CN106440601A - Freezing type multistage semiconductor refrigeration refrigerator - Google Patents
Freezing type multistage semiconductor refrigeration refrigerator Download PDFInfo
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- CN106440601A CN106440601A CN201510496037.2A CN201510496037A CN106440601A CN 106440601 A CN106440601 A CN 106440601A CN 201510496037 A CN201510496037 A CN 201510496037A CN 106440601 A CN106440601 A CN 106440601A
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- heat
- twin
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- chilling plate
- refrigeration
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Abstract
The invention relates to a multistage semiconductor refrigeration refrigerator capable of achieving freezing. A two-stage semiconductor chilling plate is adopted for refrigeration, and an air cooling manner is utilized in the interior to transfer cold of a cold face heat radiator to air in the refrigerator. The two-stage semiconductor chilling plate is subjected to waterproof sealing through the cold face heat radiator, a heat face copper substrate or water cooling plate and an O-type sealing ring. The semiconductor refrigeration refrigerator can be used as a freezer, and the problem that an existing semiconductor refrigerator can be only used as a refrigerated container is solved; through the advanced heat radiation technology, heat generated by the heat face of the two-stage semiconductor chilling plate is radiated in time, and guarantees are provided for making the required freezing temperature; and according to the technical scheme that a refrigeration module adopts O-type ring sealing, the problem that when the low temperature is made through the semiconductor chilling plate, water inlet failures are extremely prone to happening is effectively solved.
Description
Technical field
The present invention relates to refrigerator field.More particularly relate to substitute traditional compressor using twin-stage semiconductor chilling plate,
Using pyroelectric effect, form the big temperature difference that can achieve refrigerating effect, make refrigerator inside reach the function of freezing, be simultaneous for partly leading
The body cooling piece problem that incident water inlet was lost efficacy when producing low temperature, using advanced sealing means, improves the reliability of system
Property.
Background technology
With scientific and technological development, refrigerator is also being constantly brought forth new ideas, and semiconductor refrigerating, as a new solutions for refrigeration, gradually should
In small-sized refrigerator, the semiconductor refrigerating technology in refrigerator is applied to there is a very big defect, i.e. quasiconductor body ice at present
Case can only realize the function of cold preservation, can not reach the requirement to freezing in people's life.The semiconductor chilling plate of single-stage is in hot face
In the case that temperature is 50 DEG C, the maximum temperature difference of formation is 78 degree about, and in the case of having thermic load, the temperature difference can reduce,
The final effect being reached is to make refrigerator inside reach 5-18 DEG C.
When semiconductor chilling plate produces low temperature, when especially realizing freezing, low temperature can make the water condensation of in the air cause partly to lead
The water inlet of body cooling piece was lost efficacy, and greatly increased the risk of refrigeration for refrigerator inefficacy.The sealing means of common foaming or sealing are not
Enough to the long reliability ensureing sealing.
Semiconductor chilling plate hot-face temperature directly can affect the refrigeration depth that huyashi-chuuka (cold chinese-style noodles) can reach, and only leans on natural heat dissipation to dissipate
Go out the heat that the hot face of semiconductor cooler is shed.
Content of the invention
To achieve these goals, the present invention employs the following technical solutions：Frozen type multilevel semiconductor refrigerator, by warm
End fin (1), hot junction fan (2), cold end radiator (3), O-ring seal (4), twin-stage semiconductor chilling plate (5),
The device such as copper base or cooled plate (6) forms.When refrigerator is started working, by pyroelectric effect, thermoelectric material two ends start respectively
Absorb heat and release heat.The quasiconductor of twin-stage can form the bigger temperature difference than single-stage, and copper base or cooled plate are passed through in hot junction
(6), heat is conducted to fin by heat pipe or water pump, and by hot junction fan (2) by heat derives refrigerator, inside is blown by fan
Wind, makes internal temperature of refrigerator distribution more uniformly, cold end radiator (3), copper base (6) use screw in the way of air-cooled
The mode of fastening is fixed, by being machined in O-ring (4) on huyashi-chuuka (cold chinese-style noodles) radiator (3) or copper base or cooled plate (6)
Mill out fixing groove, simultaneously in copper base or cooled plate (6) perforate, for the test of later product sealing reliability.
For the problems referred to above, the purpose of the present invention mainly realizes the refrigerating effect of semiconductor freezer, the quasiconductor system of twin-stage
Cold, in small refrigerator, can achieve the refrigerating effect of the big temperature difference.
In packaged refrigeration TE module, twin-stage thermoelectric refrigerator has very high mechanical strength under stress,
But comparatively ratio is relatively low for its shear strength, module fixing twin-stage semiconductor chilling plate by way of groove milling.
Profile using customization is the sealing ring that square, line section is circle, is mode by huyashi-chuuka (cold chinese-style noodles) radiator by screw fastening
(3), sealing ring (4), twin-stage semiconductor chilling plate (5), copper base or cooled plate (6) are packaged into refrigeration TE module, excellent
When good seal approach reduces semiconductor chilling plate low-temperature working, make temperature drop to below dew point temperature, condense the water of in the air
Point, cause cooling piece water inlet to lose efficacy it is ensured that the reliability of refrigerator.
Profile is the sealing ring that square line section is circle.Being shaped as of O-ring seal is customizable, the use of profile is square line
When section is the sealing ring of circle, square seal ring chamfering at processed using the chamfering mode of default size；Trip bolt will be with
Sealing ring retains certain spacing；Place the depth of sealing ring institute groove milling and width according to the diameter of sealing ring, twin-stage quasiconductor
Height, the depth of fixing twin-stage semiconductor chilling plate institute groove milling together decides on.
The leak hunting aperture that copper base is reserved, opening diameter determines according to the size of TE module, can be 4-10 millimeter, TE
Sealed using the Aviation Connector of circle sealing with o during refrigeration module encapsulation.
By two kinds of forms, the heat in hot face is shed, the first, such as Fig. 1, the hot face of twin-stage semiconductor chilling plate directly against
It is attached to cooled plate (6), by water pump (14), transfer heat to fin, hot side fin (1) and hot junction fan (2) will be made
The substantial amounts of thermal conductivity producing during cooling system work goes out；Second：As Fig. 2, the hot face of twin-stage semiconductor chilling plate is directly attached to copper
Substrate (6), imports to hot side fin (1) by heat pipe (7) that heat, then by hot junction fan (2) by refrigeration system work
As when the substantial amounts of thermal conductivity that produces go out, fan strengthens the heat exchange amount of hot side fin and outside air, increased refrigeration.
Cold end radiator passes through fan inside, and air-cooled mode is freezed.
Beneficial effects of the present invention：The refrigerating effect of small semiconductor refrigerator can be enabled, the mode of O-ring sealing can be prevented and treated
The water inlet of twin-stage semiconductor chilling plate was lost efficacy, and improved the reliability of refrigeration system.
Brief description
Fig. 1 is the right view of frozen type multilevel semiconductor refrigerator (hot junction water-cooled)；
Fig. 2 is the right view of frozen type multilevel semiconductor refrigerator (hot junction is air-cooled)；
Fig. 3 is frozen type multilevel semiconductor refrigerator copper base seal groove figure；
Fig. 4 is the schematic diagram of the twin-stage quasiconductor of frozen type multilevel semiconductor refrigerator；
Fig. 5 is the sealing principle figure of frozen type multilevel semiconductor refrigerator；
Fig. 6 is refrigeration module (hot junction water-cooled) schematic diagram of frozen type multilevel semiconductor refrigerator；
Fig. 7 is refrigeration module (hot junction the is air-cooled) schematic diagram of frozen type twin-stage semiconductor freezer；
Specific embodiment
This twin-stage semiconductor freezer, by insulation shell (8), along with the refrigeration TE module of a set of twin-stage quasiconductor,
When user needs freezing function, by the operation to refrigerator panel, control the temperature of refrigeration, gone out by wind regime mouth (9)
Wind.Frozen type semiconductor freezer, by hot side fin (1), hot junction fan (2), cold end radiator (3), O-ring seal (4),
Twin-stage semiconductor chilling plate (5), copper base or cooled plate (6), the device such as heat pipe (7) composition, wherein cold end radiator (3),
Copper base or cooled plate (6) are fixed using the mode that screw fastens, and middle O-ring of placing seals.
When twin-stage semiconductor freezer connects power supply, open after switch brings into operation, twin-stage semiconductor chilling plate (5)
By pyroelectric effect, one end forms cold end, absorbs heat, and other end forms hot junction, discharges heat.The quasiconductor system of two-stage
Cold can form the sufficiently large temperature difference, and wherein by way of O-ring seals and the external world is air to twin-stage semiconductor chilling plate (5)
Isolation, the encapsulation scheme of a semiconductor chilling plate shown in accompanying drawing 4, the encapsulation scheme of accompanying drawing 4 can be placed semiconductor chilling plate and be existed
Produce condensation water inlet Problem of Failure during low temperature, so that the reliability of refrigerator is greatly improved.Produce in frozen type quasiconductor ice running
Raw heat, is derived by the cooling system that heat pipe, fin, fan, cooled plate, water pump or heat pipe, fin, fan form,
Control the temperature in hot face, so that refrigeration is become apparent from.
Fig. 2 is the schematic diagram of groove milling in copper base or cooled plate, and it is square that O-ring is customized to profile, and chamfering is all used in corner
Process, the bottom of groove and the corner angle at top all use chamfered.
Twin-stage semiconductor chilling plate is packaged into a refrigeration TE module by way of screw fastens, and screw is centrosymmetric cloth
Put, fixed form can be fastened to copper base by getting through hole in heat sink side, and screw adopts stainless steel, and bottom is lined with (10)
Heat insulating washer, fastens refrigeration TE module using moment of torsion screw knife, is allowed to huyashi-chuuka (cold chinese-style noodles) radiator, twin-stage half in rational compression zone
Conductor cooling piece, copper base fit tightly.
The hole of the air-leakage test that copper base or cooled plate are reserved, big I determines in the reasonable scope, the system after having assembled
Cold TE module can detect with snap joint plus air-tightness detection device, No leakage is then using the aviation of the sealing ring with o of customization
Joint sealing, the needle point of the wire of twin-stage semiconductor chilling plate and Aviation Connector is welded by inside, is hollow from stitch
Aviation Connector, joint and copper base or cooled plate build O-ring seal sealing, Aviation Connector and copper base or the water of middle use silica gel
Cold drawing is using the screw fastening being arranged symmetrically.
Hot-side heat dissipation adopts two ways, the first, such as Fig. 1, the hot face of twin-stage semiconductor chilling plate is directly attached to cooled plate
(6), the runner designed, designed of cooled plate, need to reserve the encapsulation refrigeration screw position of TE module, air-leakage test mouth during design
The position of the trip bolt of position, Aviation Connector and cooled plate, by water pump (14), transfers heat to fin, fin concatenates
On the water cooled pipeline of water-cooled, fin periphery is covered with the shell installing fan, and hot side fin (1) and hot junction fan (2) will be made
The substantial amounts of thermal conductivity producing during cooling system work goes out；Second：As Fig. 2, the hot face of twin-stage semiconductor chilling plate is directly attached to copper
Substrate (6), imports to hot side fin (1) by heat pipe (7) that heat, and the radical of heat pipe also has size to pass through conduction
Big thermal power is calculated, then produce when refrigeration system being worked by the hot junction fan (2) being fixed on deep freezer shell big
The thermal conductivity of amount goes out, and fan strengthens the heat exchange amount of hot side fin and outside air, increased refrigeration.
Claims (9)
1. a kind of frozen type multilevel semiconductor refrigerator, including：Hot side fin (1), hot junction fan (2), cold end radiator
(3), O-ring seal (4), twin-stage semiconductor chilling plate (5), copper base or cooled plate (6), heat insulating box (8) etc. fills
Put.Wherein cold end radiator (3), copper base or cooled plate (6), O-ring seal (4) are by twin-stage quasiconductor and external environment condition
Separate, reach the effect of waterproof sealing.
2. frozen type multilevel semiconductor refrigerator according to claim 1 is it is characterised in that described use twin-stage is partly led
Body cooling piece (5) connects unidirectional current, forms, in cold and hot surface, the big temperature difference sufficiently achieving refrigerating effect, cold end is by way of air-cooled
With refrigerator inside heat exchange, make the air themperature of inside reach subzero, realize the effect of freezing.
3. frozen type multilevel semiconductor refrigerator according to claim 1, twin-stage semiconductor chilling plate is fastened by screw
Mode be packaged into a refrigeration TE module, screw is centrosymmetric arrangement, and fixed form can be tight by getting through hole in heat sink side
The mode being affixed to copper base (6) or beating heat sink hole from copper base (6) side is fastened to cold end radiator (3), cold end radiator
(3) attach heat-barrier material and copper base (6) between, in the heat-barrier material perforate of refrigerator, cold end radiator is embedded box house.
4. frozen type multilevel semiconductor refrigerator according to claim 1, in packaged refrigeration TE module, twin-stage
Thermoelectric refrigerator has very high mechanical strength under stress, but comparatively ratio is relatively low for its shear strength, and module is passed through
The mode of groove milling fixes twin-stage semiconductor chilling plate.
5. frozen type multilevel semiconductor refrigerator according to claim 1 is it is characterised in that twin-stage under working condition
Semiconductor chilling plate coldface temperature is less than air dew point temperature, can condense the moisture of in the air, and described O-ring seal (4) will be double
Level semiconductor cooling piece (5) is completely isolated with extraneous humid air, and sealing ring is placed in the O-ring conduit of huyashi-chuuka (cold chinese-style noodles) radiator (3),
Or it is placed in the O-ring conduit of copper base.
6. frozen type multilevel semiconductor refrigerator according to claim 1, wherein O-ring seal (4) for profile can be
Square line section is the sealing ring of circle.
Being shaped as of O-ring seal is customizable, using profile be square line section be circle sealing ring when, square seal ring
Processed using the chamfering mode of default size at chamfering；Trip bolt will retain certain spacing with sealing ring；Place sealing ring institute
The depth of groove milling and width are according to the diameter of sealing ring, the height of twin-stage quasiconductor, the groove milling of fixing twin-stage semiconductor chilling plate institute
Depth together decide on.
7. the leak hunting aperture that frozen type multilevel semiconductor refrigerator according to claim 1, wherein copper base are reserved, perforate
Diameter determines according to the size of TE module, can be 4-10 millimeter, using circle sealing with o during the encapsulation of TE refrigeration module
Aviation Connector sealed.
8. frozen type multilevel semiconductor refrigerator according to claim 1 is it is characterised in that by two kinds of forms by heat
The heat in face sheds, the first, such as Fig. 1, the hot face of twin-stage semiconductor chilling plate is directly attached to cooled plate (6), by water pump
(14), transfer heat to fin, it is substantial amounts of that hot side fin (1) is produced when refrigeration system being worked with hot junction fan (2)
Thermal conductivity goes out；Second：As Fig. 2, the hot face of twin-stage semiconductor chilling plate is directly attached to copper base (6), by heat pipe (7) that
Individual heat imports to hot side fin (1), the more substantial amounts of thermal conductivity producing when refrigeration system being worked by hot junction fan (2) goes out, wind
Fan strengthens the heat exchange amount of hot side fin and outside air, increased refrigeration.
9. frozen type multilevel semiconductor refrigerator according to claim 1 is it is characterised in that cold end radiator (3) is by interior
Portion's fan, air-cooled mode is freezed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510496037.2A CN106440601A (en) | 2015-08-11 | 2015-08-11 | Freezing type multistage semiconductor refrigeration refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510496037.2A CN106440601A (en) | 2015-08-11 | 2015-08-11 | Freezing type multistage semiconductor refrigeration refrigerator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106440601A true CN106440601A (en) | 2017-02-22 |
Family
ID=58092992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510496037.2A Pending CN106440601A (en) | 2015-08-11 | 2015-08-11 | Freezing type multistage semiconductor refrigeration refrigerator |
Country Status (1)
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107131699A (en) * | 2017-06-28 | 2017-09-05 | 浙江聚珖科技股份有限公司 | Cold storage semiconductor freezer |
| CN107257618A (en) * | 2017-08-16 | 2017-10-17 | 合肥庆响网络科技有限公司 | Communication apparatus contacting radiator |
| CN107621118A (en) * | 2017-09-29 | 2018-01-23 | 南京工业大学 | A kind of semiconductor refrigerating hutch suitable for cold chain transportation |
| CN107940799A (en) * | 2017-10-28 | 2018-04-20 | 东台市凯润精密机械股份有限公司 | A kind of high-effect radiating refrigerator |
| CN110044950A (en) * | 2019-04-30 | 2019-07-23 | 西南交通大学 | Freezing-thawing test system |
| CN111413133A (en) * | 2020-04-20 | 2020-07-14 | 华中科技大学 | Freezing slicer |
| CN112242480A (en) * | 2020-09-30 | 2021-01-19 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Thermoelectric refrigeration method for chip-level electronic equipment |
| CN112254371A (en) * | 2020-09-28 | 2021-01-22 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Thermal control device for multi-stage gradient thermoelectric refrigeration chip |
| CN113490820A (en) * | 2019-06-26 | 2021-10-08 | Lg电子株式会社 | Thermoelectric module and refrigerator comprising same |
| CN113720046A (en) * | 2021-09-02 | 2021-11-30 | 晋江爱家制冷设备有限公司 | Integrated liquid circulation low-temperature radiator |
| CN115164493A (en) * | 2022-07-15 | 2022-10-11 | 青岛海容商用冷链股份有限公司 | Air-cooled semiconductor freezer and control method thereof |
| CN115164494A (en) * | 2022-07-15 | 2022-10-11 | 青岛海容商用冷链股份有限公司 | Semiconductor refrigeration freezer and control method thereof |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107131699A (en) * | 2017-06-28 | 2017-09-05 | 浙江聚珖科技股份有限公司 | Cold storage semiconductor freezer |
| CN107257618A (en) * | 2017-08-16 | 2017-10-17 | 合肥庆响网络科技有限公司 | Communication apparatus contacting radiator |
| CN107621118A (en) * | 2017-09-29 | 2018-01-23 | 南京工业大学 | A kind of semiconductor refrigerating hutch suitable for cold chain transportation |
| CN107940799A (en) * | 2017-10-28 | 2018-04-20 | 东台市凯润精密机械股份有限公司 | A kind of high-effect radiating refrigerator |
| CN110044950A (en) * | 2019-04-30 | 2019-07-23 | 西南交通大学 | Freezing-thawing test system |
| CN113490820A (en) * | 2019-06-26 | 2021-10-08 | Lg电子株式会社 | Thermoelectric module and refrigerator comprising same |
| CN111413133A (en) * | 2020-04-20 | 2020-07-14 | 华中科技大学 | Freezing slicer |
| CN112254371A (en) * | 2020-09-28 | 2021-01-22 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Thermal control device for multi-stage gradient thermoelectric refrigeration chip |
| CN112242480A (en) * | 2020-09-30 | 2021-01-19 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Thermoelectric refrigeration method for chip-level electronic equipment |
| CN113720046A (en) * | 2021-09-02 | 2021-11-30 | 晋江爱家制冷设备有限公司 | Integrated liquid circulation low-temperature radiator |
| CN113720046B (en) * | 2021-09-02 | 2022-10-04 | 晋江爱家制冷设备有限公司 | Integrated liquid circulation low-temperature radiator |
| CN115164493A (en) * | 2022-07-15 | 2022-10-11 | 青岛海容商用冷链股份有限公司 | Air-cooled semiconductor freezer and control method thereof |
| CN115164494A (en) * | 2022-07-15 | 2022-10-11 | 青岛海容商用冷链股份有限公司 | Semiconductor refrigeration freezer and control method thereof |
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Addressee: Power Technology (Shenzhen) Co., Ltd. Document name: Notification of Passing Preliminary Examination of the Application for Invention |
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Application publication date: 20170222 |