CN108983537A - Heat exchanger and projection device - Google Patents
Heat exchanger and projection device Download PDFInfo
- Publication number
- CN108983537A CN108983537A CN201710400867.XA CN201710400867A CN108983537A CN 108983537 A CN108983537 A CN 108983537A CN 201710400867 A CN201710400867 A CN 201710400867A CN 108983537 A CN108983537 A CN 108983537A
- Authority
- CN
- China
- Prior art keywords
- heat
- tec
- heat exchanger
- connector
- stage portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 235000012149 noodles Nutrition 0.000 claims abstract description 16
- 238000005057 refrigeration Methods 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 7
- 238000009413 insulation Methods 0.000 claims description 6
- 239000000565 sealant Substances 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/16—Cooling; Preventing overheating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
Abstract
The present invention provides a kind of heat exchanger and the projection device using the heat exchanger, stage portion is provided on heat exchanger, stage portion supports the TEC chip in the side of TEC chip, and it is arranged with heat source and/or radiator interval, so that stage portion does not contact simultaneously with the huyashi-chuuka (cold chinese-style noodles) of TEC chip and hot face, it is possible to prevente effectively from the short circuit phenomenon of TEC cold and hot surface, improves the refrigerating efficiency of TEC.The input power of same refrigeration effect, TEC is lower, and for the heat that the hot face TEC generates with regard to less, the thermic load dissipated needed for system is also just less, can play energy-saving effect.
Description
Technical field
The present invention relates to optics technical field of heat dissipation, and in particular to a kind of heat exchanger and the projection comprising the heat exchanger are set
It is standby.
Background technique
Many optical devices such as red laser, digital micromirror device (Digital Micromirror Device, DMD) are in work
Very high to radiating condition requirement when making, substrate temperature is due to needing to realize heat dissipation, substrate temperature lower than environment temperature
Sometimes it may require that and maintain 20 DEG C or so, when design of heat exchanger needs using semiconductor cooler (Thermal Energy
Converter, TEC).At this point, entire heat radiation module is using TEC as boundary, be divided into two parts: contacting with TEC huyashi-chuuka (cold chinese-style noodles) is low temperature
Component is then high-temperature component with the hot face contact of TEC, when heat dissipation design must as far as possible low-temperature components and high-temperature component every
Leave and, cannot cold and hot short circuit, such TEC could efficient work.Meanwhile two supply lines of TEC need in the prior art
Want internal extraction, it is necessary to design sufficiently large cable-through hole, can just supply lines be made to draw, and after supply lines is pierced by, cable-through hole with
It can be had the gap between supply lines, the hot-air of surrounding can penetrate into inside it, since the substrate temperature of these components is lower than surrounding
Environment temperature, when air humidity is larger, module internal may can generate condensed water, condensed water can damage these devices and
TEC, so carrying out the sealing condensation-proof design of mould group is just particularly important.
Therefore, it is really necessary to provide one kind new heat exchanger and projection device to solve the above problems.
Summary of the invention
The invention mainly solves the technical problem of providing a kind of heat exchanger and projection devices, to solve to change in the prior art
Short circuit problem between the hot cold and hot component of device, while good sealing and dustproof and condensation-proof ability can be possessed again.
In order to solve the above technical problems, one technical scheme adopted by the invention is that: a kind of heat exchanger is provided, including is had
The shell of accommodating space, the company for being housed in the intracorporal heat source of shell, refrigeration module and the connection refrigeration module and the shell
Fitting, the refrigeration module include heat sink and the TEC chip for realizing heat transfer, TEC chip one end with it is described
Heat sink is connected, and the other end is connected with the heat source, and described connector one end is connected with shell, and one end is supported with heat sink,
The connector is provided with the stage portion extended towards TEC chip direction, and the stage portion supports the TEC chip, and
It is arranged with the heat source and/or heat sink interval.
Preferably, the connector is extended to form close to the side of the heat sink towards TEC chip direction described
Stage portion, the stage portion supports the TEC chip in the side close to the heat sink, and is arranged with the heat source interval.
Preferably, the connector extends to form described towards TEC chip direction close to the side of the heat source
Rank portion, the stage portion supports the TEC chip in the side close to the heat source, and is arranged with the heat sink interval.
Preferably, the connector extends to form the stage portion towards TEC chip direction, and the stage portion supports
The center of the TEC chip, and setting is spaced with the heat source and heat sink.
Preferably, the TEC chip includes the hot face being oppositely arranged and huyashi-chuuka (cold chinese-style noodles), and the huyashi-chuuka (cold chinese-style noodles) is supported with the heat source, institute
It states hot face to support with the heat sink, is provided with heat-conducting interface material between the heat sink and the hot face of the TEC chip.
Preferably, the heat sink is cold plate, and the heat source is the light source for being housed in the accommodating space, and the light source falls
It sets and is suspended on the connector.
Preferably, the stud of protrusion is provided on the connector, the light source is fixed on the spiral shell using stepped screw
On column, the stepped screw includes the first screw rod and from first screw rod the second screw rod outstanding, second screw rod it is straight
Diameter is less than the diameter of first screw rod, and the screw thread of the stepped screw is arranged on second screw rod.
Preferably, heat-insulating washer is provided between the stepped screw and the stud, the heat-insulating washer is around described
Second screw rod simultaneously offsets with first screw rod.
Preferably, heat-insulation chamber is collectively formed in the connector and the shell, and the heat exchanger includes being located in heat-insulation chamber
Portion is used to be electrically connected the first pcb board, the second pcb board and connection first pcb board and the institute of the TEC chip and external power supply
State the adapter of the second pcb board.
Preferably, it is provided with the sealant layer of hot setting at the installation gap of the adapter and the connector, states
Sealing ring is provided between shell and the connector.
In order to solve the above technical problems, the present invention also provides a technical solutions to be: providing a kind of projection device comprising
Heat exchanger as described above.
The beneficial effects of the present invention are: be in contrast to the prior art, the present invention provides a kind of heat exchanger, on heat exchanger
It is provided with stage portion, stage portion supports the TEC chip in the side by TEC chip, and sets with heat source and/or radiator interval
It sets, so that stage portion does not contact simultaneously in the huyashi-chuuka (cold chinese-style noodles) of TEC chip and hot face, it is possible to prevente effectively from the short circuit of TEC cold and hot surface
Phenomenon improves the refrigerating efficiency of TEC, has good user experience.
Detailed description of the invention
Fig. 1 is the decomposition texture schematic diagram of present invention heat exchanger；
Fig. 2 is the cross-sectional view of present invention heat exchanger；
Fig. 3 is the cross-sectional view of another angle of present invention heat exchanger；
Fig. 4 is the structural schematic diagram of present invention heat exchanger conductive component.
Specific embodiment
It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not intended to limit the present invention.
The present invention provides a kind of heat exchanger and the projection device using the heat exchanger, cold to solve heat exchanger in the prior art
Short circuit problem between thermal part, while good sealing and dustproof and condensation-proof ability can be possessed again.
Embodiment one
As depicted in figs. 1 and 2, present invention heat exchanger includes shell 1, heat source 2, connector 3, refrigeration module 4 and conductive component 5.
Shell 1 has accommodating space, and connector 3 is for connecting shell 1 and refrigeration module 4, so that refrigeration module 4 is fixed on
On shell 1.Heat-insulation chamber is collectively formed in connector 3 and shell 1, and heat source 2 is housed in heat-insulation chamber and supports with the refrigeration module 4
To be exchanged heat by refrigeration module 4 with the external world.
In the present embodiment, shell 1 includes that the hollow metal cover board 11 in top and lid connect in the hollow of metal cover board 11
The glass cover-plate 12 at position.It can also be copper in selectable other embodiments that metal cover board 11, which is Aluminum cover, wherein
The cover board of the other materials such as cover board or stainless steel.
Heat source 2 is in the present embodiment light source, and the light source hang upside down is on connector 3.In other selectable realities
It applies in mode, it can also be in heat source to be on the bigger component of the calorific values such as dmd chip.
Connector 3 is in the present embodiment aluminium material, can also be copper, no in selectable other embodiments
Become rusty steel, PU(polyurethane) etc. materials.
Refrigeration module 4 includes realizing the TEC chip 401 of heat transfer and playing heat spreading function heat sink 402, TEC chip
401 one end and heat sink 402 support, and the other end is supported with heat source 2.In the present embodiment, heat sink 402 is cold plate, can
In the other embodiments of selection, or other radiators.Preferably, the hot face of heat sink 402 and TEC chip 401 it
Between be provided with promote heat transfer heat-conducting interface material.
As shown in Fig. 2, TEC chip 401 is in the case where energization, heat can be from the one of TEC chip 401 facing towards another side
Transmission, to form the hot face 4011 being oppositely arranged and huyashi-chuuka (cold chinese-style noodles) 4012.In the present embodiment, huyashi-chuuka (cold chinese-style noodles) 4012 is set towards heat source 2
It sets, to absorb the heat of the generation of heat source 2 and be transmitted to hot face；Hot face 4011 is arranged towards heat sink 402, to receive huyashi-chuuka (cold chinese-style noodles)
The heat of 4012 transmission is simultaneously dispersed into external environment by heat sink 402, and then forms the heat dissipation channel for being directed to heat source 2.?
In present embodiment, sealing ring 6 is additionally provided between connector 3 and shell 1 and connector 3 and refrigeration module 4, to exchange heat
The environment of opposing seal is formed inside device to prevent extraneous gas from entering in the internal performance for condensing into steam and influencing product.
3 one end of connector is connected with shell 1, and one end is supported with heat sink 402, is provided in the side close to heat sink 2
The stage portion 31 extended towards 401 direction of TEC chip, stage portion 31 support the TEC in the side close to the heat sink 402
Chip 401, and be arranged with the heat source interval, to be accurately positioned the position of TEC chip 401.Specifically, the stage portion 31
The TEC chip 401 is supported in the position in the hot face 4011 of the TEC chip 401, and the thickness of stage portion 31 is less than TEC core
The thickness of piece 401 is arranged in this way, allowing for stage portion 31 and the interval of huyashi-chuuka (cold chinese-style noodles) 4012 of the connector 3 for fixing TEC chip 401,
It will not be contacted with huyashi-chuuka (cold chinese-style noodles) 4012, to avoid cold and hot component short circuit.In addition, the huyashi-chuuka (cold chinese-style noodles) 4012 of TEC chip 401 and hot face 4011 it
Between further have heat-barrier material and sealant, avoid from around TEC chip occur cold and hot surface short circuit.
Referring to shown in Fig. 3, the stud 32 towards 2 protrusion setting of heat source is provided on connector 3, heat source 2 uses step spiral shell
Nail 7 is fixed on stud 32.Wherein stepped screw 7 includes the first screw rod 71 and from second screw rod 72 outstanding of the first screw rod 71,
Wherein the diameter of the first screw rod 71 is greater than the diameter of the second screw rod 72.In the present embodiment, only it is arranged on the second screw rod 72
There are screw thread, specially external screw thread, the first screw rod 71 is inserted into the screw hole on heat source 2 for realizing the fixation with heat source 2, the second screw rod
In 72 insertion studs 32, and the fixation with screw-internal thread fit realization heat source 2 and connector 3 inside stud.Outside first screw rod 71
Side is also arranged with spring 8, for guaranteeing fixed reliability, stepped screw is prevented to be embossed TEC chip.
Further, heat-insulating washer 9 is provided between stepped screw 7 and stud 32, which uses rubber or modeling
Material or other heat-barrier materials be made, around the second screw rod 72 simultaneously offset with the top surface of the first screw rod 71, in this way can more into
The contact area of the reduction stepped screw 7 and heat source 2 of one step, effectively obstructs thermally conductive between cold and hot component, and can effectively lock
Light source and be unlikely to damage TEC chip by pressure.
In addition, 2 outer dimension of heat source of present invention heat exchanger is smaller than 3 outline border of connector, can be stopped between enough air in this way
Away from partition light source is thermally conductive with adapter outline border.
As described in Figure 4, conductive component 5 includes the first pcb board 501, the second pcb board 503 and connection first pcb board
501 and second pcb board 503 adapter 502.Specifically, inside heat-insulation chamber, the power supply wire bonding of TEC chip 401 and heat source 2
It connects on the first pcb board 501, by adapter 502 first pcb board 501 and the second pcb board 503 is welded one by one respectively and are connected,
One layer of sealant layer finally is set using sealant hot setting at the installation gap of adapter 502 and connector 3, while
Sealant hot setting is used at other installation gaps of heat exchanger, such cavity 16 can obstruct the disengaging of air completely,
Reach dust-proof well and condensation-proof effect.
Embodiment two
Present embodiment is substantially the same with the first embodiment, and difference is only that, in the present embodiment, stage portion is formed in
Connector is arranged close to the side of heat source, and with the heat sink interval.Specifically, the connector close to the heat source one
Side extends to form the stage portion towards TEC chip direction, and the stage portion supports institute in the side close to the heat source
TEC chip is stated, and is arranged with the heat sink interval.
Preferably, the stage portion supports the TEC chip in the position of the TEC chip huyashi-chuuka (cold chinese-style noodles), and stage portion
Thickness is less than the thickness of TEC chip, in this way, allowing for connector for fixing the stage portion of TEC chip and the hot face of TEC chip
Interval setting, will not be with hot face contact, to avoid cold and hot component short circuit.
Embodiment three
Present embodiment is substantially the same with the first embodiment, and difference is only that, in the present embodiment, stage portion is formed in
On the connector, and setting is spaced with the heat source and heat sink.Specifically, the connector is towards the TEC chip
Direction extends to form the stage portion, and the stage portion supports the TEC chip, and is spaced and sets with the heat source and heat sink
It sets.Since the thickness of the stage portion is less than the thickness of TEC chip, in this way, allowing for connector for fixing the platform of TEC chip
The hot face and huyashi-chuuka (cold chinese-style noodles) of rank portion and TEC chip are spaced setting, will not contact with hot face and huyashi-chuuka (cold chinese-style noodles), to avoid cold and hot component short
Road.
Preferably, the stage portion is formed on the connector, and supports the medium position of the TEC chip.
The beneficial effects of the present invention are: be in contrast to the prior art, the present invention provides a kind of heat exchanger, on heat exchanger
It is provided with stage portion, stage portion supports the TEC chip in the side of TEC chip, and the thickness of stage portion is less than TEC chip two
The distance between end face, it is possible to prevente effectively from the short circuit phenomenon of TEC cold and hot surface, improves the refrigerating efficiency of TEC.Same refrigeration effect
The input power of fruit, TEC is lower, and for the heat that the hot face TEC generates with regard to less, the thermic load dissipated needed for system is also just less,
Energy-saving effect can be played.The present invention can accomplish sealing and dustproof and condensation-proof again simultaneously, can be in the severe of more high humidity at higher temperature
It is run in environment, application surface is very extensive, has good user experience.
The above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair
Equivalent structure or equivalent flow shift made by bright specification and accompanying drawing content is applied directly or indirectly in other relevant skills
Art field, is included within the scope of the present invention.
Claims (11)
1. a kind of heat exchanger, including with accommodating space shell, be housed in the intracorporal heat source of shell, refrigeration module and connection institute
State the connector of refrigeration module Yu the shell, which is characterized in that the refrigeration module includes heat sink and for realizing heat
The TEC chip of transmitting, TEC chip one end are supported with the heat sink, and the other end is supported with the heat source, the connector
One end is connected with shell, and one end is supported with heat sink, and the connector is provided with the step extended towards TEC chip direction
Portion, the stage portion supports the TEC chip, and is arranged with the heat source and/or heat sink interval.
2. heat exchanger according to claim 1, which is characterized in that side direction of the connector close to the heat sink
TEC chip direction extends to form the stage portion, and the stage portion supports the TEC in the side close to the heat sink
Chip, and be arranged with the heat source interval.
3. heat exchanger according to claim 1, which is characterized in that the connector is close to the side of the heat source towards institute
It states TEC chip direction and extends to form the stage portion, the stage portion supports the TEC core in the side close to the heat source
Piece, and be arranged with the heat sink interval.
4. heat exchanger according to claim 1, which is characterized in that the connector extends towards TEC chip direction
The stage portion is formed, the stage portion supports the TEC chip, and is spaced setting with the heat source and heat sink.
5. heat exchanger as described in claim 1, which is characterized in that the TEC chip includes the hot face being oppositely arranged and huyashi-chuuka (cold chinese-style noodles),
The huyashi-chuuka (cold chinese-style noodles) is supported with the heat source, and the hot face is supported with the heat sink, the hot face of the heat sink and the TEC chip
Between be provided with heat-conducting interface material.
6. heat exchanger according to claim 1, which is characterized in that the heat sink is cold plate, and the heat source is to be housed in
The light source of the accommodating space, the light source hang upside down is on the connector.
7. heat exchanger according to claim 6, which is characterized in that the stud of protrusion is provided on the connector, it is described
Light source is fixed on the stud using stepped screw, and the stepped screw includes the first screw rod and protrudes from first screw rod
The second screw rod, the diameter of second screw rod is less than the diameter of first screw rod, and the screw thread setting of the stepped screw exists
On second screw rod.
8. heat exchanger according to claim 7, which is characterized in that be provided between the stepped screw and the stud absolutely
Heat pad circle, the heat-insulating washer offset around second screw rod and with first screw rod.
9. heat exchanger according to claim 4, which is characterized in that the connector is collectively formed heat-insulated with the shell
Chamber, the heat exchanger include inside the heat-insulation chamber for be electrically connected the TEC chip and external power supply the first pcb board, the
The adapter of two pcb boards and connection first pcb board and second pcb board.
10. heat exchanger according to claim 9, which is characterized in that the installation gap of the adapter and the connector
Place is provided with the sealant layer of hot setting, is provided with sealing ring between the shell and the connector.
11. a kind of projection arrangement, which is characterized in that including the heat exchanger as described in claims 1 to 10 any one.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710400867.XA CN108983537A (en) | 2017-05-31 | 2017-05-31 | Heat exchanger and projection device |
| PCT/CN2017/100574 WO2018218801A1 (en) | 2017-05-31 | 2017-09-05 | Heat exchanger and projection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710400867.XA CN108983537A (en) | 2017-05-31 | 2017-05-31 | Heat exchanger and projection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108983537A true CN108983537A (en) | 2018-12-11 |
Family
ID=64454128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710400867.XA Pending CN108983537A (en) | 2017-05-31 | 2017-05-31 | Heat exchanger and projection device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108983537A (en) |
| WO (1) | WO2018218801A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019200978A1 (en) * | 2018-04-20 | 2019-10-24 | 深圳光峰科技股份有限公司 | Heat exchanger and display device |
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| CN207067638U (en) * | 2017-05-31 | 2018-03-02 | 深圳市光峰光电技术有限公司 | Heat exchanger and projector equipment |
| CN207006042U (en) * | 2017-07-05 | 2018-02-13 | 上海小糸车灯有限公司 | Auto lamp with diffraction shape lighting effect |
| US20200346577A1 (en) * | 2017-09-07 | 2020-11-05 | Marelli Automotive Lighting France | Optical Device for a Motor Vehicle Providing Two Separate Lighting Functions |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019200978A1 (en) * | 2018-04-20 | 2019-10-24 | 深圳光峰科技股份有限公司 | Heat exchanger and display device |
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| Publication number | Publication date |
|---|---|
| WO2018218801A1 (en) | 2018-12-06 |
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