WO2019200978A1

WO2019200978A1 - Heat exchanger and display device

Info

Publication number: WO2019200978A1
Application number: PCT/CN2019/070521
Authority: WO
Inventors: 邓高飞; 刘宪; 王则钦; 李屹
Original assignee: 深圳光峰科技股份有限公司
Priority date: 2018-04-20
Filing date: 2019-01-05
Publication date: 2019-10-24
Also published as: CN208175209U

Abstract

A heat exchanger and a display device having same. The heat exchanger (20, 20') comprises a shell (21), a heat source (23), an adaptor (25), a refrigeration component (24), a cold plate (27), a first seal ring (22), a second seal ring (26), a first sealant (28, 28'), and a second sealant (29, 29'). The refrigeration component (24) is located below the heat source (23). The shell (21), the adaptor (25), and the cold plate (27) are sequentially provided and enclosed to form a cavity for accommodating the heat source (23) and the refrigeration component (24). The first seal ring (22) is located between the shell (21) and the adaptor (25). The second seal ring (26) is located between the adaptor (25) and the cold plate (27). The shell (21) comprises a first outer surface (211). The adaptor (25) comprises a second outer surface (251). The cold plate (27) comprises a third outer surface (271). The first sealant (28, 28') is located at a joint between the first outer surface (211) and the second outer surface (251). The second sealant (29, 29') is located at a joint between the second outer surface (251) and the third outer surface (271). The heat exchanger has better sealing effect, and can improve the phenomenon that the heat source produces the condensate water.

Description

Heat exchanger and display device

Technical field

The utility model relates to a heat exchanger and a display device.

Background technique

Some devices (such as light source modules with red laser, DMD chips, etc.) require very high heat dissipation conditions during operation, and the substrate temperature is sometimes required to be maintained at around 20 ° C (lower than ambient temperature). Refrigerant components (such as TEC cooling fins) are required. Since the substrate temperature of the device is lower than the ambient temperature, when the humidity of the air is high, condensed water may be generated inside the module, and the condensed water may damage the device and the cooling element; in addition, when dust enters the inside of the module, these The efficiency of the device is greatly reduced, so it is especially important to make the dust-proof and anti-condensation design of these modules.

Utility model content

In order to solve the problem that the existing device is prone to condensed water, the utility model provides a heat exchanger and a display device which can improve the problem of condensed water.

a heat exchanger comprising a housing, a heat source, an adapter, a refrigerating element, a cold plate, a first sealing ring, a second sealing ring, a first sealing glue and a second sealing glue, wherein the cooling element is located Under the heat source, the housing, the adapter and the cold plate are sequentially disposed and enclose a cavity for housing the heat source and the cooling element, and the first sealing ring is located at the housing and the housing Between the adapters, the second sealing ring is located between the adapter and the cold plate, the housing includes a first outer surface, and the adapter includes a second outer surface, The cold plate includes a third outer surface, the first sealant is located at a junction between the first outer surface and the second outer surface, the second sealant is located on the second outer surface and the The joint between the third outer surfaces.

In one embodiment, the housing further includes a first bottom surface coupled to the first outer surface and engaging the adapter, the first outer surface including a first outer side and coupled to the a first connecting surface between the first outer side surface and the first bottom surface, the adapter further comprising a second bottom surface connecting one side of the second outer surface, the second bottom surface and the first bottom surface Correspondingly and engaging, the first sealing ring is sandwiched between the first bottom surface and the second bottom surface, the second outer surface includes a second outer side surface and is connected to the second outer side surface and the first a second connecting surface between the bottom surfaces, the first connecting surface and the second connecting surface enclosing a first receiving portion, and at least a portion of the first sealant is received in the first receiving portion.

In one embodiment, the adapter includes a third bottom surface corresponding to the cold plate and connected to a side of the second outer surface away from the second bottom surface, the second outer surface further comprising a connection The second outer side surface is away from the third connecting surface on the side of the second connecting surface, and the cold plate further includes a fourth bottom surface connected to the third outer surface and engaging with the third bottom surface, a second sealing ring is sandwiched between the third bottom surface and the fourth bottom surface, the third outer surface includes a third outer side surface and a first connection between the third outer side surface and the fourth bottom surface The fourth connecting surface and the fourth connecting surface enclose a second receiving portion, and at least a portion of the second sealing adhesive is received in the second receiving portion.

In one embodiment, an outer surface of the first sealant is flush with the first outer surface and the second outer surface, and an outer surface of the second sealant and the second outer surface The third outer surface is flush.

In one embodiment, the first sealant or/and the second sealant have a triangular, partially circular, T-shaped or trapezoidal cross-section.

In one embodiment, the distance between the first outer side surface and the second outer side surface is greater than or equal to 1 mm, and the distance between the second outer side surface and the third outer side surface is greater than or equal to 1 mm. .

In an embodiment, the first bottom surface or the second bottom surface has a first groove, at least part of the first sealing ring is received in the first groove, the third bottom surface or The fourth bottom surface has a second groove, and at least a portion of the second sealing ring is received in the second groove.

In one embodiment, the first sealant and the second sealant are both annular, and the distance between the first seal ring and the first sealant is greater than or equal to 5 mm, and the second The distance between the sealing ring and the second sealant is greater than or equal to 5 mm.

In one embodiment, the heat source is a light source module or a DMD chip, and the cooling element is a TEC chip.

A display device includes a heat exchanger including a housing, a heat source, an adapter, a refrigerating member, a cold plate, a first seal ring, a second seal ring, a first sealant, and a second seal a rubber, the refrigerating component is located under the heat source, and the casing, the adapter and the cold plate are sequentially disposed and enclose a cavity for accommodating the heat source and the refrigerating component, the first a sealing ring is located between the housing and the adapter, the second sealing ring is located between the adapter and the cold plate, the housing includes a first outer surface, the transfer The piece includes a second outer surface, the cold plate includes a third outer surface, the first sealant is located at a junction between the first outer surface and the second outer surface, and the second sealant is located a junction between the second outer surface and the third outer surface.

Compared with the prior art, in the heat exchanger, the first sealing ring and the second sealing ring form a first sealing isolation, and the first sealing glue and the second sealing glue form a second The channel is sealed, so that two inner and outer sealing means are formed to ensure sufficient sealing performance between the casing and the adapter, between the adapter and the cold plate, and thus To the extent that the outside air and tiny dust are blocked from infiltrating into the heat source, thereby avoiding condensation or entering dust inside the heat source, thereby preventing damage of the heat source by the condensed water or dust, thereby ensuring the efficiency of the heat source for a long time, and the heat exchanger has a very high Good anti-condensation ability and sealing and dustproof performance.

Further, when the heat source is a light source module, such as a light source module having a red laser, the heat exchanger has better anti-condensation capability and sealing and dustproof performance due to the above sealing design, so that the replacement The heat device can withstand harsh environments such as higher ambient temperature and humidity, and guarantees long-term, stable and high-efficiency work of the light source module with red laser, and has a wide application range. In addition, when the heat source is a DMD chip or the like, the above sealing design also contributes to heat dissipation and anti-condensation design of the DMD chip.

DRAWINGS

1 is a perspective exploded view of a heat exchanger having an anti-condensation design.

2 is a schematic cross-sectional view of the heat exchanger shown in FIG. 1.

3 is a perspective exploded view of a heat exchanger according to an embodiment of the present invention.

Figure 4 is a schematic cross-sectional view of the heat exchanger shown in Figure 3.

FIG. 5 is a schematic cross-sectional structural view of a heat exchanger according to another embodiment of the present invention.

Main component symbol description

Heat exchanger 20, 20'

Housing

11, 21

First sealing ring

12, 22

Heat source

13,23

Refrigeration components

14, 24

Adapters

15, 25

Second sealing ring

16, 26

Cold plate

17,27

First sealant 28, 28'

Second sealant 29, 29’

First outer surface 211

First bottom surface 212

First outer side 213

First connection surface 214, 214'

Top plate 21a

Side panel 21b

Second outer surface 251

Second bottom surface 252

Second outer side 253

Second connecting surface 254, 254'

Side wall 25a

Third bottom surface 255

Third connection surface 256, 256'

Third outer surface 271

Fourth bottom surface 272

Third outer side 273

Fourth connecting surface 274, 274'

First housing part 280, 280'

Second accommodating part 290, 290'

First groove 220

Second groove 260

Part 1 201

The second part 202

The present invention will be further described in conjunction with the above drawings in the following detailed description.

detailed description

The above described objects, features and advantages of the present invention will become more apparent from the aspects of the invention.

In the following description, numerous specific details are set forth in order to facilitate a full understanding of the invention, but the invention may be practiced otherwise than as described herein. Where similar applications are made, the invention is not limited by the specific embodiments disclosed below.

2 is a detailed description of the present invention in conjunction with the schematic diagrams. In the detailed description of the embodiments of the present invention, for the convenience of description, the sectional view of the device structure will not be partially enlarged according to the general proportion, and the schematic diagram is only an example, which is not here. The scope of protection of the present invention should be limited. In addition, the actual three-dimensional dimensions of length, width and depth should be included in the actual production.

The details are described below by way of examples.

First, please refer to FIG. 1 and FIG. 2. FIG. 1 is a perspective exploded view of a heat exchanger 10 having an anti-condensation design, and FIG. 2 is a schematic cross-sectional view of the heat exchanger 10 of FIG. The heat exchanger 10 includes a housing 11, a first sealing ring 12, a heat source 13, a refrigerating element 14, an adapter 15, a second sealing ring 16, and a cold plate 17. The cooling element 14 is located below the heat source, and the housing 11, the adapter 15 and the cold plate 17 are sequentially disposed and enclose a cavity for accommodating the heat source 13 and the cooling element 14. The first sealing ring 12 is located between the housing 11 and the adapter 15 for achieving a seal between the housing 11 and the adapter 15 , and the second sealing ring 16 is located The adapter 15 and the cold plate 17 are used to achieve a seal between the adapter 15 and the cold plate 17. In the heat exchanger 10 shown in FIG. 1-2, the heat source 13 is mainly used as a light source module (such as a light source module having a red laser), and the housing 11 may have a transparent glass top plate for making The light emitted by the light source module is transmitted. The refrigeration element 14 can be a semiconductor refrigeration chip, such as a TEC chip.

However, the heat exchanger 10 described above can basically solve the problem of dustproof and anti-condensation at normal temperature (in a good environment), but when the ambient temperature and humidity around the heat exchanger 10 are high, the time is long, the heat exchanger Defects in dust and condensation resistance of 10 will be highlighted. Specifically, as shown in FIG. 2, the bonding surface of the casing 11 and the adapter 15 and the bonding surface of the cold plate 17 and the adapter 15 are only by the first sealing ring 12 and the first The second sealing ring 16 isolates the air and the dust. Once the first sealing ring 12 or the second sealing ring 16 is damaged or otherwise abnormal, the inspector does not find out that the abnormal material is used as a normal material or a normal sealing ring after many years. After aging, the fine dust and hot air around the heat source will permeate into the heat exchanger 10 along the gap in Fig. 2 (a gap in one circle), and the air humidity in the heat exchanger 10 is accumulated. When it is increased to a certain amount, when the hot air encounters the heat source 13 having a lower temperature (for example, the heat source is 20 ° C when the light source module has a red light), condensed water is generated, which may damage the heat source 13 And the refrigeration element 14 reduces the service life of the heat source 13 and the refrigeration element 14.

In view of the above problems of the heat exchanger 10 solution, the present invention further proposes a heat exchanger 20 which can improve the above problems. Please refer to FIG. 3 and FIG. 4, FIG. 3 is a heat exchanger according to an embodiment of the present invention. FIG. 4 is a schematic cross-sectional view of the heat exchanger 20 shown in FIG. The heat exchanger 20 includes a housing 21, a first sealing ring 22, a heat source 23, a refrigerating element 24, an adapter 25, a second sealing ring 26, a cold plate 27, a first sealant 28, and a second sealant 29 . The cooling element 24 is located below the heat source 23, and the housing 21, the adapter 25 and the cold plate 27 are sequentially disposed and enclose a cavity for housing the heat source 23 and the cooling element 24. The first sealing ring 22 is located between the housing 21 and the adapter 25 for achieving a seal between the housing 21 and the adapter 25, and the second sealing ring 26 Located between the adapter 25 and the cold plate 27 for achieving a seal between the adapter 25 and the cold plate 27.

The housing 21 includes a first outer surface 211, the adapter 25 includes a second outer surface 251, the cold plate 27 includes a third outer surface 271, and the first sealant 28 is located at the first outer surface At the junction between the surface 211 and the second outer surface 251, the second sealant 29 is located at the junction between the second outer surface 251 and the third outer surface 271.

Specifically, the heat source 23 may be a light source module or a DMD chip. In this embodiment, the heat source 23 is mainly used as a light source module (such as a light source module having a red laser), and the housing 21 may be a top plate 21a having transparent glass for transmitting light emitted from the light source module, the housing 21 may further include a side plate 21b connecting the peripheral edges of the top plate 21a, the top plate 21a and the side plate 21b being enclosed A accommodating space for accommodating the heat source 23 . The refrigeration element 24 can be a semiconductor refrigeration chip, such as a TEC chip.

The housing 21 further includes a first bottom surface 212 coupled to the first outer surface 211 and engaging the adapter, the first outer surface 211 including a first outer side 213 and connected to the first A first connecting surface 214 between the outer side surface 213 and the first bottom surface 212. It can be understood that the first outer surface 211 may include an outer surface of the top plate 21a and the side plate 21b, and the first bottom surface 212 may be a bottom surface of the side plate 21b.

The adapter 25 further includes a second bottom surface 252 connected to one side of the second outer surface 251. The second bottom surface 252 corresponds to and engages with the first bottom surface 212, and the first sealing ring 22 is clamped to Between the first bottom surface 212 and the second bottom surface 252, the second outer surface 251 includes a second outer side surface 253 and a second portion between the second outer side surface 253 and the second bottom surface 252. The first connecting surface 214 and the second connecting surface 254 enclose a first receiving portion 280 , and at least a portion of the first sealant 28 is received in the first receiving portion 280 . Further, in the embodiment, the adapter 25 also fixes the refrigerating component 24, and specifically, the adapter 25 may be a frame including a side wall 25a that is connected end to end. The refrigeration element 24 can be housed and fixed in the casing of the adapter 25. It can be understood that the second outer surface 251 can be the outer surface of the side wall 25a, and the second bottom surface 252 can be the top surface of the side wall 25a.

The adapter 25 further includes a third bottom surface 255 corresponding to the cold plate 27 and connected to a side of the second outer surface 251 away from the second bottom surface 252, the second outer surface 251 further comprising a connection The second outer side surface 253 is away from the third connecting surface 256 on the side of the second connecting surface 254. The third bottom surface 255 may be a bottom surface of the side wall 25a. The cold plate 27 further includes a fourth bottom surface 272 connected to the third outer surface 271 and joined to the third bottom surface 255, and the second sealing ring 26 is sandwiched between the third bottom surface 255 and the first surface Between the four bottom surfaces 272, the third outer surface 271 includes a third outer side surface 273 and a fourth connecting surface 274 connected between the third outer side surface 273 and the fourth bottom surface 272, the third connection The surface 256 and the fourth connecting surface 274 enclose a second receiving portion 290 , and at least a portion of the second sealing rubber 29 is received in the second receiving portion 290 .

In this embodiment, the first sealant 28 fills the first receiving portion 280, and the outer surface of the first sealant 28 and the first outer side surface 213 of the first outer surface 211 are The second outer surface 251 is flush; the second sealant 29 fills the second receiving portion 290, and the outer surface of the second sealant 29 and the second outer surface of the second outer surface 251 253. The third outer side surface 273 of the third outer surface 271 is flush. The first sealant 28 and the second sealant 29 have a triangular, partially circular, T-shaped or trapezoidal shape, and are not limited thereto. As shown in FIG. 4, the embodiment mainly adopts The cross section of the first sealant 28 and the second sealant 29 is illustrated as a triangle.

Further, in order to achieve a better sealing effect of the first sealant 28 and the second sealant 29, the dimensions of the first receiving portion 280 and the second receiving portion 290 are preferably set. . Specifically, in an embodiment, the distance between the first outer side surface 213 and the second outer side surface 253 may be greater than or equal to 1 mm, so that the opening of the first receiving portion 280 has a certain width, thereby Sufficient first sealant 28 can be accommodated to achieve a better sealing effect. The distance between the second outer side surface 253 and the third outer side surface 273 is greater than or equal to 1 mm, so that the opening of the second receiving portion 290 has a certain width, so that a sufficient second sealant 29 can be accommodated. Achieve better sealing results.

Further, the first bottom surface 212 or the second bottom surface 252 may have a first groove 220, at least part of the first sealing ring 22 being received in the first groove 220, the first The third bottom surface 255 or the fourth bottom surface 272 has a second recess 260 into which at least a portion of the second seal ring 26 is received. In addition, the depth of the first groove 220 may be slightly smaller than the thickness of the first sealing ring 22 for clamping the first sealing ring 22 on the first bottom surface 212 and the second bottom surface Between 252, a better sealing effect is achieved. The depth of the second groove 260 may be slightly smaller than the thickness of the second sealing ring 26 for clamping the second sealing ring 26 to the third bottom surface 255 and the fourth bottom surface 272 Between, to achieve a better sealing effect.

The first sealant 28 and the second sealant 29 are both annular, that is, the first sealant 28 is located at a joint of the ring between the housing 21 and the adapter 25 ( In the first receiving portion 280), the second sealant 29 is located at a joint of the ring between the adapter 25 and the cold plate 27 (such as the second receiving portion 290). . In an embodiment, the distance between the first sealing ring 22 and the first sealant 28 may be greater than or equal to 5 mm for ensuring a sufficient isolation distance; the second sealing ring 26 and the first The distance between the two sealants 29 is greater than or equal to 5 mm for ensuring a sufficient separation distance. The first sealant 28 and the second sealant 29 may be room temperature curing adhesives which are cured at normal temperature, but are not limited thereto. The first sealing ring 22 and the second sealing ring 26 may be a silicone ring or a rubber ring, and the cross-sectional shape of the two may be circular or other shapes designed as needed.

Compared with the prior art, in the heat exchanger 20, the first sealing ring 22 and the second sealing ring 26 form a first sealing isolation, the first sealing glue 28 and the second sealing The glue 29 forms a second sealing isolation, so that two inner and outer sealing means are formed to ensure that the housing 21 and the adapter 25 are between the adapter 25 and the cold plate 27 The sealing performance is strong enough to block the outside air and minute dust from entering the heat source 23 to avoid condensed water or dust entering the heat source 23, thereby preventing the condensed water or dust from damaging the heat source 23, thereby preventing the heat source 23 from being damaged for a long time. To ensure the efficiency of the heat source 23, the heat exchanger 20 has good anti-condensation capability and sealing and dustproof performance.

Further, when the heat source 23 is a light source module, such as a light source module having a red laser, the heat exchanger 20 has better anti-condensation capability and sealing and dustproof performance due to the above sealing design. The heat exchanger 20 can withstand harsh environments such as higher ambient temperature and humidity, and guarantees long-term, stable and high-efficiency work of the light source module with red laser, and has a wide application range. In addition, when the heat source 23 is a DMD chip or the like, the above sealing design also contributes to heat dissipation and anti-condensation design of the DMD chip.

Please refer to FIG. 5. FIG. 5 is a schematic cross-sectional view of a heat exchanger 20' according to another embodiment of the present invention. The heat exchanger 20' is substantially the same as the heat exchanger 20, that is, the above-mentioned pair The description of the heat exchanger 20 can be basically applied to the heat exchanger 20'. The difference between the two is mainly: the first connecting surface 214', the second connecting surface 254', the third connecting surface 256' and the fourth connecting surface 274. 'Differently, in the heat exchanger 20', the first connecting surface 214', the second connecting surface 254', the third connecting surface 256' and the fourth connecting surface 274' each include a first portion 201 and a second portion The portion 202 has an angle between the first portion 201 and the second portion 202, and a cross section of the first receiving portion 280' surrounded by the first connecting surface 214' and the second connecting surface 254' is The second receiving portion 290 ′ of the third connecting surface 256 ′ and the fourth connecting surface 274 ′ has a trapezoidal cross section, and is located at the first sealant 28 ′ of the first receiving portion 280 ′. The cross section is also trapezoidal, and the second sealant 29' located in the second receiving portion 290' also has a trapezoidal cross section.

The present invention also provides a display device, which can be applied to a projector, an LCD (Liquid Crystal Display) display, etc., and the display device can include a light source device, a spatial light modulator module, and a projection lens. The light source device may adopt the heat exchangers 20, 20' of the light source module in the above embodiment. The spatial light modulator module may adopt the heat exchanger in which the heat source is a DMD chip in the above embodiment, and the spatial modulator module is configured to output image light according to the light emitted by the light source device and the image data modulated by the input image data. The projection lens is configured to display a projection image according to the image light.

In addition, it can be understood that the heat exchangers 20, 20' in which the heat source is the light source module in the above embodiment of the present invention can also be used in a stage light system, an in-vehicle lighting system, a surgical lighting system, etc., and are not limited to the above display devices. .

The above description is only an embodiment of the present invention, and thus does not limit the scope of the patent of the present invention, and the equivalent structure or equivalent flow transformation made by using the specification and the drawings of the present invention, or directly or indirectly applied to other The related technical fields are all included in the scope of patent protection of the present invention.

Claims

A heat exchanger, comprising: a casing, a heat source, an adapter, a refrigerating component, a cold plate, a first sealing ring, a second sealing ring, a first sealing glue and a second sealing glue The cooling element is located below the heat source, and the housing, the adapter and the cold plate are sequentially disposed and enclose a cavity for housing the heat source and the cooling element, the first seal a ring is located between the housing and the adapter, the second sealing ring is located between the adapter and the cold plate, the housing includes a first outer surface, the adapter The second outer surface is included, the cold plate includes a third outer surface, the first sealant is located at a joint between the first outer surface and the second outer surface, and the second sealant is located at the joint A joint between the second outer surface and the third outer surface.
A heat exchanger according to claim 1 wherein said housing further includes a first bottom surface coupled to said first outer surface and engaging said adapter, said first outer surface comprising An outer side surface and a first connecting surface connected between the first outer side surface and the first bottom surface, the adapter further comprising a second bottom surface connecting one side of the second outer surface, the first a second bottom surface corresponding to and joined to the first bottom surface, the first sealing ring being sandwiched between the first bottom surface and the second bottom surface, the second outer surface comprising a second outer side surface and connected to the a second connecting surface between the second outer side surface and the second bottom surface, the first connecting surface and the second connecting surface enclosing a first receiving portion, at least part of the first sealant being disposed In the first receiving portion.
The heat exchanger according to claim 2, wherein said adapter comprises a third bottom surface corresponding to said cold plate and connected to said second outer surface away from said second bottom surface, said The second outer surface further includes a third connecting surface connected to a side of the second outer side away from the second connecting surface, the cold plate further comprising a third outer surface connected to the third outer surface a fourth bottom surface of the joint, the second sealing ring is sandwiched between the third bottom surface and the fourth bottom surface, the third outer surface includes a third outer side surface and is connected to the third outer side surface a fourth connecting surface between the fourth bottom surface, the third connecting surface and the fourth connecting surface enclosing a second receiving portion, and at least a portion of the second sealing adhesive is received in the second receiving portion in.
The heat exchanger according to any one of claims 1 to 3, wherein an outer surface of the first sealant is flush with the first outer surface and the second outer surface, The outer surface of the second sealant is flush with the second outer surface and the third outer surface.
The heat exchanger according to any one of claims 1 to 3, wherein the first sealant or/and the second sealant have a triangular, partially circular, T-shaped or trapezoidal cross section.
A heat exchanger according to claim 3, wherein a distance between said first outer side surface and said second outer side surface is greater than or equal to 1 mm, said second outer side surface and said third outer side surface The distance between them is greater than or equal to 1 mm.
The heat exchanger according to claim 3, wherein said first bottom surface or said second bottom surface has a first recess, and at least a portion of said first sealing ring is received in said first recess The third bottom surface or the fourth bottom surface has a second groove, and at least a portion of the second sealing ring is received in the second groove.
The heat exchanger according to claim 3, wherein the first sealant and the second sealant are both annular, and a distance between the first seal ring and the first sealant is greater than Equal to 5 mm, the distance between the second sealing ring and the second sealant is greater than or equal to 5 mm.
The heat exchanger according to claim 1, wherein the heat source is a light source module or a DMD chip, and the cooling element is a TEC chip.
A display device comprising a heat exchanger, characterized in that the heat exchanger employs the heat exchanger according to any one of claims 1-9.