CN219289399U - Shoe drying device - Google Patents
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- CN219289399U CN219289399U CN202222759517.1U CN202222759517U CN219289399U CN 219289399 U CN219289399 U CN 219289399U CN 202222759517 U CN202222759517 U CN 202222759517U CN 219289399 U CN219289399 U CN 219289399U
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Abstract
The utility model discloses a shoe drying device, which comprises a box body, wherein an air inlet is formed in the box body; the heating module is arranged at the air inlet of the box body; the semiconductor module is arranged on the box body and is provided with a cold end and a hot end, the cold end of the semiconductor module is arranged in the box body and used for condensing hot and humid air in the box body, and the hot end of the semiconductor module is arranged outside the box body. According to the utility model, the cold end of the semiconductor module is arranged in the box body and can be used for condensing damp and hot air in the box body, and the hot end of the semiconductor module is arranged outside the box body, so that the hot end can conveniently dissipate heat to the outside of the box body, the heat dissipation of the hot end is quickened, the refrigerating effect of the cold end is improved, the air humidity in the box body is reduced, the drying efficiency of shoes is improved, the space in the box body can be saved, the space utilization rate in the box body is improved, and the device is particularly suitable for shoe drying devices with compact space structures.
Description
Technical Field
The utility model belongs to the field of shoe drying, and particularly relates to a shoe drying device.
Background
In the prior art, a heater and a semiconductor condenser are generally arranged in a box body of the shoe drying device. However, since the semiconductor has a cold end and a hot end, the cold end condenses, and the cold end heats when refrigerating, the cold end and the hot end are simultaneously arranged in the box body, the problem of heat exchange between the cold end and the hot end exists, the quick condensation cannot be realized, the drying efficiency is to be improved, and the radiator arranged on the cold end and the hot end and the cold end and the hot end occupies a large amount of space in the box body, so that the semiconductor is not suitable for a small-sized shoe dryer.
The Chinese patent with the application number of 201620884070.2 discloses a semiconductor deep dehumidification low-temperature drying shoe cabinet with an air supply pipe, which comprises a shoe cabinet body, wherein a semiconductor dehumidifier is arranged in the shoe cabinet body; a plurality of blast pipes are arranged in the shoe cabinet body, the blast pipes are communicated with the air outlets of the semiconductor dehumidifier, and the shoe openings of shoes are hung on the blast pipes or are opposite to the blast pipes; after the wet air in the shoe cabinet body enters the semiconductor dehumidifier and is dehumidified, dry air is output from an air outlet and is conveyed into the inner cavity of the shoe through the air distribution pipe to dry the shoe. The semiconductor dehumidifier comprises a shell, a semiconductor refrigerating sheet is arranged in the shell, a heat absorption fin group is arranged on one side of the semiconductor refrigerating sheet, a heat dissipation fin group is arranged on the other side of the semiconductor refrigerating sheet, after the semiconductor refrigerating sheet is electrified and works, the heat absorption fin group absorbs heat, the heat dissipation fin group releases heat, wet air flows through the heat absorption fin group to be cooled and dehumidified, becomes low-temperature saturated air, and then flows through the heat dissipation fin group to take away heat on the heat dissipation fin group.
But the semiconductor dehumidifier of this scheme has the casing, sets up semiconductor refrigeration piece and the both ends of refrigeration piece set up heat absorption fin and radiating fin in the casing, leads to occupying the space in the shoe cabinet body greatly, and the volume that needs the shoe cabinet is great to heat absorption fin and radiating fin are located same casing, and cold junction and hot junction carry out heat exchange, lead to condensation efficiency not high, thereby lead to the long problem of stoving time.
The present utility model has been made in view of this.
Disclosure of Invention
The utility model aims to overcome the defects of the prior art, and aims to provide a shoe drying device, wherein the cold end of a semiconductor module is arranged in a box body for condensation, and the hot end is arranged outside the box body, so that the space occupied in the box body can be reduced, the heat dissipation of the hot end can be accelerated, the condensation effect of the cold end is improved, and the shoe drying efficiency is accelerated.
In order to solve the technical problems, the utility model adopts the basic conception of the technical scheme that: there is provided a shoe drying apparatus comprising,
the box body is provided with an air inlet;
the heating module is arranged at the air inlet of the box body;
the semiconductor module is arranged on the box body and is provided with a cold end and a hot end, the cold end of the semiconductor module is arranged in the box body and used for condensing hot and humid air in the box body, and the hot end of the semiconductor module is arranged outside the box body.
Further, also comprises
The heat exchanger is arranged outside the box body and is in contact with the hot end of the semiconductor module for heat dissipation.
Further, the heat exchanger is a water-cooled heat exchanger and is attached to the hot end of the semiconductor module outside the box body.
Further, the method also comprises the steps of,
the water storage tank is arranged at the bottom in the box body and is used for collecting condensed water;
the liquid inlet and the liquid outlet of the water-cooled heat exchanger are respectively communicated with the outlet and the inlet of the water storage tank, and are used for leading the condensed water in the water storage tank into the heat exchanger and then exchanging heat with the hot end, and discharging the condensed water back to the water storage tank.
The utility model can remarkably reduce the temperature of the hot end by contacting and exchanging heat with the hot end of the semiconductor module through the water-cooled heat exchanger, thereby enabling the hot end to generate more heat and refrigerating more correspondingly to the cold end.
Further, the semiconductor module is arranged on the side wall of the box body; the water-cooled heat exchanger includes,
the heat exchange water tank is attached to the cold end of the semiconductor module outside the box body;
one end of the water inlet pipe is connected with the water storage tank, the other end of the water inlet pipe penetrates through the outside of the tank body and is connected with the heat exchange water tank, and a water pump is arranged on the water inlet pipe to introduce condensed water in the water storage tank into the heat exchange water tank;
and one end of the drain pipe is connected with the heat exchange water tank, and the other end of the drain pipe penetrates back into the tank body to be connected with the water storage tank, so that water in the heat exchange water tank is guided into the water storage tank.
Further, the semiconductor module cooling device also comprises a condensation sheet which is arranged in the box body and is in contact with condensed air at the cold end of the semiconductor module.
Further, the device also comprises a water collecting box which is arranged on the inner wall of the box body and below the condensing sheet and is used for collecting condensate on the condensing sheet;
one end of the water guide pipe is connected with the water collecting box, and the other end of the water guide pipe extends to the water storage tank to guide condensed water in the water collecting box into the water storage tank.
Further, an opening is formed in the side wall of the box body, and the semiconductor module is a semiconductor refrigerating sheet and is arranged in the opening of the box body;
the condensing sheet is arranged on the inner side wall of the semiconductor refrigerating sheet positioned in the box body, and the water-cooled heat exchanger is attached to the outer side wall of the semiconductor refrigerating sheet positioned outside the box body.
Further, the condensing sheet and the water-cooled heat exchanger are fixed through a connecting piece penetrating through the box body, and the semiconductor refrigerating sheet is clamped and fixed in the opening.
Further, the heating module is arranged on the outer side wall of the box body at the periphery of the air inlet, the heating module comprises a heating channel, a fan is arranged at the inlet of the heating channel, and the outlet of the heating channel is communicated with the air inlet of the box body.
By adopting the technical scheme, compared with the prior art, the utility model has the following beneficial effects.
(1) The shoe drying device is arranged on the box body, the cold end of the semiconductor module is arranged in the box body, the cold end can condense damp and hot air in the box body, the hot end of the semiconductor module is arranged outside the box body, so that the hot end can radiate heat to the outside of the box body, the heat radiation of the hot end is quickened, the refrigerating effect of the cold end is improved, the air humidity in the box body is reduced, the drying efficiency of shoes is improved, the cold end is arranged in the box body and the hot end is arranged outside the box body, the space in the box body can be saved, the space utilization rate in the box body is improved, and the shoe drying device is particularly suitable for shoe drying devices with compact space structures.
(2) According to the utility model, the water storage tank for containing condensed water is circularly communicated with the water cooler heat exchanger, condensed water with low temperature is led into the water-cooled heat exchanger to exchange heat with the hot end, so that the heat dissipation effect of the hot end is good, an external water source is not needed, the structural design is simple, then the water heated after heat exchange in the water-cooled heat exchanger is led into the water storage tank again, and is mixed with new condensed water for cooling, and the water can be reused as the water source of the water-cooled heat exchanger, so that the drying effect of the shoe drying device is remarkably improved, and the shoe drying device is simple in structure, low in cost and good in drying effect.
The following describes the embodiments of the present utility model in further detail with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model. It is evident that the drawings in the following description are only examples, from which other drawings can be obtained by a person skilled in the art without the inventive effort. In the drawings:
FIG. 1 is a schematic view of a shoe drying apparatus according to the present utility model;
FIG. 2 is a schematic view of the utility model at another angle to FIG. 1;
FIG. 3 is a schematic cross-sectional view taken along the direction A-A in FIG. 2 in accordance with the present utility model.
In the figure: 1. a case; 11. an air inlet; 12. an opening; 13. a water storage tank; 14. a water collecting box; 15. a water conduit; 16. a case body; 17. a box cover; 2. a heating module; 3. a semiconductor module; 4. a heat exchanger; 41. a heat exchange water tank; 42. a water inlet pipe; 43. a drain pipe; 44. a water pump; 5. condensing sheets; 6. a blower.
It should be noted that these drawings and the written description are not intended to limit the scope of the inventive concept in any way, but to illustrate the inventive concept to those skilled in the art by referring to the specific embodiments.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions in the embodiments will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present utility model, and the following embodiments are used to illustrate the present utility model, but are not intended to limit the scope of the present utility model.
In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
As shown in fig. 1 to 3, the shoe drying device according to the present utility model includes a case 1, a heating module 2, and a semiconductor module 3. The semiconductor module 3 can be used for condensing hot and humid air after being electrified.
The box body 1 is provided with an air inlet 11, and the heating module 2 is arranged at the air inlet 11 of the box body 1.
The semiconductor module 3 is provided on the case 1. The semiconductor module 3 is provided with a cold end and a hot end, the cold end of the semiconductor module 3 is arranged inside the box body 1 and used for condensing hot and humid air in the box body 1, and the hot end of the semiconductor module 3 is arranged outside the box body 1.
After the semiconductor module 3 is electrified, cold end refrigeration can be used for condensing hot and humid air, and the hotter the hot end is, the colder the cold end is. The shoe drying device can also be used for drying clothes, articles and the like.
The shoe drying device is arranged on the box body 1 and is used for arranging the cold end of the semiconductor module 3 in the box body 1, condensing hot and humid air in the box body 1, arranging the hot end of the semiconductor module 3 outside the box body 1, facilitating the heat end to radiate heat to the outside of the box body 1, accelerating the heat end to radiate heat, improving the refrigerating effect of the cold end, reducing the air humidity in the box body 1, improving the drying efficiency of shoes, arranging the cold end inside the box body 1 and arranging the hot end outside the box body 1, saving the space in the box body 1, improving the space utilization rate in the box body 1, and being particularly suitable for shoe drying devices with compact space structures.
Further, the shoe drying device further comprises a heat exchanger 4. The heat exchanger 4 is arranged outside the box body 1, and the heat exchanger 4 is in contact with the hot end of the semiconductor module 3, so that heat dissipation of the hot end is quickened.
According to the utility model, the heat exchanger 4 is arranged outside the box body 1, and the heat exchanger 4 is in contact with the hot end of the semiconductor module 3, so that heat generated by the hot end can be accelerated to dissipate heat, more heat can be generated by the hot end, more refrigeration is generated by the corresponding cold end, the condensation efficiency in the box body 1 is accelerated, the air humidity is reduced, and the drying efficiency of the shoe drying device is further improved.
The heat exchanger 4 may be an air-cooled radiator (e.g. a heat radiating fin), a heat pipe radiator, or a liquid-cooled radiator (e.g. a water-cooled radiator).
In a preferred embodiment, the heat exchanger 4 is a water-cooled heat exchanger. The water-cooled heat exchanger is attached to the hot end of the semiconductor module 3 outside the box body 1. The water-cooled heat exchanger is filled with water, the temperature of the water in the water-cooled heat exchanger is subjected to heat exchange with the hot end, the temperature of the water is increased, the temperature of the hot end is reduced, and the heat generated by the hot end of the semiconductor module 3 is taken away through water circulation, so that the heat dissipation of the hot end is realized.
The utility model can obviously reduce the temperature of the hot end by contacting and exchanging heat with the hot end of the semiconductor module 3 through the water-cooled heat exchanger, thereby leading the hot end to generate more heat and corresponding to more refrigeration of the cold end.
Further, the shoe drying device further comprises a water storage tank 13.
The water storage tank 13 is arranged at the bottom of the box body 1 and is used for collecting condensed water. The liquid inlet of the water-cooled heat exchanger is communicated with the outlet of the water storage tank 13, the liquid outlet of the water-cooled heat exchanger is communicated with the inlet of the water storage tank 13, and the water-cooled heat exchanger is used for leading condensed water in the water storage tank 13 into the water-cooled heat exchanger and then exchanging heat with the hot end, and discharging the condensed water back to the water storage tank 13.
According to the utility model, the water storage tank 13 for containing condensed water is circularly communicated with the water-cooled heat exchanger, condensed water with low temperature is led into the water-cooled heat exchanger to exchange heat with the hot end, so that the heat dissipation effect of the hot end is good, an external water source is not needed, the structural design is simple, and then the water heated after heat exchange in the water-cooled heat exchanger is led into the water storage tank 13 again to be mixed with new condensed water for cooling, so that the condensed water can be reused as the water source of the water-cooled heat exchanger.
Preferably, the semiconductor module 3 is disposed on a side wall of the case 1.
The water-cooled heat exchanger includes a heat exchange water tank 41, a water inlet pipe 42, and a water outlet pipe 43.
The heat exchange water tank 41 is attached to the cold end of the semiconductor module 3 outside the case 1.
One end of the water inlet pipe 42 is connected with the water storage tank 13, and the other end of the water inlet pipe 42 penetrates through the outside of the box body 1 and is connected with the heat exchange water tank 41. The water inlet pipe 42 is provided with a water pump 44 for introducing the condensed water in the water storage tank 13 into the heat exchange water tank 41.
One end of the drain pipe 43 is connected to the heat exchange water tank 41, and the other end of the drain pipe 43 is inserted into the tank body 1 and connected to the water storage tank 13, so that water in the heat exchange water tank 41 is introduced into the water storage tank 13.
The water storage tank 13 may be a separate component, and may be detachably mounted inside the case 1, or may be concavely disposed at the bottom of the case 1, and be integrally formed with the case 1.
Further, the shoe drying device further comprises a condensing sheet 5. The condensation piece 5 is arranged in the box body 1, is in contact with the cold end of the semiconductor module 3 for heat conduction, and receives cold energy of the cold end for condensing air.
The shoe drying device further comprises a water collecting box 14 and a water guide pipe 15.
The water collecting box 14 is arranged on the inner wall of the box body 1 and below the condensing sheet 5, and is used for collecting condensate on the condensing sheet 5. One end of the water guide pipe 15 is connected with the water collection box 14, and the other end of the water guide pipe 15 extends to the water storage tank 13 to guide condensed water in the water collection box 14 into the water storage tank 13.
The condensation sheet 5 can not only condense the hot and humid air in the tank 1, but also guide the condensed water to flow down into the water collection box 14.
The condensing plate 5 comprises a base plate and a plurality of fins which are arranged on the base plate at intervals in parallel. The base plate is arranged on the inner side wall of the box body 1, and the fins are vertically extended to enable the condensed hot and humid air to be condensed water and guide the condensed water to downwards.
The specific using process comprises the following steps: the heating module 2 is electrified for heating, and the fan 6 is electrified for blowing hot air into the box body 1. The hot air can quickly evaporate and convert the moisture of the object to be dried into water vapor while taking away the moisture on the object to be dried in the box body 1. After the semiconductor module is electrified, the hot end is in contact with the water-cooled heat exchanger for heat dissipation, the cold end is in contact with the condensing sheet 5 for condensing air, and water formed by condensation falls into the water collecting box 14 and enters the water storage tank 13 through the water guide pipe 15. The water circulation is realized through the water pump 44, the condensed water in the water storage tank 13 is introduced into the water-cooled heat exchanger, heat generated by the hot end of the semiconductor module 3 is taken away, more refrigerating capacity is generated at the cold end, the temperature of the condensing sheet 5 is reduced rapidly, the water vapor in the box body 1 is condensed rapidly, the condensation speed is accelerated, and the water formed by condensation falls into the water collection box 14 and enters the water storage tank 13 through the water guide pipe 15.
In a specific embodiment, an opening 12 is formed in a side wall of the box 1, and the semiconductor module 3 is a semiconductor refrigeration piece and is arranged in the opening 12 of the box 1. The condensing sheet 5 is arranged on the inner side wall of the semiconductor refrigerating sheet positioned in the box body 1, and the water-cooled heat exchanger is attached to the outer side wall of the semiconductor refrigerating sheet positioned outside the box body 1.
The semiconductor module 3 is arranged into a semiconductor refrigerating sheet, so that the contact area between the cold end and the condensing sheet 5 and the contact area between the hot end and the heat exchange water tank 41 can be increased, the heat exchange efficiency is improved, the drying efficiency of the shoe drying device is improved, the space occupied in the box body 1 is saved, and the installation is simple and the cost is low.
The condensing sheet 5 and the water-cooled heat exchanger are fixed by a connecting piece penetrating through the box body 1 at the periphery of the opening 12, the semiconductor refrigerating sheet is clamped between the condensing sheet 5 and the water-cooled heat exchanger, and the semiconductor refrigerating sheet is fixed in the opening 12.
The base plate of the condensing sheet 5 is penetrated by the connecting piece and is connected with the mounting hole on the water-cooled heat exchanger.
Preferably, the box 1 includes a box body 16 and a box cover 17 for closing an upper opening of the box body 16.
The opening 12 is provided in a side wall of the case 16. The semiconductor refrigerating sheet is arranged in the opening 12 of one side wall of the box body 16, the condensing sheet 5 is arranged on the inner side wall of the box body 16, and the water-cooled heat exchanger is arranged on the outer side wall of the box body 16.
A side wall of the water collecting box 14 is arranged on the inner side wall of the box body 16, and the lower ends of the fins extend into the water collecting box 14. The water storage tank 13 is arranged on the bottom wall in the box body 16.
Preferably, the water storage tank 13 is a water storage box, which is matched with the bottom of the tank 1, and is placed on the bottom in the tank 1.
Further, the heating module 2 is disposed on the outer side wall of the case 1 at the periphery of the air inlet 11, so that the space occupied in the case 1 can be reduced.
In a specific embodiment, the heating module 2 includes a heating channel, the heating channel is convexly disposed on the outer side wall of the box 1, a fan 6 is disposed at an inlet of the heating channel, and an outlet of the heating channel is communicated with an air inlet 11 of the box 1.
Preferably, the heating module 2 is disposed on the outer side wall of the case 1.
The heating module 2 and the semiconductor module 3 are disposed on opposite side walls of the case 1.
The heating module 2 is an electrical heating module, preferably a PTC heating module.
The foregoing description is only a preferred embodiment of the present utility model, and the present utility model is not limited to the above-mentioned embodiment, but is not limited to the above-mentioned embodiment, and any simple modification, equivalent change and modification made by the technical matter of the present utility model can be further combined or replaced by the equivalent embodiment without departing from the scope of the technical solution of the present utility model.
Claims (9)
1. A shoe drying device, characterized in that: comprising the steps of (a) a step of,
the box body is provided with an air inlet;
the heating module is arranged at the air inlet of the box body;
the semiconductor module is arranged on the box body and is provided with a cold end and a hot end, the cold end of the semiconductor module is arranged in the box body and used for condensing hot and humid air in the box body, and the hot end of the semiconductor module is arranged outside the box body;
the heat exchanger is arranged outside the box body and is in contact with the hot end of the semiconductor module for heat dissipation.
2. A shoe drying apparatus according to claim 1, wherein: the heat exchanger is a water-cooled heat exchanger and is attached to the hot end of the semiconductor module outside the box body.
3. A shoe drying apparatus according to claim 2, wherein: also included is a method of manufacturing a semiconductor device,
the water storage tank is arranged at the bottom in the box body and is used for collecting condensed water;
the liquid inlet and the liquid outlet of the water-cooled heat exchanger are respectively communicated with the outlet and the inlet of the water storage tank, and are used for leading the condensed water in the water storage tank into the heat exchanger and then exchanging heat with the hot end, and discharging the condensed water back to the water storage tank.
4. A shoe drying apparatus according to claim 3, wherein: the semiconductor module is arranged on the side wall of the box body; the water-cooled heat exchanger includes,
the heat exchange water tank is attached to the cold end of the semiconductor module outside the box body;
one end of the water inlet pipe is connected with the water storage tank, the other end of the water inlet pipe penetrates through the outside of the tank body and is connected with the heat exchange water tank, and a water pump is arranged on the water inlet pipe to introduce condensed water in the water storage tank into the heat exchange water tank;
and one end of the drain pipe is connected with the heat exchange water tank, and the other end of the drain pipe penetrates back into the tank body to be connected with the water storage tank, so that water in the heat exchange water tank is guided into the water storage tank.
5. A shoe drying apparatus according to any one of claims 3 to 4, wherein: the semiconductor module further comprises a condensation sheet which is arranged in the box body and is in contact with condensation air at the cold end of the semiconductor module.
6. The shoe drying apparatus according to claim 5, wherein: the water collecting box is arranged on the inner wall of the box body and below the condensing sheet and is used for collecting condensate on the condensing sheet;
one end of the water guide pipe is connected with the water collecting box, and the other end of the water guide pipe extends to the water storage tank to guide condensed water in the water collecting box into the water storage tank.
7. The shoe drying apparatus according to claim 5, wherein: the side wall of the box body is provided with an opening, and the semiconductor module is a semiconductor refrigerating sheet and is arranged in the opening of the box body;
the condensing sheet is arranged on the inner side wall of the semiconductor refrigerating sheet positioned in the box body, and the water-cooled heat exchanger is attached to the outer side wall of the semiconductor refrigerating sheet positioned outside the box body.
8. The shoe drying apparatus according to claim 7, wherein: the condensing sheet and the water-cooled heat exchanger are fixed through a connecting piece penetrating through the box body, and the semiconductor refrigerating sheet is clamped and fixed in the opening.
9. A shoe drying apparatus according to claim 1, wherein: the heating module is arranged on the outer side wall of the box body at the periphery of the air inlet, the heating module comprises a heating channel, a fan is arranged at the inlet of the heating channel, and the outlet of the heating channel is communicated with the air inlet of the box body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222759517.1U CN219289399U (en) | 2022-10-20 | 2022-10-20 | Shoe drying device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222759517.1U CN219289399U (en) | 2022-10-20 | 2022-10-20 | Shoe drying device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219289399U true CN219289399U (en) | 2023-07-04 |
Family
ID=86959318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222759517.1U Active CN219289399U (en) | 2022-10-20 | 2022-10-20 | Shoe drying device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219289399U (en) |
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2022
- 2022-10-20 CN CN202222759517.1U patent/CN219289399U/en active Active
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