by a person skilled in the art, the micro high-pressure fan 71 is arranged at the unprocessed air inlet 75 in a preferred arrangement mode and can be arranged at other positions to achieve the purpose of the invention. Two wires of the semiconductor refrigerating sheet 5 in the embodiment are connected with the anode and the cathode of the singlechip 4; the two sides of the semiconductor refrigerating sheet 5 are respectively provided with a cold end 51 and a hot end 52, and are connected with an air conditioning end 7 and a temperature diffusion end 8 after being isolated, heat-conducting paste is filled between the semiconductor refrigerating sheet 5 and the air conditioning end 7, and heat-conducting paste is filled between the semiconductor refrigerating sheet 5 and the temperature diffusion end 8, so that the tight contact is improved, and the thermal resistance coefficient is reduced. The heat insulation ventilation duct 73 and the heat exchanger 72 structure increase the time for air to exchange heat, so that the air conditioning performance is greatly improved compared with the prior art, and an effective air conditioning function is realized.
Referring to fig. 7, the air recirculator may be a micro air circulation fan mounted at the bottom of the insulated ventilation duct. The heat insulation ventilation duct 73 of the air conditioning end 7 has an air inlet and an air outlet and can accommodate a heat exchanger, the bottom of the heat insulation ventilation duct 73 is provided with a bottom groove for installing a micro air circulation fan 74, the micro air circulation fan 74 can blow a part of the processed air back to the air inlet end through the bottom groove for repeated heat exchange, and the heat exchanger 72 is partitioned by an intermediate partition plate to form an air circulation channel. It will be appreciated by those skilled in the art that the above air recirculator is only an example, the heat-insulating ventilation duct 73 may be a duct having an air inlet and an air outlet, the heat exchanger 72 may be disposed in the duct, the duct may be "U-shaped", "S-shaped", or other structures, the length of the duct may be increased to increase the contact time between the air and the heat exchanger 72 and increase the heat exchange effect, and the duct connected to each other may be disposed at the air inlet end and the air outlet end as an air recirculator (not shown).
Specifically, referring to a plan view of the air conditioning side air flow and air circulation flow and a schematic flow diagram of the air conditioning side air flow of fig. 9 and fig. 11, a micro high pressure fan 71 blows untreated air from an untreated air inlet 75 into a heat exchanger 72 in an insulating ventilation duct 73 for heat exchange, a micro air circulation fan 74 provided at a treated air outlet 76 blows a part of the treated air back to the untreated air inlet 75 to be mixed with hot air (see fig. 10), and the untreated air inlet 75 has an air mixing point 77. The portable air conditioner of this embodiment directly blows the air of having handled to the human body, makes to conduct heat and does not receive the influence of space size, realizes making its body to feel temperature comfort level and promotes fast, compares and reduces with current air conditioning equipment power consumption, realizes energy-concerving and environment-protective purpose. The wires of the micro high-pressure fan 71, the micro air circulation fan 74, the semiconductor refrigerating sheet 5 and the micro high-flow fan 83 are respectively connected with the corresponding power output ports of the singlechip 4. The whole system device of the embodiment combines a mains supply (power frequency alternating current) and a lithium battery charging power supply, is not limited by the power supply during working, can be used along with charging, is convenient to carry, does not need to be maintained, can normally work when being placed in any non-extreme climate and non-closed space, and has the advantages of strong impact resistance and shock resistance, light weight, low noise, simplicity in manufacturing, low cost, safety and reliability. The air temperature and humidity contacting with the skin of a human body can be efficiently reduced for a long time at high temperature, and heatstroke is prevented; the air temperature contacting with the skin of a human body can be efficiently heated for a long time at low temperature, and the air warming and cold dispelling device is warm and reliable in structure; the battery is adopted for power supply, so that the device is safe, convenient, low in power consumption and environment-friendly.
Referring to fig. 7 and 8, the temperature diffusion end 8 includes a heat storage fin 81, a heat transfer pipe 82, a small high-flow fan 83, and a heat sink 84, the heat storage fin 81 is connected to one surface of the semiconductor cooling fin 5, the other surface of the semiconductor cooling fin 5 is connected to the heat exchanger 72, one end of the heat transfer pipe 82 is connected to the heat storage fin 81, the other end of the heat transfer pipe 82 is connected to the heat sink 84, and the small high-flow fan 83 is disposed at the bottom of the heat sink 84. The air conditioning end 7 of the embodiment is composed of a micro high-pressure fan 71, a heat exchanger 72, a heat insulation ventilation pipeline 73 and a micro air circulation fan 74 which are specially designed and distributed, so that air is sucked into the air conditioning end 7 by a high-speed fan at high temperature, the heat exchanger 72 in the ventilation pipeline can effectively reduce the air temperature and humidity under the condition of refrigeration, part of processed air is guided to the front end of the ventilation pipeline by the air circulation fan to be mixed with unprocessed air, and the rest of processed air is blown to a human body through an air outlet, so that the air conditioning refrigeration and heating effects of the invention are more remarkable. The temperature diffusion end 8 is composed of a heat storage plate 81, a heat pipe 82, a small high-flow fan 83 and a heat sink 84, which are designed and arranged, so that the hot end 52 can effectively dissipate heat to ensure the cooling performance of the cold end 51 during the operation of the semiconductor cooling fin 5. When the work mechanism of the semiconductor refrigerating sheet 5 after the cold-hot conversion is the same as the work mechanism introduced above, the air temperature is effectively increased and then the air is blown to the human body.
Preferably, the heat pipe 82 is welded to the heat sink 84 and the heat sink 81, and a conductive liquid is provided in the heat pipe 82. The micro air circulation fan 74 is provided at the bottom of the heat insulation ventilation duct 73. The singlechip 4 is arranged at the top of the airtight shell cover 2. Be provided with dew drainage hole 10 on the thermal-insulated air pipe 73, dew drainage hole 10 is connected to dew collector 9, and dew drainage hole 10 preferably sets up on thermal-insulated air pipe 73's the back lateral wall. Specifically, the battery pack 3 is placed on both sides of the airtight casing 1, and the dew-water collectors 9 are located between the heat-insulating ventilation duct 73 and the heat-radiating fins 84. In this embodiment, the heat exchanger 72 is preferably a copper-aluminum hybrid heat-conducting metal sheet, the heat storage sheet 81 is preferably a heat storage copper sheet, and the heat dissipation sheet 84 is preferably an aluminum heat dissipation sheet. The heat storage sheet 81 and the heat radiating sheet 84 have functions of heat transfer and cold transfer, and when the portable air conditioner performs refrigeration, the heat storage sheet 81 and the heat radiating sheet 84 are used for heat transfer; in the case of heating by the portable air conditioner, the heat storage fins 81 and the heat dissipation fins 84 are used for transferring cold. Openings are provided in the hermetic case 1 and the hermetic cover 2 to facilitate heat dissipation by the heat conductive pipes 82 and the heat radiating fins 84.
After the portable semiconductor air conditioner is tested, the test scene is that the air temperature is 30 ℃ and the relative humidity is 80 percent, and the test environment data is measured in real time on the spot; 4 18650 lithium batteries are used for power supply, and a cooling test is started 30 seconds after the start-up:
when the air is cooled by the air conditioner, the temperature of the air is reduced to 20 ℃ when the air with the temperature of 30 ℃ is output from the air inlet to the air outlet through the air conditioning end 7, and the temperature difference between the air treated by the refrigeration mode and the air before treatment in the environment reaches 10 ℃ as a result. After 90 minutes of operation, the cooling efficiency is only reduced by about 20%, and the air temperature difference between the air inlet and the air outlet is about 8 ℃, which is caused by the fact that the circuit design is not completely matched with the lithium battery packs 3 to output stable power electricity. And the volume is small, is about the size of the palm of an adult, has the weight of only about 800 g, and can be easily hung on the waist to blow wind into clothes.
The working principle of the portable semiconductor air conditioner of the invention is as follows:
the air-conditioning refrigeration mode is explained, firstly, the battery pack 3 is connected with the power supply input port of the singlechip 4 in the airtight shell 1, and the singlechip 4 controls the power supply switch under the drive program, and the electrodes convert and regulate the output power output by each power supply. The wires of the high-pressure fan, the air circulation fan, the semiconductor refrigerating sheet 5 and the high-flow fan are respectively connected with the corresponding power output ports of the singlechip 4. When the control switch is turned on, the singlechip 4 outputs electric power with corresponding power to each power supply output port according to the circuit design and instructions built in the driving program, so that parts needing to be driven by the electric power operate at the most appropriate power.
The power of the semiconductor refrigerating sheet 5 adopted by the invention is selected to be 36W low-power type, the semiconductor refrigerating sheet 5 is also called thermoelectric refrigeration, namely a Peltier effect is used for manufacturing a thermoelectric refrigerating assembly, the thermoelectric refrigerating assembly is a solid-state heat pump, does not need maintenance, has no noise, can work at any position, has strong shock resistance and shock resistance, and has two functions of refrigeration and heating, when the direct current electric polarity is changed, namely a cold-warm switch in a singlechip 4, the same refrigerating sheet can realize heat absorption or heat release, the whole machine has no suction action of a compressor, the system refrigeration and heating are respectively formed at two sides of the semiconductor refrigerating sheet 5 after the semiconductor refrigerating sheet 5 is electrified, a cold end 51 and a hot end 52 are respectively separated by a heat insulation layer 6 to weaken the mutual influence of temperature, and the cold end 51 is connected with an air conditioning end 7 consisting of a heat exchanger 72, a micro high-voltage fan 71, a heat insulation ventilation pipeline 73 and a micro, the heat-insulating ventilation duct 73 and the heat exchanger 72 multiply increase the heat transfer area, so that the air medium is directly blown to the human body after rapid heat exchange and conduction to realize the effect of a cooling and heating air conditioner; the hot end 52 is connected to the temperature diffusion end 8 composed of the heat storage fin 81, the heat conduction pipe 82, the high flow fan and the heat dissipation fin for heat dissipation to ensure the stable refrigeration efficiency of the cold end 51. And the heat conducting paste is filled between the semiconductor cooling sheet 5 and the heat exchanger 72 and between the semiconductor cooling sheet 5 and the heat storage sheet 81 to reduce the heat resistance, so that the overall working efficiency is improved.
The invention aims to actually improve the body sensing temperature comfort of a user, and is designed on the basis of the following natural laws discovered by thermodynamics, aeromechanics and meteorology in order to achieve the target functions, functional structures and operation mechanisms:
i) the law of heat conduction describes that heat in a region can propagate from a high temperature to a low temperature;
ii) calculating the heat conduction performance among various materials according to the heat conductivity;
iii) air psychrometric chart application and dew point temperature calculation;
iv) calculating the somatosensory temperature and the heat index;
v) application of a wind speed and wind volume curve graph;
vi) designing a ventilation system by applying an equal-pressure method for calculation;
vii) calculating the diffusion radius of the air outlet.
The invention calculates the thermal conductivity of various materials according to the formula of how the temperature changes along with time described by a thermal conductivity equation, the application of a wind speed and wind volume curve chart and the calculation of an equal pressure method for designing a ventilation system and calculating the diffusion radius of an air outlet, thereby obtaining the core design of the invention, namely the structure of the air conditioning end 7, wherein the function of the air conditioning end 7 aims at regulating the temperature and the humidity of the air flowing through in a volume limiting manner, a long time, a fast speed and a high efficiency manner.
The target function of the air conditioning end 7, functional benefits, functional structure and operation mechanism are designed by using the natural law as a basis, in order to actually make the sensible temperature comfort of a user rise, the sensible temperature and heat index calculation result is added into the driving program of the single-chip microcomputer 4, when the temperature sensor of the single-chip microcomputer 4 measures that the cold end 51 reaches the target working temperature, the single-chip microcomputer 4 controls the power supply to output to the micro high-pressure fan 71 to pressurize the air according to the driving program, so that the air flows into the heat-insulating ventilation duct 73, the air can reach the air outlet through the heat exchanger 72 in the heat-insulating ventilation duct 73 with higher efficiency, meanwhile, the whole design of the heat-insulating ventilation duct 73 can increase the contact time and the contact surface area of the air and the heat exchanger 72, thereby the air temperature and humidity can be efficiently adjusted, and during the period, the air needs to, the surface area contacted with the air is increased, so that the heat exchange effect is more remarkable; the micro air circulation fan 74 circulates part of the air to the air inlet of the heat insulation ventilation duct 73, the contact time of the air and the heat exchanger 72 is increased when the air is mixed, most of the processed air is evenly distributed and blown to the human body through the diffusivity of the air outlet, the temperature sensing comfort degree of a user is increased in real time, and the air conditioning efficiency of the air conditioner is improved by more than 2 times compared with that of a similar product due to the design of the air conditioning end 7. In addition, the air temperature management system can be arranged, the temperature sensor of the single chip microcomputer 4 measures the air temperature of the air inlet in real time, when the air in the air inlet reaches the target temperature, the single chip microcomputer 4 adjusts the current output connected with the semiconductor refrigerating sheet 5, the micro high-voltage fan 71 and the micro air circulating fan 74 according to a driving program, and the working temperature and the air circulation time of the air conditioning end 7 can be quickly and effectively adjusted; according to the current cold/hot air mode, after the air at the air inlet is at a high/low target temperature, the single chip microcomputer 4 adjusts the power supply output to return to normal output according to the driving program, so that the effect of constant temperature is achieved, and the power consumption is reduced. Dew condensed on the heat exchanger 72 during long-term use can be intensively drained to the dew drainage holes 10 and flows into the dew collector 9 for storage due to gravity and the design of the heat insulation ventilation pipeline 73 and the air pressure difference between the dew drainage holes 10 and the dew collector 9, and can also assist the temperature diffusion end 8 in cooling.
When the invention is controlled to carry out cold-warm mode conversion, the circuit design of the singlechip 4 can lead the power output anode and cathode connected with the semiconductor refrigerating sheet 5 to alternately carry out cold-warm mode conversion, and because the anode and the cathode of the semiconductor refrigerating sheet 5 are alternately changed, cold-hot end conversion can be generated, and the operation mechanism is repeated after the cold-hot end conversion to adjust the temperature of output air.
The temperature diffusion terminal 8 acts on the semiconductor cooling fin 5 during operation to enable the hot terminal 52 to dissipate heat effectively to ensure efficient operation of the cold terminal, so that the overall size is smaller and the appearance design is more convenient for users without affecting the heat dissipation efficiency. The temperature diffusion end 8 comprises a heat storage fin 81, a heat conduction pipe 82, a high flow fan and a heat dissipation fin 84, the heat storage fin 81, the heat conduction pipe 82 and the heat dissipation fin 84 are welded into a whole, the heat generated by the hot end 52 is conducted to the heat dissipation fin through the heat storage fin 81 under the action of capillary effect and heat conduction liquid heat convection in the heat conduction pipe 82, the single chip microcomputer 4 controls power output to the small high flow fan 83 to blow air to the heat dissipation fin 84 under the driving program, the air and the heat dissipation fin 84 generate heat exchange action to cool the heat dissipation fin 84, and then the heat conduction pipe 82 conducts the heat exchange action to the heat storage fin 81 and the hot end 52 in the same mode to realize effective cooling.
The single chip 4 is used as the control system of the present invention, and those skilled in the art will appreciate that the present invention may be implemented by a computer program, and the computer program may be divided into one or more modules/units, and one or more modules/units are stored in the memory and executed by the processor to implement the present invention. One or more modules/units may be a series of computer program instruction segments capable of performing specific functions, which are used to describe the execution of a computer program in a terminal device. The computer program may be divided into the above modules and realize the functions thereof. It will be appreciated by those skilled in the art that some of the components required for implementing the invention may also be included, for example the terminal device may also include input output devices, network access devices, buses, etc. The purpose of the invention can be achieved by reading the description of the invention by a person skilled in the art.
The portable air conditioner has the characteristics of remarkable air conditioning efficiency, reasonable structural design, convenience in use and easiness in carrying, is suitable for being used in non-extreme climate areas of the world, is particularly suitable for people needing to be outdoors for a long time, and has obvious improvement effect on the air temperature and humidity in clothes of users.
The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, therefore, the present invention is not limited by the appended claims. It is to be understood that the above description is intended to be illustrative, and not restrictive. For example, the above-described embodiments (and/or aspects thereof) may be used in combination with each other. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from its scope. Many other embodiments and modifications within the scope and spirit of the claims will be apparent to those of skill in the art from reading the foregoing description.
Claims (10)
1. The utility model provides a personal portable air conditioner based on semiconductor refrigeration piece, includes airtight shell, airtight cap, group battery, singlechip, semiconductor refrigeration piece and air conditioning component, the group battery, the singlechip, semiconductor refrigeration piece and air conditioning component set up in the airtight shell, airtight cap sets up the top of airtight shell, its characterized in that: the single chip microcomputer is electrically connected with the battery pack and the semiconductor refrigerating sheet respectively; the air conditioning assembly comprises an air conditioning end and a temperature diffusion end, the air conditioning end and the temperature diffusion end are connected to two sides of the semiconductor refrigerating sheet respectively, the air conditioning end comprises a micro high-pressure fan, a heat exchanger, a heat insulation ventilation pipeline and an air recirculator, the heat exchanger is arranged in the heat insulation ventilation pipeline, the micro high-pressure fan is used for providing circulation power for air, and the air recirculator can guide a part of processed air back to the heat exchanger to regulate the air temperature again.
2. The portable air conditioner based on semiconductor refrigerating sheet as claimed in claim 1, wherein: the temperature diffusion end includes heat storage piece, heat pipe, small-size high flow fan and fin, heat storage piece with the one side of semiconductor refrigeration piece is connected, the another side of semiconductor refrigeration piece with heat exchanger connects, the one end of heat pipe with the heat storage piece is connected, the other end and the fin of heat pipe are connected, small-size high flow fan sets up the bottom of fin.
3. The portable air conditioner based on semiconductor refrigerating sheet as claimed in claim 2, wherein: the heat conduction pipe is welded with the heat storage fin and the radiating fin into a whole, and the heat conduction pipe is internally provided with a conduction liquid.
4. The portable air conditioner based on semiconductor refrigerating sheet as claimed in claim 1, wherein: a temperature sensor is arranged at an untreated air inlet and transmits the temperature measured in real time to the single chip microcomputer.
5. The portable air conditioner based on semiconductor refrigerating sheet as claimed in claim 1, wherein: be provided with dew drainage hole on the thermal-insulated air pipe, dew drainage hole is connected to dew collector.
6. The portable air conditioner based on semiconductor refrigerating sheet as claimed in claim 5, wherein: dew drainage hole sets up on thermal-insulated air pipe's the back lateral wall.
7. The portable air conditioner based on semiconductor refrigerating sheet as claimed in claim 1, wherein: and heat-conducting paste is filled between the semiconductor refrigerating sheet and the air conditioning end.
8. The portable air conditioner based on semiconductor refrigerating sheet as claimed in claim 2, wherein: the wires of the miniature high-voltage fan, the semiconductor refrigerating sheet and the miniature high-flow fan are respectively connected with the corresponding power output ports of the single chip microcomputer.
9. The portable air conditioner based on semiconductor refrigerating sheet as claimed in claim 1, wherein: and heat-conducting paste is filled between the semiconductor refrigerating sheet and the temperature diffusion end.
10. The portable air conditioner based on semiconductor refrigerating sheet as claimed in any one of claims 1-9, wherein: the heat insulation ventilating duct has an air inlet and an air outlet and can accommodate a heat exchanger; the air recirculator is a miniature air circulation fan arranged in the heat-insulating ventilation pipeline or a pipeline connecting the air inlet end with the air outlet end.
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CN201810973108.7A CN110857800A (en) | 2018-08-24 | 2018-08-24 | Portable air conditioner based on semiconductor refrigerating sheet |
PCT/CN2019/102042 WO2020038444A1 (en) | 2018-08-24 | 2019-08-22 | Portable air conditioner based on semiconductor refrigeration sheet |
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CN201810973108.7A CN110857800A (en) | 2018-08-24 | 2018-08-24 | Portable air conditioner based on semiconductor refrigerating sheet |
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CN116541910B (en) * | 2023-06-07 | 2024-02-13 | 黄理鑫 | Heat transfer module for biological cryopreservation and design and manufacturing method thereof |
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