CN217275043U - Storage cabinet - Google Patents

Abstract

The utility model discloses a storage cabinet, include: a cabinet for holding articles; a heat exchange assemblies for carrying out the moisture condensation dehumidification of heat exchange in to the internal air of cabinet with the cabinet body, heat exchange assemblies includes: the refrigerator comprises a semiconductor refrigeration piece, a cold end radiator positioned at the cold end of the semiconductor refrigeration piece and a hot end radiator positioned at the hot end of the semiconductor refrigeration piece, wherein the cold end radiator is used for exchanging heat with the inside of the cabinet body, and the hot end radiator is used for discharging heat generated by the semiconductor refrigeration piece to the outside; the hot end radiator comprises a condensation end, an evaporation end and working fluid circulating between the condensation end and the evaporation end, wherein the evaporation end is used for absorbing heat of the hot end of the semiconductor refrigeration sheet, and the working fluid absorbs heat at the evaporation end and changes into a gas state, flows to the condensation end and changes into a liquid after radiating, and then flows back to the evaporation end. The semiconductor refrigeration piece is arranged on the cabinet body of the storage cabinet, and the semiconductor refrigeration piece is combined to refrigerate the interior of the cabinet body so as to realize air condensation dehumidification, and the safety of articles in the storage cabinet is guaranteed.

Description

Storage cabinet

Technical Field

The utility model relates to a dehumidification technical field, in particular to locker.

Background

With the development of society, the living standard of people is improved, more and more families pursue higher living quality, and the requirements for storing and nursing clothes are higher and higher.

The wardrobe is used for placing clean clothes so as to achieve dust prevention and neatness of the clothes. However, because the interior of the wardrobe is moist due to no illumination, no ventilation and the like, especially in the rainy season in the south, the south and the south, the humidity is higher, and therefore, the clothes are moldy due to the moist storage environment, and a large amount of bacteria are bred in the moist wardrobe, so that the clothes are further moldy.

Therefore, the technical problem to be solved by those skilled in the art is how to reduce the humidity in the storage cabinet to ensure the safety of the articles.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model provides a humidity in locker to guarantee the security of article.

In order to achieve the above object, the utility model provides a following technical scheme:

a stowage bin, comprising:

a cabinet for holding articles;

the heat exchange assembly is used for exchanging heat with the cabinet body and dehumidifying moisture in air in the cabinet body in a condensation mode, and comprises: the refrigerator comprises a semiconductor refrigeration piece, a cold end radiator positioned at the cold end of the semiconductor refrigeration piece and a hot end radiator positioned at the hot end of the semiconductor refrigeration piece, wherein the cold end radiator is used for exchanging heat with the inside of the cabinet body, and the hot end radiator is used for discharging heat generated by the semiconductor refrigeration piece to the outside;

the hot-end radiator comprises a condensing end, an evaporating end and working fluid circulating between the condensing end and the evaporating end, the evaporating end is used for absorbing heat of the hot end of the semiconductor refrigerating sheet, and the working fluid absorbs heat at the evaporating end, changes phase into gas, flows to the condensing end, dissipates heat, changes phase into liquid and then flows back to the evaporating end.

Preferably, in the storage cabinet, the heat exchange assembly is located on the side wall and/or the top of the cabinet body, the hot end radiator is located on the outer side of the cabinet body, the cold end radiator is located inside the cabinet body, and the semiconductor refrigeration sheet is embedded into a cabinet plate of the cabinet body.

Preferably, in the storage cabinet, a cabinet plate of the cabinet body is a heat insulation piece, and a hot end and a cold end of the semiconductor refrigeration piece are separated by the cabinet plate in a heat insulation way; and the cabinet plate is provided with a mounting through hole, the semiconductor refrigeration piece is embedded into the mounting through hole in a sealing way through a heat insulation assembly, and the hot end radiator and the cold end radiator are connected through a heat insulation connecting piece and clamp the semiconductor refrigeration piece in the middle.

Preferably, in the storage cabinet, the height of the condensation end is higher than that of the evaporation end.

Preferably, in the storage cabinet, the hot end radiator is an inflation type flat heat pipe formed by extrusion molding of an aluminum plate, one end of the hot end radiator is the evaporation end, and the other end of the hot end radiator is the condensation end;

the expansion type flat heat pipe is vertically or obliquely arranged, so that the condensation end and the evaporation end are arranged up and down.

Preferably, in the storage cabinet, a flow path of the hot end heat sink at the evaporation end is formed into a funnel shape which is gradually reduced from the condensation end to the evaporation end; the flow path of the hot end radiator at the condensation end forms a rectangle or is a funnel shape which is symmetrical with the flow path of the evaporation end.

Preferably, in the storage cabinet, the hot end heat sink is provided with a hot end heat dissipation fin at the condensation end.

Preferably, in the above storage cabinet, the cold heat sink comprises:

the substrate is used for being attached to the cold end of the semiconductor refrigeration piece;

and the radiating fins are positioned at one end of the base plate, which is far away from the semiconductor chilling plate.

Preferably, in the storage cabinet, a super-hydrophilic coating is coated on the surface of the heat dissipation fin, and a water receiving box for collecting liquid on the heat dissipation fin is arranged in the cabinet body.

Preferably, in the storage cabinet, the heat exchange assembly further includes an isolation cover covering the outside of the cold end radiator and used for isolating the articles from the heat dissipation fins, and the isolation cover has a ventilation channel for the gas in the cabinet to pass through.

Preferably, in the storage cabinet, heat conducting layers are respectively arranged between the hot end radiator and the hot end of the semiconductor refrigeration sheet and between the cold end radiator and the cold end of the semiconductor refrigeration sheet.

Preferably, in the above-mentioned locker, the storage cabinet further comprises a humidity sensor for detecting the humidity inside the cabinet body, and the humidity sensor is in signal connection with the semiconductor refrigeration piece and is used for controlling the start and stop of the semiconductor refrigeration piece.

The utility model provides a locker has set up the semiconductor refrigeration piece on the cabinet body of locker to combine the effect of semiconductor refrigeration piece, to the internal dehumidification of refrigerating in order to realize the air condensation of cabinet, in addition, the hot junction radiator that sets up is for the phase change radiator who makes working solution state change through inhaling exothermic process, with the radiating efficiency of increase semiconductor refrigeration piece, guarantee the power of semiconductor refrigeration piece, and then guarantee the dehumidification effect, guarantee the security of article in the locker.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is an assembled side view of a heat exchange assembly as disclosed in an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a heat exchange assembly disclosed in an embodiment of the present invention after being disassembled;

fig. 3 is a front view of another structure of a hot end heat sink of the heat exchange assembly disclosed in the embodiment of the present invention;

fig. 4 is a front view of a hot end heat sink of the heat exchange assembly disclosed in an embodiment of the present invention when mounted obliquely;

fig. 5 is a schematic structural view of a cold end radiator of the heat exchange assembly disclosed in the embodiment of the present invention;

fig. 6 is a schematic structural view of the heat exchange assembly disclosed in the embodiment of the present invention installed on the side wall of the cabinet body;

fig. 7 is a schematic structural view of the heat exchange assembly disclosed in the embodiment of the present invention, which is installed on the side wall of the cabinet body in another direction;

fig. 8 is a schematic structural view of the heat exchange assembly disclosed in the embodiment of the present invention installed on the top plate of the cabinet body;

wherein, 1 is a cabinet body, 2 is a heat exchange component, and 3 is a water receiving box;

21 is a semiconductor refrigeration sheet, 22 is a cold-end radiator, 23 is a hot-end radiator, 24 is an isolation cover, 25 is a hot-end radiating fin, and 26 is a wedge block;

221 is a substrate, 222 is a heat dissipation fin, 223 is a mounting hole;

231 is the working fluid, 232 is the connecting hole, 233 is the mounting hole.

Detailed Description

The utility model discloses a humidity in locker to guarantee the security of article.

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

In the following, the terms "first", "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

The application discloses locker in order to guarantee the dry environment of the internal portion of cabinet to guarantee the safety of article in the locker, prevent to influence the problem of use because of the humidity, need dehumidify the operation to locker inside.

In order to solve the problems, the Peltier effect of the semiconductor material is utilized to realize the purpose of refrigeration, so that the air in the storage cabinet is condensed to realize the purpose of dehumidification. Specifically, the Peltier effect of semiconductor materials is that when direct current passes through a galvanic couple formed by two different semiconductor materials connected in series, heat can be absorbed and released at the two ends of the galvanic couple respectively.

As shown in fig. 1 and 2, a heat exchange assembly 2 is disclosed, where the heat exchange assembly 2 includes a semiconductor chilling plate 21, a hot-end heat sink 23 located at the hot end of the semiconductor chilling plate 21, and a cold-end heat sink 22 located at the cold end of the semiconductor chilling plate 21. Because what the core of this application utilized is the refrigeration effect of semiconductor refrigeration piece 21, consequently, during the assembly, cold junction radiator 22 is located the inside of the cabinet body, and hot junction radiator 23 is located the outside of the cabinet body, and semiconductor refrigeration piece 21 is installed in the cabinet board of locker.

According to the principle of the semiconductor refrigeration sheet 21, the two ends of the semiconductor refrigeration sheet 21 are respectively provided with the hot end and the cold end (not shown in the figure), so that moisture in air in the storage cabinet is condensed to achieve the purpose of dehumidification by fully utilizing the refrigeration function of the cold end, and preferably, the cold end radiator 22 is arranged at the cold end of the semiconductor refrigeration sheet 21. In fig. 1, it is shown that the cold-end heat sink 22 includes a base plate 221 and heat dissipation fins 222, wherein the base plate 221 is attached to the cold end of the semiconductor chilling plate 21, and the heat dissipation fins 222 are disposed on one side of the base plate 221 away from the semiconductor chilling plate 21.

In addition, in order to dissipate heat generated by the semiconductor cooling fins 21 to ensure the cooling efficiency of the semiconductor cooling fins 21, it is preferable that the hot-side heat sink 23 is provided at the hot side of the semiconductor cooling fins 21. The hot-side heat sink 23 includes a condensation end and an evaporation end (not shown in the figure), and a working fluid (the condensation end, the evaporation end and the working fluid are not shown in the figure) circulating at the condensation end and the evaporation end, and it is required to be limited that the working fluid becomes gaseous after absorbing heat at the evaporation end and becomes liquid after dissipating heat at the condensation end, that is, the hot-side heat sink 23 is a phase change heat sink. The evaporation end is attached to the hot end of the semiconductor refrigeration piece 21 and used for absorbing heat of the semiconductor refrigeration piece 21, and the condensation end is far away from the semiconductor refrigeration piece 21 and used for heat dissipation.

During operation, semiconductor refrigeration piece 21 starts, and the hot junction produces heat, and the working solution in the evaporating end absorbs latent heat and becomes gaseous state and gets into the condensing end, and gaseous working solution emits latent heat at the condensing end, condenses to the liquid state to flow back to the evaporating end, and the heat that the steam liquefaction released gives off to the external world, thereby accomplishes whole radiating process.

In practice, in order to facilitate the circulation of the working fluid in the hot-side radiator 23 at the evaporation side and the condensation side, it is preferable that the height of the evaporation side is set lower than that of the condensation side. So, during operation, gaseous working solution can independently rise to the condensation end, after the condensation end heat dissipation changed into liquid, then under the effect of gravity, automatic backward flow to the evaporation end.

The automatic circulation of the working liquid is realized by utilizing a gravity backflow mode, the structure can be effectively simplified, and the power cost is reduced.

As shown in fig. 3, the hot-end heat sink 23 may be a flat-plate heat pipe formed by extrusion molding of an aluminum plate, and has an evaporation end at one end and a condensation end at the other end. During processing, the working medium heat exchange flow path 231 designed according to the planning of each part is extruded by an aluminum plate to be integrally formed, and then is vacuumized and packaged after being filled with working liquid. Working medium heat exchange flow paths 231 are formed at adjacent concave positions on the blowing-up flat heat pipe. The four top corners of the hot end radiator 23 are respectively provided with connecting holes 232 which can be fixedly connected with the storage cabinet through screws during assembly, in addition, the evaporation end of the hot end radiator 23 is also provided with mounting holes 233, and the number and the positions of the mounting holes 233 are not particularly limited.

The hot-end heat sink 23 may be an integrally formed structure, and one end of the hot-end heat sink 23 is used as an evaporation end and the other end is used as a condensation end according to the distribution of the pipelines and the difference of the positions of the semiconductor cooling fins 21. In practice, a separate chamber may be provided and communicated with each other through a pipeline, specifically, the connection may be realized through a sintered heat pipe or a flat plate with a channel, and the specific structure of the working medium heat exchange flow path 231 may be set according to different requirements.

In the specific structure of the hot-end heat sink 23 shown in fig. 3, it can be seen that the flow path of the evaporation end for attaching to the hot end of the semiconductor chilling plate 21 is formed into a funnel shape, i.e., the flow path is tapered from the condensation end to the evaporation end, so as to ensure that the liquid flowing back from the condensation end can be collected to the middle part of the evaporation end, absorb the heat generated by the semiconductor chilling plate 21 as much as possible, and improve the heat exchange efficiency. In addition, the flow path of the condensation end shown in fig. 3 is formed into a funnel-shaped structure which is symmetrical with the evaporation end, so that the hot end radiator 23 is symmetrical in structure, convenient to process and attractive in appearance.

Furthermore, as can be seen from the hot-side heat sink 23 shown in fig. 2 and 7, the flow channel of the condensation side may also constitute a rectangular structure, i.e., the flow path profile of the hot-side heat sink 23 is rectangular and one end thereof is tapered.

In order to realize the height of the condensation end higher than that of the evaporation end, the hot-end radiator 23 can be vertically installed, i.e. the condensation end is positioned above the evaporation end. The hot side heat sink 23 may also be mounted at an incline, in particular by means of wedges 26 or brackets, as shown in fig. 4. Because the hot end radiator 23 has different structures, when the evaporation end and the condensation end are communicated through a pipeline, the inclined installation can be realized through the bending of the pipeline; when the heat sink is of an integral structure, the wedge 26 may be used to mount the heat sink obliquely, but the present invention is not limited thereto, and the hot end heat sink 23 may be formed to have a bent structure during machining.

It can be understood by those skilled in the art that the specific installation manner of the hot-side heat sink 23 and the connection manner of the evaporation end and the condensation end can be set according to different requirements, as long as it can be satisfied that the height of the condensation end is higher than that of the evaporation end when the hot-side heat sink 23 is installed at a desired position.

The circulation of the working fluid inside the hot-end radiator 23 is realized by utilizing the action of gravity, so that no additional power is needed, and the structure is simple. For example, the heights of the evaporation end and the condensation end may be set to be equivalent, and the condensed working fluid may be driven to the evaporation end by driving the pump. The liquid working fluid can be driven by the driving part, but the gaseous working fluid can reach the evaporation end by diffusion.

When the area of the hot-end radiator 23 is enough to analyze the hot-end heat flux density, the radiator does not need to be cooled by air, no fan can generate noise, and the effect of silent work can be achieved. In addition, the blowing plate is thin and occupies little space when installed.

It can be understood by those skilled in the art that when the heat dissipation effect of the condensation end is not enough to meet the heat dissipation requirement of the semiconductor cooling fins 21, a hot-end heat dissipation fin 25 may be disposed at the condensation end of the hot-end heat sink 23, as shown in fig. 4, to increase the heat dissipation efficiency of the condensation end and improve the heat dissipation effect of the hot-end heat sink 23. Preferably, the hot-side heat radiation fins 25 are positioned on the side far away from the semiconductor chilling plates 21.

As shown in fig. 5, a specific structure of the cold-end heat sink 22 is disclosed, which includes: a base 221 and heat dissipation fins 222. Wherein, the base plate 221 is a rectangular flat plate structure so as to be convenient for laminating the cold end of the semiconductor refrigeration sheet 21 and improve the heat exchange area, and an assembling hole 223 is formed on one side surface of the base plate 221. The heat dissipation fins 222 are uniformly arranged on the other side of the base plate 221, and the size of the heat dissipation fins 222 in the thickness direction of the base plate 221 is much larger than the thickness of the base plate 221, so as to increase the contact area with air. The heat dissipating fins 222 serve to enhance the heat transfer process and increase the heat exchange area of the cold side in contact with the air. In the embodiment, the thickness of the substrate 221 is not too thick or too thin, and too thick increases thermal resistance to facilitate heat dissipation, and the connection strength for fixing the substrate 221 needs to be satisfied to improve the reliability of the fixing.

During assembly, the base plate 221 is closely attached to the cold end of the semiconductor refrigerating sheet 21, but considering the condition that the wall thickness of the storage cabinet with heat insulation is larger than the thickness of the semiconductor refrigerating sheet 21, a boss is designed on the base plate 221 and can be embedded into the installation position of the storage cabinet. An example installation method: after the semiconductor refrigeration piece 21 and the cold-end radiator 22 are assembled, the semiconductor refrigeration piece is plugged from the inside of the storage cabinet, the hot-end radiator 23 penetrates through the storage cabinet from the corresponding position outside the storage cabinet through screws, the cold-end radiator 22 and the hot-end radiator 23 are screwed and fixed, and meanwhile, the semiconductor refrigeration piece 21 can be guaranteed to be clamped tightly. Therefore, in the flow path design of the inflation plate, the working medium heat exchange flow path 231 should be kept away from the position of the mounting hole 233.

In practice, the cold heat sink 22 may be in other forms, such as a water cooling pipe, etc., and the water inside the water cooling pipe is cooled by the heat transfer and the air inside the cabinet is cooled and dehumidified by the water cooling pipe.

The cooling fins 222 are simple in structure, easy to assemble, and obvious in cooling effect, so that the cold-end heat sink 22 is preferably configured to have a fin structure.

In an embodiment, the surface of the heat dissipating fins 222 is coated with super-hydrophilic coating, and a water receiving box 3 for collecting the liquid on the heat dissipating fins 222 is disposed in the storage cabinet, as shown in fig. 6. During operation, heat exchange assembly 2 work and can refrigerate, contact through the air in fin 222 and the locker, make the air in the locker meet the cold and condense into the water droplet and attach to fin 222, under the effect of gravity, the comdenstion water on fin 222 can drip to water receiver 3 in, accomplish the moisture of dehumidification and collection removal in the locker.

In a further embodiment, the heat exchange assembly 2 further comprises a shielding cover 24 covering the outside of the cold-end heat sink 22, as shown in fig. 2, for shielding the cold-end heat sink 22 from the articles in the storage cabinet, so as to prevent the articles from touching the cold-end heat sink 22 and getting wet. Preferably, the isolation cover 24 is a plastic box, and the plastic box is opened up and down to ensure the air to pass through and the condensed water to flow down, and a gap is left between the plastic box and the free end of the heat dissipation fins 222 of the cold-end heat sink 22 to ensure the air to circulate, and the top end and the bottom end of the plastic box and the gap between the top end and the heat dissipation fins 222 form a ventilation channel of the isolation cover 24 for the air to circulate in the storage cabinet. In addition, to enhance the cooling effect at the cold side heat sink 22, a layer of thermally insulating material may be applied to the side walls of the plastic box.

The size and shape of the isolation cover 24 can be set according to the size and shape of the cold-end heat sink 22, and the material of the isolation cover 24 is preferably low in heat conductivity. The shield 24 may be mounted by screws to the cold-side heat sink 22 or directly to the locker.

In order to reduce the contact thermal resistance, heat-conducting layers are arranged between the hot end of the hot end radiator 23 and the semiconductor refrigeration piece 21 and between the cold end of the cold end radiator 22 and the semiconductor refrigeration piece 21, the semiconductor refrigeration piece 21 can be prevented from being in direct contact with the hot end radiator 23 and the cold end radiator 22 under the action of the heat-conducting layers, and the contact thermal resistance is reduced. Preferably, the heat conductive layer may be a heat conductive silicone layer or a heat conductive sheet. In practice, the cold end and hot end of the semiconductor refrigerating sheet 21 may be coated with a heat-conducting silicone layer or bonded with a heat-conducting sheet.

As shown in fig. 6 and 7, the heat exchange assembly 2 may be mounted on a side wall of the cabinet body 1 of the storage cabinet, specifically, a mounting through hole is formed on the side wall of the cabinet body 1, the cold end radiator 22 of the heat exchange assembly 2 is located inside the cabinet body 1 and protrudes, and the hot end radiator 23 is located outside the cabinet body 1. The water receiving box 3 is arranged below the heat exchange assembly 2, and according to the structures, condensed water generated after the heat exchange assembly 2 is condensed can be collected in the water receiving box 3 below, so that the condensed water can be treated conveniently.

For the specific position of the heat exchange assembly 2 on the side wall of the cabinet 1, it is preferable to be near one end of the bottom plate to facilitate the arrangement of the hot-end radiator 23. The number of the heat exchange assemblies 2 and the arrangement position thereof may be set in practice according to the refrigeration efficiency of the heat exchange assemblies 2.

As shown in fig. 8, the heat exchange assembly 2 may be assembled on the top plate of the cabinet 1, and it will be appreciated by those skilled in the art that the heat exchange assembly 2 may also be installed on the bottom plate of the cabinet 1. When the heat exchange component 2 is installed on the top plate, when the height of the evaporation end is lower than that of the condensation end, the hot end radiator 23 can be installed in an inclined mode through the wedge block 26, and a pipeline for connecting the evaporation end and the condensation end is bent or a driving piece is added.

The cabinet 1 shown in fig. 6 to 8 is a rectangular structure, and it should be noted that the shape, size, material, and the like of the cabinet 1 are not specifically limited, and the cabinet is designed according to different requirements. When the number of the heat exchange assemblies 2 is multiple, the heat exchange assemblies can be arranged on the top and the side walls of the cabinet body 1.

In order to avoid heat neutralization between the cold end and the hot end of the semiconductor refrigeration sheet 21, the two ends of the semiconductor refrigeration sheet 21 need to be isolated, and in combination with the installation object of the semiconductor refrigeration sheet 21, preferably, the two ends of the semiconductor refrigeration sheet 21 can be separated through a cabinet plate of the cabinet body 1. The cabinet panel may be an insulation, for example, the cabinet panel may be arranged in a vacuum configuration for insulation purposes.

Specifically, the cabinet body 1 is provided with an installation through hole with a size slightly larger than that of the semiconductor refrigeration piece 21, so that the two ends of the semiconductor refrigeration piece 21 are prevented from being neutralized by heat at the installation through hole, and therefore, when the semiconductor refrigeration piece 21 is installed, heat insulation components such as heat insulation aerogel or heat insulation cotton can be filled between the semiconductor refrigeration piece 21 and the installation through hole for heat insulation and sealing. Furthermore, the semiconductor refrigeration piece 21 is wrapped with heat insulation cotton.

Furthermore, when the heat exchange assembly 2 is assembled with the cabinet plate 1, the heat insulation connecting piece penetrates through the heat insulation cotton from the mounting hole 233 of the hot end radiator 23 and then is fixedly connected with the assembling hole 223 on the substrate 221 of the cold end radiator 22, so that the connection between the hot end radiator 23 and the cold end radiator 22 is realized, the semiconductor refrigeration sheet 21 is clamped between the hot end radiator 23 and the cold end radiator 22, and then the cabinet body 1 is assembled through the connecting holes 232 on the four top corners of the hot end radiator 23. The use of a thermally insulating connector, which may be a plastic connector or other low thermal conductivity connector, prevents cold from passing between the cold side heat sink 22 and the hot side heat sink 23 through the connector and out of the cold. Here, the connection of heat exchange assembly 2 and the connection mode of heat exchange assembly 2 and cabinet 1 are disclosed, and in practice, other connection modes, such as clamping connection, can be adopted to realize the connection.

As will be understood from the above description, the cabinet 1 may be any cabinet 1 requiring a dehumidifying structure, such as: the heat exchange component 2 can be applied to the cabinet body of a wardrobe, the shell of an air conditioner or the cabinet body of electrical equipment as long as the structure needing dehumidification is adopted.

When the wardrobe is used in an environment with no need of large cooling capacity, the cold-end heat exchanger 22 does not need a large heat exchange area, so that the wardrobe is small in size, and the wardrobe can not occupy the space for storing clothes when being arranged on the lower portion of the side wall or the rear wall of the wardrobe.

On the basis of above-mentioned technical scheme, the locker disclosed in this application still includes the humidity transducer who is used for detecting 1 inside humidity of cabinet body to this humidity transducer and semiconductor refrigeration piece 21 signal connection for control semiconductor refrigeration piece 21 opens and stops. During operation, when humidity sensor acquires that humidity in the cabinet body 1 reaches first predetermined humidity value, then semiconductor refrigeration piece 21 switches on, and the start work dehumidifies in the cabinet body 1, when humidity that acquires until humidity sensor reaches second predetermined humidity value, stop work, and this first predetermined humidity value is greater than the second default.

As used in this application and the appended claims, the terms "a," "an," "the," and/or "the" are not intended to be inclusive in the singular, but rather are intended to be inclusive in the plural unless the context clearly dictates otherwise. In general, the terms "comprises" and "comprising" merely indicate that steps and elements are included which are explicitly identified, that the steps and elements do not form an exclusive list, and that a method or apparatus may include other steps or elements. An element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in the process, method, article, or apparatus that comprises the element.

In the present specification, the embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (12)

1. A storage cabinet, comprising:

a cabinet for holding articles;

the heat exchange assembly is used for exchanging heat with the cabinet body and dehumidifying moisture in air in the cabinet body in a condensation mode, and comprises: the refrigerator comprises a semiconductor refrigeration piece, a cold end radiator positioned at the cold end of the semiconductor refrigeration piece and a hot end radiator positioned at the hot end of the semiconductor refrigeration piece, wherein the cold end radiator is used for exchanging heat with the inside of the cabinet body, and the hot end radiator is used for discharging heat generated by the semiconductor refrigeration piece to the outside;

the hot-end radiator comprises a condensing end, an evaporating end and working fluid circulating between the condensing end and the evaporating end, the evaporating end is used for absorbing heat of the hot end of the semiconductor refrigerating sheet, and the working fluid absorbs heat at the evaporating end, changes phase into gas, flows to the condensing end, dissipates heat, changes phase into liquid and then flows back to the evaporating end.

2. The storage cabinet of claim 1, wherein the heat exchange assembly is located on the side walls and/or the top of the cabinet body, the hot end heat sink is located on the outer side of the cabinet body, the cold end heat sink is located on the inner side of the cabinet body, and the semiconductor refrigeration fins are embedded in the cabinet plates of the cabinet body.

3. A cabinet according to claim 2, wherein the cabinet panel is thermally insulated and the hot and cold ends of the semiconductor chilling plates are thermally separated by the panel; and the cabinet plate is provided with a mounting through hole, the semiconductor refrigeration piece is embedded into the mounting through hole in a sealing way through a heat insulation assembly, and the hot end radiator and the cold end radiator are connected through a heat insulation connecting piece and clamp the semiconductor refrigeration piece in the middle.

4. The storage cabinet of claim 2, wherein the condensation end is higher than the evaporation end.

5. The storage cabinet of claim 4, wherein the hot side heat sink is an air-blown flat heat pipe extruded from aluminum sheet, one end being the evaporation end and the other end being the condensation end;

the expansion type flat heat pipe is vertically or obliquely arranged, so that the condensation end and the evaporation end are arranged up and down.

6. The storage cabinet of claim 5, wherein the flow path of the hot side heat sink at the evaporation side is formed into a funnel shape tapering from the condensation side to the evaporation side; the flow path of the hot end radiator at the condensation end is rectangular or funnel-shaped and is symmetrical to the flow path of the evaporation end.

7. The storage cabinet of claim 1, wherein the hot side heat sink is provided with hot side heat fins at the condensation end.

8. A cabinet according to claim 2, wherein the cold end heat sink comprises:

the substrate is used for being attached to the cold end of the semiconductor refrigeration piece;

and the radiating fins are positioned at one end of the base plate, which is far away from the semiconductor chilling plate.

9. A cabinet according to claim 8, wherein the fins are coated with a super-hydrophilic coating, and a water-receiving box is provided in the cabinet for collecting liquid on the fins.

10. A cabinet according to claim 9, wherein the heat exchange assembly further comprises a shield for shielding the articles from the fins outside the cold heat sink, and wherein the shield has a ventilation channel for the passage of gases within the cabinet.

11. A storage cabinet according to any one of claims 1 to 10, wherein heat conducting layers are provided between the hot end heat sink and the hot end of the semiconductor chilling plates and between the cold end heat sink and the cold end of the semiconductor chilling plates.

12. The storage cabinet of any one of claims 1 to 10, further comprising a humidity sensor for detecting humidity inside the cabinet, wherein the humidity sensor is in signal connection with the semiconductor chilling plate and is used for controlling the semiconductor chilling plate to start and stop.

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