CN113208419A

CN113208419A - Cooking device

Info

Publication number: CN113208419A
Application number: CN202110663599.7A
Authority: CN
Inventors: 任富佳; 宋龙龙; 冯国华; 潘艳丽; 刘连超
Original assignee: Hangzhou Robam Appliances Co Ltd
Current assignee: Hangzhou Robam Appliances Co Ltd
Priority date: 2021-06-15
Filing date: 2021-06-15
Publication date: 2021-08-06

Abstract

The invention relates to the field of cooking equipment, in particular to a cooking device. The cooking device comprises a cooking cavity and a refrigerating system, wherein the refrigerating system comprises a semiconductor refrigerating sheet and a heat conducting assembly; the heat conduction assembly comprises a plurality of heat conduction pipes which are communicated with each other, heat conduction liquid is arranged in the heat conduction pipes, the heat conduction pipes surround the cooking cavity and are in heat conduction connection with the cooking cavity, and the refrigerating surface of the semiconductor refrigerating piece is in contact with the heat conduction assembly in a laminating mode. The cooking device provided by the invention can keep food fresh, reduce the food deterioration probability, reduce the amount and temperature of steam discharged at the moment of opening the door after cooking is finished, and even can not discharge steam, so that the probability of scalding a user by the steam is reduced, the problem of heavy kitchen moisture is relieved, and the user experience is improved.

Description

Cooking device

Technical Field

The invention relates to the field of cooking equipment, in particular to a cooking device.

Background

The existing cooking devices (such as an electric steamer, an electric oven, a steaming and baking integrated machine and the like) generally only have cooking functions and do not have refrigeration and freezing functions, so that when a user utilizes the reserved cooking function, the freshness of food materials put into the cooking device in advance is difficult to ensure; after cooking is finished, if the user does not take out the food materials in time, the food materials are easy to deteriorate; in addition, for the cooking device with steaming function, after the food materials are steamed, a large amount of high-temperature steam can be discharged instantly when the door is opened, and the high-temperature steam not only easily scalds a user, but also easily causes the heavy moisture in a kitchen, thereby greatly influencing the user experience.

In summary, how to overcome the above-mentioned defects of the existing cooking devices is a technical problem to be solved by those skilled in the art.

Disclosure of Invention

The invention aims to provide a cooking device, which aims to solve the technical problems that food materials cannot be preserved and a large amount of high-temperature steam is easily discharged at the moment of opening a door in the cooking device in the prior art.

The invention provides a cooking device which comprises a cooking cavity and a refrigerating system, wherein the refrigerating system comprises a semiconductor refrigerating sheet and a heat conducting assembly.

The heat conduction assembly comprises a plurality of heat conduction pipes which are communicated with each other, heat conduction liquid is arranged in the heat conduction pipes, the heat conduction pipes surround the outside of the cooking cavity and are in heat conduction connection with the cooking cavity, and the refrigerating surface of the semiconductor refrigerating piece is in contact with the heat conduction assembly in a laminating manner.

Preferably, as an implementation mode, the heat conducting assembly further comprises a liquid circulating pump, and the liquid circulating pump is communicated with the heat conducting pipe and is used for driving the heat conducting liquid in the heat conducting pipe to circulate.

Preferably, as an implementable mode, the heat conducting assembly comprises a liquid storage box, the heat conducting pipe is communicated with the liquid storage box, and the liquid storage box is in contact with the refrigerating surface of the semiconductor refrigerating sheet in a fitting manner.

Preferably, as an implementation mode, the heat conduction pipe includes a liquid outlet pipe, a liquid return pipe, a first main pipe, a second main pipe and a plurality of capillary tubes.

Many the both ends of capillary are equallyd divide respectively with first being responsible for with the second is responsible for the intercommunication, first be responsible for with the drain pipe intercommunication, the second be responsible for with return the liquid pipe intercommunication, the drain pipe with return the liquid pipe and pass through liquid storage box intercommunication.

Preferably, as an implementation mode, the liquid outlet pipe comprises a first liquid outlet pipe section and a second liquid outlet pipe section, and the first liquid outlet pipe section is communicated with the second liquid outlet pipe section through the liquid circulating pump;

or the liquid return pipe comprises a first liquid return pipe section and a second liquid return pipe section, and the first liquid return pipe section is communicated with the second liquid return pipe section through the liquid circulating pump.

Preferably, as an implementation mode, each capillary is U-shaped, the capillary surrounds the bottom wall and the two side walls of the cooking cavity, and the capillaries are arranged at intervals along the depth direction of the cooking cavity.

Preferably, as an embodiment, the cross-sectional area of the in-tube channel of the liquid outlet tube is greater than or equal to the total cross-sectional area of the in-tube channels of the plurality of capillary tubes, and/or the cross-sectional area of the in-tube channel of the liquid return tube is less than or equal to the total cross-sectional area of the in-tube channels of the plurality of capillary tubes.

Preferably, as an implementable manner, the cooking device further comprises a heat dissipation mechanism, the heat dissipation mechanism is opposite to the heating surface of the semiconductor chilling plate, and the heat dissipation mechanism is used for dissipating heat from the heating surface of the semiconductor chilling plate.

Preferably, as an implementable mode, the heat dissipation mechanism includes a heat dissipation fan and a heat dissipation air duct, a window is formed in the heat dissipation air duct, the semiconductor refrigeration sheet is installed at the window, a heating surface of the semiconductor refrigeration sheet faces the inside of the heat dissipation air duct, and the heat dissipation fan is used for driving air flow in the heat dissipation air duct to flow towards the air outlet.

Preferably, as an implementation manner, a heat dissipation fin is installed at the window, the heat dissipation fin is located on one side of the semiconductor refrigeration fin facing the heat dissipation air duct, a heating surface of the semiconductor refrigeration fin is attached to the heat dissipation fin, and a heat dissipation area of the heat dissipation fin is larger than an area of the heating surface of the semiconductor refrigeration fin;

and/or, a heat insulation plate is installed at the window, the heat insulation plate is located on one side, deviating from the heat dissipation air duct, of the cooling fin, a mounting hole is formed in the heat insulation plate, and the semiconductor refrigeration piece is embedded in the mounting hole.

Preferably, as an implementation mode, the cooking device comprises a controller, the semiconductor chilling plate is connected with a power supply through an electronic switch, and the electronic switch is electrically connected with the controller.

The controller is used for controlling the electronic switch to be turned on when cooking is finished; and/or the controller is used for controlling the electronic switch to be turned on after the timing for making dishes is started; and/or the controller is used for controlling the electronic switch to be closed after the timing of the reserved cooking is finished.

Preferably, as an implementation mode, a temperature sensor is installed in the cavity of the cooking cavity and used for sensing the temperature in the cooking cavity; the temperature sensor is electrically connected with the controller, the controller is used for controlling the electronic switch to be switched on when the temperature sensed by the temperature sensor is higher than a high threshold value, and the controller is used for controlling the electronic switch to be switched off when the temperature sensed by the temperature sensor is reduced to a low threshold value.

Compared with the prior art, the cooking device provided by the invention has the beneficial effects that:

the invention provides a cooking device, which comprises a cooking cavity and a refrigerating system, wherein the refrigerating system mainly comprises a semiconductor refrigerating sheet and a heat conducting assembly, the heat conducting assembly comprises a plurality of heat conducting pipes which are communicated with each other, heat conducting liquid exists in the heat conducting pipes, the heat conducting pipes surround the outside of the cooking cavity of the cooking device and are in heat conducting connection with the cooking cavity, and therefore the heat conducting liquid in the heat conducting pipes can exchange heat with the cooking cavity; the refrigerating surface of the semiconductor refrigerating sheet is in contact with the heat conducting assembly in a laminating mode, and therefore the heat conducting assembly (the heat conducting pipe and the heat conducting liquid) is cooled through the semiconductor refrigerating sheet.

When the food materials need to be refrigerated or frozen for fresh keeping by using the cooking device, or after the cooking device finishes steaming, the cooking device provided by the invention can be started, the heat in the cooking cavity can be conducted to the refrigerating surface of the semiconductor refrigerating sheet through the heat conduction pipe and the heat conduction liquid in the cooking cavity, the refrigerating surface of the semiconductor refrigerating sheet can transfer the heat from the heat conduction pipe and the heat conduction liquid to the heating surface of the semiconductor refrigerating sheet and dissipate the heat, and the operation is carried out for a period of time so that the temperature in the cooking cavity can be reduced.

Therefore, on one hand, the cooking device provided by the invention can realize the functions of refrigerating and refreshing or freezing and refreshing the food materials in the cooking cavity, not only can ensure the freshness of the food materials which are put into the cooking device in advance, but also can refrigerate and refresh the food materials after the cooking is finished; on the other hand, the steam that cooking device produced in the culinary art process can condense into liquid to, the steam volume and the temperature of exhaust can reduce when opening the door, can not discharge steam even, not only reduced the probability that the user was scalded by steam, but also can alleviate the problem that kitchen moisture became heavy, improved user experience.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a schematic perspective view illustrating an internal structure of a cooking apparatus according to an embodiment of the present invention;

fig. 2 is an exploded view of a part of a cooking apparatus according to an embodiment of the present invention;

fig. 3 is a schematic diagram of a further exploded structure of the cooking device in fig. 2 according to the embodiment of the present invention.

Icon:

100-a cooking cavity;

200-semiconductor refrigerating sheets; 210-a refrigeration surface; 220-heating noodles;

310-a liquid outlet pipe; 320-a liquid return pipe; 330-a capillary; 340-a first main tube; 350-a second main pipe;

400-liquid circulation pump;

500-a liquid storage cartridge;

600-a heat dissipation fan;

700-a heat dissipation air duct;

800-a heat sink;

900-heat insulation plate; 910-mounting holes.

Detailed Description

The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "inside", "outside", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted" and "connected" are to be interpreted broadly, e.g., as being either fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The present invention will be described in further detail below with reference to specific embodiments and with reference to the attached drawings.

Referring to fig. 1 and 2, the present embodiment provides a cooking apparatus, which includes a cooking cavity 100 and a refrigeration system, the refrigeration system mainly includes a semiconductor refrigeration sheet 200 and a heat conduction assembly, wherein the heat conduction assembly includes a plurality of heat conduction pipes connected to each other, heat conduction liquid exists in the heat conduction pipes, and the heat conduction pipes surround the cooking cavity 100 of the cooking apparatus and are in heat conduction connection with the cooking cavity 100, so that the heat conduction liquid in the heat conduction pipes can exchange heat with the cooking cavity 100; the refrigerating surface 210 of the semiconductor refrigerating sheet 200 is in contact with the heat conducting component in an attaching manner, so that the heat conducting component (the heat conducting pipe and the heat conducting liquid) is cooled by the semiconductor refrigerating sheet 200.

When the food materials need to be refrigerated or frozen for fresh keeping by using the cooking device, or after the cooking device finishes steaming, the cooking device provided by the invention can be started, the heat in the cooking cavity 100 can be conducted to the refrigerating surface 210 of the semiconductor refrigerating sheet 200 through the heat conduction pipe and the heat conduction liquid in the heat conduction pipe, the refrigerating surface 210 of the semiconductor refrigerating sheet 200 can transfer the heat from the heat conduction pipe and the heat conduction liquid to the heating surface 220 of the semiconductor refrigerating sheet 200 and dissipate the heat, and the operation is carried out for a period of time, so that the temperature in the cooking cavity 100 can be reduced.

Therefore, the cooking device provided in this embodiment, on one hand, can realize the function of refrigerating and refreshing or freezing and refreshing the food material in the cooking cavity 100, not only can ensure the freshness of the food material put into the cooking device in advance, but also can refrigerate and refresh the food material after the cooking is completed; on the other hand, the steam that cooking device produced in the culinary art process can condense into liquid to, the steam volume and the temperature of exhaust can reduce when opening the door, can not discharge steam even, not only reduced the probability that the user was scalded by steam, but also can alleviate the problem that kitchen moisture became heavy, improved user experience.

Still can set up liquid circulation pump 400 in above-mentioned heat conduction assembly's concrete structure, communicate this liquid circulation pump 400 with the heat pipe, get up with the heat conduction liquid circulation in the liquid circulation pump 400 drive heat pipe, so, heat conduction liquid is after flowing to the position that is close to culinary art chamber 100 and absorbing the heat that comes from culinary art chamber 100, can take these heats to flow to the refrigeration face 210 department of semiconductor refrigeration piece 200, semiconductor refrigeration piece 200 can absorb the heat that comes from heat conduction liquid, and shift away it, so, can improve the speed of heat conduction, and then, improve refrigeration efficiency.

Can set up liquid storage box 500 at heat-conducting component's concrete structure, store box 500 intercommunication with heat pipe and liquid to store box 500 and the laminating contact of the refrigeration face 210 of semiconductor refrigeration piece 200 with liquid, so, be convenient for increase heat-conducting liquid and the area of contact of semiconductor refrigeration face 210, improve heat exchange efficiency, and then, improve refrigeration efficiency.

Preferably, referring to fig. 2 and 3, a liquid outlet pipe 310, a liquid return pipe 320, a first main pipe 340, a second main pipe 350 and a plurality of capillary tubes 330 may be arranged in the specific structure of the heat conducting pipe, and both ends of the plurality of capillary tubes 330 are respectively communicated with the first main pipe 340 and the second main pipe 350, that is, the first main pipe 340 and the second main pipe 350 can be indirectly communicated via the capillary tubes 330; the first main pipe 340 is connected to the liquid outlet pipe 310, the second main pipe 350 is connected to the liquid return pipe 320, and the liquid outlet pipe 310 and the liquid return pipe 320 are connected to the liquid storage box 500, so that the heat transfer liquid in the liquid storage box 500 can sequentially flow through the liquid outlet pipe 310, the first main pipe 340, the capillary tube 330, the second main pipe 350 and the liquid return pipe 320, return to the liquid storage box 500, and circularly flow along the above flow direction under the driving of the liquid circulation pump 400.

As an implementation manner, the liquid outlet pipe 310 may be provided as two sections, which are respectively defined as a first liquid outlet pipe section and a second liquid outlet pipe section, and the first liquid outlet pipe section and the second liquid outlet pipe section are communicated through the liquid circulation pump 400, so that the liquid circulation pump 400 can directly drive the heat conduction liquid in the liquid outlet pipe to flow, and thus, the liquid flow speed in each capillary 330 tends to be equal, and the cooling effect in each area of the cooking cavity 100 is more balanced.

As another possible implementation manner, referring to fig. 3, the liquid return pipe 320 may be provided in two sections, which are respectively defined as a first liquid return pipe section and a second liquid return pipe section, and the first liquid return pipe section and the second liquid return pipe section are communicated through the liquid circulation pump 400, so that the liquid circulation pump 400 can directly drive the heat conduction liquid in the liquid return pipe 320 to flow, and thus, the liquid flow speed in each capillary 330 tends to be equal, and the cooling effect in each area of the cooking cavity 100 is more balanced.

Specifically, referring to fig. 3, the shape of each capillary 330 may be set to be U-shaped, the capillaries 330 are surrounded outside the bottom wall and the two side walls of the cooking cavity 100, and the capillaries 330 are arranged at intervals along the depth direction of the cooking cavity 100, so that the cooling effect in each region of the cooking cavity 100 is balanced, and the cooling efficiency is improved.

Specifically, the area of the cross section of the inner channel of the liquid outlet pipe 310 is set to be larger than or equal to the sum of the areas of the cross sections of the inner channels of the plurality of capillaries 330, so that the liquid outlet pipe 310 can provide sufficient heat-conducting liquid for the capillaries 330, and the probability of air existing in the capillaries 330 is reduced, thereby improving the heat exchange efficiency of the capillaries 330 and the cooking cavity 100 and improving the cooling effect of the cooking cavity 100.

Preferably, the area of the cross section of the tube channel of the liquid return tube 320 is set to be smaller than or equal to the sum of the cross sections of the tube channels of the plurality of capillaries 330, so that the liquid resistance in each capillary 330 is ensured, the probability of air existing in the capillary 330 is further reduced, and the heat conduction efficiency is improved.

The specific structure of the cooking device provided in this embodiment may be provided with a heat dissipation mechanism, and the heat dissipation mechanism is disposed opposite to the heating surface 220 of the semiconductor chilling plate 200, so that the heat dissipation mechanism can be used to dissipate heat from the heating surface 220 of the semiconductor chilling plate 200, thereby ensuring normal operation of the semiconductor chilling plate 200.

Above-mentioned heat dissipation mechanism includes cooling fan 600 and heat dissipation wind channel 700, set up the window on heat dissipation wind channel 700, install semiconductor refrigeration piece 200 in window department, and make the face of heating 220 of semiconductor refrigeration piece 200 towards the inside in heat dissipation wind channel 700, cooling fan 600 can drive the air current in the heat dissipation wind channel 700 and flow towards the air outlet, the air current is at the flow in-process, can absorb the heat of the face of heating 220 of semiconductor refrigeration piece 200, and carry the heat and discharge from the air outlet, so, can improve the heat dissipation efficiency of the face of heating 220 of semiconductor refrigeration piece 200, and then, improve refrigeration effect.

It should be noted that the heat dissipation air duct 700 may be an original air duct of the cooking device, the air duct is in air flow communication with the cooking cavity 100 of the cooking device, and hot air in the cooking cavity 100 may be exhausted through the heat dissipation air duct 700; the heat dissipation duct 700 may also be a new duct different from the original duct of the cooking apparatus.

Preferably, referring to fig. 2 and 3, a heat sink 800 may be further installed at the window of the heat dissipation air duct 700, the heat sink 800 is disposed on one side of the semiconductor chilling plate 200 facing the heat dissipation air duct 700, and the heating surface 220 of the semiconductor chilling plate 200 is attached to the heat sink 800, so that heat generated by the heating surface 220 of the semiconductor chilling plate 200 can be conducted to the heat sink 800, and heat on the heat sink 800 can be taken away by the air flow in the heat dissipation air duct 700, that is, the heat of the heating surface 220 of the semiconductor chilling plate 200 can be indirectly absorbed by the air flow in the heat dissipation air duct 700 through the heat sink 800.

It should be noted that the heat dissipation area of the heat dissipation plate 800 is larger than the area of the heating surface 220 of the semiconductor chilling plate 200, so that the heat dissipation efficiency of the semiconductor chilling plate 200 is improved.

Further, the heat insulation board 900 may be installed at the window, the heat insulation board 900 is disposed on a side of the heat dissipation sheet 800 away from the heat dissipation air duct 700, the heat insulation board 900 is provided with the installation hole 910, and the semiconductor chilling plate 200 is embedded in the installation hole 910, so that the influence of the heat on the heating surface 220 of the semiconductor chilling plate 200 and the heat on the heat dissipation sheet 800 on the chilling surface 210 of the semiconductor chilling plate 200 may be reduced, and the chilling efficiency of the semiconductor chilling plate 200 may be improved.

In the specific structure of the cooking apparatus provided in this embodiment, a controller may be provided, the semiconductor refrigeration sheet 200 is connected to a power supply through an electronic switch, and the electronic switch is electrically connected to the controller.

After cooking is finished, the controller can control the electronic switch to be turned on, the semiconductor refrigeration piece 200 is connected with the power supply, the semiconductor refrigeration piece 200 starts to refrigerate, the temperature in the cooking cavity 100 is reduced, if steam exists in the cooking cavity 100 at the moment, the steam can be condensed into liquid after the temperature is reduced, the amount of the steam discharged when the door is opened can be reduced, the temperature of the steam is reduced, and a user is prevented from being scalded; when a user uses the reservation function to cook dishes, the controller can control the electronic switch to be turned on after the reservation cooking is started in time, the semiconductor refrigeration sheet 200 starts to refrigerate, and the temperature in the cooking cavity 100 is reduced, so that a refrigeration environment or a freezing environment can be formed in the cooking cavity 100 in a reservation time period before cooking, the food materials to be cooked in the cooking cavity 100 can be refrigerated or frozen, and the probability of food material deterioration is reduced; the controller can also control the electronic switch to be closed after the cooking is reserved and finished in time, and the semiconductor refrigerating sheet 200 stops refrigerating, so that the cooking device can cook normally.

The user can start the refrigerating system after finishing cooking, so that the cooked food materials in the cooking cavity 100 can be refrigerated and stored, and the probability of food material deterioration is reduced.

Further, a temperature sensor may be installed in the cavity of the cooking cavity 100, the temperature sensor is used to sense the temperature in the cooking cavity 100, and when the temperature sensed by the temperature sensor is higher than or equal to a preset high threshold, the controller controls the electronic switch to be turned on, so that the refrigeration system starts to refrigerate, so as to reduce the ambient temperature in the cooking cavity 100; when the temperature that temperature sensor sensing arrived falls to low threshold, the controller can control electronic switch disconnection, makes refrigerating system stop refrigeration, and like this, the temperature in the culinary art chamber 100 alright maintain between low threshold and high threshold, realizes the accurate accuse temperature to culinary art chamber 100.

It should be noted that the low threshold and the high threshold preset in the controller may be set as one group, or may be set as multiple groups, for example: the temperature interval between a group of low threshold values and a group of high threshold values can be set to be suitable for adjusting the temperature field of the whole machine when the cooking device cooks, so that the temperature of the electric heating pipe is prevented from overshooting; another set of temperature intervals between the low threshold and the high threshold may be set for proper refrigeration such that the temperature within the cooking chamber 100 is continuously within the proper refrigeration temperature range.

In summary, the present invention discloses a cooking apparatus, which overcomes many technical defects of the conventional cooking apparatus. The cooking device that this embodiment provided can keep fresh to eating the material, reduces and eats material probability of rotting to can reduce and open the door after accomplishing the culinary art and discharge steam volume and steam temperature in the twinkling of an eye, can not discharge steam even, not only reduced the probability that the user was scalded by steam, but also can alleviate the problem that kitchen moisture became heavy, improved user experience degree.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A cooking device, characterized in that it comprises a cooking chamber (100) and a refrigeration system comprising a semiconductor refrigeration sheet (200) and a heat conducting assembly;

the heat conduction assembly comprises a plurality of heat conduction pipes which are communicated with each other, heat conduction liquid is arranged in the heat conduction pipes, the heat conduction pipes surround the cooking cavity (100) and are in heat conduction connection with the cooking cavity (100), and the refrigerating surface (210) of the semiconductor refrigerating sheet (200) is in contact with the heat conduction assembly in a laminating mode.

2. The cooking device of claim 1, wherein the heat conducting assembly further comprises a liquid circulation pump (400), the liquid circulation pump (400) being in communication with the heat conducting tube for driving circulation of the heat conducting liquid within the heat conducting tube.

3. The cooking device according to claim 2, wherein the heat conducting assembly comprises a liquid storage box (500), the heat conducting pipe being in communication with the liquid storage box (500), the liquid storage box (500) being in abutting contact with the refrigerating surface (210) of the semiconductor refrigerating sheet (200).

4. The cooking apparatus according to claim 3, wherein the heat conductive pipe comprises an outlet pipe (310), a liquid return pipe (320), a first main pipe (340), a second main pipe (350), and a plurality of capillary tubes (330);

many the both ends of capillary (330) equally divide respectively with first person in charge (340) with the second is responsible for (350) intercommunication, first person in charge (340) with drain pipe (310) intercommunication, the second be responsible for (350) with return liquid pipe (320) intercommunication, drain pipe (310) with return liquid pipe (320) through liquid storage box (500) intercommunication.

5. The cooking apparatus according to claim 4, wherein the outlet pipe (310) comprises a first outlet pipe section and a second outlet pipe section, the first outlet pipe section and the second outlet pipe section are communicated through the liquid circulating pump (400);

or the liquid return pipe (320) comprises a first liquid return pipe section and a second liquid return pipe section, and the first liquid return pipe section is communicated with the second liquid return pipe section through the liquid circulating pump (400).

6. The cooking apparatus according to claim 4, wherein each of the capillaries (330) has a U-shape, the capillaries (330) surround the bottom wall and two side walls of the cooking chamber (100), and the capillaries (330) are arranged at intervals in a depth direction of the cooking chamber (100).

7. The cooking device according to claim 4, wherein the cross-sectional area of the inner channel of the liquid outlet tube (310) is greater than or equal to the total cross-sectional area of the inner channels of the plurality of capillaries (330), and/or the cross-sectional area of the inner channel of the liquid return tube (320) is less than or equal to the total cross-sectional area of the inner channels of the plurality of capillaries (330).

8. The cooking device according to any one of claims 1 to 7, further comprising a heat dissipation mechanism opposite to the heating surface (220) of the semiconductor chilling plate (200), the heat dissipation mechanism being configured to dissipate heat from the heating surface (220) of the semiconductor chilling plate (200).

9. The cooking device according to claim 8, wherein the heat dissipation mechanism comprises a heat dissipation fan (600) and a heat dissipation air duct (700), a window is formed in the heat dissipation air duct (700), the semiconductor refrigeration sheet (200) is installed at the window, the heating surface (220) of the semiconductor refrigeration sheet (200) faces the inside of the heat dissipation air duct (700), and the heat dissipation fan (600) is used for driving the airflow in the heat dissipation air duct (700) to flow towards the air outlet.

10. The cooking device according to claim 9, wherein a heat sink (800) is mounted at the window, the heat sink (800) is located on one side of the semiconductor chilling plate (200) facing the heat dissipation air duct (700), and a heating surface (220) of the semiconductor chilling plate (200) is attached to the heat sink (800), and a heat dissipation area of the heat sink (800) is larger than an area of the heating surface (220) of the semiconductor chilling plate (200);

and/or, window department installs heat insulating board (900), heat insulating board (900) are located what fin (800) deviated from one side of radiating air duct (700), mounting hole (910) have been seted up on heat insulating board (900), semiconductor refrigeration piece (200) inlay and establish in mounting hole (910).

11. The cooking device according to any one of claims 1 to 7, wherein the cooking device comprises a controller, the semiconductor chilling plate (200) is connected with a power supply through an electronic switch, and the electronic switch is electrically connected with the controller;

12. The cooking apparatus according to claim 11, wherein a temperature sensor is mounted in a cavity of the cooking cavity (100) for sensing a temperature inside the cooking cavity (100); the temperature sensor is electrically connected with the controller, the controller is used for controlling the electronic switch to be switched on when the temperature sensed by the temperature sensor is higher than a high threshold value, and the controller is used for controlling the electronic switch to be switched off when the temperature sensed by the temperature sensor is reduced to a low threshold value.