CN117948621A

CN117948621A - Integrated kitchen

Info

Publication number: CN117948621A
Application number: CN202211324557.1A
Authority: CN
Inventors: 傅平; 李运胜; 刘昌林
Original assignee: Shenzhen Casdon Electrical Appliance Co ltd
Current assignee: Shenzhen Casdon Electrical Appliance Co ltd
Priority date: 2022-10-27
Filing date: 2022-10-27
Publication date: 2024-04-30

Abstract

The invention discloses an integrated kitchen, comprising: the refrigerator comprises a case main body, an inner container, a cabinet door, a refrigerating assembly and a controller; the case body is provided with an installation cavity; one side of the inner container is opened and is arranged in the mounting cavity; the cabinet door can be movably connected to the cabinet body and used for opening and closing the opening of the inner container; the refrigeration assembly comprises a first semiconductor refrigeration piece, wherein the first semiconductor refrigeration piece comprises a first power input end and a second power input end; a working end of the first semiconductor refrigeration piece is tightly attached to the outer wall surface of the inner container; the controller comprises a control circuit and a switching circuit which are connected with each other, wherein the switching circuit comprises a first output end which is electrically connected with a first power input end and a second output end which is electrically connected with a second power input end; the switching circuit switches the current output directions of the first output end and the second output end according to the control signal output by the control circuit; the invention integrates the freezing and fermenting functions, thereby meeting the use requirement of users and reducing the use cost of the users.

Description

Integrated kitchen

Technical Field

The invention relates to the technical field of kitchen appliances, in particular to an integrated kitchen range.

Background

At present, kitchen space is smaller and smaller due to the problem of room price, and in order to achieve the function maximization, the household electrical appliance product is miniaturized, modularized and multifunctional integrated in structure, and the space sense and the use sense which are concise for consumers are restored. The existing integrated kitchen range in the market not only has the cooking function, but also has various functional modules, such as a sterilizing cabinet, a water purifier, an automatic electric cooker, an electric oven, a microwave oven and an air conditioner.

In daily diet life, people have processing demands on some foods, such as ice cream and ice cubes, so that an integrated stove with a refrigerating function appears on the market in the prior art, however, fermentation of some foods, such as yoghurt, sweet wine, natto, rice wine and cheese, is often required to be heated to a certain temperature for fermentation, but the existing integrated stove with the refrigerating function cannot meet the demands of freezing and fermentation at the same time, so that people need to buy special fermentation machines for making the foods, the use cost of people is increased, and the living space of people is compressed.

Disclosure of Invention

The invention aims to provide an integrated kitchen range, which can effectively solve the problem that the existing integrated kitchen range can not realize the freezing and fermentation of food at the same time.

The technical problems are solved by the following technical scheme:

an integrated cooktop, comprising: the case body is provided with an installation cavity;

the inner container is opened at one side and is arranged in the mounting cavity;

The cabinet door can be movably connected to the cabinet main body and used for opening and closing the opening of the inner container;

the refrigeration assembly comprises a first semiconductor refrigeration piece, wherein the first semiconductor refrigeration piece comprises a first power input end and a second power input end; a working end of the first semiconductor refrigeration piece is closely attached to the outer wall surface of the inner container;

The controller comprises a control circuit and a switching circuit, wherein the control circuit is connected with the switching circuit, the switching circuit comprises a first output end and a second output end, the first output end is electrically connected with the first power input end, and the second output end is electrically connected with the second power input end; the switching circuit switches the current output directions of the first output end and the second output end according to the control signal output by the control circuit.

Compared with the background technology, the integrated stove has the following beneficial effects:

According to the integrated kitchen, the first semiconductor refrigerating piece is arranged on the outer wall surface of the top of the inner container, the control circuit controls the switching circuit to supply power to the first semiconductor refrigerating piece, the first output end outputs forward current to the first power input end, the current flows through the first semiconductor refrigerating piece and then flows out to the second output end from the second power input end, and the working end, which is tightly attached to the outer wall surface of the inner container, of the first semiconductor refrigerating piece can be a cold end or a hot end; if the working end of the first semiconductor refrigeration piece, which is tightly attached to the outer wall surface of the inner container, is a cold end, heat exchange is performed with the inner container wall surface, so that the temperature inside the inner container is reduced, and the food freezing requirement is met; when food needs to be fermented, the control circuit controls the switching circuit to switch the current output direction, namely the second output end outputs forward current to the second power input end, the current flows through the first semiconductor refrigerating piece and flows out to the first output end from the first power input end, the working end of the first semiconductor refrigerating piece, which is tightly attached to the outer wall surface of the inner container, is a hot end, and heat exchange is performed with the wall surface of the inner container, so that the internal temperature of the inner container is increased, and the food fermentation temperature requirement is met; therefore, the freezing and fermentation functions are integrated, and the use cost of a user is reduced while the use requirement of the user is met.

In one embodiment, the first semiconductor refrigeration element is located at a top center position of the liner.

In one embodiment, the refrigeration assembly further comprises a first heat exchange assembly, the first heat exchange assembly comprises a first heat conduction block and a first heat exchange fan, and one end of the first heat conduction block is closely attached to the other working end of the first semiconductor refrigeration piece; the first heat exchange fan is arranged at the other end of the first heat conduction block, and the controller is electrically connected with the first heat exchange fan.

In one embodiment, the refrigeration assembly further comprises a second semiconductor refrigeration piece, and a working end of the second semiconductor refrigeration piece is closely mounted on the outer wall surface of the liner; the second semiconductor refrigerating piece comprises a third power input end and a fourth power input end, the first output end is electrically connected with the third power input end, and the second output end is electrically connected with the fourth power input end.

In one embodiment, the second semiconductor refrigeration piece is located at the bottom center of the inner container.

In one embodiment, a heat-conducting silicone grease layer is arranged between the first semiconductor refrigerating piece and the inner container; and/or a heat conduction silicone grease layer is arranged between the second semiconductor refrigerating piece and the inner container.

In one embodiment, the refrigeration assembly further comprises a second heat exchange assembly, and the second heat exchange assembly is closely mounted on the other working end of the second semiconductor refrigeration piece.

In one embodiment, the second heat exchange assembly comprises a second heat conduction block and a second heat exchange fan, wherein one end of the second heat conduction block is closely attached to the other working end of the second semiconductor refrigeration piece; the second heat exchange fan is arranged at the other end of the second heat conduction block, and the controller is electrically connected with the second heat exchange fan.

In one embodiment, the outer wall surface of the inner container is coated with an insulation layer, and the insulation layer is provided with a through hole in which the first semiconductor refrigerating piece and the second semiconductor refrigerating piece are embedded.

In one embodiment, the wall surfaces of the case body, which are located at two sides of the opening of the inner container, are provided with ventilation holes, and the ventilation holes are communicated with the installation cavity.

Drawings

FIG. 1 is a schematic diagram of an exploded construction of an integrated range refrigeration assembly, liner and insulation of the present invention;

FIG. 2 is an enlarged view of FIG. 1 at A;

FIG. 3 is a schematic view of a longitudinal cross-sectional structure of the integrated oven refrigeration assembly, inner container and insulation layer of the present invention;

FIG. 4 is a schematic diagram of an integrated stove circuit structure according to the present invention;

fig. 5 is a schematic view of the integrated kitchen range in the whole structure.

Description of the reference numerals:

1. a case main body; 10. a vent hole; 2. an inner container; 3. a cabinet door; 4. a refrigeration assembly; 40. a first semiconductor refrigeration member; 400. a first power input; 401. a second power input; 41. a first heat exchange assembly; 410. a first heat conduction block; 411. a first heat exchange fan; 42. a second semiconductor refrigeration member; 420. a third power input; 421. a fourth power input; 43. a second heat exchange assembly; 430. a second heat conduction block; 431. a second heat exchange fan; 5. a controller; 50. a control circuit; 51. a switching circuit; 510. a first output terminal; 511. a second output terminal; 6. a heat preservation layer; 60. and a through hole.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

In the description of the present invention, it should be understood that, if the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc. indicate or refer to an orientation or a positional relationship based on that shown in the drawings, it is merely for convenience of describing the present invention and simplifying the description, and does not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.

The terms "first," "second," "third," "fourth," and the like, if any, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or an implicit indication of the number of features being indicated. Thus, a feature defining "a first", "a second", "a third" and a fourth "may explicitly or implicitly include one or more such feature. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present invention, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.

The present embodiment provides an integrated cooker, as shown in fig. 1to 5, including: the case comprises a case body 1, wherein the case body 1 is provided with an installation cavity;

The inner container 2 is opened at one side of the inner container 2 and is arranged in the installation cavity;

The cabinet door 3 can be movably connected to the cabinet main body 1 and used for opening and closing the opening of the liner 2;

A refrigeration assembly 4, said refrigeration assembly 4 comprising a first semiconductor refrigeration member 40, said first semiconductor refrigeration member 40 comprising a first power input 400 and a second power input 401; a working end of the first semiconductor refrigeration element 40 is closely attached to the outer wall surface of the liner 2;

The controller 5, the controller 5 includes a control circuit 50 and a switching circuit 51, the control circuit 50 is connected with the switching circuit 51, the switching circuit 51 includes a first output terminal 510 and a second output terminal 511, the first output terminal 510 is electrically connected with the first power input terminal 400, and the second output terminal 511 is electrically connected with the second power input terminal 401; the switching circuit 51 switches the current output directions of the first output terminal 510 and the second output terminal 511 according to the control signal output from the control circuit 50.

Based on the above structure, the control circuit 50 controls the switching circuit 51 to supply power to the first semiconductor refrigeration element 40 through the first semiconductor refrigeration element 40 arranged on the top outer wall surface of the liner 2, the first output end 510 outputs forward current to the first power input end 400, the current flows through the first semiconductor refrigeration element 40 and then flows out to the second output end 511 from the second power input end 401, and the working end of the first semiconductor refrigeration element 40, which is tightly attached to the outer wall surface of the liner 2, can be a cold end or a hot end; if the working end of the first semiconductor refrigeration piece 40, which is tightly attached to the outer wall surface of the inner container 2, is a cold end, heat exchange is performed with the wall surface of the inner container 2, so that the temperature inside the inner container 2 is reduced, and the food freezing requirement is met; when food needs to be fermented, the control circuit 50 controls the switching circuit 51 to switch the current output direction, namely the second output end 511 outputs forward current to the second power input end 401, the current flows through the first semiconductor refrigeration piece 40 and then flows out from the first power input end 400 to the first output end 510, the working end of the first semiconductor refrigeration piece 40, which is tightly attached to the outer wall surface of the inner container 2, is a hot end, and exchanges heat with the wall surface of the inner container 2, so that the internal temperature of the inner container 2 is increased, and the food fermentation temperature requirement is met; therefore, the freezing and fermentation functions are integrated, and the use cost of a user is reduced while the use requirement of the user is met.

The semiconductor refrigerating or heating device uses the Peltier effect, namely, when current passes through a couple loop formed by different semiconductor materials, irreversible Joule heat is generated, and heat absorption and heat release phenomena can be respectively generated at two ends of the couple along with different current directions. By utilizing this effect, when the first semiconductor refrigeration member 40 is powered, one end (cold end) of the first semiconductor refrigeration member 40 absorbs heat and transfers the heat to the other end (hot end) of the first semiconductor refrigeration member 40 to be emitted, and if the power supply polarity of the first semiconductor refrigeration member 40 is changed, the other end (cold end) of the first semiconductor refrigeration member 40 absorbs heat and transfers the heat to the one end (hot end) of the first semiconductor refrigeration member 40 to be emitted, and refrigeration or heating is realized at the same end of the first semiconductor refrigeration member 40.

In order to achieve the cooling or heating effect, the inner container 2 is made of a metal material with excellent heat conductivity, such as an aluminum alloy, stainless steel, and the like, and is provided with a conventional structure without any particular description, and will not be described here again.

In addition, the connection between the first semiconductor refrigeration element 40 and the inner container 2 may be a screw connection, a snap connection, or the like, and preferably, in this embodiment, the first semiconductor refrigeration element 40 is connected to the inner container 2 by a screw.

It should be noted that, the control circuit 50 may be formed by an MCU or a CPU and its peripheral circuits, the switching circuit 51 may be formed by a switching chip, and the switching chip has two output terminals, one of the output terminals may output a high level and the other output terminal outputs a low level, and after the control circuit 50 outputs a control signal to the switching circuit 51 to switch the current direction, one of the output terminals outputs a low level and the other output terminal outputs a high level, so as to complete the current output direction switching.

Preferably, in this embodiment, as shown in fig. 1, the first semiconductor refrigeration member 40 is located at the top center of the inner container 2, which has the advantage of making the heat transfer from the inner part of the inner container 2 downward more uniform, and avoiding the influence of excessive temperature difference across the inner container 2 on the processing of food.

In this embodiment, the refrigeration unit 4 further includes a first heat exchange unit 41, where the first heat exchange unit 41 includes a first heat conduction block 410 and a first heat exchange fan 411, and one end of the first heat conduction block 410 is closely mounted on the other working end of the first semiconductor refrigeration unit 40; the first heat exchange fan 411 is mounted at the other end of the first heat conduction block 410, and the controller 5 is electrically connected with the first heat exchange fan 411; by providing the first heat conducting block 410 and the first heat exchanging fan 411, the heat transfer efficiency of the other working end of the first semiconductor refrigeration element 40 is increased, so that the refrigeration or heating efficiency of the working end of the first semiconductor refrigeration element 40 and the outer wall surface of the liner 2 are improved.

Preferably, in the present embodiment, the first heat conducting block 410 may be formed of a plurality of heat conducting fins, wherein one ends of the plurality of heat conducting fins are integrally formed and are closely attached to the other working ends of the first semiconductor refrigeration member 40, and the first heat exchanging fan 411 faces the other ends of the plurality of heat conducting fins, so as to improve the refrigeration or heating efficiency of the first semiconductor refrigeration member 40 by improving the air flow rate and the heat exchanging area.

Further, the first semiconductor refrigeration unit 40, the first heat conducting block 410 and the first heat exchanging fan 411 may be connected by a fastening, a screw, or the like. Preferably, in the present embodiment, screw connection is adopted among the first semiconductor refrigeration piece 40, the first heat conduction block 410 and the first heat exchange fan 411.

In this embodiment, the refrigeration assembly 4 further includes a second semiconductor refrigeration member 42 and a second heat exchange assembly 43, where a working end of the second semiconductor refrigeration member 42 is closely mounted on the outer wall surface of the inner container 2; the second heat exchange component 43 is closely mounted on the other working end of the second semiconductor refrigeration piece 42; the second semiconductor refrigeration unit 42 includes a third power input terminal 420 and a fourth power input terminal 421, the first output terminal 510 is electrically connected to the third power input terminal 420, and the second output terminal 511 is electrically connected to the fourth power input terminal 421; by adding the second semiconductor cooling member 42, the cooling or heating speed is increased.

In order to increase the cooling or heating speed, when the switching circuit 51 supplies power to the first semiconductor refrigeration device 40 and the second semiconductor refrigeration device 42 at the same time, the working ends of the first semiconductor refrigeration device 40 and the second semiconductor refrigeration device 42, which are respectively in close contact with the liner 2, are both cold ends or hot ends.

In addition, the connection between the second semiconductor refrigeration element 42 and the inner container 2 may be a screw connection or a snap connection, and in this embodiment, the second semiconductor refrigeration element 42 is preferably connected to the inner container 2 by a screw connection.

Preferably, the second semiconductor cooling element 42 is located at the bottom center of the inner container 2, which has the advantage of being on a straight line in the same vertical direction as the first semiconductor cooling element 40, so that the heat transfer from the inner part of the inner container 2 to the upper side is more uniform, and the influence on the processing of food due to the overlarge temperature difference of the inner container 2 is avoided.

Preferably, in this embodiment, a heat-conducting silicone grease layer is disposed between the first semiconductor refrigeration unit 40 and the inner container 2; and/or a heat conduction silicone grease layer is arranged between the second semiconductor refrigeration piece 42 and the inner container 2; the design has the advantages of reducing the clearance between the semiconductor refrigerating piece and the liner 2, thereby reducing the thermal resistance and improving the heat exchange efficiency.

Further, in the present embodiment, as shown in fig. 1, the second heat exchange assembly 43 includes a second heat conducting block 430 and a second heat exchange fan 431, and one end of the second heat conducting block 430 is closely mounted on the other working end of the second semiconductor refrigeration unit 42; the second heat exchange fan 431 is installed at the other end of the second heat conduction block 430, and the controller 5 is electrically connected with the second heat exchange fan 431; similarly, by providing the second heat conducting block 430 and the second heat exchanging fan 431, the heat transfer efficiency of the other working end of the second semiconductor refrigeration member 42 is increased, so that the refrigeration or heating efficiency of the working end of the second semiconductor refrigeration member 42 and the outer wall surface of the liner 2 are improved.

Preferably, in the present embodiment, the second heat conducting block 430 may be formed of a plurality of heat conducting fins, wherein one ends of the plurality of heat conducting fins are integrally formed and closely attached to the other working ends of the second semiconductor refrigeration member 42, and the second heat exchanging fan 431 faces the other ends of the plurality of heat conducting fins, so as to improve the refrigeration or heating efficiency of the second semiconductor refrigeration member 42 by improving the air flow rate and the heat exchanging area.

Further, the second semiconductor refrigeration member 42, the second heat conduction block 430 and the second heat exchange fan 431 may be connected by a fastening, a screw, or the like. Preferably, in the present embodiment, the second semiconductor refrigeration member 42, the second heat conduction block 430 and the second heat exchange fan 431 are connected by screws.

In this embodiment, the outer wall surface of the inner container is covered with an insulation layer 6, and the insulation layer 6 is provided with a through hole 60 into which the first semiconductor refrigeration element 40 and the second semiconductor refrigeration element 42 are embedded; the design has the advantages of reducing the heat transfer between the inner container 2 and the outside and improving the refrigerating or heating effect of the inner container 2.

It should be noted that, the heat insulation layer 6 may be made of phenolic resin, rubber-plastic sponge, polyurethane foam, etc., and is not limited by the conventional structure without being specifically described.

In this embodiment, as shown in fig. 4, the walls of the case body 1 at two sides of the opening of the inner container 2 are provided with ventilation holes 10, and the ventilation holes 10 are communicated with the installation cavity, so that the heat or cold generated when the semiconductor refrigerating element works is discharged to the external environment, and the refrigerating or heating efficiency of the semiconductor refrigerating element is maintained stable.

In the specific content of the above embodiment, any combination of the technical features may be performed without contradiction, and for brevity of description, all possible combinations of the technical features are not described, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The foregoing detailed description of the embodiments presents only a few embodiments of the present invention, which are described in some detail and are not intended to limit the scope of the present invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.

Claims

1. An integrated cooktop, comprising: the case body is provided with an installation cavity;

2. The integrated cooker of claim 1, wherein the first semiconductor cooler is located at a top center position of the inner container.

3. The integrated cooker of claim 1, wherein the refrigeration assembly further comprises a first heat exchange assembly comprising a first heat conduction block and a first heat exchange fan, one end of the first heat conduction block being mounted in close proximity to the other working end of the first semiconductor refrigeration member; the first heat exchange fan is arranged at the other end of the first heat conduction block, and the controller is electrically connected with the first heat exchange fan.

4. The integrated cooker of claim 2, wherein the refrigeration assembly further comprises a second semiconductor refrigeration member, a working end of the second semiconductor refrigeration member being mounted in close proximity to the outer wall surface of the inner container; the second semiconductor refrigerating piece comprises a third power input end and a fourth power input end, the first output end is electrically connected with the third power input end, and the second output end is electrically connected with the fourth power input end.

5. The integrated cooker of claim 4, wherein the second semiconductor cooler is located at a bottom center position of the inner container.

6. The integrated cooker of claim 4, wherein a heat conductive silicone grease layer is provided between the first semiconductor refrigeration member and the inner container;

And/or a heat conduction silicone grease layer is arranged between the second semiconductor refrigerating piece and the inner container.

7. The integrated cooker of claim 4, wherein the refrigeration assembly further comprises a second heat exchange assembly mounted snugly to the other working end of the second semiconductor refrigeration member.

8. The integrated cooker of claim 7, wherein the second heat exchanging assembly comprises a second heat conducting block and a second heat exchanging fan, one end of the second heat conducting block is closely mounted on the other working end of the second semiconductor refrigerating element, and the second heat exchanging fan is mounted on the other end of the second heat conducting block; the controller is electrically connected with the second heat exchange fan.

9. The integrated cooker according to claim 4, wherein an outer wall surface of the inner container is covered with a heat insulating layer, and the heat insulating layer is provided with a through hole into which the first semiconductor refrigerating element and the second semiconductor refrigerating element are embedded.

10. The integrated cooker of any one of claims 1 to 9, wherein ventilation holes are provided in the wall surfaces of the case body on both sides of the inner container opening, and the ventilation holes are communicated with the installation cavity.