JP2003324219A - Thermoelectric module fixing structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem in a conventional technique that, since a trouble is apt to be generated by the reason of permeation of moisture in the case of current flowing, vibration from the outside and an unbalanced load due to a shock in a structure in which a thermoelectric semiconductor element and a metal electrode are retained on an electric insulating substrate in a thermoelectric module having a thermoelectric element like a Peltier element, shield by a sealing solvent and a jacket for fixing a thermoelectric module which is described by JP 3055679 are provided for countermeasures of the trouble, however, the prevention of permeation of moisture and an unbalanced-load withstanding force are not sufficient in both the means. <P>SOLUTION: The periphery of a thermoelectric module is surrounded by a sealing member having elasticity. Thermally conductive members are arranged on the whole of the heat generating surface and the heat absorbing surface of the thermoelectric module, respectively. The sealing member is compressed and fixed by the thermally conductive members, and a trench is formed in the whole periphery or a part of at least one surface of the sealing member. As a result, the vibration resistance, shock resistance and hermetically sealing property of the thermoelectric module are increased. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a thermoelectric module mounting structure for a thermoelectric heating and cooling device including a thermoelectric module.

[0002]

2. Description of the Related Art Conventionally, a thermoelectric module having a thermoelectric element such as a Peltier element has been widely used in a cooling device for a CPU of a computer and an electronic heating / cooling device such as a refrigerator.

FIG. 5 shows such a conventional thermoelectric module. This thermoelectric module 10
As shown in FIG. 5, the thermoelectric element 110 and the thermoelectric element 1
And a substrate 111 having an electrical insulating property for supporting the insulating film 10. In the thermoelectric module 10, the n-type thermoelectric semiconductor element 12n and the p-type thermoelectric semiconductor element 1 which are the thermoelectric elements 110 are included.
2p are arranged alternately, and n-type thermoelectric semiconductor element 12
Metal electrodes (the upper electrode plate 13 and the lower electrode plate 14) are soldered between the end faces of the n and p type thermoelectric semiconductor elements 12p, and the n type thermoelectric semiconductor elements 12n and the p type thermoelectric semiconductor elements 12p are electrically connected alternately. It is connected in series. A direct current power source is connected to the metal electrodes 13 and 14 via a lead wire 112, and when a current is passed from this power source,
Due to the Peltier effect, the metal electrode 13 on one end face side absorbs heat and the metal electrode 14 on the other end face side generates heat. The metal electrodes 13 and 14 of the thermoelectric module 10 are adhered and fixed to a substrate 111 having good thermal conductivity and electrical insulation such as ceramics by a metallizing method or the like. The thermoelectric module 10 is used by disposing a heat exchange member such as a combination of a heat sink and a fan outside the substrate 111.

However, in the thermoelectric module, one of the substrates is cooled by heat absorption, so that the surrounding moisture is condensed and penetrates into the thermoelectric module to corrode the metal electrode connecting the Peltier element or to cause a gap between the metal electrodes. There is a risk that the thermoelectric module will be reduced in function or it may cause a failure. Further, the thermoelectric module is held by being sandwiched between the heat sink side heat-conductive member and the heat radiation side heat-conductive member, and the thermoelectric module part is biased by external vibration or shock. There is a risk of damage to the Peltier element, which may cause the thermoelectric module to fail.

Therefore, conventionally, a space between the surrounding substrates of the thermoelectric element module is sealed with a sealing solvent, or the method disclosed in Japanese Patent No. 305
A jacket having a structure for fixedly mounting a thermoelectric module as described in No. 5679 has been proposed.

In the mounting structure using this jacket, the thermoelectric module is surrounded by a resin frame, and the heat radiation side heat sink and the resin frame are fixed with screws, and the thermoelectric module is fixed with screws between the heat absorption side heat sink and the heat radiation side heat sink. The thermoelectric module is sealed by fixing with a curable resin over the entire circumference of the gap between the heat radiation side resin frame and the heat absorption side heat sink.

[0007]

However, with the above-described shielding of the surroundings by the sealing solvent, pinholes are generated, or moisture is passed but water is not passed, so that the internal breathing action is caused by repeated cooling and heating of the thermoelectric module. As a result, moisture will infiltrate and condensation will occur inside, and when fixing with a resin frame and curable resin, the heat exchange rate will decrease significantly,
Furthermore, the structure is complicated, the workability is poor, and the cost is high. Furthermore, due to the difference in the coefficient of thermal expansion between the resin frame, the curable resin, the heat radiation side heat sink, and the heat absorption side heat sink, repeated cooling and heating of the thermoelectric module, and fluctuations in the outside air temperature, etc., provide reliable sealing with the outside air. I can't.

The present invention has been made to solve the above problems, has a simple structure and is easy to assemble, prevents moisture from entering the thermoelectric module, and mechanically operates from the outside. An object of the present invention is to provide a thermoelectric module mounting structure that can alleviate vibrations and shocks, minimize the decrease in heat exchange efficiency, and enhance the durability of the thermoelectric module.

[0009]

Means for Solving the Problems In order to achieve the above-mentioned object, the present invention has solved the problems by means of the following item 8.

According to a first aspect of the present invention, a thermoelectric module having a heat generating surface that generates heat when energized and a heat absorbing surface that absorbs the heat, and a heat radiating side heat that comes into planar contact with each of the heat generating surface and the heat absorbing surface. It has a good conductive member and a heat absorbing side good thermal conductive member, and is arranged all around the side surface portion between the heat generating surface and the heat absorbing surface of the thermoelectric module, and the heat absorbing side good heat conducting member and the heat radiating side good heat In a thermoelectric module mounting structure configured by a sealing member that is in contact with a conductive member and seals the thermoelectric module, the sealing member has elasticity, and the heat absorbing side is good in heat and the heat generating side is good in heat. A surface that is compressed and fixed by a conductive member and is in contact with the heat-absorption-side heat-conductive member, a surface that is in contact with the heat-radiation-side heat-conductive member, and a surface that is not in contact with the heat-absorption-side heat-conductive member and the heat-radiation-side heat good On one or more surfaces not in contact with the conductive member, the entire circumference of the sealing member or Is due to having a groove partly.

The invention of claim 2 is because a part or all of the inside of the sealing member is hollow.

According to a third aspect of the present invention, the heat generating surface and the heat absorbing surface of the thermoelectric module are polygonal, and the outer periphery of the sealing member arranged along the periphery is around the polygonal corner of the thermoelectric module. In the above, the shape is larger on the outer peripheral side than the other periphery, and the area in contact with the heat-absorption-side heat-conductive member and the heat-radiation-side heat-conductive member is large.

According to a fourth aspect of the present invention, a part or all of the inside of the sealing member is hollow, a surface in contact with the heat-absorption-side heat-conductive member and a surface in contact with the heat-radiation-side heat-conductive member, and This is because the sealing member has a convex portion on the entire circumference or a part thereof on one or more surfaces that do not contact the heat absorption side heat conducting member and the heat dissipation side heat conducting member. .

The invention of claim 5 is based on the fact that the sealing member has waterproofness, moistureproofness and dustproofness or is added thereto.

The invention of claim 6 is because the sealing member has air permeability or is added.

According to a seventh aspect of the present invention, the dimension between the heat-absorption-side heat-conductive member and the heat-radiation-side heat-conductive member of the sealing member is the same between the heat-generating surface and the heat-absorbing surface of the thermoelectric module. This is due to being in the range of 105% to 250% of the dimension between.

According to the invention of claim 8, the sealing member has a guide portion of a screw for compressing and fixing the sealing member between the heat-absorption-side heat-conductive member and the heat-radiation-side heat-conductive member. It is due to.

[0018]

Embodiments of the present invention will be described in detail below with reference to the drawings.

FIG. 1 is a diagram showing a schematic configuration of an embodiment of a thermoelectric module mounting structure of the present invention, (a) is a plan view and (b) is a front view.

As shown in FIG. 1, the thermoelectric module mounting structure according to the present embodiment has a thermoelectric module 10, a heat conductive heat dissipation plate 20 that supports the thermoelectric module in a planar shape, a heat conductive heat absorbing plate 30, and a thermoelectric module. A rubber molding sealing member 40 that surrounds the periphery and is sandwiched between the heat dissipation plate 20 and the heat absorption plate 30 and compressed and fixed to seal the thermoelectric module 10 is provided.

The thermoelectric module 10 shown in FIG.
As shown in, the thermoelectric element 110 and an electrically insulating substrate 111 that supports the thermoelectric element 110 are provided. The thermoelectric module 10 is supported between the outer surface of the substrate 111 and the heat radiating plate 20 and between the outer surface of the substrate 111 and the heat absorbing plate 30 via a heat conductive grease such as silicon grease. A fixing screw hole 201 for compressing and fixing the thermoelectric module 10 and the sealing member 40 with the heat absorbing plate 30 is installed in the heat radiating plate 20, and the pressurizing screw hole 30 of the heat absorbing plate 30 is provided.
The thermoelectric module 10 and the sealing member 40 are fixed by the fixing screw 50 from 1.

FIG. 2 is a fracture cross-sectional view of the sealing member 40 seen from the direction A. The groove 401 of the sealing member 40 is provided in the process of being compressed and fixed by providing a groove 401 around the entire circumference of a part or the whole surface of the sealing member, or a part or the whole of the inside of the sealing member being hollow 402. The original installation position can be maintained without the entire sealing member being twisted or deformed by the deformation of the hollow portion 402, and the deformation does not protrude from the end portions of the heat dissipation plate 20 or the heat absorption plate 30. Also, the thermoelectric module 10 is not deformed to press the thermoelectric module 10 side. Further, the sealing member 40
In the corner portion 101 of the thermoelectric module 10, the outer periphery is larger in shape toward the outer peripheral side than the other periphery, and the heat radiating plate 20 and the heat absorbing plate 3 are
The area compressed by 0 is large, and generally absorbs vibrations and impacts from the outside which are concentratedly applied to the corners of the thermoelectric module 10 to protect the thermoelectric module 10.
Furthermore, a screw hole 405 for guiding the fixing screw 50 for pressurizing is provided in this portion.

In FIG. 3, the inside of the sealing member 40 is hollow, and a rib 4 having a convex shape is formed on the entire circumference of the surface in contact with the heat absorbing plate 20 and the heat radiating plate 30.
I have placed 03. Thereby, the heat absorbing plate 20 and the heat radiating plate 3
It is possible to ensure close contact with 0 and to prevent the sealing member 40 from being deformed to the periphery. By using or adding a material having waterproofness, dustproofness, and moistureproofness to the sealing member 40, it is possible to prevent moisture from entering the inside of the thermoelectric module and to prevent condensation of moisture even when cooled by heat absorption. Reliability and life can be improved.

Further, FIG. 4 shows a structure in which a material 404 having air permeability is added to the sealing member 40. As a result, it is possible to prevent a pressure difference between the inside and the outside of the sealing member due to the thermoelectric module 10 being repeatedly cooled and heated, and to eliminate the influence of mechanical stress exerted on the thermoelectric module 10 by the pressure difference.

Further, the thickness dimension of the sealing member 40 between the heat absorbing plate 20 and the heat radiating plate 30 before compression fixing is determined by the thermoelectric module 1
By setting the thickness of 0 to the range of 105% to 250%,
Sufficient fixing strength and sealing property of the sealing member can be obtained. Further, it is possible to obtain sufficient protection strength against the thermoelectric module against external vibration and shock.

[0026]

As described above, according to the thermoelectric module mounting structure of the present invention, the influence of external force on the thermoelectric module is reduced, and the waterproof, dustproof, and moistureproof properties are excellent, and good durability is obtained. You can

[Brief description of drawings]

FIG. 1 is a diagram showing a schematic configuration of an embodiment of a thermoelectric module mounting structure of the present invention.

FIG. 2 is a diagram showing a schematic configuration of a cross section of a sealing member in an embodiment of a thermoelectric module mounting structure of the present invention.

FIG. 3 is a diagram showing a schematic configuration of a cross section of a sealing member in another embodiment of the thermoelectric module mounting structure of the present invention.

FIG. 4 is a diagram showing a schematic configuration of a cross section of a sealing member in another embodiment of the thermoelectric module mounting structure of the present invention.

FIG. 5 is a diagram showing a schematic configuration of a conventional thermoelectric module.

[Explanation of symbols]

10 thermoelectric module 20 heat sink 30 heat absorbing plate 40 sealing member 50 fixing screw 110 thermoelectric element 111 substrate 112 lead wire 201 fixing screw hole 301 Pressurized screw hole 401 groove 402 hollow 403 Convex rib 404 breathable material 405 Guide screw hole

Claims (8)

[Claims] 1. A thermoelectric module having a heat-generating surface that generates heat when energized and a heat-absorbing surface that absorbs heat, and a heat-radiating-side heat-conductive member that comes into planar contact with each of the heat-generating surface and the heat-absorbing surface. It has a heat-absorption-side heat-conductive member, and is arranged on the entire circumference of the side surface between the heat-generating surface and the heat-absorption surface of the thermoelectric module, and the heat-absorbing-side heat-conductive member and the heat-radiating-side heat-conductive member are provided. In a thermoelectric module mounting structure configured by a sealing member that contacts and seals the thermoelectric module, the sealing member has elasticity, and the heat absorbing side heat conducting member and the heat generating side heat conducting member are A surface which is fixed by compression and which is in contact with the heat-absorption-side heat-conductive member, a surface which is in contact with the heat-radiation-side heat-conductive member, a surface which is not in contact with the heat-absorption-side heat-conductive member, and the heat-radiation-side heat-conductive member Grooves are provided on the entire circumference or part of the sealing member on one or more surfaces that do not contact. A thermoelectric module mounting structure, characterized in that 2. The thermoelectric module mounting structure according to claim 1, wherein a part or all of the inside of the sealing member is hollow. 3. The heat-generating surface and the heat-absorbing surface of the thermoelectric module are polygonal, and the outer periphery of a sealing member arranged along the periphery is another periphery around the corner of the polygon of the thermoelectric module. The shape is larger toward the outer peripheral side, and the area in contact with the heat-absorption-side heat-conductive member and the heat-radiation-side heat-conductive member is large, and the heat-radiation-side heat-conductive member has a large area.
Thermoelectric module mounting structure described in. 4. A part or all of the inside of the sealing member is hollow, a surface in contact with the heat-absorption-side heat-conductive member, a surface in contact with the heat-dissipation-side heat-conductive member, and the heat-absorption-side heat conductive member. Mounting the thermoelectric module, characterized in that it has a convex portion on the entire circumference or a part of the sealing member on one or more surfaces not in contact with the heat-dissipating side heat-conductive member Construction. 5. The thermoelectric module according to claim 1, wherein the sealing member has waterproofness, moistureproofness, and dustproofness or is added thereto. Mounting structure. 6. The method according to claim 1, wherein the sealing member has air permeability or is added thereto.
Alternatively, the thermoelectric module mounting structure according to claim 3 or claim 4 or claim 5. 7. The dimension between the heat-absorption-side heat-conductive member and the heat-radiation-side heat-conductive member of the sealing member is 105 between the heat-generating surface and the heat-absorbing surface of the thermoelectric module. %
It is in the range of -250%, The thermoelectric module mounting structure according to claim 1 or claim 2 or claim 3 or claim 4 or claim 5 or claim 6. 8. The sealing member has a guide portion of a screw for compressing and fixing the sealing member between the heat-absorbing-side heat-conductive member and the heat-radiating-side heat-conductive member. Claim 1 or Claim 2 or Claim 3 or Claim 4 or Claim 5
Alternatively, the thermoelectric module mounting structure according to claim 6 or 7.