CN215872417U - Liquid cooling machine case with internal and external double circulation systems - Google Patents
Liquid cooling machine case with internal and external double circulation systems Download PDFInfo
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- CN215872417U CN215872417U CN202121591226.5U CN202121591226U CN215872417U CN 215872417 U CN215872417 U CN 215872417U CN 202121591226 U CN202121591226 U CN 202121591226U CN 215872417 U CN215872417 U CN 215872417U
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Abstract
The utility model relates to the technical field of liquid cooling machine cases, and particularly discloses a liquid cooling machine case with an internal and external double circulation system, which comprises a case body, a chip substrate arranged in the case body, a liquid cooling plate arranged in the case body and used for supporting the chip substrate, an internal circulation system and an external cold source system which are respectively connected with the liquid cooling plate; and a liquid cooling joint assembly is arranged between the liquid cooling plate and the external cooling source system. The utility model can effectively realize the self-circulation of the liquid cooling system in the case and the external circulation of the liquid cooling system of the case, the two circulation systems can be freely switched, are independent and do not interfere with each other, and the whole structure is simple and reliable.
Description
Technical Field
The utility model relates to the technical field of liquid cooling cabinets, in particular to a liquid cooling cabinet with an internal and external double circulation system.
Background
With the rapid development of electronic equipment, the power consumption of a chip is increased, the volume requirement is reduced, the integration level of devices is higher and higher, the heat flux density is higher and higher, and higher requirements are provided for the heat dissipation efficiency of a chassis of the electronic equipment. In the prior art, liquid cooling heat dissipation has been widely applied to the industries of aerospace, automobiles, computers and the like because of its advantages of good heat dissipation, low noise and maintainability.
In the environment of electronic equipment, shock vibration, temperature and humidity, liquid supply conditions and weight are all factors to be considered. How to take away the heat of the electronic device through the case self-circulation liquid cooling system under the condition of lacking an external cold source system, and meanwhile, the external circulation function of the case liquid cooling system is realized under the condition of considering the centralized liquid supply of the system.
SUMMERY OF THE UTILITY MODEL
The technical problem to be solved by the utility model is to provide a liquid cooling cabinet with an internal and external double circulation system; can effectually realize quick-witted incasement portion liquid cooling system self-loopa, can realize quick-witted case liquid cooling system's extrinsic cycle again, two circulation systems can freely switch, mutually independent mutually noninterfere, and overall structure is simple reliable.
The technical problem to be solved by the utility model is as follows:
a liquid cooling case with an internal and external double circulation system comprises a case body, a chip substrate arranged in the case body, a liquid cooling plate arranged in the case body and used for supporting the chip substrate, an internal circulation system and an external cooling source system which are respectively connected with the liquid cooling plate; and a liquid cooling joint assembly is arranged between the liquid cooling plate and the external cooling source system.
When the cold source system is used, the liquid cooling joint component is in a closed state when the external cold source system is lacked; starting the internal circulation system, and performing heat dissipation treatment on water in the liquid cooling plate through the internal circulation system to dissipate heat of the chip substrate arranged on the liquid cooling plate;
under the condition of an external cold source system, the liquid cooling joint assembly is connected with the external cold source system, the liquid cooling joint assembly is in an open state at the moment, the internal circulation system is in a closed state, and liquid is supplied to the liquid cooling plate through the external cold source system, so that heat dissipation of a chip substrate installed on the liquid cooling plate is realized;
the utility model effectively realizes the heat dissipation of the inner part of the case by connecting the inner circulation system and the outer cold source system, and the two systems can be freely switched according to the use requirement and are relatively independent and do not interfere with each other.
In some possible embodiments, the heat dissipation of the chip substrate is realized for an effective inner circulation system; the inner circulation system comprises a water pump connected with the liquid cooling plate through a pipeline and a heat exchanger respectively connected with the water pump and the liquid cooling plate through pipelines.
In some possible embodiments, the liquid cooling plate is provided with a liquid outlet and a liquid inlet, the water pump is provided with a water inlet and a water outlet, and the heat exchanger is provided with a heat exchange outlet and a heat exchange inlet; the liquid inlet is connected with the water outlet, and the liquid outlet is connected with the heat exchange inlet; the heat exchange outlet is connected with the water inlet; the liquid outlet and the liquid inlet are respectively connected with an external cold source system.
In some possible embodiments, the liquid cooling joint assembly includes a joint a connected to the liquid cooling plate, a fixed frame installed outside the heat exchanger, and a joint B installed outside the fixed frame and communicating with the joint a; the other end of the joint B is connected with an external cold source system.
In some possible embodiments, the joint a comprises a pagoda joint with one end connected with the liquid inlet of the liquid cooling plate, and a sealing ring a which is arranged at one end of the pagoda structure far away from the liquid inlet and connected with the fixing frame;
the joint B comprises a self-sealing joint which is arranged on the outer side of the fixed frame and penetrates through the box body, and a sealing ring B which is arranged at one end of the self-sealing joint far away from the external cold source system.
In some possible embodiments, the liquid cooling joint assemblies are two groups, wherein two ends of one group are respectively connected with the liquid outlet and the inlet of the external cooling system, and two ends of the other group are respectively connected with the liquid inlet and the outlet of the external cooling system.
In some possible embodiments, the fixing frame is provided with an open slot, an opening of the open slot is arranged at one side close to the box body, and a through hole is arranged at the bottom of the open slot; connect A still including being used for installing the pagoda joint and being provided with the mount pad A that runs through-hole A, one side that the pagoda joint was kept away from to mount pad A is provided with the mounting groove A that is used for installing sealing washer A, hole, through-hole A, mounting groove A, the through-hole that runs through of pagoda joint communicate in proper order.
In some possible embodiments, the connector B comprises a mounting seat B for mounting the self-sealing connector and provided with a through hole B, one side of the mounting seat B, which is far away from the self-sealing connector, is provided with a mounting groove B for mounting the sealing ring B, and the inner hole, the through hole B, the mounting groove B and the through hole of the self-sealing connector are sequentially communicated.
In some possible embodiments, the inner hole of the self-sealing joint, the sealing ring B, the through hole, the inner hole of the pagoda joint and the sealing ring a are coaxially arranged.
Compared with the prior art, the utility model has the beneficial effects that:
the utility model arranges an inner circulation system and an outer cold source system; the heat dissipation of the chip substrate can be effectively realized under different conditions;
according to the utility model, the liquid cooling joint assembly is arranged between the liquid cooling plate and the external cold source system, and the sealing or opening can be effectively realized through the liquid cooling joint assembly, so that the liquid is prevented from flowing out of the liquid cooling joint assembly when the external cold source system is not available.
By arranging the internal circulation system and the external cold source system, the two systems can be freely switched, are independent and do not interfere with each other, and the whole structure is simple and reliable.
Drawings
FIG. 1 is a schematic view showing the connection relationship among a case, a liquid-cooled plate, a chip substrate, an internal circulation system, and a liquid-cooled joint assembly according to the present invention;
FIG. 2 is a schematic view of a fluid-cooled joint assembly according to the present invention;
FIG. 3 is a schematic view showing the connection between the liquid cooling plate and the internal circulation system according to the present invention;
FIG. 4 is a schematic diagram showing the connection relationship between the liquid cooling plate, the internal circulation system, the liquid cooling joint assembly and the external cold source system according to the present invention;
wherein: 1. a right side plate; 2. a left side plate; 3. a lower cover plate; 4. an upper cover plate; 5. a front panel; 6. a handle; 7. a back plate; 8. a liquid-cooled plate; 9. a chip substrate; 10. a water pump; 11. a liquid-cooled tube; 12. a heat exchanger; 13. a fan; 14. a liquid cooled joint assembly; 141. a joint A; 142. a sealing ring A; 143. a fixing frame; 144. a joint B; 145. a seal ring B; 20. an external cooling source system.
Detailed Description
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; either directly or indirectly through intervening media, either internally or in any other relationship. Reference herein to "first," "second," and similar words, does not denote any order, quantity, or importance, but rather are used to distinguish one element from another. Also, the use of the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one. In the implementation of the present application, "and/or" describes an association relationship of associated objects, which means that there may be three relationships, for example, a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. In the description of the embodiments of the present application, the meaning of "a plurality" means two or more unless otherwise specified. For example, the plurality of positioning posts refers to two or more positioning posts. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The present invention is described in detail below, as shown in FIGS. 1-4;
a liquid cooling case with an internal and external double circulation system comprises a case body, a chip substrate 9 arranged in the case body, a liquid cooling plate 8 arranged in the case body and used for supporting the chip substrate 9, and an internal circulation system and an external cold source system 20 which are respectively connected with the liquid cooling plate 8 through pipelines; a liquid cooling joint assembly 14 is arranged between the liquid cooling plate 8 and the external cooling source system 20; the liquid cooling joint assembly 14 is connected with the liquid cooling plate 8 and the external cooling source system 20 through pipelines.
In use, the fluid connector assembly 14 is in a closed position when the external heat sink system 20 is absent; the internal circulation system is started, and the water in the liquid cooling plate 8 is subjected to heat dissipation treatment through the internal circulation system, so that the chip substrate 9 arranged on the liquid cooling plate 8 is subjected to heat dissipation;
under the condition of having the external cold source system 20, the liquid cooling joint assembly 14 is connected with the external cold source system 20, at the moment, the liquid cooling joint assembly 14 is in an open state, the internal circulation system is in a closed state, and liquid is supplied to the liquid cooling plate 8 through the external cold source system 20, so that the heat dissipation of the chip substrate 9 installed on the liquid cooling plate 8 is realized;
the utility model effectively realizes the heat dissipation of the inner part of the case by connecting the inner circulation system and the outer cold source system 20, and the two systems can be freely switched according to the use requirement and are relatively independent and do not interfere with each other.
An inner cavity flow channel is arranged inside the liquid cooling plate 8, and the inner circulation system and the external cold source system 20 are communicated with the inner cavity flow channel through pipelines.
The liquid-cooled panels 8 are prior art and their internal structure will not be described in detail here.
In some possible embodiments, heat dissipation to the chip substrate 9 is achieved for efficient through the internal circulation system; the internal circulation system comprises a water pump 10 connected with the liquid cooling plate 8 through a pipeline, and a heat exchanger 12 respectively connected with the water pump 10 and the liquid cooling plate 8 through pipelines.
The heat exchanger 12 conveys water into the water pump 10, and the water pump 10 conveys water or other liquid to an inner cavity flow passage in the liquid cooling plate 8 through a pipeline; then, water or other liquid in the original inner cavity flow channel is discharged through an outlet of the inner cavity flow channel, the discharged water or other liquid enters the heat exchanger 12 for heat exchange and then is reused to form an inner circulation system, and the chip substrate 9 on the liquid cooling plate 8 is cooled;
in some possible embodiments, the liquid cooling plate 8 is provided with a liquid outlet and a liquid inlet, the water pump 10 is provided with a water inlet and a water outlet, and the heat exchanger 12 is provided with a heat exchange outlet and a heat exchange inlet; the liquid inlet is connected with the water outlet, and the liquid outlet is connected with the heat exchange inlet; the heat exchange outlet is connected with the water inlet; the liquid outlet and the liquid inlet are connected to an external cold source system 20 through a liquid cooling connector assembly 14.
When an external cold source system 20 is available, the external cold source system 20 is connected with a liquid outlet and a liquid inlet through the liquid cooling joint assembly 14, the external cold source system 20 conveys water or other liquid into the liquid cooling plate 8 through a pipeline, and then the water or other liquid originally stored in the inner cavity flow channel is discharged into the external cold source system 20 through the liquid outlet of the liquid cooling plate 8, so that cyclic utilization is realized, the liquid in the liquid cooling plate 8 is replaced, and further the heat dissipation of the chip substrate 9 mounted on the liquid cooling plate 8 is realized;
the conduits described in the present invention are liquid cooled tubes 11.
In some possible embodiments, to be effective, the fluid-cooled connector assembly 14 can be self-sealing without the external heat sink system 20, preventing water or other liquids from exiting through the fluid-cooled connector assembly 14; the liquid cooling joint assembly 14 comprises a joint A141 connected with the liquid cooling plate 8, a fixed frame 143 arranged outside the heat exchanger 12, and a joint B144 arranged outside the fixed frame 143 and communicated with the joint A141; the other end of the joint B144 is connected to the external cooling source system 20.
In some possible embodiments, the joint a141 includes a pagoda joint having one end connected to the liquid inlet of the liquid cooling plate 8, and a sealing ring a142 installed at one end of the pagoda structure away from the liquid inlet and connected to the fixing frame 143;
the joint B144 includes a self-sealing joint installed outside the fixing frame 143 and penetrating through the box body, and a sealing ring B145 installed at one end of the self-sealing joint far from the external cold source system 20.
In some possible embodiments, the liquid cooling joint assemblies 14 are two groups, wherein two ends of one group are respectively connected to the liquid outlet and the inlet of the external cooling system 20, and two ends of the other group are respectively connected to the liquid inlet and the outlet of the external cooling system.
When the external cold source system 20 is available, the group of liquid cooling joint assemblies 14 are respectively connected with the liquid inlet and the outlet of the external cold source system 20; the self-sealing joint is arranged for effectively avoiding water or liquid from flowing out; only when the self-sealing joint is connected with the outlet of the external cold source system 20, the self-sealing joint is opened, so that water or liquid in the external cold source system 20 can enter the liquid cooling plate 8, and when the self-sealing joint is not connected with the external cold source system 20, the self-sealing joint is in a sealing state;
the other group of liquid cooling joint assemblies 14 are respectively connected with a liquid outlet and an inlet of the external cold source system 20, and similarly, the self-sealing joints in the group can be opened only when being connected and are not connected with the external cold source system 20, and the self-sealing joints are in a sealing state;
the joint A141 adopts a pagoda joint, so that the assembly and disassembly are more convenient.
In some possible embodiments, the fixing frame 143 is provided with an open slot, the opening of the open slot is arranged at one side close to the box body, and the bottom of the open slot is provided with a through hole; connect A141 still including being used for installing the pagoda joint and being provided with the mount pad A that runs through-hole A, one side that mount pad A kept away from the pagoda joint is provided with the mounting groove A that is used for installing sealing washer A142, hole, through-hole A, mounting groove A, the through-hole that runs through of pagoda joint communicate in proper order.
In some possible embodiments, the joint B144 includes a mounting seat B for mounting the self-sealing joint and provided with a through hole B, a mounting groove B for mounting the sealing ring B145 is provided on a side of the mounting seat B away from the self-sealing joint, and the inner hole, the through hole B, the mounting groove B, and the through hole of the self-sealing joint are sequentially communicated.
In some possible embodiments, the inner hole of the self-sealing joint, the sealing ring B, the through hole, the inner hole of the pagoda joint and the sealing ring a are coaxially arranged.
Preferably, as shown in fig. 1, the box body comprises a cavity formed by enclosing a right side plate, a left side plate 2, a lower cover plate 3, an upper cover plate 4, a front panel 5 and a rear plate 7, and a handle 6 installed on the outer side of the front panel 5; the liquid cooling plate 8 is arranged on the lower cover plate 3;
preferably, as shown in fig. 1, in order to make the structure more compact, the water pump 10 is disposed between the liquid cooling plate and the heat exchanger, and a fan 13 is disposed on a side of the heat exchanger 12 away from the water pump 10;
as shown in fig. 2, in order to switch between the self-circulation and the external circulation, two liquid-cooled joint assemblies 14 are installed in the middle of the rear plate 7 of the cabinet, and each liquid-cooled joint assembly 14 includes a pagoda joint, a sealing ring a142, a fixing frame 143, a sealing ring B145 and a self-sealing joint. The pagoda joint and the self-sealing joint are respectively fixed on the inner side and the outer side of the fixing frame 143 through a sealing ring A142 and a sealing ring B145, the pagoda joint is connected with the liquid cooling plate 8 through a liquid cooling pipe, and the self-sealing joint is used for connecting an external cooling source system.
As shown in fig. 3, the self-sealing joint is in a disconnected state in the absence of the external cold source system 20, so that the self-sealing of the liquid cooling pipeline can be realized. A water outlet of the water pump 10 is connected with a three-way joint, one branch of the three-way joint is connected with a flange joint of a liquid inlet of the liquid cooling plate 8, cooling liquid passes through a flow channel of an inner cavity of the liquid cooling plate 8 and is connected with the other three-way joint, one branch of the three-way joint is connected with a heat exchange inlet of the heat exchanger 12, and after secondary heat exchange is carried out in the inner cavity of the heat exchanger 12, the cooling liquid flows out through a heat exchange outlet of the heat exchanger 12 and is connected with a water inlet of the water pump 10; thus, a liquid cooling self-circulation system in the case is formed.
As shown in fig. 4, under the condition of centralized liquid supply by the external cold source system 20, the water pump 10 is in a stop state, the self-sealing joints are respectively communicated with the external cold source system 20 to form a water inlet and outlet joint, the cooling liquid of the external cold source system 20 is connected with the three-way joint through the self-sealing joints, one branch is connected with the liquid inlet of the liquid cooling plate 8, flows out from the liquid outlet of the liquid cooling plate 8, and is connected with the other three-way joint, and one branch of the three-way joint is connected with the other self-sealing joint and finally flows back into the external cold source system 20; thus, the external circulation of the liquid cooling system of the case is formed.
The utility model is not limited to the foregoing embodiments. The utility model extends to any novel feature or any novel combination of features disclosed in this specification and any novel method or process steps or any novel combination of features disclosed.
Claims (9)
1. A liquid cooling case with an internal and external double circulation system comprises a case body, a chip substrate arranged in the case body, and is characterized by also comprising a liquid cooling plate arranged in the case body and used for supporting the chip substrate, an internal circulation system and an external cold source system which are respectively connected with the liquid cooling plate; and a liquid cooling joint assembly is arranged between the liquid cooling plate and the external cooling source system.
2. The liquid cooling cabinet with the internal and external dual circulation systems as claimed in claim 1, wherein the internal circulation system comprises a water pump connected to the liquid cooling plate through a pipeline, and a heat exchanger connected to the water pump and the liquid cooling plate through pipelines.
3. The liquid cooling cabinet of an internal and external dual circulation system as claimed in claim 2, wherein the liquid cooling plate is provided with a liquid outlet and a liquid inlet, the water pump is provided with a water inlet and a water outlet, and the heat exchanger is provided with a heat exchange outlet and a heat exchange inlet; the liquid inlet is connected with the water outlet, and the liquid outlet is connected with the heat exchange inlet; the heat exchange outlet is connected with the water inlet; the liquid outlet and the liquid inlet are respectively connected with an external cold source system.
4. The liquid cooling cabinet with internal and external dual circulation systems as claimed in claim 2,
the liquid cooling joint assembly comprises a joint A connected with the liquid cooling plate, a fixed frame arranged on the outer side of the heat exchanger, and a joint B arranged on the outer side of the fixed frame and communicated with the joint A; the other end of the joint B is connected with an external cold source system.
5. The liquid cooling cabinet with the internal and external double circulation systems as claimed in claim 3, wherein the joint A comprises a pagoda joint with one end connected with the liquid inlet of the liquid cooling plate, and a sealing ring A which is arranged at one end of the pagoda structure far away from the liquid inlet and connected with the fixing frame;
the joint B comprises a self-sealing joint which is arranged on the outer side of the fixed frame and penetrates through the box body, and a sealing ring B which is arranged at one end of the self-sealing joint far away from the external cold source system.
6. The liquid cooling cabinet with internal and external dual circulation systems as claimed in claim 4, wherein the liquid cooling joint assemblies are divided into two groups, wherein two ends of one group are respectively connected with the liquid outlet and the inlet of the external cooling system, and two ends of the other group are respectively connected with the liquid inlet and the outlet of the external cooling system.
7. The liquid cooling cabinet with the internal and external dual circulation systems as claimed in claim 6, wherein the fixing frame is provided with an open slot, the opening of the open slot is arranged at one side close to the cabinet body, and the bottom of the open slot is provided with a through hole; connect A still including being used for installing the pagoda joint and being provided with the mount pad A that runs through-hole A, one side that the pagoda joint was kept away from to mount pad A is provided with the mounting groove A that is used for installing sealing washer A, hole, through-hole A, mounting groove A, the through-hole that runs through of pagoda joint communicate in proper order.
8. The liquid cooling cabinet with the internal and external dual circulation systems according to claim 7, wherein the joint B comprises a mounting seat B for mounting the self-sealing joint and provided with a through hole B, a mounting groove B for mounting the sealing ring B is arranged on one side of the mounting seat B away from the self-sealing joint, and the inner hole, the through hole B, the mounting groove B and the through hole of the self-sealing joint are sequentially communicated.
9. The liquid cooling cabinet with internal and external dual circulation systems as claimed in claim 8, wherein the inner hole of the self-sealing joint, the sealing ring B, the through hole, the inner hole of the pagoda joint and the sealing ring A are coaxially arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121591226.5U CN215872417U (en) | 2021-07-13 | 2021-07-13 | Liquid cooling machine case with internal and external double circulation systems |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121591226.5U CN215872417U (en) | 2021-07-13 | 2021-07-13 | Liquid cooling machine case with internal and external double circulation systems |
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| Publication Number | Publication Date |
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| CN215872417U true CN215872417U (en) | 2022-02-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202121591226.5U Active CN215872417U (en) | 2021-07-13 | 2021-07-13 | Liquid cooling machine case with internal and external double circulation systems |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024011912A1 (en) * | 2022-07-15 | 2024-01-18 | 中兴通讯股份有限公司 | Maintenance device, liquid cooling system, and maintenance method for liquid cooling system |
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2021
- 2021-07-13 CN CN202121591226.5U patent/CN215872417U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024011912A1 (en) * | 2022-07-15 | 2024-01-18 | 中兴通讯股份有限公司 | Maintenance device, liquid cooling system, and maintenance method for liquid cooling system |
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