CN113720046A - Integrated liquid circulation low-temperature radiator - Google Patents
Integrated liquid circulation low-temperature radiator Download PDFInfo
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- CN113720046A CN113720046A CN202111026370.9A CN202111026370A CN113720046A CN 113720046 A CN113720046 A CN 113720046A CN 202111026370 A CN202111026370 A CN 202111026370A CN 113720046 A CN113720046 A CN 113720046A
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- radiator
- temperature
- low
- plate
- temperature liquid
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B39/00—Evaporators; Condensers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses an integrated liquid circulation low-temperature radiator, which comprises a radiating shell, radiating pipes and a radiating assembly, wherein a sealing plate is attached to one side of the radiating shell, the sealing plate is integrally square, a plurality of radiating pipe hole seals are uniformly arranged on the sealing plate and are respectively arranged opposite to the axes of the corresponding radiating pipes, a radiator guide plate is attached to one side of the sealing plate, and a plurality of groups of high-temperature liquid inlets and low-temperature liquid outlets are arranged on a water tank, so that pipelines in multiple directions are convenient to install, the power loss in the pipelines caused by unnecessary bending is avoided, and meanwhile, a semiconductor hot end heat-conducting plate, a semiconductor refrigerating sheet, a semiconductor cold end and a flow guide assembly are arranged, so that water flow can be further radiated, the heat flow in the pipelines is rapidly cooled, the use requirement is met, and an installation cavity is arranged, the pipeline can be well arranged and placed, and the whole structure of the device is more compact and precise.
Description
Technical Field
The invention relates to the field of radiators, in particular to an integrated liquid circulation low-temperature radiator.
Background
Common radiators can be divided into various types such as air cooling, heat pipe radiators, liquid cooling, semiconductor refrigeration, compressor refrigeration and the like according to the heat dissipation mode.
The existing radiator has some defects in the use process, the radiator is firstly loose in structure, the connection pipeline is complex, the whole attractiveness is influenced, the follow-up maintenance process is inconvenient, and meanwhile, in the refrigeration process, an auxiliary refrigeration device is lacked between the connecting piece of the water tank and the radiator, so that the heat dissipation effect is poor, and the use experience of the radiator is influenced.
Disclosure of Invention
In order to solve the existing problems, the invention provides an integrated liquid circulation low-temperature radiator.
The invention is realized by the following technical scheme:
an integrated liquid circulation low-temperature radiator comprises a radiating shell, radiating tubes and a radiating assembly, wherein a sealing plate is arranged on one side of the radiating shell in a laminating manner, the sealing plate is integrally square, a plurality of radiating tube hole seals are uniformly arranged on the sealing plate and are respectively arranged opposite to the axes of the corresponding radiating tubes, a radiator guide plate is arranged on one side of the sealing plate in a laminating manner, a flow guide assembly is arranged on one side of the radiator guide plate in a laminating manner, the flow guide assembly is integrally square, a water pump volute cavity and an installation cavity are arranged on the side wall of the flow guide assembly, a low-temperature liquid connector and a high-temperature liquid connector are arranged on the side wall of the flow guide assembly, a water pump is fixedly arranged on the side wall of the flow guide assembly, the output end of the water pump extends into the water pump volute cavity, and a semiconductor cold-end heat-conducting plate is embedded in the installation cavity, the utility model discloses a semiconductor refrigeration assembly, including water conservancy diversion subassembly, semiconductor cold junction heat-conducting plate, semiconductor refrigeration piece, semiconductor hot junction heat-conducting plate, fixed mounting has the water tank on the lateral wall of water conservancy diversion subassembly, fixed multiunit high-temperature liquid import and the low-temperature liquid export of being provided with on the outer wall of water tank, every group high-temperature liquid import and low-temperature liquid export communicate with each other with the water tank respectively.
Preferably, fixed mounting has a plurality of cooling tubes in the radiating shell, communicates with each other through the connecting pipe between two adjacent cooling tubes, installs a plurality of radiator unit jointly on a plurality of cooling tubes, and radiator unit comprises a plurality of wavy panel, and radiator unit adopts the heat conduction material to make.
Preferably, the rubber ring is fixedly installed on the inner wall of the heat dissipation pipe hole seal, the diameter of the heat dissipation pipe hole seal is slightly larger than the diameter of the heat dissipation pipe by minus mm, and the thickness of the rubber ring arranged on the inner wall of the heat dissipation pipe hole seal is within minus mm.
Preferably, be provided with square form keyway on the closing plate, the embedding has the sealing washer in the square form keyway on the closing plate, and one side top, bottom and the four corners department of closing plate all fix and are provided with the threaded connection hole.
Preferably, a plurality of guide grooves are formed in the radiator guide plate, and a plurality of threaded connection holes are formed in the four corners of the side wall of the radiator guide plate in a penetrating mode respectively.
Preferably, a plurality of connecting pipelines are installed in the installation cavity, one pipeline is communicated with the water pump volute cavity, one pipeline is fixedly connected and communicated with the high-temperature liquid connector, and the other pipeline is fixedly connected and communicated with the low-temperature liquid connector.
Preferably, an isolation assembly is arranged in the water tank, the isolation assembly is a sealing rubber partition plate, and a high-temperature liquid inlet and a low-temperature liquid outlet in each group are arranged in the same interval area.
Preferably, two square grooves are arranged on the semiconductor hot end heat-conducting plate and are respectively arranged opposite to the low-temperature liquid connecting port and the high-temperature liquid connecting port.
Compared with the prior art, the invention has the beneficial effects that: be provided with multiunit high temperature liquid import and low temperature liquid export on the water tank, make things convenient for the pipeline of a plurality of directions to be convenient for the installation like this, avoid unnecessary buckling and cause the power loss in the pipeline, be provided with semiconductor hot junction heat-conducting plate simultaneously, semiconductor refrigeration piece, semiconductor cold junction heat-conducting plate and water conservancy diversion subassembly, can further dispel the heat to rivers like this, make inside thermal current cool off rapidly, thereby reach the operation requirement, be provided with the installation cavity, can be fine arrange in order and lay the pipeline, and device overall structure is more compact and accurate.
Drawings
FIG. 1 is a perspective view of the structure of the present invention;
fig. 2 is an exploded view of the structure of fig. 1 according to the present invention.
In the figure: the heat dissipation device comprises a water tank 1, a semiconductor hot end heat conduction plate 2, a semiconductor refrigeration piece 3, a semiconductor cold end heat conduction plate 4, a flow guide assembly 5, a water pump volute cavity 6, an installation cavity 7, a water pump 8, a low-temperature liquid connection port 9, a high-temperature liquid connection port 10, a radiator flow guide plate 11, a sealing ring 12, a sealing plate 13, a radiating pipe hole seal 14, a radiating shell 15, a radiating pipe 16, a radiating assembly 17, a high-temperature liquid inlet 18 and a low-temperature liquid outlet 19.
Detailed Description
The invention is described in further detail below with reference to the following detailed description and accompanying drawings:
as shown in fig. 1 and 2, an integrated liquid circulation low-temperature heat sink includes a heat dissipation housing 15, a heat dissipation pipe 16 and a heat dissipation assembly 17, wherein a sealing plate 13 is attached to one side of the heat dissipation housing 15, the sealing plate 13 is integrally square, a plurality of heat dissipation pipe hole seals 14 are uniformly arranged on the sealing plate 13, the plurality of heat dissipation pipe hole seals 14 are respectively arranged opposite to the axes of the corresponding heat dissipation pipes 16, a heat dissipation flow guide plate 11 is attached to one side of the sealing plate 13, a flow guide assembly 5 is attached to one side of the heat dissipation flow guide plate 11, the flow guide assembly 5 is integrally square, a water pump volute cavity 6 and an installation cavity 7 are arranged on the side wall of the flow guide assembly 5, a low-temperature liquid connection port 9 and a high-temperature liquid connection port 10 are arranged on the side wall of the flow guide assembly 5, a water pump 8 is fixedly installed on the side wall of the flow guide assembly 5, the output of water pump 8 stretches into in the water pump spiral case cavity 6, the embedding has semiconductor cold junction heat-conducting plate 4 in the installation cavity 7, one side laminating of semiconductor cold junction heat-conducting plate 4 is provided with semiconductor refrigeration piece 3, one side laminating of semiconductor refrigeration piece 3 is provided with semiconductor hot junction heat-conducting plate 2, fixed mounting has water tank 1 on the lateral wall of water conservancy diversion subassembly 5, fixed multiunit high temperature liquid import 18 and the low temperature liquid export 19 of being provided with on the outer wall of water tank 1, every group high temperature liquid import 18 and low temperature liquid export 19 communicate with each other with water tank 1 respectively.
Fixed mounting has a plurality of cooling tubes 16 in the heat dissipation casing 15, communicates with each other through the connecting pipe between two adjacent cooling tubes 16, installs a plurality of radiator unit 17 jointly on a plurality of cooling tubes 16, and radiator unit 17 comprises a plurality of wavy panels, and radiator unit 17 adopts the heat conduction material to make.
The inner wall of the radiating pipe hole seal 14 is fixedly provided with a rubber ring, the diameter of the radiating pipe hole seal 14 is slightly larger than the diameter of the radiating pipe 16 by 1-2mm, and the thickness of the rubber ring arranged on the inner wall of the radiating pipe hole seal 14 is 3-4 mm.
Be provided with square form keyway on the closing plate 13, the embedding has sealing washer 12 in the square form keyway on the closing plate 13, and one side top, bottom and the four corners department of closing plate 13 all fix and are provided with the threaded connection hole.
The radiator guide plate 11 is provided with a plurality of guide grooves, and four corners of the side wall of the radiator guide plate 11 are respectively provided with a plurality of threaded connection holes in a penetrating manner.
A plurality of connecting pipelines are arranged in the mounting cavity 7, one pipeline is communicated with the water pump volute cavity 6, one pipeline is fixedly connected and communicated with the high-temperature liquid connector 10, and the other pipeline is fixedly connected and communicated with the low-temperature liquid connector 9.
An isolation component is arranged in the water tank 1, the isolation component is a sealing rubber partition plate, and a high-temperature liquid inlet 18 and a low-temperature liquid outlet 19 in each group are arranged in the same interval area.
Two square grooves are arranged on the semiconductor hot end heat-conducting plate 2 and are respectively opposite to the low-temperature liquid connecting port 9 and the high-temperature liquid connecting port 10.
The working principle is as follows: when the device is used, the device is installed, so that the device can form the state shown in the attached drawing 1, when heat dissipation is carried out or hot liquid needs to be converted into cold liquid, an external high-temperature liquid inlet pipe is connected with a high-temperature liquid inlet 18 arranged on a water tank 1, an external low-temperature liquid return pipe is connected with a low-temperature liquid outlet 19, so that the operation can be completed, a plurality of groups of high-temperature liquid inlets 18 and low-temperature liquid outlets 19 are arranged on the water tank 1, so that the pipeline in multiple directions is convenient to install, the power loss in the pipeline caused by unnecessary bending is avoided, meanwhile, a semiconductor hot end heat conduction plate 2, a semiconductor refrigeration sheet 3, a semiconductor cold end heat conduction plate 4 and a flow guide assembly 5 are arranged, so that the water flow can be further dissipated, the internal heat flow is rapidly cooled, the use requirement is met, and the whole operation flow of the device is as follows, the heat flow enters the water tank 1 through the high-temperature liquid inlet 18, when the semiconductor refrigeration piece 3 works, one side is high temperature, the high-temperature position is jointed with the semiconductor hot end heat-conducting plate 2, so that the temperature at the position of the semiconductor hot end heat-conducting plate 2 is higher, when the heat flow passes through the position of the semiconductor hot end heat-conducting plate 2, the heat flow leads the heat at the position of the semiconductor hot end heat-conducting plate 2 to pass through the square groove arranged at one side of the semiconductor hot end heat-conducting plate 2, then enters the high-temperature liquid connecting port 10, then enters the plurality of radiating pipes 16 along the central output end at the position of the volute cavity 6 of the water pump under the action of the water pump 8, passes through the radiating of the plurality of radiating components 17, the liquid reaching a certain temperature flows back again along the low-temperature liquid connecting port 9 through the pipeline in the installation cavity 7, the semiconductor refrigeration piece 3 is arranged at one side of the semiconductor cold end heat-conducting plate 4, and the side wall at the low-temperature position of the semiconductor refrigeration piece 3 is jointed with the semiconductor cold end heat-conducting plate 4, fluid carries out final heat dissipation under the effect of semiconductor cold junction heat-conducting plate 4 to make the liquid that flows out via low temperature liquid outlet 19 be the temperature that needs, thereby guarantee the completion of work, be provided with installation cavity 7, can be fine arrange in order and lay the pipeline, and device overall structure is compacter and accurate.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (8)
1. An integrated liquid circulation low-temperature radiator comprises a radiating shell (15), a radiating pipe (16) and a radiating assembly (17), and is characterized in that; a sealing plate (13) is attached to one side of the radiating shell (15), the sealing plate (13) is integrally square, a plurality of radiating pipe hole seals (14) are uniformly arranged on the sealing plate (13), the radiating pipe hole seals (14) are respectively arranged opposite to the axes of corresponding radiating pipes (16), a radiator guide plate (11) is attached to one side of the sealing plate (13), a flow guide assembly (5) is attached to one side of the radiator guide plate (11), the flow guide assembly (5) is integrally square, a water pump volute cavity (6) and an installation cavity (7) are arranged on the side wall of the flow guide assembly (5), a low-temperature liquid connector (9) and a high-temperature liquid connector (10) are arranged on the side wall of the flow guide assembly (5), and a water pump (8) is fixedly installed on the side wall of the flow guide assembly (5), the output of water pump (8) stretches into in water pump spiral case cavity (6), the embedding has semiconductor cold junction heat-conducting plate (4) in installation cavity (7), one side laminating of semiconductor cold junction heat-conducting plate (4) is provided with semiconductor refrigeration piece (3), one side laminating of semiconductor refrigeration piece (3) is provided with semiconductor hot junction heat-conducting plate (2), fixed mounting has water tank (1) on the lateral wall of water conservancy diversion subassembly (5), fixed multiunit high temperature liquid import (18) and low temperature liquid export (19) of being provided with on the outer wall of water tank (1), every group high temperature liquid import (18) and low temperature liquid export (19) communicate with each other with water tank (1) respectively.
2. The integrated liquid circulation low-temperature radiator as claimed in claim 1, wherein: fixed mounting has a plurality of cooling tubes (16) in heat dissipation casing (15), communicates with each other through the connecting pipe between two adjacent cooling tubes (16), installs a plurality of radiator unit (17) jointly on a plurality of cooling tubes (16), and radiator unit (17) comprise a plurality of wavy panel, and radiator unit (17) adopt the heat conduction material to make.
3. The integrated liquid circulation low-temperature radiator as claimed in claim 1, wherein: the inner wall of the radiating pipe hole seal (14) is fixedly provided with a rubber ring, the diameter of the radiating pipe hole seal (14) is slightly larger than the diameter of the radiating pipe (16) by 1-2mm, and the thickness of the rubber ring arranged on the inner wall of the radiating pipe hole seal (14) is 3-4 mm.
4. The integrated liquid circulation low-temperature radiator as claimed in claim 1, wherein: be provided with square form keyway on closing plate (13), embedding has sealing washer (12) in the square form keyway on closing plate (13), and one side top, bottom and the four corners department of closing plate (13) all are fixed and are provided with the threaded connection hole.
5. The integrated liquid circulation low-temperature radiator as claimed in claim 1, wherein: the radiator guide plate (11) is provided with a plurality of guide grooves, and four corners of the side wall of the radiator guide plate (11) are respectively provided with a plurality of threaded connecting holes in a penetrating mode.
6. The integrated liquid circulation low-temperature radiator as claimed in claim 1, wherein: a plurality of connecting pipelines are arranged in the mounting cavity (7), one pipeline is communicated with the water pump volute cavity (6), one pipeline is fixedly connected and communicated with the high-temperature liquid connector (10), and the other pipeline is fixedly connected and communicated with the low-temperature liquid connector (9).
7. The integrated liquid circulation low-temperature radiator as claimed in claim 1, wherein: an isolation assembly is arranged in the water tank (1), the isolation assembly is a sealing rubber partition plate, and a high-temperature liquid inlet (18) and a low-temperature liquid outlet (19) in each group are arranged in the same interval area.
8. The integrated liquid circulation low-temperature radiator as claimed in claim 1, wherein: the semiconductor hot end heat-conducting plate (2) is provided with two square grooves which are respectively arranged opposite to the low-temperature liquid connecting port (9) and the high-temperature liquid connecting port (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111026370.9A CN113720046B (en) | 2021-09-02 | 2021-09-02 | Integrated liquid circulation low-temperature radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111026370.9A CN113720046B (en) | 2021-09-02 | 2021-09-02 | Integrated liquid circulation low-temperature radiator |
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| Publication Number | Publication Date |
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| CN113720046A true CN113720046A (en) | 2021-11-30 |
| CN113720046B CN113720046B (en) | 2022-10-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111026370.9A Active CN113720046B (en) | 2021-09-02 | 2021-09-02 | Integrated liquid circulation low-temperature radiator |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09326582A (en) * | 1996-04-03 | 1997-12-16 | Denso Corp | Boiling cooling device and case cooling device equipped therewith |
| CN2708371Y (en) * | 2004-06-28 | 2005-07-06 | 施展 | Heat pipe type radiator for desktop computer |
| CN103642692A (en) * | 2013-12-19 | 2014-03-19 | 孙迪祥 | Inner low-temperature operation table of cell culture clean bench |
| CN106440601A (en) * | 2015-08-11 | 2017-02-22 | 卡孚特能源技术（深圳）有限公司 | Freezing type multistage semiconductor refrigeration refrigerator |
| CN208521920U (en) * | 2018-06-06 | 2019-02-19 | 晋江爱家制冷设备有限公司 | A kind of Novel fin formula liquid cooling heat radiator |
| CN210154125U (en) * | 2019-02-21 | 2020-03-17 | 佛山市顺德区美的饮水机制造有限公司 | Air-cooled circulating drinking liquid semiconductor refrigeration system and refrigeration equipment |
-
2021
- 2021-09-02 CN CN202111026370.9A patent/CN113720046B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09326582A (en) * | 1996-04-03 | 1997-12-16 | Denso Corp | Boiling cooling device and case cooling device equipped therewith |
| CN2708371Y (en) * | 2004-06-28 | 2005-07-06 | 施展 | Heat pipe type radiator for desktop computer |
| CN103642692A (en) * | 2013-12-19 | 2014-03-19 | 孙迪祥 | Inner low-temperature operation table of cell culture clean bench |
| CN106440601A (en) * | 2015-08-11 | 2017-02-22 | 卡孚特能源技术（深圳）有限公司 | Freezing type multistage semiconductor refrigeration refrigerator |
| CN208521920U (en) * | 2018-06-06 | 2019-02-19 | 晋江爱家制冷设备有限公司 | A kind of Novel fin formula liquid cooling heat radiator |
| CN210154125U (en) * | 2019-02-21 | 2020-03-17 | 佛山市顺德区美的饮水机制造有限公司 | Air-cooled circulating drinking liquid semiconductor refrigeration system and refrigeration equipment |
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| Publication number | Publication date |
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| CN113720046B (en) | 2022-10-04 |
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