CN116928923A - Storage cabinet - Google Patents

Abstract

The application discloses a locker, comprising: a cabinet body for holding articles; a heat transfer assembly for carrying out the heat exchange with the cabinet body and dehumidifying the moisture condensation in the internal air of cabinet, heat transfer assembly includes: the semiconductor refrigerating plate, the cold end radiator positioned at the cold end of the semiconductor refrigerating plate and the hot end radiator positioned at the hot end of the semiconductor refrigerating plate are used for exchanging heat with the cabinet body, and the hot end radiator is used for discharging heat generated by the semiconductor refrigerating plate to the outside; the hot end radiator comprises a condensing end, an evaporating end and working fluid circulating between the condensing end and the evaporating end, wherein the evaporating end is used for absorbing heat of the hot end of the semiconductor refrigerating sheet, and the working fluid absorbs heat and changes phase into gas at the evaporating end and flows to the condensing end to dissipate heat and change phase into liquid and then flows back to the evaporating end. The semiconductor refrigerating sheets are arranged on the cabinet body of the cabinet, and the effect of the semiconductor refrigerating sheets is combined to refrigerate the cabinet body so as to realize air condensation and dehumidification, thereby ensuring the safety of articles in the cabinet.

Description

Storage cabinet

Technical Field

The application relates to the technical field of dehumidification, in particular to a storage cabinet.

Background

With the development of society, the living standard of people is improved, more families pursue higher living quality, and the storage and nursing requirements on clothes are also higher.

The wardrobe is used for placing clean clothes so as to realize dust prevention and neatness of the clothes. However, because there is no light, no ventilation, etc. in the wardrobe, the interior of the wardrobe is moist, especially for the southern return to the south, the plum rain season, the humidity is greater, therefore, the clothes can go moldy due to the moist storage environment, and the moist wardrobe can also grow a large amount of bacteria, further leading to the moldy of the clothes.

Therefore, how to reduce the humidity in the locker to ensure the safety of the articles is a technical problem to be solved urgently by those skilled in the art.

Disclosure of Invention

In view of this, the present application provides a humidity in the locker to ensure the safety of the articles.

In order to achieve the above purpose, the present application provides the following technical solutions:

a locker, comprising:

a cabinet body for holding articles;

the heat exchange assembly for carrying out heat exchange with the cabinet body and condensing and dehumidifying the moisture in the air in the cabinet body, the heat exchange assembly comprises: the semiconductor refrigerator comprises a semiconductor refrigerating sheet, a cold end radiator positioned at the cold end of the semiconductor refrigerating sheet and a hot end radiator positioned at the hot end of the semiconductor refrigerating sheet, wherein the cold end radiator is used for exchanging heat with the cabinet body, and the hot end radiator is used for discharging heat generated by the semiconductor refrigerating sheet to the outside;

the hot end radiator comprises a condensing end, an evaporating end and working fluid circulating between the condensing end and the evaporating end, wherein the evaporating end is used for absorbing heat of the hot end of the semiconductor refrigerating sheet, and the working fluid absorbs heat and changes phase into gas at the evaporating end and flows to the condensing end to dissipate heat and change phase into liquid and then flows back to the evaporating end.

Preferably, in the above-mentioned locker, the heat exchange component is located on a side wall and/or a top of the cabinet body, the hot end radiator is located on an outer side of the cabinet body, the cold end radiator is located in the cabinet body, and the semiconductor refrigeration sheet is embedded in a cabinet plate of the cabinet body.

Preferably, in the above-mentioned storage cabinet, a cabinet plate of the cabinet body is a heat-insulating member, and the hot end and the cold end of the semiconductor refrigeration sheet are separated by the heat-insulating member; and the cabinet plate is provided with a mounting through hole, the semiconductor refrigerating sheet is sealed and embedded into the mounting through hole through the heat insulation component, and the hot end radiator and the cold end radiator are connected through the heat insulation connecting piece and clamp the semiconductor refrigerating sheet in the middle.

Preferably, in the above-mentioned storage cabinet, the height of the condensation end is higher than the height of the evaporation end.

Preferably, in the above-mentioned storage cabinet, the hot-end radiator is a flat-plate heat pipe formed by extrusion of an aluminum plate, one end is the evaporation end, and the other end is the condensation end;

the flat-plate heat pipes are vertically or obliquely arranged so that the condensing end and the evaporating end are arranged up and down.

Preferably, in the above-mentioned storage cabinet, a flow path of the hot end radiator at the evaporation end forms a funnel shape that tapers from the condensation end to the evaporation end; the flow path of the hot end radiator at the condensing end forms a rectangle or is a funnel-shaped symmetrical with the flow path of the evaporating end.

Preferably, in the above storage cabinet, the hot end radiator is provided with a hot end radiating fin at the condensation end.

Preferably, in the above cabinet, the cold end radiator includes:

the base plate is used for being attached to the cold end of the semiconductor refrigeration piece;

and the radiating fins are positioned at one end of the base plate far away from the semiconductor refrigerating sheet.

Preferably, in the above cabinet, the surface of the heat dissipation fin is coated with a super-hydrophilic coating, and a water receiving box for collecting the liquid on the heat dissipation fin is arranged in the cabinet.

Preferably, in the above cabinet, the heat exchange assembly further includes a shielding cover covering the outside of the cold end radiator for shielding the articles from the heat radiating fins, and the shielding cover has a ventilation channel for passing the gas in the cabinet.

Preferably, in the above storage cabinet, a heat conducting layer is disposed between the hot end radiator and the hot end of the semiconductor refrigeration sheet and between the cold end radiator and the cold end of the semiconductor refrigeration sheet.

Preferably, in the above cabinet, the cabinet further includes a humidity sensor for detecting the humidity inside the cabinet body, where the humidity sensor is in signal connection with the semiconductor refrigeration sheet, and is used to control the start and stop of the semiconductor refrigeration sheet.

The application provides a locker, wherein a semiconductor refrigerating sheet is arranged on a locker body of the locker, and the locker body is refrigerated by combining the effect of the semiconductor refrigerating sheet to realize air condensation and dehumidification.

Drawings

In order to more clearly illustrate the embodiments of the application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is an assembled side view of a heat exchange assembly disclosed in an embodiment of the present application;

FIG. 2 is a schematic diagram of a disassembled heat exchange assembly according to an embodiment of the present application;

FIG. 3 is a front view of another configuration of a hot side heat sink of the heat exchange assembly disclosed in an embodiment of the present application;

FIG. 4 is a front view of a hot side heat sink of the heat exchange assembly disclosed in an embodiment of the present application when mounted in an inclined orientation;

FIG. 5 is a schematic view of a cold end radiator of a heat exchange assembly disclosed in an embodiment of the present application;

FIG. 6 is a schematic view of a heat exchange assembly according to an embodiment of the present application mounted on a side wall of a cabinet;

FIG. 7 is a schematic view of a heat exchange assembly according to an embodiment of the present application mounted on a side wall of a cabinet in another direction;

FIG. 8 is a schematic view of a heat exchange assembly according to an embodiment of the present application mounted on a top plate of a cabinet;

wherein, 1 is a cabinet body, 2 is a heat exchange component, and 3 is a water receiving box;

the semiconductor refrigerating sheet 21, the cold end radiator 22, the hot end radiator 23, the isolation cover 24, the hot end radiating fins 25 and the wedge blocks 26;

221 is a substrate, 222 is a radiating fin, 223 is an assembly hole;

231 is working fluid, 232 is a connection hole, and 233 is a mounting hole.

Detailed Description

The application discloses humidity in a locker to ensure the safety of articles.

The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

The terms "first" and "second" are used below for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature.

The application discloses a locker, which is used for ensuring the dry environment in the locker body so as to ensure the safety of articles in the locker and prevent the problem of influence on use caused by humidity.

In order to solve the problems, the application utilizes the Peltier effect of the semiconductor material to realize the purpose of refrigeration, thereby condensing the air in the storage cabinet to realize the purpose of dehumidification. Specifically, the Peltier effect of a semiconductor material is that when a direct current passes through a couple of two different semiconductor materials in series, heat can be absorbed and released at the two ends of the couple, respectively.

As shown in fig. 1 and 2, a heat exchange assembly 2 is disclosed, the heat exchange assembly 2 comprising a semiconductor refrigeration sheet 21, a hot side heat sink 23 located at the hot side of the semiconductor refrigeration sheet 21, and a cold side heat sink 22 located at the cold side of the semiconductor refrigeration sheet 21. Since the core of the application utilizes the refrigeration effect of the semiconductor refrigeration piece 21, when in assembly, the cold end radiator 22 is positioned in the cabinet body, the hot end radiator 23 is positioned outside the cabinet body, and the semiconductor refrigeration piece 21 is arranged in the cabinet plate of the cabinet.

The principle of the semiconductor refrigeration sheet 21 indicates that the two ends of the semiconductor refrigeration sheet 21 are respectively a hot end and a cold end (not shown), and in order to fully utilize the refrigeration function of the cold end, the cold end radiator 22 is preferably disposed at the cold end of the semiconductor refrigeration sheet 21 to condense the moisture of the air in the storage cabinet so as to achieve the dehumidification purpose. The cold end radiator 22 shown in fig. 1 comprises a base plate 221 and radiating fins 222, wherein the base plate 221 is attached to the cold end of the semiconductor refrigeration piece 21, and the radiating fins 222 are arranged on one side of the base plate 221 away from the semiconductor refrigeration piece 21.

In addition, in order to dissipate heat generated from the semiconductor cooling fin 21 to ensure cooling efficiency of the semiconductor cooling fin 21, it is preferable that the hot side heat sink 23 is provided at the hot side of the semiconductor cooling fin 21. The hot-side radiator 23 includes a condensing end and an evaporating end (not shown in the drawing) and a working fluid (the condensing end, the evaporating end and the working fluid are not shown in the drawing) circulating between the condensing end and the evaporating end, and it is required to be limited that the working fluid becomes a gas state after absorbing heat at the evaporating end and becomes a liquid state after dissipating heat at the condensing end, i.e., the hot-side radiator 23 is a phase-change radiator. The evaporation end is attached to the hot end of the semiconductor refrigeration sheet 21 and is used for absorbing heat of the semiconductor refrigeration sheet 21, and the condensation end is far away from the semiconductor refrigeration sheet 21 and is used for heat dissipation.

When the semiconductor refrigerating plate 21 is in operation, the hot end generates heat, the working fluid in the evaporation end absorbs the latent heat to be gaseous and enters the condensation end, the gaseous working fluid releases the latent heat at the condensation end, is condensed to be liquid and flows back to the evaporation end, and the heat released by the vapor liquefaction is emitted to the outside, so that the whole heat dissipation process is completed.

In practice, in order to facilitate circulation of the working fluid in the hot side radiator 23 at the evaporation side and the condensation side, it is preferable that the height of the evaporation side be set to be lower than that of the condensation side. Therefore, when the device works, gaseous working fluid can automatically rise to the condensing end, and after the condensing end dissipates heat and is converted into a liquid state, the working fluid automatically flows back to the evaporating end under the action of gravity.

The automatic circulation of the working solution is realized by utilizing a gravity backflow mode, so that the structure can be effectively simplified, and the power cost is reduced.

As shown in fig. 3, the hot-end radiator 23 may be configured as a flat-plate heat pipe having a flat shape and a flat shape, which is formed by extruding an aluminum plate, and has one end opposite to the evaporation end and the other end opposite to the condensation end. During processing, the working medium heat exchange flow path 231 planned and designed according to each part is extruded and integrally formed by an aluminum plate, and then is vacuumized, poured with working fluid and then packaged. A working medium heat exchange flow path 231 is formed at the adjacent concave position on the expansion type flat heat pipe. The four top corners of the hot end radiator 23 are respectively provided with a connecting hole 232, and can be fixedly connected with the storage cabinet by screws during assembly, and in addition, the evaporation end of the hot end radiator 23 is also provided with mounting holes 233, and the number and the positions of the mounting holes 233 can be not particularly limited.

The hot-end radiator 23 may be an integrally formed structure, and one end of the hot-end radiator 23 is used as a evaporating end and the other end is used as a condensing end according to the distribution of the pipelines and the positions of the hot-end radiator relative to the semiconductor refrigerating sheet 21. In practice, separate chambers may be provided and connected through a pipeline, specifically, the connection may be achieved by sintering a heat pipe or forming a channel on a flat plate, and the specific structure of the working medium heat exchange flow path 231 may be set according to different needs.

In the specific structure of the hot end radiator 23 shown in fig. 3, it can be seen that the flow path of the evaporation end, which is used for being attached to the hot end of the semiconductor refrigeration sheet 21, forms a funnel shape, i.e. tapers from the condensation end to the evaporation end, so as to ensure that the liquid flowing back from the condensation end can be collected to the middle part of the evaporation end, absorb the heat generated by the semiconductor refrigeration sheet 21 as much as possible, and improve the heat exchange efficiency. In addition, the flow path of the condensing end shown in fig. 3 has a funnel-shaped structure symmetrical to the evaporating end, so that the hot end radiator 23 has a symmetrical structure, and is convenient to process and attractive.

Furthermore, as can be seen from the hot side radiator 23 shown in fig. 2 and 7, the flow channels of the condensing side may also constitute a rectangular structure, i.e. a structure in which the flow channel profile of the hot side radiator 23 is rectangular and one end thereof is tapered.

In order to achieve a higher level of condensing end than evaporating end, the hot end radiator 23 may be mounted vertically, i.e. with the condensing end above the evaporating end. The hot side heat sink 23 may also be mounted obliquely, in particular by means of wedges 26 or brackets, as shown in fig. 4. Because of the different structures of the hot end radiator 23, when the evaporation end and the condensation end are communicated through a pipeline, the inclined installation can be realized through the bending of the pipeline; when it is an integral structure, the wedge 26 may be used to achieve oblique mounting, but not limited thereto, and the hot-end radiator 23 may be formed into a bent structure at the time of processing.

It will be appreciated by those skilled in the art that the specific installation manner of the hot-end radiator 23 and the connection manner of the evaporation end and the condensation end may be set according to different needs, so long as the above-mentioned installation of the hot-end radiator 23 at a desired position can be satisfied, and the height of the condensation end is ensured to be higher than that of the evaporation end.

The circulation of the working fluid inside the hot-end radiator 23 is achieved by utilizing the gravity, so that no additional power is required, and the structure is simple, but the application is not limited thereto, i.e. the heights of the evaporation end and the condensation end are not limited, and the liquid working fluid is driven to flow back by the power element. For example, the heights of the evaporation end and the condensation end may be set to be equivalent, and the condensed working fluid may be driven to the evaporation end by driving the pump. The liquid working fluid can be driven by adopting the driving piece, but the gaseous working fluid can reach the evaporation end in a diffusion mode.

When the area of the hot end radiator 23 is enough to analyze the hot end heat flux, the radiator is not required to be cooled by air cooling, no fan generates no noise, and the effect of mute operation can be achieved. In addition, the inflation sheet is thin and occupies little space when installed.

It will be appreciated by those skilled in the art that when the heat dissipation effect of the condensation end is insufficient to meet the heat dissipation requirement of the semiconductor refrigeration sheet 21, the condensation end of the hot end radiator 23 may be provided with a hot end heat dissipation fin 25, as shown in fig. 4, so as to increase the heat dissipation efficiency of the condensation end and improve the heat dissipation effect of the hot end radiator 23. Preferably, the hot side heat dissipating fins 25 are located on the side away from the semiconductor cooling fins 21.

As shown in fig. 5, a specific structure of a cold end radiator 22 is disclosed, comprising: a base 221 and a heat dissipating fin 222. The base plate 221 is a rectangular flat plate structure, so that the cold end of the semiconductor refrigeration piece 21 can be attached, the heat exchange area can be increased, and an assembly hole 223 is formed in one side surface of the base plate 221. The heat dissipation fins 222 are uniformly disposed on the other side of the substrate 221, and the dimension of the heat dissipation fins 222 along the thickness direction of the substrate 221 is much larger than the thickness of the substrate 221, so as to increase the contact area with air. The heat dissipation fins 222 are used for enhancing the heat transfer process and increasing the heat exchange area of the cold end contacted with air. In a specific embodiment, the thickness of the substrate 221 is not too thick or too thin, and the too thick substrate increases the thermal resistance of heat conduction, which is not beneficial to heat dissipation, and meanwhile, the connection strength of the substrate 221 needs to be satisfied, so that the reliability of the fixing is improved.

During assembly, the base plate 221 is tightly attached to the cold end of the semiconductor refrigeration piece 21, but considering the situation that the thickness of the wall surface of the locker with heat insulation is larger than that of the semiconductor refrigeration piece 21, a boss is designed on the base plate 221, and can be embedded into the installation position of the locker. An example of an installation method: the semiconductor refrigerating sheet 21 and the cold end radiator 22 are plugged into the cabinet from the inside after being assembled, the hot end radiator 23 penetrates through the cabinet from the corresponding position outside the cabinet by using screws, the cold end radiator 22 and the hot end radiator 23 are screwed and fixed, and meanwhile the semiconductor refrigerating sheet 21 can be clamped. Therefore, in the design of the expansion plate flow path, the working fluid heat exchange flow path 231 should be avoided from the position of the mounting hole 233.

In practice, the cold end radiator 22 may be other forms, such as a water-cooled tube, which cools water in the water-cooled tube by heat transfer, and cools and dehumidifies air in the cabinet by the water-cooled tube.

The cooling fin 222 is simple in structure, easy to assemble and obvious in cooling effect, so that the cold end radiator 22 is preferably provided with a fin structure.

In one embodiment, the surface of the radiating fin 222 is coated with a super-hydrophilic coating, and a water receiving box 3 for collecting the liquid on the radiating fin 222 is disposed in the storage cabinet, as shown in fig. 6. During operation, the heat exchange assembly 2 works and can refrigerate, air in the storage cabinet contacts with the air through the radiating fins 222, so that the air in the storage cabinet is cooled and condensed into water drops to be attached to the radiating fins 222, and under the action of gravity, the condensed water on the radiating fins 222 can drop into the water receiving box 3 to finish dehumidification in the storage cabinet and collect the removed water.

In a further embodiment, the heat exchange assembly 2 further includes a shielding cover 24 covering the outer side of the cold end radiator 22, as shown in fig. 2, for separating the cold end radiator 22 from the articles in the storage cabinet, so as to prevent the articles from touching the cold end radiator 22 and being wetted. Preferably, the isolation cover 24 is a plastic box, the plastic box is opened up and down, air can be guaranteed to pass through, condensed water flows down, a gap is reserved between the plastic box and the free ends of the radiating fins 222 of the cold end radiator 22, so that air circulation is guaranteed, and the ventilation channels of the isolation cover 24 for air circulation in the storage cabinet are formed by the top end and the bottom end of the plastic box and the gaps between the plastic box and the radiating fins 222. In addition, to enhance the cooling effect at the cold end heat sink 22, a layer of insulating material may be coated on the side walls of the plastic box.

The size and shape of the shield 24 may be set according to the size and shape of the cold end radiator 22, and a material having low thermal conductivity is preferable for the shield 24. The mounting for the cage 24 may be by screws to the cold end radiator 22 or directly to the cabinet.

In order to reduce the contact thermal resistance, heat conducting layers are arranged between the hot end radiator 23 and the hot end of the semiconductor refrigerating sheet 21 and between the cold end radiator 22 and the cold end of the semiconductor refrigerating sheet 21, and the semiconductor refrigerating sheet 21 can be prevented from being in direct contact with the hot end radiator 23 and the cold end radiator 22 through the effect of the heat conducting layers, so that the contact thermal resistance is reduced. Preferably, the heat conductive layer may be a heat conductive silicone grease layer or a heat conductive sheet. In practice, the surfaces of the cold and hot ends of the semiconductor refrigeration sheet 21 may be coated with a thermally conductive silicone grease layer or bonded with a thermally conductive sheet.

As shown in fig. 6 and 7, the heat exchange assembly 2 may be mounted on a side wall of the cabinet body 1 of the storage cabinet, specifically, a mounting through hole is formed on the side wall of the cabinet body 1, the cold end radiator 22 of the heat exchange assembly 2 is located inside the cabinet body 1 and protrudes, and the hot end radiator 23 is located outside the cabinet body 1. The water receiving box 3 is arranged below the heat exchange assembly 2, and as can be seen from the structures, condensed water generated after condensation of the heat exchange assembly 2 can be collected in the water receiving box 3 below, so that the condensed water can be conveniently treated.

For a specific location of the heat exchange assembly 2 on the side wall of the cabinet 1, it is preferable to be close to one end of the bottom plate, so as to arrange the hot end radiator 23. The number of heat exchange assemblies 2, and the arrangement position may be set according to the cooling efficiency of the heat exchange assemblies 2 in practice.

As shown in fig. 8, the heat exchange assembly 2 may be assembled on the top plate of the cabinet 1, and it is conceivable to those skilled in the art that the heat exchange assembly 2 may also be mounted on the bottom plate of the cabinet 1. When the heat exchange assembly 2 is installed on the top plate, when the height of the evaporation end is required to be ensured to be lower than that of the condensation end, the hot end radiator 23 can be obliquely installed through the wedge 26, and a pipeline connecting the evaporation end and the condensation end can be bent or a driving part can be added.

The cabinet body 1 shown in fig. 6 to 8 has a rectangular structure, and the shape, the size, the material, and the like of the cabinet body 1 are not particularly limited, and only need to be designed according to different requirements. When there are a plurality of heat exchange assemblies 2, the heat exchange assemblies can be arranged on the top and the side wall of the cabinet body 1.

In order to avoid heat neutralization at the cold end and the hot end of the semiconductor refrigeration sheet 21, it is necessary to isolate both ends of the semiconductor refrigeration sheet 21, and in combination with the object to which the semiconductor refrigeration sheet 21 is mounted, it is preferable that both ends of the semiconductor refrigeration sheet 21 be separated by the cabinet plate of the cabinet 1. The cabinet plate can be a heat insulating piece, for example, the cabinet plate can be arranged into a vacuum structure so as to realize the purpose of heat insulation.

Specifically, the cabinet body 1 is provided with a mounting through hole with a size slightly larger than that of the semiconductor refrigeration piece 21, so that heat neutralization at the mounting through hole is avoided at two ends of the semiconductor refrigeration piece 21, and therefore, when the semiconductor refrigeration piece 21 is mounted, heat insulation components such as heat insulation aerogel or heat insulation cotton can be filled between the semiconductor refrigeration piece 21 and the mounting through hole for heat insulation and sealing. Further, the periphery of the semiconductor refrigeration sheet 21 is wrapped with heat insulation cotton.

Further, when the heat exchange assembly 2 is assembled with the cabinet plate 1, the heat insulation connecting piece is utilized to fixedly connect with the assembly holes 223 on the base plate 221 of the cold end radiator 22 after penetrating through the heat insulation cotton from the assembly holes 233 of the hot end radiator 23, so as to realize the connection of the hot end radiator 23 and the cold end radiator 22, clamp the semiconductor refrigerating sheet 21 between the hot end radiator 23 and the cold end radiator 22, and then assemble the semiconductor refrigerating sheet to the cabinet body 1 through the connection holes 232 on the four vertex angles of the hot end radiator 23. The use of an insulated connection, which may be a plastic connection or other connection of low thermal conductivity, prevents neutralization of cold between the cold and hot side heat sinks 22, 23 by the connection. The connection of the heat exchange assembly 2 and the connection mode of the heat exchange assembly 2 and the cabinet body 1 are disclosed herein, and in practice, other connection modes, such as clamping, can be adopted to achieve the connection.

As can be seen from the above description, the cabinet 1 may be any cabinet 1 requiring a dehumidifying structure, for example: the heat exchange assembly 2 can be applied to a cabinet body of a wardrobe, a housing of an air conditioner, a cabinet body of an electrical device, and the like as long as a dehumidifying structure is required.

When the environment is a wardrobe, the cold-end heat exchanger 22 does not need large cold energy and large heat exchange area, so the volume is small, and the cold-end heat exchanger is arranged on the lower part of the side wall or the rear wall of the wardrobe and does not occupy the space for storing clothes.

On the basis of the technical scheme, the locker disclosed by the application further comprises a humidity sensor for detecting the humidity inside the locker body 1, and the humidity sensor is in signal connection with the semiconductor refrigerating sheet 21 and is used for controlling the start and stop of the semiconductor refrigerating sheet 21. When the operation, when humidity sensor obtained the humidity in the cabinet body 1 reaches first default humidity value, then semiconductor refrigeration piece 21 switches on, begins the work, dehumidifies in the cabinet body 1, and when humidity sensor obtained the humidity reaches second default humidity value, stops working, and this first default humidity value is greater than the second default value.

As used in the specification and in the claims, the terms "a," "an," "the," and/or "the" are not specific to a singular, but may include a plurality, unless the context clearly dictates otherwise. In general, the terms "comprises" and "comprising" merely indicate that the steps and elements are explicitly identified, and they do not constitute an exclusive list, as other steps or elements may be included in a method or apparatus. The inclusion of an element defined by the phrase "comprising one … …" does not exclude the presence of additional identical elements in a process, method, article, or apparatus that comprises an element.

In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (12)

1. A locker, comprising:

a cabinet body for holding articles;

the heat exchange assembly for carrying out heat exchange with the cabinet body and condensing and dehumidifying the moisture in the air in the cabinet body, the heat exchange assembly comprises: the semiconductor refrigerator comprises a semiconductor refrigerating sheet, a cold end radiator positioned at the cold end of the semiconductor refrigerating sheet and a hot end radiator positioned at the hot end of the semiconductor refrigerating sheet, wherein the cold end radiator is used for exchanging heat with the cabinet body, and the hot end radiator is used for discharging heat generated by the semiconductor refrigerating sheet to the outside;

the hot end radiator comprises a condensing end, an evaporating end and working fluid circulating between the condensing end and the evaporating end, wherein the evaporating end is used for absorbing heat of the hot end of the semiconductor refrigerating sheet, and the working fluid absorbs heat and changes phase into gas at the evaporating end and flows to the condensing end to dissipate heat and change phase into liquid and then flows back to the evaporating end.

2. The cabinet of claim 1, wherein the heat exchange assembly is located on a side wall and/or a top of the cabinet, the hot side radiator is located on an outer side of the cabinet, the cold side radiator is located inside the cabinet, and the semiconductor refrigeration sheet is embedded in a cabinet plate of the cabinet.

3. The cabinet of claim 2, wherein the panels of the cabinet are insulation and the hot and cold ends of the semiconductor refrigeration panels are thermally isolated by the panels; and the cabinet plate is provided with a mounting through hole, the semiconductor refrigerating sheet is sealed and embedded into the mounting through hole through the heat insulation component, and the hot end radiator and the cold end radiator are connected through the heat insulation connecting piece and clamp the semiconductor refrigerating sheet in the middle.

4. The locker of claim 2, wherein the condensing end is higher than the evaporating end.

5. The cabinet of claim 4, wherein said hot side heat sink is a flat-plate heat pipe of a blown-up type extruded from an aluminum plate, one end being said evaporation end and the other end being said condensation end;

the flat-plate heat pipes are vertically or obliquely arranged so that the condensing end and the evaporating end are arranged up and down.

6. The cabinet of claim 5, wherein a flow path of the hot side heat sink at the evaporation end forms a funnel tapering from the condensation end toward the evaporation end; the flow path of the hot end radiator at the condensing end forms a rectangle or is a funnel-shaped symmetrical with the flow path of the evaporating end.

7. The cabinet of claim 1, wherein the hot side heat sink is provided with hot side heat sink fins at the condensing end.

8. The cabinet of claim 2, wherein the cold end heat sink comprises:

the base plate is used for being attached to the cold end of the semiconductor refrigeration piece;

and the radiating fins are positioned at one end of the base plate far away from the semiconductor refrigerating sheet.

9. The cabinet of claim 8, wherein the heat sink fin surface is coated with a super hydrophilic coating and a water receiving box for collecting liquid on the heat sink fin is provided in the cabinet.

10. The cabinet of claim 9, wherein said heat exchange assembly further comprises a shield covering an outer side of said cold end radiator for shielding said heat fins from said articles, and said shield has a vent passage for passage of gas within said cabinet.

11. The cabinet according to any one of claims 1-10, wherein a heat conductive layer is provided between the hot side heat sink and the hot side of the semiconductor cooling fin and between the cold side heat sink and the cold side of the semiconductor cooling fin.

12. The cabinet according to any one of claims 1-10, further comprising a humidity sensor for detecting the humidity inside the cabinet, wherein the humidity sensor is in signal connection with the semiconductor cooling sheet for controlling the start and stop of the semiconductor cooling sheet.