CN204006454U - Portable air-conditioning - Google Patents

Portable air-conditioning Download PDF

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Publication number
CN204006454U
CN204006454U CN201420389412.4U CN201420389412U CN204006454U CN 204006454 U CN204006454 U CN 204006454U CN 201420389412 U CN201420389412 U CN 201420389412U CN 204006454 U CN204006454 U CN 204006454U
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China
Prior art keywords
air
conditioning
heat
exchange
cavity
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CN201420389412.4U
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Chinese (zh)
Inventor
高希成
王定远
徐培培
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Qingdao Haier Smart Technology R&D Co Ltd
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Qingdao Haier Smart Technology R&D Co Ltd
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Abstract

The utility model provides a kind of portable air-conditioning, comprises shell, semiconductor chilling plate, the first heat-exchange system and the second heat-exchange system; Semiconductor chilling plate is fixed in shell and by shell and is divided into the first cavity and the second cavity, on shell, offer the first air outlet and the first air inlet that are communicated with the first cavity, also offer the second air outlet and the second air inlet that are communicated with the second cavity, the first heat-exchange system is arranged in the first cavity, and the second heat-exchange system is arranged in the second cavity; The first heat-exchange system comprises the first conductive substrate, the first heat pipe and the first fan, and the second heat-exchange system comprises the second conductive substrate, the second heat pipe and the second fan.Realization facilitates user to go out to carry portable air-conditioning, improves the Portable outgoing performance of portable air-conditioning.

Description

Portable air-conditioning
Technical field
The utility model relates to air-conditioning equipment, relates in particular to a kind of portable air-conditioning.
Background technology
At present, air-conditioning is household electrical appliance conventional in people's daily life, and air-conditioning of the prior art generally includes indoor set and off-premises station, and off-premises station is fixing without, and indoor set is fixed within doors.User can only can be freezed or be heated by air-conditioning indoor, and user is outdoor, can not carry air-conditioning and go out.Therefore, how realizing user's portable air-conditioning equipment of going out is technical problem to be solved in the utility model.
Summary of the invention
Technical problem to be solved in the utility model is: provide a kind of lightweight and be convenient to the portable air-conditioning of going out to carry, realize and facilitate user to go out to carry portable air-conditioning, improve the Portable outgoing performance of portable air-conditioning.
The technical scheme that the utility model provides is that a kind of portable air-conditioning, comprises shell, semiconductor chilling plate, the first heat-exchange system and the second heat-exchange system; Described semiconductor chilling plate is fixed in described shell and by described shell and is divided into the first cavity and the second cavity, on described shell, offer the first air outlet and the first air inlet that are communicated with described the first cavity, on described shell, also offer the second air outlet and the second air inlet that are communicated with described the second cavity, described the first heat-exchange system is arranged in described the first cavity, and described the second heat-exchange system is arranged in described the second cavity; Described the first heat-exchange system comprises the first conductive substrate, the first heat pipe and the first fan, described the first heat pipe is embedded in described the first conductive substrate, described the first conductive substrate is fixed on a surface of described semiconductor chilling plate, described the first heat pipe is between described the first fan and described the first air outlet, and the outlet air surface of described the first fan is towards described the first air outlet; Described the second heat-exchange system comprises the second conductive substrate, the second heat pipe and the second fan, described the second heat pipe is embedded in described the second conductive substrate, described the second conductive substrate is fixed on another surface of described semiconductor chilling plate, described the second heat pipe is between described the second fan and described the second air outlet, and the outlet air surface of described the second fan is towards described the second air outlet.
Further, on described the first heat pipe, be provided with multi-disc the first fin, on described the second heat pipe, be provided with multi-disc the second fin.
Further, the front of described shell offers described the first air outlet, and the back side of described shell offers described the second air outlet.
Further, the top of described shell offers the first air inlet, and the sidewall of described shell offers the second air inlet.
Further, in described the first air outlet, be provided with wind-guiding grate.
Further, also comprise case, described case has bonnet that can switch, and the front of described case is provided with control panel, and described control panel is electrically connected to described semiconductor chilling plate, described the first fan and described the second fan; On described case, also offer and described the first air outlet, described the first air inlet, described the second air outlet and described the second air inlet air-conditioning the first air outlet, air-conditioning the first air inlet, air-conditioning the second air outlet and air-conditioning the second air inlet one to one.
Further, on described case, be provided with flexible handle.
Further, in the sidewall of described case, offer draw-in groove, the sidewall of described shell is outside equipped with card article, and described card article is installed in described draw-in groove.
The portable air-conditioning that the utility model provides, by semiconductor chilling plate is set in shell, make enclosure be divided into the first cavity and the second cavity, and the heat that semiconductor chilling plate produces and cold can be corresponding by the first heat-exchange system and the second heat-exchange system heat exchange and change the first cavity and the second cavity in the temperature of air, and from air outlet, export under the effect of fan; User can change the sense of current of semiconductor chilling plate as required, thereby can from the first air outlet, export as required hot blast or cold wind, the effect that realization heats and freezes, and owing to adopting semiconductor chilling plate effect to heat or the original paper that freezes, the light and small volume of the overall weight that makes portable air-conditioning, realization facilitates user to go out to carry portable air-conditioning, improves the Portable outgoing performance of portable air-conditioning.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is embodiment more of the present utility model, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the cutaway view of the utility model portable air-conditioning embodiment;
Fig. 2 is the structural representation of the utility model portable air-conditioning embodiment housing;
Fig. 3 is the structural representation of case in the utility model portable air-conditioning embodiment.
The specific embodiment
For making object, technical scheme and the advantage of the utility model embodiment clearer, below in conjunction with the accompanying drawing in the utility model embodiment, technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is the utility model part embodiment, rather than whole embodiment.Embodiment based in the utility model, those of ordinary skills are not making the every other embodiment obtaining under creative work prerequisite, all belong to the scope of the utility model protection.
As Figure 1-Figure 2, the present embodiment portable air-conditioning, comprises shell 100, semiconductor chilling plate 109, the first heat-exchange system 122 and the second heat-exchange system 123; Semiconductor chilling plate 109 is fixed in shell 100 and by shell 100 and is divided into the first cavity 110 and the second cavity 115, on shell 100, offer the first air outlet 101 and the first air inlet 105 that are communicated with the first cavity 110, on shell 100, also offer the second air outlet 104 and the second air inlet 103 that are communicated with the second cavity 115, the first heat-exchange system 122 is arranged in the first cavity 110, the second heat-exchange systems 123 and is arranged in the second cavity 115; The first heat-exchange system 122 comprises the first conductive substrate 107, the first heat pipe 113 and the first fan 111, the first heat pipe 113 is embedded in the first conductive substrate 107, the first conductive substrate 107 is fixed on a surface of semiconductor chilling plate 109, the first heat pipe 113 is between the first fan 111 and the first air outlet 101, and the outlet air surface of the first fan 111 is towards the first air outlet 101; The second heat-exchange system 123 comprises the second conductive substrate 108, the second heat pipe 120 and the second fan 114, the second heat pipe 120 is embedded in the second conductive substrate 108, the second conductive substrate 108 is fixed on another surface of semiconductor chilling plate 109, the second heat pipe 120 is between the second fan 114 and the second air outlet 104, and the outlet air surface of the second fan 114 is towards the second air outlet 104.
Particularly, the present embodiment portable air-conditioning shell 100 inside are divided into two independently cavitys by semiconductor chilling plate 109, and top is the first cavity 110, and bottom is the second cavity 115.The first cavity 110 lower ends are that the first conductive substrate 107, the second cavity 115 upper ends are the second conductive substrate.Two conductive substrates, respectively with upper and lower two the surperficial close contacts of semiconductor chilling plate 109, carry out neither endothermic nor exothermic heat exchange.In the first cavity 110, be provided with in the first heat-exchange system 122, the second cavities 115 the second heat-exchange system 123 is installed.The first heat-exchange system 122 mainly consists of the first conductive substrate 107, the first heat pipe 113, the first fin 112, the first fan 111; The second heat-exchange system 123 mainly consists of the second conductive substrate 108, the second heat pipe 120, the second fin 121, the second fan 114.The first heat pipe 113 with fin 112 between the first fan 111 and the first air outlet 101, many the first heat pipe 113 lower end levels are equidistantly inserted the first conductive substrate 107 inside, and take the shape of the letter U and extend upward, many first heat pipe 113 upper end levels equidistantly or level of incline insert in the first fin 112.The second heat pipe 120 with fin 121 between the second fan 114 and the second air outlet 104, many the second heat pipe 120 upper end levels are equidistantly inserted the second conductive substrate 108 inside, and take the shape of the letter U to downward-extension, many second heat pipe 120 lower ends equidistantly or level of incline insert in the second fin 121.
When the nice and cool pattern of portable air-conditioning operation, semiconductor chilling plate 109 energisings, semiconductor chilling plate 109 upper ends are cold junction, lower end is hot junction, semiconductor chilling plate upper end and the first heat-exchange system 122 carry out Cooling capacity exchanging, and lower end and the second heat-exchange system 123 carry out exchange heat.The first fan 111 and the second fan 114 are all worked.In the present embodiment portable air-conditioning course of work, in the first cavity 110, the transfer of heat mainly by the first heat-exchange system 122, semiconductor chilling plate 109 cold junctions being absorbed is to blowing in the air of human body.Semiconductor refrigerating 109 work, its upper surface is cold junction.The first fan 111 operations, the air sucking from the first air inlet 105 is blowed to the first fin 112 by the first fan 111 and heat exchange occurs the first heat pipe 113, and air is lowered the temperature to be blown out from the first air outlet 101, blows to human body.The heat that the first fin 112 and the first heat pipe 113 and air heat exchange absorb imports in the first conductive substrate 107 by the heat pipe of many U-shapeds, the first conductive substrate 107 contacts heat exchange with semiconductor chilling plate 109 generating planes, and the heat of absorption is finally reached to semiconductor cold junction.In the first air outlet 101, can be provided with wind-guiding grid (not shown), can realize air-supply according to the position adjustments wind-guiding grid at people place.In the second cavity 115, be mainly in the waste gas of the transfer of heat of semiconductor chilling plate 109 hot junctions generations being arranged to air-conditioning by the second heat-exchange system 123.Semiconductor refrigerating 109 work, semiconductor lower surface is hot junction, there is heat exchange by contacting with the second conductive substrate 108,109 of semiconductor chilling plates in the heat that hot junction produces, heat is imported in the second heat pipe 120, and dispel the heat by U-shaped the second heat pipe 120 and the second fin 121.The second fan 114 operations, the air sucking from two the second air inlets 103 of both sides is blowed to the second heat pipe 120 and the second fin 121 by the second fan, with heat pipe and fin generation heat exchange, air is blown to the second air outlet 104 along the second fin 121 directions, and discharges.The heat that semiconductor chilling plate hot junction produces finally falls apart in the air that will discharge to the second cavity 115.
The present embodiment portable air-conditioning, by the bottom at casing, dividing plate and deep bead are set, in carrying out defrost process, the hot gas producing on evaporimeter rises on deep bead through dividing plate, because deep bead is obliquely installed, hot gas will move upward along deep bead, and the first baffle plate on deep bead will stop that hot gas continues to flow, and hot gas is caught a cold after stopped by the first baffle plate and is become condensed water and flow down along deep bead, thereby effectively stop that hot gas enters into the storage space on casing top, realize and weaken the impact of hot gas on portable air-conditioning refrigeration performance in defrost process.
Based on technique scheme, optionally, as shown in Figure 1-Figure 3, for the ease of user, go out to carry, and optimize the appearance effect of the present embodiment portable air-conditioning, and the present embodiment portable air-conditioning also comprises case 300, case 300 has bonnet (not shown) that can switch, the front of case 300 is provided with control panel 302, and control panel 302 is electrically connected to semiconductor chilling plate 109, the first fan 111 and the second fan 114; On case 300, also offer and the first air outlet 101, the first air inlet 105, the second air outlet 104 and the second air inlet 103 air-conditioning the first air outlet 301, air-conditioning the first air inlet 304, air-conditioning the second air outlet 323 and air-conditioning the second air inlet 303 one to one.And on case 300, be provided with flexible handle 305, facilitate user to carry the present embodiment portable air-conditioning by flexible handle 305.And in order to offer draw-in groove (not shown) in the convenient sidewall that shell 100 is arranged on to case 300 in case 300, the sidewall of shell 100 is outside equipped with card article 102, card article 102 is installed in draw-in groove.
Finally it should be noted that: above embodiment only, in order to the technical solution of the utility model to be described, is not intended to limit; Although the utility model is had been described in detail with reference to previous embodiment, those of ordinary skill in the art is to be understood that: its technical scheme that still can record aforementioned each embodiment is modified, or part technical characterictic is wherein equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution depart from the spirit and scope of each embodiment technical scheme of the utility model.

Claims (8)

1. a kind ofportable air-conditioning, is characterized in that, comprises shell, semiconductor chilling plate, the first heat-exchange system and the second heat-exchange system; Described semiconductor chilling plate is fixed in described shell and by described shell and is divided into the first cavity and the second cavity, on described shell, offer the first air outlet and the first air inlet that are communicated with described the first cavity, on described shell, also offer the second air outlet and the second air inlet that are communicated with described the second cavity, described the first heat-exchange system is arranged in described the first cavity, and described the second heat-exchange system is arranged in described the second cavity; Described the first heat-exchange system comprises the first conductive substrate, the first heat pipe and the first fan, described the first heat pipe is embedded in described the first conductive substrate, described the first conductive substrate is fixed on a surface of described semiconductor chilling plate, described the first heat pipe is between described the first fan and described the first air outlet, and the outlet air surface of described the first fan is towards described the first air outlet; Described the second heat-exchange system comprises the second conductive substrate, the second heat pipe and the second fan, described the second heat pipe is embedded in described the second conductive substrate, described the second conductive substrate is fixed on another surface of described semiconductor chilling plate, described the second heat pipe is between described the second fan and described the second air outlet, and the outlet air surface of described the second fan is towards described the second air outlet.
2. portable air-conditioning according to claim 1, is characterized in that, is provided with multi-disc the first fin on described the first heat pipe, is provided with multi-disc the second fin on described the second heat pipe.
3. portable air-conditioning according to claim 1, is characterized in that, the front of described shell offers described the first air outlet, and the back side of described shell offers described the second air outlet.
4. portable air-conditioning according to claim 3, is characterized in that, the top of described shell offers the first air inlet, and the sidewall of described shell offers the second air inlet.
5. portable air-conditioning according to claim 3, is characterized in that, in described the first air outlet, is provided with wind-guiding grate.
6. according to the arbitrary described portable air-conditioning of claim 1-5, it is characterized in that, also comprise case, described case has bonnet that can switch, the front of described case is provided with control panel, and described control panel is electrically connected to described semiconductor chilling plate, described the first fan and described the second fan; On described case, also offer and described the first air outlet, described the first air inlet, described the second air outlet and described the second air inlet air-conditioning the first air outlet, air-conditioning the first air inlet, air-conditioning the second air outlet and air-conditioning the second air inlet one to one.
7. portable air-conditioning according to claim 6, is characterized in that, on described case, is provided with flexible handle.
8. portable air-conditioning according to claim 6, is characterized in that, in the sidewall of described case, offers draw-in groove, and the sidewall of described shell is outside equipped with card article, and described card article is installed in described draw-in groove.
CN201420389412.4U 2014-07-15 2014-07-15 Portable air-conditioning Active CN204006454U (en)

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Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
CN201420389412.4U CN204006454U (en) 2014-07-15 2014-07-15 Portable air-conditioning

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105805797A (en) * 2014-12-31 2016-07-27 青岛海尔智能技术研发有限公司 Bottom mounting method for semiconductor refrigeration module
CN105805863A (en) * 2014-12-31 2016-07-27 青岛海尔智能技术研发有限公司 Preparation method of semiconductor refrigerating module
CN105805798A (en) * 2014-12-31 2016-07-27 青岛海尔智能技术研发有限公司 Bottom mounting method of semiconductor refrigeration module
CN105805861A (en) * 2014-12-31 2016-07-27 青岛海尔智能技术研发有限公司 Cold and hot air isolation mode of semiconductor refrigeration module
CN105805862A (en) * 2014-12-31 2016-07-27 青岛海尔智能技术研发有限公司 Production method of semiconductor refrigeration module
CN105805865A (en) * 2014-12-31 2016-07-27 青岛海尔智能技术研发有限公司 Side surface mounting method of semiconductor refrigerating module
CN105805980A (en) * 2014-12-31 2016-07-27 青岛海尔智能技术研发有限公司 Side mounting method of semiconductor refrigeration module
CN105987467A (en) * 2015-02-05 2016-10-05 青岛海尔智能技术研发有限公司 Air conditioner installation method
CN105987415A (en) * 2015-02-05 2016-10-05 青岛海尔智能技术研发有限公司 Bottom mounting method of semiconductor refrigeration module

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105805861B (en) * 2014-12-31 2020-11-06 青岛海尔智能技术研发有限公司 Cold and hot air isolation structure of semiconductor refrigeration module
CN105805863A (en) * 2014-12-31 2016-07-27 青岛海尔智能技术研发有限公司 Preparation method of semiconductor refrigerating module
CN105805798A (en) * 2014-12-31 2016-07-27 青岛海尔智能技术研发有限公司 Bottom mounting method of semiconductor refrigeration module
CN105805861A (en) * 2014-12-31 2016-07-27 青岛海尔智能技术研发有限公司 Cold and hot air isolation mode of semiconductor refrigeration module
CN105805862A (en) * 2014-12-31 2016-07-27 青岛海尔智能技术研发有限公司 Production method of semiconductor refrigeration module
CN105805865A (en) * 2014-12-31 2016-07-27 青岛海尔智能技术研发有限公司 Side surface mounting method of semiconductor refrigerating module
CN105805980A (en) * 2014-12-31 2016-07-27 青岛海尔智能技术研发有限公司 Side mounting method of semiconductor refrigeration module
CN105805862B (en) * 2014-12-31 2020-10-02 青岛海尔智能技术研发有限公司 Preparation method of semiconductor refrigeration module
CN105805797A (en) * 2014-12-31 2016-07-27 青岛海尔智能技术研发有限公司 Bottom mounting method for semiconductor refrigeration module
CN105805797B (en) * 2014-12-31 2020-03-20 青岛海尔智能技术研发有限公司 Bottom mounting method of semiconductor refrigeration module
CN105805798B (en) * 2014-12-31 2020-03-20 青岛海尔智能技术研发有限公司 Bottom mounting method of semiconductor refrigeration module
CN105805863B (en) * 2014-12-31 2020-06-02 青岛海尔智能技术研发有限公司 Preparation method of semiconductor refrigeration module
CN105987415B (en) * 2015-02-05 2020-04-28 青岛海尔智能技术研发有限公司 Bottom mounting method of semiconductor refrigeration module
CN105987467A (en) * 2015-02-05 2016-10-05 青岛海尔智能技术研发有限公司 Air conditioner installation method
CN105987467B (en) * 2015-02-05 2020-10-02 青岛海尔智能技术研发有限公司 Air conditioner mounting method
CN105987415A (en) * 2015-02-05 2016-10-05 青岛海尔智能技术研发有限公司 Bottom mounting method of semiconductor refrigeration module

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