CN106403356A - Semiconductor refrigeration heat dissipation assembly, assembly method thereof and refrigeration equipment - Google Patents
Semiconductor refrigeration heat dissipation assembly, assembly method thereof and refrigeration equipment Download PDFInfo
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- CN106403356A CN106403356A CN201610882339.8A CN201610882339A CN106403356A CN 106403356 A CN106403356 A CN 106403356A CN 201610882339 A CN201610882339 A CN 201610882339A CN 106403356 A CN106403356 A CN 106403356A
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- radiator
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 114
- 238000005057 refrigeration Methods 0.000 title claims abstract description 100
- 238000000034 method Methods 0.000 title claims abstract description 12
- 230000017525 heat dissipation Effects 0.000 title abstract 3
- 238000009434 installation Methods 0.000 claims abstract description 80
- 238000009413 insulation Methods 0.000 claims abstract description 15
- 238000010276 construction Methods 0.000 claims description 14
- 230000000712 assembly Effects 0.000 claims 2
- 238000000429 assembly Methods 0.000 claims 2
- 230000000694 effects Effects 0.000 abstract description 9
- 238000005516 engineering process Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/003—Details of machines, plants or systems, using electric or magnetic effects by using thermionic electron cooling effects
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/023—Mounting details thereof
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a semiconductor refrigeration heat dissipation assembly, an assembly method thereof and refrigeration equipment, wherein the semiconductor refrigeration heat dissipation assembly comprises the following components: semiconductor refrigeration piece, set up the cold ware that looses of cold junction face side at the semiconductor refrigeration piece and set up the radiator in the hot junction face side of semiconductor refrigeration piece, semiconductor refrigeration radiator unit still includes: the heat insulation installation part is arranged on two sides of the heat insulation installation part at intervals of the cold radiator and the radiator, and the cold radiator and the radiator are respectively connected with the heat insulation installation part. The invention solves the problem of poor refrigeration effect of the refrigeration equipment in the prior art.
Description
Technical field
The present invention relates to semiconductor refrigerating technology field, in particular to a kind of semiconductor refrigeration radiating assembly and its
Assembly method and refrigeration plant.
Background technology
At present, semiconductor refrigeration radiating technology is maturely answered on refrigeration plant, and achieves good refrigeration effect
Really.
The cooler of semiconductor refrigeration radiating assembly is generally fitted with the cold end face of semiconductor chilling plate, thus by semiconductor
Cooling piece produce cold be dispersed in the refrigerating chamber of refrigeration plant, simultaneously the radiator of semiconductor refrigeration radiating assembly with partly lead
Fit in body cooling piece hot junction face, thus the heat in refrigerating chamber is passed through semiconductor chilling plate discharging to environment, therefore, semiconductor
Cooling piece serves the unidirectional delivery effect of heat.
But, the cooler of existing semiconductor refrigeration radiating assembly, semiconductor chilling plate and radiator are by using spiral shell
Screw bolt and nut links together, and screw bolt and nut has heat transmission function, thus screw bolt and nut can form heat passage, so meeting
The heat outside refrigerating chamber is led to transmit into refrigerating chamber by screw bolt and nut, the cold in refrigerating chamber also can pass through bolt simultaneously
Transmit to outside refrigerating chamber with nut, in turn result in scattering and disappearing and reducing the refrigeration of refrigeration plant of cold.
Content of the invention
Present invention is primarily targeted at providing a kind of semiconductor refrigeration radiating assembly and its assembly method and refrigeration plant,
To solve the problems, such as the poor refrigerating efficiency of refrigeration plant of the prior art.
To achieve these goals, according to an aspect of the invention, it is provided a kind of semiconductor refrigeration radiating assembly, wrap
Include：Semiconductor chilling plate, the cooler of cold end surface side being arranged on semiconductor chilling plate and the heat being arranged on semiconductor chilling plate
The radiator of end face side, semiconductor refrigeration radiating assembly also includes：Heat-insulated installation portion, cooler and radiator be disposed on every
The both sides of hot installation portion, and cooler and radiator be connected with heat-insulated installation portion respectively.
Further, heat-insulated installation portion includes：Dividing plate；First attachment structure, the first attachment structure is arranged on dividing plate, dissipates
Cooler is connected with heat-insulated installation portion by the first attachment structure；Second attachment structure, the second attachment structure is arranged on dividing plate, dissipates
Hot device is connected with heat-insulated installation portion by the second attachment structure.
Further, the first attachment structure and the second attachment structure are located at the same side of dividing plate, or the first attachment structure and
Second attachment structure is located at the both sides of dividing plate respectively.
Further, heat-insulated installation portion also includes the central annular bulge-structure being arranged on dividing plate, and central annular is raised
Through hole is offered, semiconductor chilling plate is arranged on through hole so that the cold end face of semiconductor chilling plate and hot junction face are distinguished at structure
Become placed against with cooler and radiator.
Further, heat-insulated installation portion also includes edge ring-type bulge-structure, and edge ring-type bulge-structure is arranged on dividing plate
The outer circumferential side of upper and centrally located annular projection structure.
Further, heat-insulated installation portion also includes cover plate, and cover plate has the avoidance hole being correspondingly arranged with through hole, and cover plate lid sets
In one end away from dividing plate of edge ring-type bulge-structure, and dividing plate, central annular bulge-structure, edge ring-type bulge-structure and
Cover plate surrounds insulated space jointly.
Further, the first attachment structure and the second attachment structure are arranged in insulated space.
Further, the first attachment structure or the second attachment structure are fixedly connected with central annular bulge-structure.
Further, the first attachment structure is multiple, and multiple first attachment structures are around the circumference of central annular bulge-structure
Interval setting, and/or the second attachment structure be multiple, multiple second attachment structures are circumferentially-spaced around central annular bulge-structure
Setting.
Further, the first attachment structure is the first installation projection, and the first installation projection offers the first connecting hole, half
Conductor refrigeration radiating assembly also includes the first connecting bolt assembly and the first attaching nut, and the first attaching nut is fastened on first even
Connect in the hole, the first connecting bolt assembly is passed through cooler and is fastenedly connected with the first attaching nut.
Further, the second attachment structure is the second installation projection, and the second installation projection offers the second connecting hole, half
Conductor refrigeration radiating assembly also includes the second connecting bolt assembly and the second attaching nut, and the second attaching nut is fastened on second even
Connect in the hole, the second connecting bolt assembly is passed through radiator and is fastenedly connected with the second attaching nut.
Further, semiconductor refrigeration radiating assembly also includes insulation construction, and insulation construction is arranged in insulated space.
According to a further aspect in the invention, there is provided a kind of refrigeration plant, including housing and semiconductor refrigeration radiating assembly,
Semiconductor refrigeration radiating assembly is arranged on housing, and semiconductor refrigeration radiating assembly is above-mentioned semiconductor refrigeration radiating assembly.
Further, housing has refrigerating chamber, and the cooler of semiconductor refrigeration radiating assembly is with respect to semiconductor refrigerating
The radiator of radiating subassembly is near the side of refrigerating chamber.
According to a further aspect in the invention, there is provided a kind of assembly method of semiconductor refrigeration radiating assembly, including：Step
One, semiconductor chilling plate is arranged at heat-insulated installation portion；Step 2, cooler is installed to the cold end face of semiconductor chilling plate
Behind side, then radiator is installed to the hot junction face side of semiconductor chilling plate, or radiator is installed to semiconductor chilling plate
Hot junction face side after, then cold end face side cooler being installed to semiconductor chilling plate.
Application technical scheme, by arranging heat-insulated installation portion, and cooler and radiator is disposed on
Cooler and radiator are connected with heat-insulated installation portion by the both sides of heat-insulated installation portion simultaneously respectively.So, can not only be by cold scattering
Device and radiator are respectively installed on heat-insulated installation portion, and the installation improving between cooler, radiator and semiconductor chilling plate is steady
Qualitative, but also be avoided that cooler and radiator directly contact and cause loss of refrigeration capacity, also avoid cold in cold scattering simultaneously
Device is lost with the junction of heat-insulated installation portion with the junction of heat-insulated installation portion or radiator, thus effectively prevent refrigeration setting
Cold in standby refrigerating chamber runs off, and improves the refrigeration of refrigeration plant.
Brief description
The Figure of description constituting the part of the application is used for providing a further understanding of the present invention, and the present invention shows
Meaning property embodiment and its illustrate for explaining the present invention, does not constitute inappropriate limitation of the present invention.In the accompanying drawings：
Fig. 1 shows that a kind of decomposition texture of the semiconductor refrigeration radiating assembly of the alternative embodiment according to the present invention is illustrated
Figure；
Fig. 2 shows the sectional view at the first attachment structure of the semiconductor refrigeration radiating assembly in Fig. 1；
Fig. 3 shows the sectional view at the second attachment structure of the semiconductor refrigeration radiating assembly in Fig. 1.
Wherein, above-mentioned accompanying drawing includes the following drawings mark：
10th, semiconductor chilling plate；20th, cooler；30th, radiator；40th, heat-insulated installation portion；41st, dividing plate；42nd, the first connection
Structure；421st, the first connecting hole；43rd, the second attachment structure；431st, the second connecting hole；44th, central annular bulge-structure；441st, lead to
Hole；45th, edge ring-type bulge-structure；46th, cover plate；461st, avoid hole；47th, insulated space；50th, the first connecting bolt assembly；60、
First attaching nut；70th, the second connecting bolt assembly；80th, the second attaching nut；90th, insulation construction.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation description is it is clear that described embodiment is only a part of embodiment of the present invention, rather than whole embodiments.Below
Description only actually at least one exemplary embodiment is illustrative, and never conduct to the present invention and its application or makes
Any restriction.Based on the embodiment in the present invention, those of ordinary skill in the art are not making creative work premise
Lower obtained every other embodiment, broadly falls into the scope of protection of the invention.
It should be noted that term used herein above is merely to describe specific embodiment, and it is not intended to restricted root
Illustrative embodiments according to the application.As used herein, unless the context clearly indicates otherwise, otherwise singulative
It is also intended to including plural form, additionally, it should be understood that, when in this manual using term "comprising" and/or " bag
Include " when, it indicates existing characteristics, step, operation, device, assembly and/or combinations thereof.
Unless specifically stated otherwise, the part otherwise illustrating in these embodiments and positioned opposite, the digital table of step
Reach formula and numerical value does not limit the scope of the invention.Simultaneously it should be appreciated that for the ease of description, each portion shown in accompanying drawing
The size divided not is to draw according to actual proportionate relationship.For technology, side known to person of ordinary skill in the relevant
Method and equipment may be not discussed in detail, but in the appropriate case, described technology, method and apparatus should be considered to authorize explanation
A part for book.In all examples with discussion shown here, any occurrence should be construed as merely exemplary, and
Not by way of limitation.Therefore, the other examples of exemplary embodiment can have different values.It should be noted that：Similar label
Represent similar terms with letter in following accompanying drawing, therefore, once being defined in a certain Xiang Yi accompanying drawing, then subsequent attached
In figure does not need it is further discussed.
In describing the invention it is to be understood that the noun of locality as " forward and backward, upper and lower, left and right ", " laterally, vertical,
Vertically, the orientation indicated by level " and " top, bottom " etc. or position relationship are normally based on orientation shown in the drawings or position and close
System, is for only for ease of the description present invention and simplifies description, in the case of illustrating on the contrary, these nouns of locality do not indicate that
Must have specific orientation or with specific azimuth configuration and operation with the device of hint indication or element, therefore can not manage
Solve as limiting the scope of the invention；The noun of locality " inside and outside " refers to inside and outside with respect to each part profile of itself.
For the ease of description, space relative terms can be used here, such as " ... on ", " ... top ",
" in ... upper surface ", " above " etc., for describing as a device shown in the figure or feature and other devices or spy
The spatial relation levied.It should be appreciated that space relative terms be intended to comprise except device in figure described by orientation
Outside different azimuth in use or operation.For example, if the device in accompanying drawing is squeezed, it is described as " in other devices
Part or construction above " or " other devices or construction on " device after will be positioned as " other devices or construction under
Side " or " under other devices or construction ".Thus, exemplary term " ... top " can include " ... top " and
" in ... lower section " two kinds of orientation.This device can also position (ratating 90 degrees or be in other orientation) by other different modes, and
And respective explanations are made to space used herein above description relatively.
Furthermore, it is necessary to explanation, limit parts using the word such as " first ", " second ", it is only for be easy to
Corresponding parts are distinguished, such as be there is no Stated otherwise, above-mentioned word does not have particular meaning, therefore it is not intended that to this
The restriction of invention protection domain.
In order to solve the problems, such as the poor refrigerating efficiency of refrigeration plant of the prior art, the invention provides a kind of semiconductor
Refrigeration radiating assembly and its assembly method and refrigeration plant, wherein, refrigeration plant includes housing and above-mentioned semiconductor refrigerating dissipates
Hot assembly, semiconductor refrigeration radiating assembly is arranged on housing, and semiconductor refrigeration radiating assembly is that following semiconductor refrigeratings dissipate
Hot assembly.
In an alternative embodiment (not shown) of the present invention, the housing of refrigeration plant has refrigerating chamber, semiconductor system
The cooler 20 of cold radiating subassembly with respect to semiconductor refrigeration radiating assembly radiator 30 near the side of refrigerating chamber.So energy
Enough ensure that refrigeration plant has optimal refrigeration.
As shown in Figure 1 to Figure 3, semiconductor refrigeration radiating assembly includes：Semiconductor chilling plate 10, it is arranged on semiconductor refrigerating
The cooler 20 of the cold end surface side of piece 10 and the radiator 30 of the hot junction surface side being arranged on semiconductor chilling plate 10, semiconductor refrigerating
Radiating subassembly also includes heat-insulated installation portion 40, and cooler 20 and radiator 30 are disposed on the both sides of heat-insulated installation portion 40, and
Cooler 20 and radiator 30 are connected with heat-insulated installation portion 40 respectively.
By arranging heat-insulated installation portion 40, and cooler 20 and radiator 30 are disposed on the two of heat-insulated installation portion 40
Cooler 20 and radiator 30 are connected with heat-insulated installation portion 40 by side simultaneously respectively.So, by cooler 20 and can not only dissipate
Hot device 30 is respectively installed on heat-insulated installation portion 40, improves the peace between cooler 20, radiator 30 and semiconductor chilling plate 10
Dress stability, but also be avoided that cooler 20 and radiator 30 directly contact and cause loss of refrigeration capacity, also avoid cold simultaneously
Amount is lost with the junction of heat-insulated installation portion 40 with the junction of heat-insulated installation portion 40 or radiator 30 in cooler 20, thus having
Prevent the cold in the refrigerating chamber of refrigeration plant to run off to effect, improve the refrigeration of refrigeration plant.
Alternatively, heat-insulated installation portion 40 is made up of the poor nonmetallic materials of hot property.
As shown in Figure 1 to Figure 3, heat-insulated installation portion 40 includes dividing plate 41, the first attachment structure 42 and the second attachment structure 43；
First attachment structure 42 is arranged on dividing plate 41, and cooler 20 is connected with heat-insulated installation portion 40 by the first attachment structure 42, the
Two attachment structures 43 are arranged on dividing plate 41, and radiator 30 is connected with heat-insulated installation portion 40 by the second attachment structure 43.So,
Cooler 20 and radiator 30 are arranged separately in dividing plate 41 by the first attachment structure 42 and the second attachment structure 43 respectively, it is to avoid
Contact between cooler 20 and radiator 30, also avoid the company that cold passes through cooler 20 and first attachment structure 42 simultaneously
Connect the junction transmission of place and radiator 30 and the first attachment structure 42.
Alternatively, the first attachment structure 42 and the second attachment structure 43 are located at the same side of dividing plate 41, or first connects knot
Structure 42 and the second attachment structure 43 are respectively positioned at the both sides of dividing plate 41.
In the present embodiment, the first attachment structure 42 and the second attachment structure 43 are positioned at the same side of dividing plate 41, so, energy
Enough integral thickness effectively reducing heat-insulated installation portion 40, thus reducing the overall volume of semiconductor refrigeration radiating assembly, and then
Be conducive to the miniaturization of refrigeration plant.
Certainly in one alternative embodiment (not shown) of the present invention, in order to improve the first attachment structure 42 and the further
Two attachment structures 43 and the connective stability of dividing plate 41, the first attachment structure 42 and the second attachment structure 43 are located at dividing plate 41 respectively
Both sides.It should be noted that in order to avoid heat or heat to pass through the first attachment structure 42 and the second attachment structure further
43 transmission, the first attachment structure 42 and the second attachment structure 43 are not coaxially disposed.
As shown in Figure 1 to Figure 3, heat-insulated installation portion 40 also includes the central annular bulge-structure 44 being arranged on dividing plate 41,
Through hole 441 is offered, semiconductor chilling plate 10 is arranged at through hole 441 so that semiconductor refrigerating at central annular bulge-structure 44
The cold end face of piece 10 and hot junction face are become placed against with cooler 20 and radiator 30 respectively.So, cooler 20 by with through hole
Semiconductor chilling plate 10 at 441 contacts so that the heat of cooler 20 side pass through semiconductor chilling plate 10 uniaxially to
Transmit at radiator 30, and scatter and disappear at radiator 30 it is ensured that cooler 20 side keeps enough colds, and then improve
The refrigeration of refrigeration plant.
As shown in Figure 1 to Figure 3, heat-insulated installation portion 40 also includes edge ring-type bulge-structure 45, edge ring-type bulge-structure
45 be arranged on dividing plate 41 and centrally located annular projection structure 44 outer circumferential side.So, edge ring-type bulge-structure 45 plays
The effect heat-insulated to central annular projection structure 44, improve the effect of heat insulation of heat-insulated installation portion 40, it is to avoid heat-insulated installation
There is the exchange of heat or cold at portion 40.
As shown in Figure 1 to Figure 3, heat-insulated installation portion 40 also includes cover plate 46, and cover plate 46 is had and is correspondingly arranged with through hole 441
Avoid hole 461, cover plate 46 lid is located at one end away from dividing plate 41 of edge ring-type bulge-structure 45, and dividing plate 41, central annular
Bulge-structure 44, edge ring-type bulge-structure 45 and cover plate 46 surround insulated space 47 jointly.So, insulated space 47 becomes envelope
Close space, reduce further the heat transfer efficiency of heat-insulated installation portion 40, improve heat-insulated installation portion 40 and heat and cold are completely cut off
Effect it is ensured that the heat of cooler 20 side be only capable of by semiconductor chilling plate 10 to radiator 30 side transmit.
As shown in Figure 1 to Figure 3, in order to make the effect of heat insulation between cooler 20 and radiator 30 further, it is to avoid heat-insulated
The heat of installation portion 40 both sides or cold at semiconductor chilling plate 10 outside part transmission, semiconductor refrigeration radiating assembly is also
Including insulation construction 90, insulation construction 90 is arranged in insulated space 47.
Alternatively, the first attachment structure 42 and the second attachment structure 43 are arranged in insulated space 47.So it is ensured that right
The effectively utilizes of insulated space 47, it is to avoid be separately provided the first attachment structure 42 and the second attachment structure 43 takies extra sky
Between and increase the volume of semiconductor refrigeration radiating assembly, meanwhile, the first attachment structure 42 and the second attachment structure 43 include protecting
In warm structure 90, the heat-blocking action to the first attachment structure 42 and the second attachment structure 43 can be further functioned as.
Alternatively, insulation construction 90 is insulating foam.
Alternatively, the first attachment structure 42 or the second attachment structure 43 are fixedly connected with central annular bulge-structure 44.
As shown in figure 1, in the alternative embodiment of the present invention, the second attachment structure 43 is solid with central annular bulge-structure 44
Fixed connection, which enhances the connective stability between the second attachment structure 43 and dividing plate 41, thus improve radiator 30 pacifying
It is contained in the stability on heat-insulated installation portion 40.
Certainly, the first attachment structure 42 equally can be fixedly connected with central annular bulge-structure 44, thus improve
Connective stability between one attachment structure 42 and dividing plate 41, and then improve cooler 20 and be arranged on heat-insulated installation portion 40
Stability.
It should be noted that in an alternative embodiment (not shown) of the present invention, the first attachment structure 42 and second
Attachment structure 43 is all fixedly connected with central annular bulge-structure 44.
As shown in figure 1, the first attachment structure 42 is multiple, multiple first attachment structures 42 are around central annular bulge-structure 44
Be provided at circumferentially spaced, and/or the second attachment structure 43 is multiple, and multiple second attachment structures 43 are around central annular bulge-structure
44 be provided at circumferentially spaced.So, multiple first attachment structures 42 are provided at circumferentially spaced energy around central annular bulge-structure 44
Enough improve the connective stability between the first attachment structure 42 and cooler 20.Multiple second attachment structures 43 are around central annular
Bulge-structure 44 be provided at circumferentially spaced the connective stability that can improve between the second attachment structure 43 and radiator 30.
Alternatively, in the present embodiment, the first attachment structure 42 is the first installation projection, and the first installation projection offers
First connecting hole 421, semiconductor refrigeration radiating assembly also includes the first connecting bolt assembly 50 and the first attaching nut 60, and first
Attaching nut 60 is fastened in the first connecting hole 421, and the first connecting bolt assembly 50 passes through cooler 20 and is connected spiral shell with first
Female 60 are fastenedly connected.Because the first attaching nut 60 is fastened in the first connecting hole 421, when cooler 20 is connected knot with first
Structure 42 is installed when connecting it is only necessary to inserting the first connecting bolt assembly 50 in first connecting hole 421 and screwing the first connection spiral shell
Bolt assembly 50, is just capable of the first connecting bolt assembly 50 and is stably connected with the first attaching nut 60, thus by cooler
20 are stably installed on heat-insulated installation portion 40, therefore reduce the installation difficulty between cooler 20 and heat-insulated installation portion 40,
Improve the assembling convenience of semiconductor refrigeration radiating assembly.
Alternatively, in the present embodiment, the second attachment structure 43 is the second installation projection, and the second installation projection offers
Second connecting hole 431, semiconductor refrigeration radiating assembly also includes the second connecting bolt assembly 70 and the second attaching nut 80, and second
Attaching nut 80 is fastened in the second connecting hole 431, and the second connecting bolt assembly 70 passes through radiator 30 and is connected spiral shell with second
Female 80 are fastenedly connected.Because the second attaching nut 80 is fastened in the second connecting hole 431, when radiator 30 is connected knot with second
Structure 43 is installed when connecting it is only necessary to inserting the second connecting bolt assembly 70 in second connecting hole 431 and screwing the second connection spiral shell
Bolt assembly 70, is just capable of the second connecting bolt assembly 70 and is stably connected with the second attaching nut 80, thus by radiator
30 are stably installed on heat-insulated installation portion 40, therefore reduce the installation difficulty between radiator 30 and heat-insulated installation portion 40,
Improve the assembling convenience of semiconductor refrigeration radiating assembly.
Certainly, in an alternative embodiment (not shown) of the present invention, in order to reduce semiconductor refrigeration radiating assembly
Processing and manufacturing difficulty.First attachment structure 42 is the first installation projection, and the first installation projection offers the first connecting hole 421,
The internal face of the first connecting hole 421 has the first screw thread, and semiconductor refrigeration radiating assembly also includes the first connecting bolt assembly 50,
First connecting bolt assembly 50 is passed through cooler 20 and is connected with the first installation projection by the first screw thread, the first attachment structure 42
For the second installation projection, the second installation projection offers the second connecting hole 431, the internal face of the second connecting hole 431 has the
Two screw threads, semiconductor refrigeration radiating assembly also includes the second connecting bolt assembly 70, and the second connecting bolt assembly 70 passes through radiating
Device 30 is simultaneously connected with the second installation projection by the second screw thread.
Present invention also offers a kind of assembly method of semiconductor refrigeration radiating assembly, including：Step one, by semiconductor system
It is arranged on for cold 10 at heat-insulated installation portion 40；Step 2, cooler 20 is installed to the cold end face side of semiconductor chilling plate 10
Afterwards, then by radiator 30 it is installed to the hot junction face side of semiconductor chilling plate 10, or radiator 30 is installed to semiconductor refrigerating
Behind the hot junction face side of piece 10, then cold end face side cooler 20 being installed to semiconductor chilling plate 10.So, effectively keep away
Exempt to connect by a connector between cooler 20 and radiator 30 and made the cold of cooler 20 side pass through connector
Spread out of and reduce the refrigerating efficiency of refrigeration plant.
A kind of concrete assembling process of the semiconductor refrigeration radiating assembly of the present invention is that cooler 20 is arranged on dividing plate 41
On, then it is fixed in the first attachment structure 42 using the first connecting bolt assembly 50, the first attachment structure 42 is embedded with
One attaching nut 60, the therefore first connecting bolt assembly 50 can directly be tightened on the first attaching nut 60.Cooler 20 is solid
After being scheduled on dividing plate 41, stick semiconductor chilling plate 10, then insulation construction 90 is arranged in insulated space 47, insulation construction
90 play the hot-fluid effect separating cold and hot end.Then cover cover plate 46, finally by the heat of radiator 30 and semiconductor chilling plate 10
End face is fitted, and using the second connecting bolt assembly 70 and the second attaching nut 80, radiator 30 is fixed on dividing plate 41.
It should be noted that term used herein above is merely to describe specific embodiment, and it is not intended to restricted root
Illustrative embodiments according to the application.As used herein, unless the context clearly indicates otherwise, otherwise singulative
It is also intended to including plural form, additionally, it should be understood that, when in this manual using term "comprising" and/or " bag
Include " when, it indicates existing characteristics, step, work, device, assembly and/or combinations thereof.
It should be noted that term " first " in the description and claims of this application and above-mentioned accompanying drawing, "
Two " it is etc. for distinguishing similar object, without for describing specific order or precedence.It should be appreciated that such use
Data can exchange in the appropriate case, so that presently filed embodiment described herein can be with except illustrating here
Or the order enforcement beyond those of description.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for the skill of this area
For art personnel, the present invention can have various modifications and variations.All within the spirit and principles in the present invention, made any repair
Change, equivalent, improvement etc., should be included within the scope of the present invention.
Claims (15)
1. a kind of semiconductor refrigeration radiating assembly, including：Semiconductor chilling plate (10), it is arranged on described semiconductor chilling plate (10)
The cooler (20) of cold end surface side and be arranged on described semiconductor chilling plate (10) hot junction surface side radiator (30), it is special
Levy and be, described semiconductor refrigeration radiating assembly also includes：
Heat-insulated installation portion (40), described cooler (20) and described radiator (30) are disposed on described heat-insulated installation portion (40)
Both sides, and described cooler (20) and described radiator (30) be connected with described heat-insulated installation portion (40) respectively.
2. semiconductor refrigeration radiating assembly according to claim 1 is it is characterised in that described heat-insulated installation portion (40) wraps
Include：
Dividing plate (41)；
First attachment structure (42), described first attachment structure (42) is arranged on described dividing plate (41), described cooler (20)
It is connected with described heat-insulated installation portion (40) by described first attachment structure (42)；
Second attachment structure (43), described second attachment structure (43) is arranged on described dividing plate (41), described radiator (30)
It is connected with described heat-insulated installation portion (40) by described second attachment structure (43).
3. semiconductor refrigeration radiating assembly according to claim 2 it is characterised in that
Described first attachment structure (42) and described second attachment structure (43) are located at the same side of described dividing plate (41), or
Described first attachment structure (42) and described second attachment structure (43) are respectively positioned at the both sides of described dividing plate (41).
4. semiconductor refrigeration radiating assembly according to claim 2 is it is characterised in that described heat-insulated installation portion (40) also wraps
Include the central annular bulge-structure (44) being arranged on described dividing plate (41), described central annular bulge-structure (44) place offers
Through hole (441), described semiconductor chilling plate (10) is arranged on described through hole (441) place so that described semiconductor chilling plate (10)
Cold end face and hot junction face are become placed against with described cooler (20) and described radiator (30) respectively.
5. semiconductor refrigeration radiating assembly according to claim 4 is it is characterised in that described heat-insulated installation portion (40) also wraps
Include edge ring-type bulge-structure (45), described edge ring-type bulge-structure (45) is arranged on described dividing plate (41) above and is located at described
The outer circumferential side of central annular bulge-structure (44).
6. semiconductor refrigeration radiating assembly according to claim 5 is it is characterised in that described heat-insulated installation portion (40) also wraps
Include cover plate (46), described cover plate (46) has the avoidance hole (461) being correspondingly arranged with described through hole (441), described cover plate (46)
Lid is located at one end away from described dividing plate (41) of described edge ring-type bulge-structure (45), and described dividing plate (41), described in
Centre annular projection structure (44), described edge ring-type bulge-structure (45) and described cover plate (46) surround insulated space jointly
(47).
7. semiconductor refrigeration radiating assembly according to claim 6 it is characterised in that described first attachment structure (42) and
Described second attachment structure (43) is arranged in described insulated space (47).
8. semiconductor refrigeration radiating assembly according to claim 4 it is characterised in that described first attachment structure (42) or
Described second attachment structure (43) is fixedly connected with described central annular bulge-structure (44).
9. semiconductor refrigeration radiating assembly according to claim 4 it is characterised in that
Described first attachment structure (42) is multiple, and multiple described first attachment structures (42) are around described central annular bulge-structure
(44) be provided at circumferentially spaced, and/or
Described second attachment structure (43) is multiple, and multiple described second attachment structures (43) are around described central annular bulge-structure
(44) be provided at circumferentially spaced.
10. the semiconductor refrigeration radiating assembly according to any one of claim 2 to 9 it is characterised in that
Described first attachment structure (42) is the first installation projection, and described first installation projection offers the first connecting hole
(421), described semiconductor refrigeration radiating assembly also includes the first connecting bolt assembly (50) and the first attaching nut (60), described
First attaching nut (60) is fastened in described first connecting hole (421), and described first connecting bolt assembly (50) passes through described
Cooler (20) is simultaneously fastenedly connected with described first attaching nut (60).
11. semiconductor refrigeration radiating assemblies according to claim 10 it is characterised in that
Described second attachment structure (43) is the second installation projection, and described second installation projection offers the second connecting hole
(431), described semiconductor refrigeration radiating assembly also includes the second connecting bolt assembly (70) and the second attaching nut (80), described
Second attaching nut (80) is fastened in described second connecting hole (431), and described second connecting bolt assembly (70) passes through described
Radiator (30) is simultaneously fastenedly connected with described second attaching nut (80).
12. semiconductor refrigeration radiating assemblies according to claim 6 are it is characterised in that described semiconductor refrigeration radiating group
Part also includes insulation construction (90), and described insulation construction (90) is arranged in described insulated space (47).
A kind of 13. refrigeration plants, including housing and semiconductor refrigeration radiating assembly, described semiconductor refrigeration radiating assembly is arranged on
It is characterised in that described semiconductor refrigeration radiating assembly is partly leading any one of claim 1 to 12 on described housing
The cold radiating subassembly of system.
14. refrigeration plants according to claim 13 are it is characterised in that described housing has refrigerating chamber, and described partly lead
The cooler (20) of the cold radiating subassembly of system is with respect to the close described system of the radiator (30) of described semiconductor refrigeration radiating assembly
The side in cold chamber.
A kind of 15. assembly methods of semiconductor refrigeration radiating assembly are it is characterised in that include：
Step one, semiconductor chilling plate (10) is arranged on heat-insulated installation portion (40) place；
Step 2, after cooler (20) being installed to the cold end face side of described semiconductor chilling plate (10), then by radiator
(30) it is installed to the hot junction face side of described semiconductor chilling plate (10), or
After radiator (30) being installed to the hot junction face side of described semiconductor chilling plate (10), then cooler (20) is installed to
The cold end face side of described semiconductor chilling plate (10).
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| CN201610882339.8A CN106403356B (en) | 2016-10-09 | 2016-10-09 | Semiconductor refrigeration heat dissipation assembly, assembly method thereof and refrigeration equipment |
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| CN107906784A (en) * | 2017-12-01 | 2018-04-13 | 浙江九州量子信息技术股份有限公司 | A kind of refrigerating plant based on TEC cooling pieces |
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