CN219199489U

CN219199489U - Electric water heater with direct cooling type refrigerating mechanism

Info

Publication number: CN219199489U
Application number: CN202320707028.3U
Authority: CN
Inventors: 刘康; 高俊岭; 郭力琪
Original assignee: Guangdong Fuxin Electronic Technology Co ltd
Current assignee: Guangdong Fuxin Electronic Technology Co ltd
Priority date: 2023-04-03
Filing date: 2023-04-03
Publication date: 2023-06-16
Anticipated expiration: 2033-04-03

Abstract

The utility model discloses an electric water heater with a direct cooling type refrigerating mechanism, which comprises an inner container, an electric heating mechanism and a direct cooling type refrigerating mechanism, wherein the electric heating mechanism is arranged at the end part of the inner container and extends to the inner part of the inner container, and the direct cooling type refrigerating mechanism is arranged outside the inner container; the direct cooling type refrigeration mechanism comprises a cold guide piece, a semiconductor refrigeration piece and a heat dissipation assembly; the inner side wall of the cold guide piece is arc-shaped, and the inner side wall of the cold guide piece is in contact with the outer wall of the inner container; the semiconductor refrigerating piece is arranged between the cold guide piece and the heat radiating component, the cold end face of the semiconductor refrigerating piece is attached to the outer side wall of the cold guide piece, and the hot end face of the semiconductor refrigerating piece is attached to the heat radiating component. According to the electric water heater with the direct-cooling type refrigerating mechanism, the direct-cooling type refrigerating mechanism is additionally arranged, so that the refrigerating efficiency of the electric water heater is improved on the premise of having a refrigerating function.

Description

Electric water heater with direct cooling type refrigerating mechanism

Technical Field

The utility model relates to the technical field of household appliances, in particular to an electric water heater with a direct-cooling refrigerating mechanism.

Background

At present, the electric water heater commonly used by people heats tap water entering the electric water heater from a water inlet through an electric heating element, and then the heated tap water flows out from a water outlet, so that the tap water is used as domestic water in a shower room and/or a kitchen by a user.

The existing electric water heater generally comprises a shell, an inner container, an electric heating element, a water inlet pipe and a water outlet pipe, wherein the water inlet pipe and the water outlet pipe are arranged on the inner container, the electric heating element is arranged at one end of the inner container and extends to the inner part of the inner container, and the electric heating element is used for heating tap water positioned in the inner container.

Because the water outlet pipe of the electric water heater in the prior art can only flow out hot water, however, in India, middle east or certain areas of China, the temperature of tap water can be up to 50 ℃ or even higher in summer, and the electric water heater cannot be directly used for bathing; in addition, when the temperature is low, a user generally washes dishes by using the water heated by the electric water heater, however, when the temperature is high, tap water with high water temperature is inconvenient to use as domestic water in a kitchen, so that the market needs an electric water heater capable of outputting hot water and cold water.

Disclosure of Invention

The utility model aims to provide an electric water heater with a direct-cooling type refrigerating mechanism, which is additionally provided with the direct-cooling type refrigerating mechanism, so that the refrigerating efficiency of the electric water heater is improved on the premise of having a refrigerating function, and the defects in the prior art are overcome.

To achieve the purpose, the utility model adopts the following technical scheme:

the electric water heater with the direct cooling type refrigerating mechanism comprises an inner container, an electric heating mechanism and the direct cooling type refrigerating mechanism, wherein the electric heating mechanism is arranged at the end part of the inner container and extends to the inner part of the inner container, and the direct cooling type refrigerating mechanism is arranged outside the inner container;

the direct cooling type refrigeration mechanism comprises a cold guide piece, a semiconductor refrigeration piece and a heat dissipation assembly; the inner side wall of the cold guide piece is arc-shaped, and the inner side wall of the cold guide piece is in contact with the outer wall of the inner container; the semiconductor refrigerating piece is arranged between the cold guide piece and the heat radiating component, the cold end face of the semiconductor refrigerating piece is attached to the outer side wall of the cold guide piece, and the hot end face of the semiconductor refrigerating piece is attached to the heat radiating component.

Preferably, the heat dissipation assembly comprises a heat dissipation block and a heat dissipation fan;

the heat dissipation block is arranged on the outer side of the semiconductor refrigerating sheet, and the hot end surface of the semiconductor refrigerating sheet is attached to the heat dissipation block; the heat dissipation fan is arranged on the outer side of the heat dissipation block.

Preferably, the heat dissipation assembly further comprises a heat dissipation fin, and the heat dissipation fin is arranged on the outer side of the heat dissipation fan; a plurality of first radiating holes are formed in the middle of the radiating fin, and the air outlet end of the radiating fan is aligned with the first radiating holes.

Preferably, the heat sink is further provided with a plurality of second heat dissipation holes, and the second heat dissipation holes are located at two ends of the heat sink.

Preferably, the refrigerator further comprises a shell, wherein the liner and the direct-cooling refrigeration mechanism are both arranged in the shell, and the outer surfaces of the radiating fins are mutually flush with the outer surface of the shell.

Preferably, the direct-cooling refrigeration mechanism further comprises a heat preservation piece, and the heat preservation piece is positioned between the cold guide piece and the heat dissipation assembly;

the face of the heat preservation piece is provided with a mounting hole for accommodating the semiconductor refrigerating piece, and the semiconductor refrigerating piece is mounted between the cold guide piece and the heat dissipation component through the heat preservation piece.

Preferably, the heat dissipation block comprises a heat dissipation plate and a plurality of heat dissipation fins, one plate surface of the heat dissipation plate is attached to the hot end surface of the semiconductor refrigeration piece, the heat dissipation fins arranged at intervals are mounted on the other plate surface of the heat dissipation plate, and the extending direction of the heat dissipation fins faces the heat dissipation fan.

Preferably, the inner container and the cold guide member are made of metal, the outer side wall of the cold guide member is provided with a cold guide surface which is vertically arranged, and the cold end surface of the semiconductor refrigeration sheet is attached to the cold guide surface.

Preferably, a plurality of semiconductor refrigeration sheets are arranged, and the cold end surfaces of the semiconductor refrigeration sheets are adhered to the cold guide surface.

Preferably, the shape of the cold guide is a semicircle, the inner container is provided with two direct-cooling refrigeration mechanisms in the same width direction, and the two direct-cooling refrigeration mechanisms are symmetrically arranged on two sides of the inner container.

The technical scheme provided by the embodiment of the application can comprise the following beneficial effects:

1. the cold end face of the semiconductor refrigerating piece is attached to the outer side wall of the cold guide piece, and the inner side wall of the cold guide piece is in contact with the outer wall of the inner container, so that the cold produced by the semiconductor refrigerating piece can be conducted to water inside the semiconductor refrigerating piece through the cold guide piece and the inner container which are in contact with each other, and refrigeration of water is achieved.

2. The semiconductor refrigerating sheet is in direct contact with the cold guide piece and the cold guide piece is in direct contact with the inner container, so that the direct and effective transmission of cold energy is facilitated, excessive loss of cold energy in the environment is avoided, and the cold production efficiency of the semiconductor refrigerating sheet is reduced.

3. The shape of the inner side wall of the cold guide piece is arc-shaped, and the inner side wall of the cold guide piece is matched with the shape of the inner container of the electric water heater, so that the contact area of the cold guide piece and the inner container is increased, the cold guide efficiency of the direct-cooling type refrigerating mechanism is increased, and the cooling of water is accelerated.

Drawings

Fig. 1 is a schematic structural diagram of an electric water heater with a direct-cooling refrigeration mechanism according to the present utility model.

Fig. 2 is a schematic partial structure of an electric water heater with a direct-cooling refrigeration mechanism according to the present utility model.

Fig. 3 is a partial structural cross-sectional view of an electric water heater with a direct-cooling refrigeration mechanism according to the present utility model.

Fig. 4 is an exploded view of a direct cooling type refrigerating mechanism in an electric water heater with the direct cooling type refrigerating mechanism according to the present utility model.

Wherein: an inner container 1;

an electric heating mechanism 2;

the direct cooling type refrigerating mechanism 3, the cold guide 31, the cold guide surface 311, the semiconductor refrigerating fin 32, the heat dissipation component 33, the heat dissipation block 331, the heat dissipation plate 3311, the heat dissipation fins 3312, the heat dissipation fan 332, the heat dissipation plate 333, the first heat dissipation hole 3331, the second heat dissipation hole 3332, the heat preservation member 34 and the mounting hole 341;

a housing 4.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.

The technical scheme provides an electric water heater with a direct-cooling type refrigerating mechanism, which comprises an inner container 1, an electric heating mechanism 2 and a direct-cooling type refrigerating mechanism 3, wherein the electric heating mechanism 2 is arranged at the end part of the inner container 1 and extends to the inner part of the inner container 1, and the direct-cooling type refrigerating mechanism 3 is arranged outside the inner container 1;

the direct-cooling refrigeration mechanism 3 comprises a cold guide 31, a semiconductor refrigeration piece 32 and a heat dissipation component 33; the inner side wall of the cold guide 31 is arc-shaped, and the inner side wall of the cold guide 31 is in contact with the outer wall of the liner 1; the semiconductor cooling plate 32 is installed between the cooling guide 31 and the heat dissipation component 33, the cold end face of the semiconductor cooling plate 32 is attached to the outer side wall of the cooling guide 31, and the hot end face of the semiconductor cooling plate 32 is attached to the heat dissipation component 33.

In order to meet various use demands of users on the electric water heater, the technical scheme provides the electric water heater with the direct cooling type refrigerating mechanism, and as shown in fig. 1-4, the direct cooling type refrigerating mechanism 3 is arranged on the electric water heater, so that the refrigerating efficiency of the electric water heater can be improved on the premise of having a refrigerating function.

Specifically, the electric water heater in this scheme includes inner bag 1, electric heating mechanism 2 and direct cooling formula refrigeration mechanism 3. Wherein the liner 1 is used for storing water; the electric heating mechanism 2 is arranged at the end part of the inner container 1 and extends into the inner container 1 to heat water positioned in the inner container 1; the direct cooling type refrigerating mechanism 3 is installed outside the inner container 1, and is used for conducting the cold generated by the direct cooling type refrigerating mechanism to the water inside the inner container 1 through a heat conduction mode, so that the direct cooling type refrigerating mechanism plays a role in cooling.

More specifically, the direct-cooling refrigeration mechanism 3 in this embodiment includes a cold guide 31, a semiconductor refrigeration sheet 32, and a heat dissipation assembly 33. The semiconductor refrigerating sheet 32 is used for refrigerating, and is made by using the peltier effect, wherein the peltier effect refers to the phenomenon that when direct current passes through a couple composed of two semiconductor materials, one end of the couple absorbs heat and the other end releases heat; in other words, the semiconductor refrigeration sheet 32 is made of two semiconductor materials, forming a hot side and a cold side, the cold side continuously absorbs heat, refrigeration is realized, and the hot side continuously releases heat. Because the cold end face of the semiconductor refrigeration piece 32 is attached to the outer side wall of the cold guide piece 31 in the scheme, and the inner side wall of the cold guide piece 31 is in contact with the outer wall of the liner 1, the cold energy generated by the semiconductor refrigeration piece 32 can be conducted to water inside the cold guide piece 31 and the liner 1 through the contact with each other, and refrigeration of water is achieved. The hot end surface of the semiconductor cooling fin 32 is attached to the heat dissipation component 33, so that the rapid heat dissipation of the hot end surface is facilitated, and the hot end and the cold end of the semiconductor cooling fin 32 are in a heat absorption and heat release balanced state in the working process, so that the rapid heat dissipation of the hot end surface is also beneficial to accelerating the rapid heat absorption of the cold end surface, so that the cold production efficiency of the semiconductor cooling fin 32 is further improved.

Further, the semiconductor refrigerating sheet 32 is in direct contact with the cold guide 31 and the cold guide 31 is in direct contact with the liner 1, so that direct and effective transfer of cold is facilitated, excessive dissipation of cold in the environment is avoided, and the cold production efficiency of the semiconductor refrigerating sheet 32 is reduced. Furthermore, the inner sidewall of the cold guide 31 is arc-shaped, which is matched with the inner container 1 of the electric water heater, thereby being beneficial to increasing the contact area between the cold guide 31 and the inner container 1, further being beneficial to increasing the cold guide efficiency of the direct-cooling type refrigerating mechanism 3 and accelerating the temperature reduction of the water body.

Further describing, the heat dissipating component 33 includes a heat dissipating block 331 and a heat dissipating fan 332;

the heat dissipation block 331 is disposed outside the semiconductor cooling fin 32, and a thermal end surface of the semiconductor cooling fin 32 is attached to the heat dissipation block 331; the heat dissipation fan 332 is installed outside the heat dissipation block 331.

In one embodiment of the present disclosure, the heat dissipating assembly 33 includes a heat dissipating block 331 and a heat dissipating fan 332 connected in sequence, and the heat dissipating block 331 is disposed near the semiconductor cooling fin 32, the heat dissipating fan 332 is mounted on the back of the heat dissipating block 331, and the heat dissipating fan 332 is disposed to effectively accelerate air flow, thereby improving the heat dissipating efficiency of the direct cooling type cooling mechanism 3.

Note that, the cooling fan 443 in the present embodiment may be an axial fan or an eddy fan, which is not limited herein.

Further describing, the heat dissipating assembly 33 further includes a heat dissipating fin 333, and the heat dissipating fin 333 is disposed outside the heat dissipating fan 332; a plurality of first heat dissipation holes 3331 are formed in the middle of the heat dissipation fin 333, and the air outlet end of the heat dissipation fan 332 is aligned with the first heat dissipation holes 3331.

In order to further ensure that the heat generated by the hot end face is rapidly discharged out of the electric water heater, so as to prevent heat accumulation inside the electric water heater, the heat dissipating assembly 33 of the present embodiment further includes a heat dissipating fin 333 provided with a plurality of first heat dissipating holes 3331, and the air outlet end of the heat dissipating fan 332 is aligned with the first heat dissipating holes 3331, so as to achieve rapid heat dissipation.

Further, the heat sink 333 is further provided with a plurality of second heat dissipating holes 3332, and the second heat dissipating holes 3332 are located at two ends of the heat sink 333.

In addition, the heat dissipating fin 333 is further provided with a plurality of second heat dissipating holes 3332 at two ends thereof, so that heat in the heat dissipating space of the heat end surface of the semiconductor refrigeration fin 32 can be conveniently discharged through the second heat dissipating holes 3332, thereby further ensuring that heat in the heat dissipating space can be fully discharged.

Further, the refrigerator further comprises a housing 4, wherein the liner 1 and the direct-cooling refrigeration mechanism 3 are both installed inside the housing 4, and the outer surfaces of the radiating fins 333 and the outer surface of the housing 4 are flush with each other.

In a preferred embodiment of the present technical solution, the inner container 1 and the direct cooling refrigeration mechanism 3 are both installed inside the housing 4, and meanwhile, the outer surfaces of the cooling fins 333 and the outer surface of the housing 4 are flush with each other, so that the electric water heater does not affect the aesthetic degree of the electric water heater on the premise of realizing the refrigeration function, and is beneficial to meeting the use experience of users.

Further describing, the direct-cooling refrigeration mechanism 3 further includes a heat-insulating member 34, where the heat-insulating member 34 is located between the cold-conducting member 31 and the heat-dissipating component 33;

the surface of the heat insulating member 34 is provided with a mounting hole 341 for accommodating the semiconductor cooling fin 32, and the semiconductor cooling fin 32 is mounted between the cold conducting member 31 and the heat dissipating component 33 through the heat insulating member 34.

In another preferred embodiment of the present technical solution, the direct-cooling refrigeration mechanism 3 further includes a heat preservation member 34, specifically, the heat preservation member 34 is located between the cold conduction member 31 and the heat dissipation member 33, a mounting hole 341 for mounting the semiconductor refrigeration sheet 32 is formed in the middle of the heat preservation member 34, the heat preservation member 34 plays a role in positioning and mounting the semiconductor refrigeration sheet 32, and meanwhile, heat and cold generated by the semiconductor refrigeration sheet 32 can be effectively prevented from being dissipated to the surroundings.

Preferably, the material of the insulating member 34 may be a heat insulating sponge, etc., and is not limited herein.

Further, the heat dissipation block 331 includes a heat dissipation plate 3311 and a plurality of heat dissipation fins 3312, wherein one surface of the heat dissipation plate 3311 is attached to the heat end surface of the semiconductor cooling fin 32, the heat dissipation fins 3312 are mounted on the other surface of the heat dissipation plate 3311 at intervals, and the extending direction of the heat dissipation fins 3312 faces the heat dissipation fan 332.

The radiating block 331 in this scheme includes heating panel 3311 and a plurality of radiating fins 3312, and the front and the hot junction face of heating panel 3311 paste mutually, and the radiating fin 3312 that the back-mounting of heating panel 3311 set up at the interval forms the through flow channel and water conservancy diversion air between a plurality of radiating fins 3312, is convenient for increase the area of contact of air and radiating block 3311, promotes the radiating effect, and radiating fin 3312's extending direction orientation radiator fan 332, and the radiator fan 332 of being convenient for drives the adjacent air row discrete hot block 331 of radiating block 331, further promotes the radiating effect.

Further, the inner container 1 and the cold guide 31 are made of metal, the outer side wall of the cold guide 31 is provided with a cold guide surface 311 vertically arranged, and the cold end surface of the semiconductor refrigeration sheet 32 is attached to the cold guide surface 311.

In some embodiments, the inner container 1 and the cold guide 31 are made of metal with higher heat conductivity, so that heat is more easily transferred quickly, and the refrigeration efficiency of the direct-cooling refrigeration mechanism 3 is further improved. In addition, the outer side wall of the cold guide 31 is provided with a cold guide surface 311 which is vertically arranged, and compared with the arc-shaped outer side wall, the cold guide surface 311 with a planar structure is more beneficial to the mutual lamination of the semiconductor refrigeration piece 32 and the cold guide 31.

Further, a plurality of semiconductor cooling fins 32 are provided, and the cold end surfaces of the semiconductor cooling fins 32 are attached to the cold conducting surface 311.

The semiconductor refrigeration piece 32 in this scheme can be provided with a plurality of to the cold terminal surface of a plurality of semiconductor refrigeration pieces 32 all laminates each other with the cold face 311 that leads of cold piece 31, thereby promotes the refrigeration efficiency of semiconductor refrigeration piece 32 even further.

Further, the cold guide 31 is in a semicircular shape, the inner container 1 is provided with two direct-cooling type refrigerating mechanisms 3 in the same width direction, and the two direct-cooling type refrigerating mechanisms 3 are symmetrically disposed at two sides of the inner container 1.

In a more preferred embodiment of the present technical solution, the cold guide 31 is in a semicircular shape, and the inner container 1 is provided with two symmetrical direct-cooling refrigeration mechanisms 3 in the same width direction (i.e. the cross-sectional direction of fig. 3), so that the occupied space can be effectively saved while the refrigeration efficiency is improved. Preferably, two symmetrical direct-cooling type refrigerating mechanisms 3 in the same width direction are a group of direct-cooling type refrigerating mechanisms 3, and the scheme can be used for installing a plurality of groups of direct-cooling type refrigerating mechanisms 3 according to actual demands of electric water heaters so as to meet the refrigerating demands of users in different living environments.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments in accordance with the present application. As used herein, the singular is also intended to include the plural unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.

The relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present utility model unless it is specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective parts shown in the drawings are not drawn in actual scale for convenience of description. Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but should be considered part of the specification where appropriate. In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.

In the description of the present utility model, it should be understood that the azimuth or positional relationships indicated by the azimuth terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal", and "top, bottom", etc., are generally based on the azimuth or positional relationships shown in the drawings, merely to facilitate description of the present utility model and simplify the description, and these azimuth terms do not indicate and imply that the apparatus or elements referred to must have a specific azimuth or be constructed and operated in a specific azimuth, and thus should not be construed as limiting the scope of protection of the present utility model; the orientation word "inner and outer" refers to inner and outer relative to the contour of the respective component itself.

Spatially relative terms, such as "above … …," "above … …," "upper surface at … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial location relative to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may also be positioned in other different ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

In addition, the terms "first", "second", etc. are used to define the components, and are only for convenience of distinguishing the corresponding components, and the terms have no special meaning unless otherwise stated, and therefore should not be construed as limiting the scope of the present utility model.

It should be noted that the terms "first," "second," and the like in the description and claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that embodiments of the present application described herein may be implemented in sequences other than those illustrated or described herein.

The technical principle of the present utility model is described above in connection with the specific embodiments. The description is made for the purpose of illustrating the general principles of the utility model and should not be taken in any way as limiting the scope of the utility model. Other embodiments of the utility model will be apparent to those skilled in the art from consideration of this specification without undue burden.

Claims

1. The electric water heater with the direct cooling type refrigerating mechanism is characterized by comprising an inner container, an electric heating mechanism and a direct cooling type refrigerating mechanism, wherein the electric heating mechanism is arranged at the end part of the inner container and extends to the inner part of the inner container, and the direct cooling type refrigerating mechanism is arranged outside the inner container;

2. The electric water heater with direct-cooling refrigeration mechanism as recited in claim 1, wherein the heat dissipating assembly comprises a heat dissipating block and a heat dissipating fan;

3. The electric water heater with direct cooling refrigeration mechanism as set forth in claim 2, wherein said heat dissipating assembly further comprises a heat sink, and said heat sink is disposed outside of said heat dissipating fan; a plurality of first radiating holes are formed in the middle of the radiating fin, and the air outlet end of the radiating fan is aligned with the first radiating holes.

4. The electric water heater with direct cooling refrigeration mechanism as recited in claim 3, wherein the heat sink further comprises a plurality of second heat dissipation holes, and the second heat dissipation holes are located at two ends of the heat sink.

5. An electric water heater with a direct-cooling refrigeration mechanism as recited in claim 3, further comprising a housing, wherein the inner container and the direct-cooling refrigeration mechanism are both mounted inside the housing, and wherein the outer surfaces of the cooling fins are flush with the outer surface of the housing.

6. The electric water heater with direct-cooled refrigeration mechanism of claim 1, further comprising a thermal insulation member positioned between the cold guide member and the heat sink assembly;

7. The electric water heater with direct cooling type refrigerating mechanism as claimed in claim 2, wherein the heat dissipating block comprises a heat dissipating plate and a plurality of heat dissipating fins, one plate surface of the heat dissipating plate is attached to the heat end surface of the semiconductor refrigerating plate, the heat dissipating fins are installed on the other plate surface of the heat dissipating plate at intervals, and the extending direction of the heat dissipating fins faces the heat dissipating fan.

8. The electric water heater with direct cooling type refrigerating mechanism as claimed in claim 1, wherein the inner container and the cold conducting piece are made of metal, the outer side wall of the cold conducting piece is provided with a cold conducting surface which is vertically arranged, and the cold end face of the semiconductor refrigerating piece is attached to the cold conducting surface.

9. The electric water heater with direct cooling type refrigeration mechanism as set forth in claim 8, wherein a plurality of said semiconductor refrigeration sheets are provided, and the cold end surfaces of a plurality of said semiconductor refrigeration sheets are all in contact with said cold conducting surface.

10. The electric water heater with the direct cooling type refrigerating mechanism according to claim 1, wherein the cold guide member is in a semicircular shape, the two direct cooling type refrigerating mechanisms are arranged on the same width direction of the inner container, and the two direct cooling type refrigerating mechanisms are symmetrically arranged on two sides of the inner container.