CN2783219Y - Thermoelectric refrigerating module - Google Patents

Thermoelectric refrigerating module Download PDF

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Publication number
CN2783219Y
CN2783219Y CNU2004200955758U CN200420095575U CN2783219Y CN 2783219 Y CN2783219 Y CN 2783219Y CN U2004200955758 U CNU2004200955758 U CN U2004200955758U CN 200420095575 U CN200420095575 U CN 200420095575U CN 2783219 Y CN2783219 Y CN 2783219Y
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CN
China
Prior art keywords
radiator
cooler
tec
piece
fin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2004200955758U
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Chinese (zh)
Inventor
温耀生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GUANGDONG FUXIN ELECTRONIC TECHNOLOGY Co Ltd
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Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CNU2004200955758U priority Critical patent/CN2783219Y/en
Priority to ES200750025A priority patent/ES2333192B1/en
Priority to US11/571,355 priority patent/US20080053108A1/en
Priority to GB0702283A priority patent/GB2432048B/en
Priority to PCT/CN2004/001477 priority patent/WO2006056105A1/en
Application granted granted Critical
Publication of CN2783219Y publication Critical patent/CN2783219Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00Machines, plants or systems, using electric or magnetic effects
    • F25B21/02Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00Machines, plants or systems, using electric or magnetic effects
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/023Mounting details thereof
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025Removal of heat
    • F25B2321/0251Removal of heat by a gas

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model relates to a thermoelectric refrigerating module comprising a TEC refrigerating sheet (8), a radiator (16) and a cold dispersion device (18), wherein the top surface of the TEC refrigerating sheet (8) is attached to the bottom surface of a brick body (4) of the cold dispersion device, and the bottom surface of the TEC refrigerating sheet (8) is closely contacted with the radiator (16). The utility model is characterized in that a heat-insulation frame block (7) is positioned between the radiator (16) and the cold dispersion device (18); the brick body (4) of the cold dispersion device (18) and the (TEC) refrigerating sheet (8) are positioned in the heat-insulation frame block (7); the radiator (16) and the cold dispersion device (18) are respectively connected with the heat-insulation frame block (7) through connectors; one end of the cold dispersion device (18), which is provided with a cold aluminium fin, is arranged in an inner frame of a positioning framework (1); the inner frame of the positioning framework (1) is sealed with the cold dispersion device (18) and the heat-insulation frame block (7) through sealing devices; the periphery of the positioning framework (1) is provided with a screw column structure (17). The cold dispersion device (18) of the utility model and the TEC refrigerating sheet are positioned in the heat-insulation frame block, and the refrigerating effect of the refrigerating sheet is good.

Description

The thermoelectric cooling module
Technical field
The utility model relates to a kind of electrothermal refrigeration module, be applicable to refrigeration plant.Belong to refrigeration technology field.
Background technology
The thermoelectric cooling technology is called conductor refrigeration or thermoelectric (al) cooling technology again.It is to utilize the thermoelectric effect of particular semiconductor material to realize refrigeration.Its core is thermoelectric chip (TEC), and TEC size commonly used is 40 * 40 * 5 (wide * long * thick) mm.Thermoelectric module is connected with the mains, and its one side can be absorbed heat, and another side can heat release.Load onto fin at corresponding face, just constituted the thermoelectric cooling module.
When using the thermoelectric cooling chip,, and can not fully efficiently, rationally use TEC often because assembling, structure are improper.The assembling of TEC needs very strong professional knowledge, and is because of its cold and hot surface all is a potsherd, to the smooth smoothness of pressure, contact-making surface, the coupling of cold and hot surface cold scattering coefficient, adiabatic effect etc., all very strict during assembling.Wherein a technology is unreasonable, all can cause the reduction of integrally cooling efficient.Existing refrigeration module is many by thermoelectric cooling sheet, heat radiation aluminium, and aluminium brick and cold scattering aluminum are formed.Heat radiation aluminium is installed on the hot side of TEC, and the huyashi-chuuka (cold chinese-style noodles) of TEC is then installed cold scattering aluminum brick and cold scattering aluminum according to this.The quality of refrigeration structure refrigeration performance except that the radiating effect of thermoelectric performance that is subjected to TEC itself and hot side influences, is influenced by the insulation effect between the TEC cold and hot surface also.Because the spacing between the TEC cold and hot surface has only 4~5MM, and the difference of temperature can reach 40~50 ℃, and is undesirable as insulation effect between the two, then can cause the string temperature between cold and hot surface, the instant heating short circuit.Therefore, refrigeration structure need be provided with the refrigeration heat insulating construction to improve refrigeration performance.And existing thermoelectric cooling heat insulating construction mostly as shown in Figure 1, and adiabatic foaming layer structure is made of hot side plastic housing a21, huyashi-chuuka (cold chinese-style noodles) plastic housing a22 and frothing heat-insulating layer a23, and refrigeration structure just is installed in the structural installing hole of this thermal insulation foaming layer.But, there is following weak point in this kind structure: at first, plastic housing itself forms heat transmission, and huyashi-chuuka (cold chinese-style noodles) plastic housing a22 links to each other with hot side plastic housing a21, contact area between the two reaches 100 square centimeters, and distance also has only about four to five centimetres, and the thermal conductivity factor that plastics are arranged is 0.2, therefore can influence insulation effect, and, because refrigeration structure can be gapped in installing hole, and be full of air in the gap, air also can cause heat transmission; Secondly, because heat radiation aluminium a11 and cold scattering aluminum a12 directly are fixed on the screw thread of cold scattering aluminum brick a14 by fixed screw a13, and only intercept between fixed screw a13 and heat radiation aluminium a11, the cold scattering aluminum a12 by pad a16, therefore, fixed screw a13 can become heat-conduction medium, causes the energy offset between the TECa1 cold and hot surface; Once more, because only posting sponge a15 on the composition surface of cold scattering aluminum a12 and huyashi-chuuka (cold chinese-style noodles) plastic housing a22 seals, when huyashi-chuuka (cold chinese-style noodles) is worked, having condensed water penetrates into sponge a15 and flows in the slit of cold scattering aluminum brick a12, caused cold and hot end to conduct heat by water, cancelling out each other of cold and hot energy, integrally cooling performance decrease have also been caused indirectly.Have the deficiency of the heat insulating construction of refrigeration module now, influenced the refrigeration of refrigeration module greatly.
The utility model content
The utility model technical issues that need to address, promptly the purpose of this utility model is for a kind of thermoelectric cooling module is provided, the structure of this thermoelectric cooling module can improve the refrigeration of refrigeration module.
Technical problem of the present utility model can solve by taking following measure: the thermoelectric cooling module, comprise TEC cooling piece, radiator, cooler, the end face of TEC cooling piece is attached to the bottom surface of cooler brick body, the bottom surface of TEC cooling piece closely contacts with radiator, its design feature is: an adiabatic frame piece is between radiator and cooler, and the brick body of cooler is positioned at adiabatic frame piece together with cooling piece; Radiator, cooler are connected with adiabatic frame piece with connector respectively; An end of establishing cold aluminium fin of described cooler places in the inside casing of a location framework, uses between the inside casing of described positioning framework and cooler, the adiabatic frame piece by the sealing device sealing, is provided with the screw column structure around the positioning framework.
The utility model technical solution problem, can also take following measure:
Be injected with threaded structural plastic guide pillar in the described adiabatic frame piece, radiator is that screw connects with the connected mode that cooler is connected with adiabatic frame piece respectively, radiator is connected with described helicitic texture with screw respectively with cooler, is provided with the plastic mattress cap between screw and radiator and cooler.
Described sealing device is made up of soft silicone rubber O-ring and plastic frame, and the top of plastic frame is provided with groove, and soft silicone rubber O-ring is embedded in the groove.
Described radiator is made up of pedestal and some fin, and pedestal is provided with the groove of some mutual balances; The root of described fin inserts respectively in separately the groove, and its root and pedestal are fixed together.
Described radiator comprises that also a cross section is the wind deflector of U type, and preceding described fin top places in the U type wind deflector, forms some heat dissipation wind channels between U type wind deflector, pedestal, fin three.
The utlity model has following outstanding effect:
1, because the brick body of the utility model cooler is positioned at adiabatic frame piece together with the TEC cooling piece, adiabatic frame piece can only carry out the hot and cold heat transmission in the face of the external world of TEC cooling piece by the brick body and the radiator of cooler.Adiabatic frame has certain height, the heat of hot and cold of TEC cooling piece is delivered in the quite long distance hot short circuit can take place, thereby improve TEC cooling piece refrigeration.
2, owing to radiator of the present utility model, cooler are connected with adiabatic frame piece with connector respectively, and adiabatic frame piece has heat insulating function, can avoid the connector that is connected with cooler of the prior art, with connector that radiator is connected between direct or indirect heat transmission, also improve the efficient of TEC cooling piece refrigerating function, helped improving the refrigeration of refrigeration module.
3, owing to use by sealing device between the inside casing of positioning framework of the present utility model and cooler, the adiabatic frame piece and seal, sealing device can play the effect that prevents the condensed water infiltration, prevented to transmit heat by water between cooler and the radiator, also helped improving the refrigeration of refrigeration module.
4, because the pedestal of radiator of the present utility model is provided with the groove of some mutual balances; The root of described fin inserts respectively in separately the groove, and its root and pedestal are fixed together.This of fin kind of fixed form makes fin can make very thinly, makes more fin one increase area of dissipation can be set on the pedestal, thereby can improve the radiating efficiency of radiator.
5, the coupling of the utility model and various products is flexible, installs simple.When the utility model is installed, only need on the application product to reserve corresponding filling installing port, positioning framework is fixed on the application product, promptly can finish installation process.And the requirement of size is very loose when installing, and is fit to streamline production model in enormous quantities.
Description of drawings
Fig. 1 is the structural representation of prior art refrigeration module.
Fig. 2 is the utility model specific embodiment structural section figure.
Fig. 3 is the structure enlarged drawing at the utility model specific embodiment sealing device place.
Fig. 4 is that the utility model specific embodiment part is installed exploded view.
The specific embodiment
Below in conjunction with specific embodiment the utility model is specifically described.
Specific embodiment:
Fig. 2, Fig. 3 and Fig. 4 constitute a specific embodiment of the present utility model.As can be seen from Figure 2, present embodiment is made up of TEC cooling piece 8, radiator 16, cold scattering 18, and the end face of TEC cooling piece 8 is attached to the bottom surface of cooler brick body 4, and the bottom surface of cooling piece 8 closely contacts with cooler 18.Described radiator 17 is that the wind deflector 13 of U type is formed by pedestal 10 and some fin 15, cross section, and pedestal 10 is provided with the groove 19 of some mutual balances; The root of described fin 15 inserts respectively in separately the groove, and its root and pedestal 10 are fixed together.Fin 15 tops place in the U type wind deflector 13, and U type wind deflector 13, pedestal 10, fin 15 threes form some heat dissipation wind channels.When radiator fan was installed, fan can be installed in an end of heat dissipation wind channel.
From Fig. 2, figure, 4 as can be known, an adiabatic frame piece 7 is between radiator 16 and cooler 18, and the brick body 4 of cooler 18 is positioned at adiabatic frame piece 7 together with TEC cooling piece 8.Radiator 16, cooler 18 are connected with adiabatic frame piece 7 with connector respectively.Be injected with the plastics guide pillar 9 of threaded structure 14 in the preceding described adiabatic frame piece 7, radiator 16 is that screw connects with the connected mode that cooler 18 is connected with adiabatic frame piece 7 respectively, radiator 16 is connected with described helicitic texture 14 with screw respectively with cooler 18,18 of screw 2 and radiator 16 and coolers are provided with plastic mattress cap 3, and 18 of screw 12 and coolers are provided with plastic mattress cap 11.An end of establishing cold aluminium fin of described cooler 18 places in the inside casing of a location framework 1, uses by sealing device between the inside casing of described positioning framework 1 and cooler, the adiabatic frame piece to seal.Sealing device is made up of soft silicone rubber O-ring 6 and plastic frame 7, and the top of plastic frame 7 is provided with groove, and soft silicone rubber O-ring 6 is embedded in the groove.The inside casing of positioning framework 1 is being pressed soft silicone rubber O-ring 6.Be provided with screw column structure 17 around the positioning framework 1.Screw column structure 17 is used for the utility model is fixed on application product.
The refrigeration module of prior art is applied in volume when being the 30L product, and the about temperature difference is generally less than 20 degrees centigrade, and above specific embodiment of the present utility model is applied in volume when being the 30L product, and the about temperature difference can reach 32 degrees centigrade.

Claims (5)

1, thermoelectric cooling module, comprise TEC cooling piece (8), radiator (16), cooler (18), the end face of TEC cooling piece (8) is attached to the bottom surface of cooler brick body (4), the bottom surface of TEC cooling piece (8) closely contacts with radiator (16), it is characterized in that: an adiabatic frame piece (7) is positioned between radiator (16) and the cooler (18), and the brick body (4) of cooler (18) is positioned at adiabatic frame piece (7) together with (TEC) cooling piece (8); Radiator (16), cooler (18) use connector to be connected with adiabatic frame piece (7) respectively; An end of establishing cold aluminium fin of described cooler (18) places in the inside casing of a location framework (1), use between the inside casing of described positioning framework (1) and cooler (18), the adiabatic frame piece (7) by the sealing device sealing, be provided with screw column structure (17) around the positioning framework (1).
2, thermoelectric cooling module according to claim 1, it is characterized in that: the plastics guide pillar (9) that is injected with threaded structure (14) in the described adiabatic frame piece (7), radiator (16) is that screw connects with the connected mode that cooler (18) is connected with adiabatic frame piece (7) respectively, radiator (16) uses screw to be connected with described helicitic texture (14) respectively with cooler (18), is provided with plastic mattress cap (3) (11) between screw and radiator (16) and cooler (18).
3, thermoelectric cooling module according to claim 1 and 2 is characterized in that: described sealing device is made up of soft silicone rubber O-ring (5) and plastic frame (6), and the top of plastic frame (6) is provided with groove, and soft silicone rubber O-ring (5) is embedded in the groove.
4, thermoelectric cooling module according to claim 3 is characterized in that: described radiator is made up of pedestal (10) and some fin (15), and pedestal (10) is provided with the groove (19) of some mutual balances; The root of described fin (15) inserts respectively in separately the groove (19), and its root and pedestal (10) are fixed together.
5, thermoelectric cooling module according to claim 4, it is characterized in that: described radiator (16) comprises that also a cross section is the wind deflector (13) of U type, preceding described fin (15) top places in the U type wind deflector (13), forms some heat dissipation wind channels between U type wind deflector (13), pedestal (10), fin (15) three.
CNU2004200955758U 2004-11-24 2004-11-24 Thermoelectric refrigerating module Expired - Fee Related CN2783219Y (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CNU2004200955758U CN2783219Y (en) 2004-11-24 2004-11-24 Thermoelectric refrigerating module
ES200750025A ES2333192B1 (en) 2004-11-24 2004-12-20 THERMOELECTRIC REFRIGERATION MODULES.
US11/571,355 US20080053108A1 (en) 2004-11-24 2004-12-20 Thermoelectric Refrigerating Modules
GB0702283A GB2432048B (en) 2004-11-24 2004-12-20 Thermoelectric refrigerating modules
PCT/CN2004/001477 WO2006056105A1 (en) 2004-11-24 2004-12-20 Thermoelectric refrigerating module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2004200955758U CN2783219Y (en) 2004-11-24 2004-11-24 Thermoelectric refrigerating module

Publications (1)

Publication Number Publication Date
CN2783219Y true CN2783219Y (en) 2006-05-24

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CNU2004200955758U Expired - Fee Related CN2783219Y (en) 2004-11-24 2004-11-24 Thermoelectric refrigerating module

Country Status (5)

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US (1) US20080053108A1 (en)
CN (1) CN2783219Y (en)
ES (1) ES2333192B1 (en)
GB (1) GB2432048B (en)
WO (1) WO2006056105A1 (en)

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CN106403356A (en) * 2016-10-09 2017-02-15 珠海格力电器股份有限公司 Semiconductor refrigeration heat dissipation assembly, assembly method thereof and refrigeration equipment
CN108679877A (en) * 2017-04-28 2018-10-19 青岛海尔特种电冰柜有限公司 Solid-state refrigerating plant
CN108983537A (en) * 2017-05-31 2018-12-11 深圳市光峰光电技术有限公司 Heat exchanger and projection device

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7587901B2 (en) 2004-12-20 2009-09-15 Amerigon Incorporated Control system for thermal module in vehicle
US8222511B2 (en) * 2006-08-03 2012-07-17 Gentherm Thermoelectric device
US20080087316A1 (en) 2006-10-12 2008-04-17 Masa Inaba Thermoelectric device with internal sensor
US9105809B2 (en) * 2007-07-23 2015-08-11 Gentherm Incorporated Segmented thermoelectric device
US7877827B2 (en) 2007-09-10 2011-02-01 Amerigon Incorporated Operational control schemes for ventilated seat or bed assemblies
EP3121060A1 (en) 2008-02-01 2017-01-25 Gentherm Incorporated Condensation and humidity sensors for thermoelectric devices
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US9685599B2 (en) 2011-10-07 2017-06-20 Gentherm Incorporated Method and system for controlling an operation of a thermoelectric device
US9989267B2 (en) 2012-02-10 2018-06-05 Gentherm Incorporated Moisture abatement in heating operation of climate controlled systems
US9662962B2 (en) 2013-11-05 2017-05-30 Gentherm Incorporated Vehicle headliner assembly for zonal comfort
KR102051617B1 (en) 2014-02-14 2019-12-03 젠썸 인코포레이티드 Conductive convective climate controlled seat
US11857004B2 (en) 2014-11-14 2024-01-02 Gentherm Incorporated Heating and cooling technologies
US11639816B2 (en) 2014-11-14 2023-05-02 Gentherm Incorporated Heating and cooling technologies including temperature regulating pad wrap and technologies with liquid system
WO2016077843A1 (en) 2014-11-14 2016-05-19 Cauchy Charles J Heating and cooling technologies
JP6527250B2 (en) 2015-06-10 2019-06-05 ジェンサーム インコーポレイテッドGentherm Incorporated Low temperature plate assembly integrated vehicle battery thermoelectric element and method of assembling thermoelectric element
KR102311397B1 (en) * 2017-04-03 2021-10-13 엘지전자 주식회사 A Refrigerator
CN108551753A (en) * 2018-06-19 2018-09-18 广州开能电气实业有限公司 A kind of totally-enclosed Power Quality Comprehensive Treatment Device
US10991869B2 (en) 2018-07-30 2021-04-27 Gentherm Incorporated Thermoelectric device having a plurality of sealing materials
CN109168302B (en) * 2018-10-23 2024-04-09 歌尔科技有限公司 Wearable equipment
CN113167510A (en) 2018-11-30 2021-07-23 金瑟姆股份公司 Thermoelectric conditioning system and method
US11152557B2 (en) 2019-02-20 2021-10-19 Gentherm Incorporated Thermoelectric module with integrated printed circuit board
CN112506320A (en) * 2020-12-10 2021-03-16 浪潮电子信息产业股份有限公司 Anti-scouring immersed liquid cooling device for heat dissipation paste and server
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Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3654528A (en) * 1970-08-03 1972-04-04 Gen Electric Cooling scheme for a high-current semiconductor device employing electromagnetically-pumped liquid metal for heat and current transfer
US4065936A (en) * 1976-06-16 1978-01-03 Borg-Warner Corporation Counter-flow thermoelectric heat pump with discrete sections
US4782664A (en) * 1987-09-16 1988-11-08 Allied Products Corporation Thermoelectric heat exchanger
DE29602367U1 (en) * 1995-03-24 1996-05-15 Alusuisse-Lonza Services AG, Neuhausen am Rheinfall Heat sink for semiconductor components or the like.
US5621614A (en) * 1995-08-24 1997-04-15 Lucasey Manufacturing Company Apparatus for mounting and enclosing an appliance
US5640852A (en) * 1995-10-06 1997-06-24 Atlas; Boris Compact thermal electric heat exchanger
US5784890A (en) * 1996-06-03 1998-07-28 Polkinghorne; John D. Compact thermoelectric refrigeration drive assembly
JP2000124510A (en) * 1998-10-19 2000-04-28 Nissan Motor Co Ltd Electronic cooling module
CN2364407Y (en) * 1999-04-08 2000-02-16 黄宝林 Vacuum thermoelectric refrigerator
DE10017169B4 (en) * 1999-09-03 2006-01-19 Webasto Ag Cover of a vehicle roof with plastic frame and edge gap seal and method for producing such a lid
US6499852B1 (en) * 1999-09-07 2002-12-31 Toyoda Gosei Co., Ltd. Vehicle display lighting device
US6345507B1 (en) * 2000-09-29 2002-02-12 Electrografics International Corporation Compact thermoelectric cooling system
CN2506937Y (en) * 2001-11-07 2002-08-21 程斌 Modularized thermoelectric refrigeration unit
JP2004347137A (en) * 2003-05-19 2004-12-09 Keyence Corp Peltier element fixing method and its cooling device, as well as laser oscillator

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CN106403356A (en) * 2016-10-09 2017-02-15 珠海格力电器股份有限公司 Semiconductor refrigeration heat dissipation assembly, assembly method thereof and refrigeration equipment
CN106403356B (en) * 2016-10-09 2022-08-02 珠海格力电器股份有限公司 Semiconductor refrigeration heat dissipation assembly, assembly method thereof and refrigeration equipment
CN108679877A (en) * 2017-04-28 2018-10-19 青岛海尔特种电冰柜有限公司 Solid-state refrigerating plant
CN108709335A (en) * 2017-04-28 2018-10-26 青岛海尔特种电冰柜有限公司 Semiconductor cooling device
CN108731298A (en) * 2017-04-28 2018-11-02 青岛海尔特种电冰柜有限公司 Solid-state refrigeration equipment
CN108917256A (en) * 2017-04-28 2018-11-30 青岛海尔特种电冰柜有限公司 Semiconductor refrigerating equipment
CN108709335B (en) * 2017-04-28 2022-03-22 青岛海尔特种电冰柜有限公司 Semiconductor refrigerating device
CN108679877B (en) * 2017-04-28 2022-03-22 青岛海尔特种电冰柜有限公司 Solid-state refrigerating device
CN108731298B (en) * 2017-04-28 2022-03-22 青岛海尔特种电冰柜有限公司 Solid-state refrigeration equipment
CN108983537A (en) * 2017-05-31 2018-12-11 深圳市光峰光电技术有限公司 Heat exchanger and projection device

Also Published As

Publication number Publication date
ES2333192B1 (en) 2011-03-10
GB2432048A (en) 2007-05-09
US20080053108A1 (en) 2008-03-06
GB0702283D0 (en) 2007-03-14
ES2333192A1 (en) 2010-02-17
GB2432048B (en) 2010-11-03
WO2006056105A1 (en) 2006-06-01

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