CN2658653Y - Semiconductor refrigerating adiabatic structure - Google Patents
Semiconductor refrigerating adiabatic structure Download PDFInfo
- Publication number
- CN2658653Y CN2658653Y CNU032681771U CN03268177U CN2658653Y CN 2658653 Y CN2658653 Y CN 2658653Y CN U032681771 U CNU032681771 U CN U032681771U CN 03268177 U CN03268177 U CN 03268177U CN 2658653 Y CN2658653 Y CN 2658653Y
- Authority
- CN
- China
- Prior art keywords
- semiconductor refrigerating
- semi
- heat insulating
- insulating construction
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/023—Mounting details thereof
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0251—Removal of heat by a gas
Abstract
The utility model discloses a semi-conductor refrigerating adiabatic structure, and comprises a froth layer adiabatic structure which is provided with an installation hole of a semi-conductor refrigerating structure. The semi-conductor refrigerating structure is provided with a heat insulative frame block made of the foam materials with the conducting coefficient of 0.03 which is used to stuff the space between the semi-conductor refrigeration structure and the cavity of the hole. In order to avoid the fixing screws influencing the heat insulative effect, the utility model also consists of a plastic round conductive column, whose inner sides on both ends are molded with the inner screw structure. In order to avoid the condensative water heat conducting, a plastic frame is arranged on one end of which the cool dispersion aluminum brick of the semi-conductor refrigerating structure is connected with the cool dispersion aluminum wing sheet, and a sealing ring is disposed between the plastic frame and the cool dispersion aluminum brick. The utility model has the advantages of simple and reasonable structure, stronger hot resistance, and resolves the problem of heat insulation of the semi-conductor refrigerating system at low costs, and thus further enhances the refrigerating effect and the semi-conductor refrigerating system. The utility model is widely applicable to the products such as the ice bag of the drinking fountain, the ice box of the vehicles, household wine tank, and refrigerator, etc.
Description
Technical field
The utility model relates to semiconductor refrigeration system, relates in particular to the semiconductor refrigerating heat insulating construction.
Background technology
The existing semiconductor electronic product made from the semiconductor temperature difference principle, its semiconductor refrigerating structure is many by semiconductor chilling plate, heat radiation aluminium, aluminium brick and cold scattering aluminum are formed, heat radiation aluminium is installed on the semiconductor chilling plate hot side, and the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate is then installed cold scattering aluminum brick and cold scattering aluminum successively.The quality of semiconductor refrigerating structure refrigeration performance except that the radiating effect of thermoelectric performance that is subjected to semiconductor chilling plate itself and cooling piece hot side influences, is influenced by the insulation effect between the semiconductor chilling plate cold and hot surface also.Because the spacing between the semiconductor chilling plate cold and hot surface has only 4～5mm, and the difference of temperature can reach 40～50 ℃, and is undesirable as insulation effect between the two, then can cause the string temperature between cold and hot surface, the instant heating short circuit.Therefore, the semiconductor refrigerating structure need be provided with the semiconductor refrigerating heat insulating construction to improve refrigeration performance.And conventional semiconductor refrigeration heat insulating construction mostly as shown in Figure 1, and adiabatic foaming layer structure is made of hot side plastic housing 21, huyashi-chuuka (cold chinese-style noodles) plastic housing 22 and frothing heat-insulating layer 23, and the semiconductor refrigerating structure just is installed in the structural installing hole of this thermal insulation foaming layer.But, there is following weak point in this kind structure: at first, plastic housing itself forms heat transmission, and the huyashi-chuuka (cold chinese-style noodles) plastic housing links to each other with the hot side plastic housing, contact area between the two reaches 100 square centimeters, and distance also has only about four to five centimetres, and the thermal conductivity factor of plastics is 0.2 again, therefore can influence insulation effect, and, because the semiconductor refrigerating structure can be gapped in installing hole, and be full of air in the gap, air also can cause heat transmission; Secondly, because heat radiation aluminium 11 and cold scattering aluminum 12 all are directly to be fixed on the screw thread of cold scattering aluminum brick 14 by fixed screw 13, and only intercept between fixed screw 13 and heat radiation aluminium and the cold scattering aluminum by pad 16, therefore, fixed screw 13 can become heat-conduction medium, causes the energy offset between cooling piece 1 cold and hot surface; Once more, seal owing to only post sponge 15 on the composition surface of cold scattering aluminum and huyashi-chuuka (cold chinese-style noodles) plastic housing, when huyashi-chuuka (cold chinese-style noodles) is worked, having condensed water produces, condensed water infiltration sponge flows in the slit of cold scattering aluminum brick, has caused cold and hot end to conduct heat by water, has also caused cancelling out each other of cold and hot energy indirectly.
Summary of the invention
The purpose of this utility model is at the problems referred to above, and a kind of semiconductor refrigerating heat insulating construction of simple in structure, excellent heat insulating performance is provided.
For achieving the above object, the technical solution of the utility model is as follows: the semiconductor refrigerating heat insulating construction, comprise the foaming layer heat insulating construction, and semiconductor refrigerating structure installing hole is arranged on this foaming layer heat insulating construction; It is the adiabatic frame piece that 0.03 foamed plastics is made that semiconductor refrigerating structure installing hole is built-in with by thermal conductivity factor, in order to the space between filling semiconductor refrigeration structure and the hole inner chamber.
For avoiding fixed screw to influence insulation effect, the utility model also comprises plastics circle guide pillar, this inner injection moulding female thread structure in plastics circle guide pillar two ends.Also be provided with the plastic mattress cap between fixed screw and the plastics circle guide pillar.
For avoiding condensed water to conduct heat, the cold scattering aluminum brick of semiconductor refrigerating structure connects cold scattering aluminum fin one end a plastic frame, seals with sealing ring between plastic frame and the cold scattering aluminum brick.
The utlity model has simple and reasonable, thermal resistance is bigger, solved the adiabatic problem of semiconductor refrigeration system at low cost, and then the refrigeration of raising semiconductor refrigeration system, can be widely used in having utilized the water dispenser of semiconductor refrigerating technology with on the products such as ice courage, automobile refrigerator, home-use wine cabinet, refrigerator.
Description of drawings
Fig. 1 is the structural representation of annexation between existing semiconductor refrigerating structure and the semiconductor refrigerating heat insulating construction;
Fig. 2 is the structural representation of semiconductor refrigerating heat insulating construction described in the utility model annexation between the semiconductor refrigerating structure;
Fig. 3 is a mounting structure exploded view of the present utility model.
Now the utility model is described in further detail in conjunction with the accompanying drawings and embodiments:
The specific embodiment
As Fig. 2, shown in Figure 3, the adiabatic frame piece 3 that the utility model comprises frothing heat-insulating layer 23, made by foamed plastics, the plastics circle guide pillar 4 of the inner injection moulding female thread structure 41 in two ends, plastic mattress cap 5, plastic frame 6, a sealing ring 7 and the plastic frame 8 made by soft silicon rubber.
The utility model and semiconductor refrigerating structure are installed when being connected, and with the huyashi-chuuka (cold chinese-style noodles) and 14 applyings of cold scattering aluminum brick of semiconductor chilling plate 1 and insert in the installing hole of adiabatic frame piece 3, cold scattering aluminum brick one end is with plastic frame 6 and sealing ring 7.Then, by mounting screw 13, plastic mattress cap 5 and being threaded of guide pillar 4 of plastics circle heat radiation aluminium 11 and cold scattering aluminum 12 are installed in adiabatic frame piece 3 two ends respectively, the fixing integrative-structure that forms is inserted this integrative-structure in the installing hole of plastic frame 8 at last.There is an edge sealing 81 at the edge of the installing hole of plastic frame 8, can further play the effect that prevents the condensed water infiltration.
Claims (5)
1, semiconductor refrigerating heat insulating construction, comprise the foaming layer heat insulating construction, semiconductor refrigerating structure installing hole is arranged on this foaming layer heat insulating construction, it is characterized in that: this semiconductor refrigerating structure installing hole is built-in with the adiabatic frame piece of being made by foamed plastics (3), in order to the space between filling semiconductor refrigeration structure and the installing hole inner chamber.
2, semiconductor refrigerating heat insulating construction according to claim 1 is characterized in that: also comprise plastics circle guide pillar (4), this inner injection moulding female thread structure (41) in plastics circle guide pillar (4) two ends.
3, semiconductor refrigerating heat insulating construction according to claim 2 is characterized in that: also comprise plastic mattress cap (5).
4, semiconductor refrigerating heat insulating construction according to claim 1 and 2: it is characterized in that: the cold scattering aluminum brick of described semiconductor refrigerating structure connects cold scattering aluminum fin one end a plastic frame (6), seals with sealing ring (7) between plastic frame and the cold scattering aluminum brick.
5, semiconductor refrigerating heat insulating construction according to claim 4 is characterized in that: described sealing ring (7) is made by soft silicon rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU032681771U CN2658653Y (en) | 2003-07-31 | 2003-07-31 | Semiconductor refrigerating adiabatic structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU032681771U CN2658653Y (en) | 2003-07-31 | 2003-07-31 | Semiconductor refrigerating adiabatic structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2658653Y true CN2658653Y (en) | 2004-11-24 |
Family
ID=34330086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU032681771U Expired - Fee Related CN2658653Y (en) | 2003-07-31 | 2003-07-31 | Semiconductor refrigerating adiabatic structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2658653Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103048855A (en) * | 2013-01-28 | 2013-04-17 | 中国科学院光电技术研究所 | Thermal-insulating device of thermal control system of aerial camera |
| CN106440601A (en) * | 2015-08-11 | 2017-02-22 | 卡孚特能源技术（深圳）有限公司 | Freezing type multistage semiconductor refrigeration refrigerator |
| CN108679877A (en) * | 2017-04-28 | 2018-10-19 | 青岛海尔特种电冰柜有限公司 | Solid-state refrigerating plant |
-
2003
- 2003-07-31 CN CNU032681771U patent/CN2658653Y/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103048855A (en) * | 2013-01-28 | 2013-04-17 | 中国科学院光电技术研究所 | Thermal-insulating device of thermal control system of aerial camera |
| CN103048855B (en) * | 2013-01-28 | 2015-07-08 | 中国科学院光电技术研究所 | Thermal-insulating device of thermal control system of aerial camera |
| CN106440601A (en) * | 2015-08-11 | 2017-02-22 | 卡孚特能源技术（深圳）有限公司 | Freezing type multistage semiconductor refrigeration refrigerator |
| CN108679877A (en) * | 2017-04-28 | 2018-10-19 | 青岛海尔特种电冰柜有限公司 | Solid-state refrigerating plant |
| CN108709335A (en) * | 2017-04-28 | 2018-10-26 | 青岛海尔特种电冰柜有限公司 | Semiconductor cooling device |
| CN108731298A (en) * | 2017-04-28 | 2018-11-02 | 青岛海尔特种电冰柜有限公司 | Solid-state refrigeration equipment |
| CN108917256A (en) * | 2017-04-28 | 2018-11-30 | 青岛海尔特种电冰柜有限公司 | Semiconductor refrigerating equipment |
| CN108679877B (en) * | 2017-04-28 | 2022-03-22 | 青岛海尔特种电冰柜有限公司 | Solid-state refrigerating device |
| CN108709335B (en) * | 2017-04-28 | 2022-03-22 | 青岛海尔特种电冰柜有限公司 | Semiconductor refrigerating device |
| CN108731298B (en) * | 2017-04-28 | 2022-03-22 | 青岛海尔特种电冰柜有限公司 | Solid-state refrigeration equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: FUXIN REFRIGERATION EQUIPMENT CO., LTD., SHUNDE D Free format text: FORMER OWNER: LIU FULIN Effective date: 20050715 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20050715 Address after: 528305, No. 11, Feng Feng Road, Ronggui District, Shunde District, Guangdong, Foshan Patentee after: Fuxin Rifrigeration Equipment Co., Ltd., Shunde Prefecture, Foshan City Address before: 528305 Guangdong Province, Shunde city Ronggui District Industrial Zone Ronglilifeng Hongfeng Road No. 11 Shunde Fuxin Electric Appliance Co. Ltd. Patentee before: Liu Fulin |
|
| C56 | Change in the name or address of the patentee |
Owner name: GUANGDONG FUXIN ELECTRONIC SCIENCE & TECHNOLOGY CO Free format text: FORMER NAME OR ADDRESS: FUXIN REFRIGERATION EQUIPMENT CO., LTD., SHUNDE DISTRICT,FOSHAN CITY |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 528305, No. 11, Hongfeng Road, Ronggui District, Shunde District, Guangdong, Foshan Patentee after: Guangdong Fuxin Electronic Technology Co., Ltd. Address before: 528305, No. 11, Hongfeng Road, Ronggui District, Shunde District, Guangdong, Foshan Patentee before: Fuxin Rifrigeration Equipment Co., Ltd., Shunde Prefecture, Foshan City |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20041124 Termination date: 20100731 |