CN218846214U

CN218846214U - Integrated kitchen

Info

Publication number: CN218846214U
Application number: CN202222851618.1U
Authority: CN
Inventors: 傅平; 李运胜; 刘昌林
Original assignee: Shenzhen Casdon Electrical Appliance Co ltd
Current assignee: Shenzhen Casdon Electrical Appliance Co ltd
Priority date: 2022-10-27
Filing date: 2022-10-27
Publication date: 2023-04-11
Anticipated expiration: 2032-10-27

Abstract

The utility model discloses an integrated kitchen, include: the refrigerator comprises a cabinet main body, an inner container, a cabinet door, a refrigeration assembly and a controller; the case main body is provided with an installation cavity; one side of the inner container is provided with an opening and is arranged in the mounting cavity; the cabinet door can be movably connected with the case main body and used for opening and closing the opening of the inner container; the refrigeration assembly comprises a first semiconductor refrigeration piece, and the first semiconductor refrigeration piece comprises a first power supply input end and a second power supply input end; one working end of the first semiconductor refrigerating piece is tightly attached to the outer wall surface of the inner container; the controller comprises a control circuit and a switching circuit which are connected with each other, and the switching circuit comprises a first output end electrically connected with the first power supply input end and a second output end electrically connected with the second power supply input end; the switching circuit switches the current output directions of the first output end and the second output end according to the control signal output by the control circuit; the utility model discloses to freeze and fermentation function integration in an organic whole, reduced user's use cost when satisfying user's user demand.

Description

Integrated kitchen

Technical Field

The utility model relates to a kitchen appliances technical field especially relates to an integrated kitchen.

Background

At present because the room price problem causes the kitchen space and diminishes, in order to reach the function maximize, the household electrical appliances product gradually forms the miniaturization structurally, and the modularization, multi-functional integration restores to give the succinct sense of space of consumer and sense of use. The integrated kitchen on the existing market not only has a cooking function, but also has various different functional modules, such as a disinfection cabinet, a water purifier, an automatic electric cooker, an electric oven, a microwave oven and an air conditioner.

In daily diet life, people have the processing demand to some food, like the preparation of ice cream, the ice-cube, consequently, an integrated kitchen of taking refrigeration function has appeared on the current market, however to the fermentation of some food, like acidophilus milk, liqueur, natto, rice wine, cheese, often need heat to certain temperature and ferment, but the demand of freezing and fermentation can't be satisfied simultaneously to the integrated kitchen of taking refrigeration function now, consequently people need buy special fermentation machine and make food, people's use cost has been increased, people's living space has been compressed simultaneously.

SUMMERY OF THE UTILITY MODEL

The technical problem solved by the utility model is to provide an integrated kitchen, it can effectively solve the problem that the freezing and fermentation of food can't be realized simultaneously to current integrated kitchen.

The technical problem is solved by the following technical scheme:

an integrated cooker comprising: the case body is provided with an installation cavity;

the inner container is provided with an opening at one side and is arranged in the mounting cavity;

the cabinet door is movably connected to the case main body and used for opening and closing the opening of the inner container;

the refrigeration assembly comprises a first semiconductor refrigeration piece, and the first semiconductor refrigeration piece comprises a first power supply input end and a second power supply input end; one working end of the first semiconductor refrigerating piece is tightly attached to the outer wall surface of the inner container;

the controller comprises a control circuit and a switching circuit, the control circuit is connected with the switching circuit, the switching circuit comprises a first output end and a second output end, the first output end is electrically connected with the first power input end, and the second output end is electrically connected with the second power input end; the switching circuit switches the current output directions of the first output end and the second output end according to the control signal output by the control circuit.

Integrated kitchen, compare with the background art, the beneficial effect who has is:

the utility model discloses an integrated kitchen, through the first semiconductor refrigeration spare that sets up at the outer wall in top of inner bag, control circuit control switching circuit supplies power for first semiconductor refrigeration spare, and first output exports forward current to first power input end, and the electric current flows through first semiconductor refrigeration spare and flows out to the second output by the second power input end again, and the work end that first semiconductor refrigeration spare and inner bag outer wall hug closely can be cold junction or hot junction; if the working end of the first semiconductor refrigerating piece, which is tightly attached to the outer wall surface of the inner container, is a cold end, heat is exchanged with the wall surface of the inner container, so that the internal temperature of the inner container is reduced, and the food refrigerating requirement is met; when food needs to be fermented, the control circuit controls the switching circuit to switch the current output direction, namely the second output end outputs forward current to the second power supply input end, the current flows through the first semiconductor refrigerating piece and then flows out from the first power supply input end to the first output end, and the working end of the first semiconductor refrigerating piece, which is tightly attached to the outer wall surface of the inner container, is a hot end and exchanges heat with the wall surface of the inner container, so that the internal temperature of the inner container is increased, and the food fermentation temperature requirement is met; thereby integrating the freezing function and the fermentation function into a whole, meeting the use requirement of a user and reducing the use cost of the user at the same time.

In one embodiment, the first semiconductor refrigeration member is located at the top center of the inner container.

In one embodiment, the refrigeration assembly further comprises a first heat exchange assembly, the first heat exchange assembly comprises a first heat conduction block and a first heat exchange fan, and one end of the first heat conduction block is tightly attached to the other working end of the first semiconductor refrigeration piece; the first heat exchange fan is installed at the other end of the first heat conduction block, and the controller is electrically connected with the first heat exchange fan.

In one embodiment, the refrigeration assembly further comprises a second semiconductor refrigeration piece, and a working end of the second semiconductor refrigeration piece is tightly attached to the outer wall surface of the inner container; the second semiconductor refrigerating part comprises a third power input end and a fourth power input end, the first output end is electrically connected with the third power input end, and the second output end is electrically connected with the fourth power input end.

In one embodiment, the second semiconductor refrigeration piece is positioned at the bottom center of the inner container.

In one embodiment, a heat-conducting silicone layer is arranged between the first semiconductor refrigerating piece and the inner container; and/or a heat-conducting silicone layer is arranged between the second semiconductor refrigerating piece and the inner container.

In one embodiment, the refrigeration assembly further comprises a second heat exchange assembly, and the second heat exchange assembly is tightly attached to the other working end of the second semiconductor refrigeration piece.

In one embodiment, the second heat exchange assembly comprises a second heat conduction block and a second heat exchange fan, and one end of the second heat conduction block is tightly attached to the other working end of the second semiconductor refrigerating piece; the second heat exchange fan is installed at the other end of the second heat conduction block, and the controller is electrically connected with the second heat exchange fan.

In one embodiment, the outer wall surface of the inner container is coated with an insulating layer, and the insulating layer is provided with through holes for embedding the first semiconductor refrigerating piece and the second semiconductor refrigerating piece.

In one embodiment, the wall surface of the case main body, which is positioned at two sides of the inner container opening, is provided with a vent hole, and the vent hole is communicated with the installation cavity.

Drawings

Fig. 1 is a schematic view of the decomposition structure of the integrated cooker refrigeration assembly, the inner container and the heat preservation layer of the utility model;

FIG. 2 is an enlarged view taken at A in FIG. 1;

fig. 3 is a schematic view of the longitudinal section structure of the integrated cooker refrigeration assembly, the inner container and the heat preservation layer of the utility model;

FIG. 4 is a schematic diagram of the circuit structure of the integrated cooker of the present invention;

fig. 5 is a schematic view of the integrated cooker of the present invention in an overall structure.

Description of reference numerals:

1. a cabinet main body; 10. a vent hole; 2. an inner container; 3. a cabinet door; 4. a refrigeration assembly; 40. a first semiconductor cooling member; 400. a first power supply input terminal; 401. a second power supply input terminal; 41. a first heat exchange assembly; 410. a first heat-conducting block; 411. a first heat exchange fan; 42. a second semiconductor refrigeration member; 420. a third power supply input terminal; 421. a fourth power supply input terminal; 43. a second heat exchange assembly; 430. a second heat-conducting block; 431. a second heat exchange fan; 5. a controller; 50. a control circuit; 51. a switching circuit; 510. a first output terminal; 511. a second output terminal; 6. a heat-insulating layer; 60. and a through hole.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be understood that if the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are used to indicate an orientation or positional relationship based on that shown in the drawings, this is merely for convenience of description and to simplify the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

The appearances of the terms "first", "second", "third" and "fourth" in this specification are not intended to be limiting, but rather are intended to indicate or imply relative importance or to implicitly indicate the number of features indicated. Thus, features defined as "first", "second", "third" and "fourth" may explicitly or implicitly include one or more of the features. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected" and "connected" should be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The present embodiment provides an integrated cooker, as shown in fig. 1 to 5, including: the case comprises a case body 1, wherein the case body 1 is provided with an installation cavity;

the inner container 2 is provided with an opening at one side and is arranged in the installation cavity;

the cabinet door 3 is movably connected to the case main body 1 and used for opening and closing the opening of the inner container 2;

a refrigeration assembly 4, the refrigeration assembly 4 comprising a first semiconductor refrigeration member 40, the first semiconductor refrigeration member 40 comprising a first power input 400 and a second power input 401; one working end of the first semiconductor refrigerating piece 40 is tightly attached to the outer wall surface of the inner container 2;

a controller 5, wherein the controller 5 includes a control circuit 50 and a switching circuit 51, the control circuit 50 is connected to the switching circuit 51, the switching circuit 51 includes a first output terminal 510 and a second output terminal 511, the first output terminal 510 is electrically connected to the first power input terminal 400, and the second output terminal 511 is electrically connected to the second power input terminal 401; the switching circuit 51 switches the current output directions of the first output terminal 510 and the second output terminal 511 according to the control signal output by the control circuit 50.

On the basis of the structure, through the first semiconductor refrigerating element 40 arranged on the outer wall surface of the top of the inner container 2, the control circuit 50 controls the switching circuit 51 to supply power to the first semiconductor refrigerating element 40, the first output end 510 outputs forward current to the first power input end 400, the current flows through the first semiconductor refrigerating element 40 and then flows out to the second output end 511 from the second power input end 401, and the working end of the first semiconductor refrigerating element 40, which is tightly attached to the outer wall surface of the inner container 2, can be a cold end or a hot end; if the working end of the first semiconductor refrigerating piece 40, which is tightly attached to the outer wall surface of the inner container 2, is a cold end, heat is exchanged with the wall surface of the inner container 2, so that the internal temperature of the inner container 2 is reduced, and the food refrigerating requirement is met; when food needs to be fermented, the control circuit 50 controls the switching circuit 51 to switch the current output direction, that is, the second output end 511 outputs a forward current to the second power input end 401, and the current flows through the first semiconductor refrigerating part 40 and then flows out from the first power input end 400 to the first output end 510, so that the working end of the first semiconductor refrigerating part 40, which is tightly attached to the outer wall surface of the inner container 2, is a hot end, and exchanges heat with the wall surface of the inner container 2, and therefore the internal temperature of the inner container 2 rises, and the food fermentation temperature requirement is met; therefore, the freezing function and the fermentation function are integrated, and the use cost of a user is reduced while the use requirement of the user is met.

The utility model discloses a semiconductor refrigeration or heat use is the Peltier effect, when having the galvanic couple return circuit that electric current passes through different semiconductor materials to constitute promptly, except producing irreversible Joule heat, can appear heat absorption, exothermic phenomenon respectively along with the difference of electric current direction in galvanic couple both ends department. By using this effect, when the first semiconductor cooling member 40 is supplied with power, one end (cold end) of the first semiconductor cooling member 40 absorbs heat and transfers the heat to the other end (hot end) of the first semiconductor cooling member 40 to be radiated, and if the power supply polarity of the first semiconductor cooling member 40 is changed, the other end (cold end) of the first semiconductor cooling member 40 absorbs heat and transfers the heat to one end (hot end) of the first semiconductor cooling member 40 to be radiated, thereby cooling or heating is realized at the same end of the first semiconductor cooling member 40.

It should be noted that, in order to achieve the cooling or heating effect, the inner container 2 is made of a metal material with excellent thermal conductivity, such as an aluminum alloy, stainless steel, and the like, and is configured in a conventional structure without specific description, and will not be described herein again.

In addition, the connection between the first semiconductor cooling element 40 and the inner container 2 may be a connection manner such as a screw or a snap, and preferably, in this embodiment, the first semiconductor cooling element 40 is connected to the inner container 2 by a screw.

It should be noted that the control circuit 50 may be composed of an MCU or a CPU and peripheral circuits thereof, the switching circuit 51 may be composed of a switch switching chip, the switch switching chip has two output terminals, one of the output terminals can output a high level and the other output terminal can output a low level, after the control circuit 50 outputs a control signal to the switching circuit 51 to perform current direction switching, correspondingly, one of the output terminals outputs a low level and the other output terminal outputs a high level, thereby completing current output direction switching.

Preferably, in this embodiment, as shown in fig. 1, the first semiconductor refrigeration part 40 is located at the top center of the inner container 2, so that the advantage of the design is that the heat transfer from the inside of the inner container 2 to the bottom is more uniform, and the influence on the processing of the food caused by the excessive temperature difference at each position of the inner container 2 is avoided.

In this embodiment, the refrigeration assembly 4 further includes a first heat exchange assembly 41, the first heat exchange assembly 41 includes a first heat conduction block 410 and a first heat exchange fan 411, and one end of the first heat conduction block 410 is tightly attached to the other working end of the first semiconductor refrigeration member 40; the first heat exchanging fan 411 is installed at the other end of the first heat conducting block 410, and the controller 5 is electrically connected to the first heat exchanging fan 411; by arranging the first heat-conducting block 410 and the first heat-exchanging fan 411, the heat transfer efficiency of the other working end of the first semiconductor refrigerating member 40 is accelerated, so that the refrigerating or heating efficiency of the working end of the first semiconductor refrigerating member 40, which is tightly attached to the outer wall surface of the inner container 2, is improved.

Preferably, in this embodiment, the first heat conducting block 410 may be composed of a plurality of heat conducting fins, wherein one end of each of the plurality of heat conducting fins is integrally formed and is closely attached to the other working end of the first semiconductor cooling element 40, and the first heat exchanging fan 411 faces the other end of the plurality of heat conducting fins, so as to improve the cooling or heating efficiency of the first semiconductor cooling element 40 by increasing the air flow rate and the heat exchanging area.

Further, the first semiconductor cooling element 40, the first heat conducting block 410 and the first heat exchanging fan 411 may be connected by a fastening, a screw, or the like. Preferably, in this embodiment, the first semiconductor cooling element 40, the first heat conducting block 410 and the first heat exchanging fan 411 are connected by screws.

In this embodiment, the refrigeration assembly 4 further includes a second semiconductor refrigeration piece 42 and a second heat exchange assembly 43, and a working end of the second semiconductor refrigeration piece 42 is mounted on the outer wall surface of the inner container 2 in a close fit manner; the second heat exchange assembly 43 is closely mounted at the other working end of the second semiconductor refrigerating element 42; the second semiconductor cooling device 42 includes a third power input end 420 and a fourth power input end 421, the first output end 510 is electrically connected to the third power input end 420, and the second output end 511 is electrically connected to the fourth power input end 421; by adding the second semiconductor cooling member 42, the speed of cooling or heating is increased.

It should be noted that, in order to increase the cooling or heating speed, when the switching circuit 51 simultaneously supplies power to the first semiconductor cooling element 40 and the second semiconductor cooling element 42, the working ends of the first semiconductor cooling element 40 and the second semiconductor cooling element 42 respectively attached to the inner container 2 are both cold ends or hot ends.

In addition, the connection between the second semiconductor refrigeration piece 42 and the inner container 2 may be a connection manner such as a screw or a buckle, and preferably, in this embodiment, the second semiconductor refrigeration piece 42 is connected with the inner container 2 through a screw.

Preferably, the second semiconductor refrigerating part 42 is located at the center of the bottom of the inner container 2, and the same design has the advantages that the position of the second semiconductor refrigerating part 42 is on the same vertical straight line, so that the heat transfer in the inner container 2 is more uniform, and the influence on the processing of food caused by overlarge temperature difference at each part of the inner container 2 is avoided.

Preferably, in this embodiment, a heat-conducting silicone layer is disposed between the first semiconductor refrigerating element 40 and the inner container 2; and/or a heat-conducting silicone layer is arranged between the second semiconductor refrigerating piece 42 and the inner container 2; the design has the advantages that the gap between the semiconductor refrigerating piece and the inner container 2 is reduced, so that the thermal resistance is reduced, and the heat exchange efficiency is improved.

Further, in this embodiment, as shown in fig. 1, the second heat exchanging assembly 43 includes a second heat conducting block 430 and a second heat exchanging fan 431, and one end of the second heat conducting block 430 is closely attached to the other working end of the second semiconductor cooling element 42; the second heat exchanging fan 431 is installed at the other end of the second heat conducting block 430, and the controller 5 is electrically connected to the second heat exchanging fan 431; similarly, by arranging the second heat-conducting block 430 and the second heat-exchanging fan 431, the heat transfer efficiency of the other working end of the second semiconductor refrigerating element 42 is increased, so that the refrigerating or heating efficiency of the working end of the second semiconductor refrigerating element 42, which is tightly attached to the outer wall surface of the inner container 2, is increased.

Preferably, in this embodiment, the second heat conducting block 430 may be formed by a plurality of heat conducting fins, wherein one end of each of the plurality of heat conducting fins is integrally formed and is closely attached to the other working end of the second semiconductor cooling element 42, and the second heat exchanging fan 431 faces the other end of the plurality of heat conducting fins, so as to increase the cooling or heating efficiency of the second semiconductor cooling element 42 by increasing the air flow rate and the heat exchanging area.

Further, the second semiconductor cooling element 42, the second heat conducting block 430 and the second heat exchanging fan 431 may be connected to each other by a fastening, a screw, or the like. Preferably, in this embodiment, the second semiconductor cooling element 42, the second heat conducting block 430 and the second heat exchanging fan 431 are connected by screws.

In this embodiment, the outer wall surface of the inner container is coated with an insulating layer 6, and the insulating layer 6 is provided with a through hole 60 for the first semiconductor refrigeration piece 40 and the second semiconductor refrigeration piece 42 to be embedded in; the design has the advantages of reducing the heat transfer between the inner container 2 and the outside and improving the refrigeration or heating effect of the inner container 2.

It should be noted that the heat insulating layer 6 may be made of materials such as phenolic resin, rubber-plastic sponge, polyurethane foam, etc., and all of them are conventional structures without specific description, and this embodiment is not excluded or limited.

In this embodiment, as shown in fig. 4, the wall surface of the case main body 1 located at two sides of the opening of the inner container 2 is provided with a vent hole 10, the vent hole 10 is communicated with the installation cavity, and thus, heat or cold generated by the semiconductor refrigeration piece during operation is discharged to the external environment, so that the refrigeration or heating efficiency of the semiconductor refrigeration piece is maintained stable.

In the detailed description of the embodiments, various technical features may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The details of the foregoing embodiments are merely representative of several embodiments of the present invention, which are described in more detail and detail, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. An integrated cooker, characterized by comprising: the case body is provided with an installation cavity;

a refrigeration assembly comprising a first semiconductor refrigeration piece comprising a first power input and a second power input; one working end of the first semiconductor refrigerating piece is tightly attached to the outer wall surface of the inner container;

2. The integrated cooker according to claim 1, wherein the first semiconductor cooler is located at a top center position of the inner container.

3. The integrated cooker according to claim 1, wherein the refrigeration assembly further comprises a first heat exchange assembly, the first heat exchange assembly comprises a first heat conduction block and a first heat exchange fan, and one end of the first heat conduction block is closely attached to the other working end of the first semiconductor refrigeration member; the first heat exchange fan is installed at the other end of the first heat conduction block, and the controller is electrically connected with the first heat exchange fan.

4. The integrated cooker according to claim 2, wherein the refrigerating assembly further comprises a second semiconductor refrigerating piece, and a working end of the second semiconductor refrigerating piece is tightly attached to the outer wall surface of the inner container; the second semiconductor refrigeration piece comprises a third power input end and a fourth power input end, the first output end is electrically connected with the third power input end, and the second output end is electrically connected with the fourth power input end.

5. The integrated cooker according to claim 4, wherein the second semiconductor refrigeration piece is located at the bottom center position of the inner container.

6. The integrated cooker according to claim 4, wherein a heat-conducting silicone layer is arranged between the first semiconductor refrigerating piece and the inner container;

and/or a heat-conducting silicone layer is arranged between the second semiconductor refrigerating piece and the inner container.

7. The integrated cooker according to claim 4, wherein the cooling assembly further comprises a second heat exchange assembly, and the second heat exchange assembly is tightly mounted at the other working end of the second semiconductor cooling member.

8. The integrated cooker according to claim 7, wherein the second heat exchange assembly comprises a second heat conduction block and a second heat exchange fan, one end of the second heat conduction block is closely attached to the other working end of the second semiconductor cooler, and the second heat exchange fan is attached to the other end of the second heat conduction block; the controller is electrically connected with the second heat exchange fan.

9. The integrated cooker according to claim 4, wherein the outer wall surface of the inner container is coated with a heat insulating layer, and the heat insulating layer is provided with through holes for the first semiconductor refrigerating member and the second semiconductor refrigerating member to be embedded in.

10. The integrated cooker according to any one of claims 1 to 9, wherein the cabinet body has vent holes on the wall surfaces thereof at both sides of the opening of the inner container, and the vent holes are communicated with the installation cavity.