JP2009195455A - Control device for game machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To favorably cool the inside of a casing while suppressing at least a temperature rise in the casing even if an electric control circuit member in the casing radiates heat by its actuation and to surely prevent a fraud to an electronic component and the like inside the casing, in a control device for game machines supported to the back face of a game machine body and having the casing. <P>SOLUTION: A cooling device 700 includes a heat sink 710, one-side ceramic substrate 720, a peltier module 730 and the other-side ceramic substrate 740. The cooling device 700 is mounted to an opening part 461 formed on a lid wall of a casing 400 of a main control board B, from its inside by the heat sink 710. The peltier module 730 is fixed to the heat sink 710 from the inside of the casing 400 via the one-side ceramic substrate 720. The other-side ceramic substrate 740 is fixed to the peltier module 730. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention is a game machine employed in various game machines such as a pachinko game machine, an arrangement ball game machine, a sparrow ball game machine, or a parrot (registered trademark) machine (rotating game machine using a game ball as a game medium). The present invention relates to a control device.

  2. Description of the Related Art Conventionally, for example, a substrate case adopted in a ball game machine disclosed in Patent Document 1 described below is configured by assembling a case lid body to a case body via an intermediate case body. A control board is interposed between the intermediate case body and the case main body and accommodated in the board case. The control board has a ROM, a CPU, etc. for controlling the game operation via the printed pattern. These various electronic components are arranged to be connected.

  Here, the substrate case is formed of a transparent synthetic resin material. For this reason, even if the ROM, CPU, etc. in the substrate case are illegally modified, the state of the unauthorized modification can be visually confirmed from the outside of the substrate case.

In addition, a large number of heat radiation holes are formed in the substrate case. As a result, the heat generated by the various electronic components is radiated from the inside to the outside of the substrate case through a large number of heat radiating holes, thereby preventing a malfunction due to a temperature rise of the various electronic components.
JP 11-290528 A

  By the way, in the above-mentioned substrate case, the above-mentioned many heat radiation holes are formed in small holes. This is to prevent unauthorized modification of electronic components such as ROM and CPU in the board case by making it difficult to insert the tool into the board case from the heat dissipation hole.

  However, although each of the above-described heat radiating holes is a hole so small that it is considered impossible to perform unauthorized tampering, even in such a small heat radiating hole, in recent years, the above-described unauthorized tampering is performed. There is a fear. For this reason, it is an urgent need to take further preventive measures against such illegal modification.

  Therefore, in order to cope with the above, the present invention provides a gaming machine control device having a casing supported on the back surface of the gaming machine main body, and the electrical control circuit member in the casing radiates heat due to its operation. However, an object of the present invention is to satisfactorily cool the inside of the casing so as to suppress at least the temperature rise in the casing and to surely prevent an illegal act on the electronic components and the like inside the casing.

  In solving the above-mentioned problems, according to the gaming machine control device according to the present invention, the gaming machine main body (200) is supported by the machine frame (100). A transparent casing (400) supported by the bottom wall (410) on the back surface and an electric control circuit member (600, 620 to 660) provided in the casing are provided.

And in the said control apparatus, it comprised the cooling means (700) which has a Peltier module (730),
The cooling means includes an opening formed on one or both of the peripheral wall (420 to 440, 470 to 490, 490a) of the casing and the opposing wall (460) provided on the casing so as to face the bottom wall. 461) so as to close the opening.

  According to this, the hole for heat dissipation is not formed at all in the casing. For this reason, the electrical control circuit member is encapsulated in the casing. Therefore, even if the electrical control circuit member includes an electrical element that is subject to unauthorized modification, such as a ROM or CPU, the unauthorized operation of the inside of the casing, that is, unauthorized manipulation of the ROM or CPU that is subject to unauthorized modification. It is impossible to perform an action such as exchanging with another ROM or CPU. As a result, it is possible to reliably prevent a fraudulent act from being performed through the heat radiating hole of the casing as in the prior art.

  According to the first aspect of the present invention configured as described above, when the control device is activated by power feeding, the electrical control circuit member generates heat by power feeding and dissipates heat inside the casing. For this reason, the temperature inside the casing rises with time.

  On the other hand, when the cooling means is activated by power feeding, the cooling means cools the inside of the casing by radiating heat generated in the casing by the Peltier module to the outside from the opening. Thereby, even if the electrical control circuit member includes electronic elements such as a ROM and a CPU, these electronic elements can maintain normal operation without causing malfunction due to temperature rise.

  As a result, according to the first aspect of the present invention, even when the electrical control circuit member generates heat during operation, the cooling means ensures good cooling inside the casing and the electronic components inside the casing. It is possible to reliably prevent fraud against such as.

Further, according to the present invention, in the control device for a gaming machine according to claim 1, the cooling means includes:
A plate-shaped heat sink (710) assembled along the opening of the casing to close the opening;
A thermally conductive electrically insulating substrate (720) fixed along the back surface of the heat sink so as to face the opening through the heat sink;
The Peltier module is provided along the back surface of the electrical insulating substrate so as to face the heat sink through the electrical insulating substrate, and generates heat by absorbing heat generated from the electrical control circuit member by supplying power to the electrical control circuit member. Then, the inside of the casing is cooled by dissipating heat from the heat generation from the opening through the electric insulating substrate and the heat sink.

  According to this, even if the electrical control circuit member generates heat by feeding, the heat is absorbed by the Peltier module and then radiated from the opening through the electrical insulating substrate and the heat sink, thereby The inside is cooled. As a result, the function and effect of the first aspect of the invention can be achieved more reliably.

According to a third aspect of the present invention, in the gaming machine control device according to the second aspect, the Peltier module includes a plurality of first electrode portions (731) and a plurality of first semiconductor portions (N P), a plurality of second semiconductor parts (P, N) and a plurality of second electrode parts (732),
The plurality of first electrode portions are sequentially arranged in a predetermined direction at intervals along the back surface of the electrically insulating substrate,
Each of the plurality of first semiconductor portions extends from the front end portion to the opposite side of the back surface of the electrical insulating substrate among the front and rear end portions in the predetermined direction of each of the plurality of first electrode portions. Extended,
The plurality of second semiconductor portions are parallel to the plurality of first semiconductor portions from the rear end portions in the predetermined direction of the plurality of first electrode portions, respectively, of the electrical insulating substrate. It extends to the opposite side of the back,
Each of the plurality of second electrode portions extends from the front first electrode portion for each of the first and second adjacent first electrode portions in the predetermined direction among the plurality of first electrode portions. It is connected across the extended end of the second semiconductor part and the extended end of the first semiconductor part extending from the first electrode part on the rear side,
The plurality of first semiconductor parts are both formed of one of an N-type thermally conductive semiconductor material and a P-type thermally conductive semiconductor material, and the plurality of second semiconductor parts are both of the N-type thermally conductive semiconductor material. And the other of the P-type thermally conductive semiconductor material.

  According to this, the second electrode portion and the first and second semiconductor portions are configured as a π-shaped first Peltier element, and the first electrode portion and the first and second semiconductor portions are π-type. It will be configured as a shaped second Peltier element. And the 1st and 2nd Peltier device arrange | positioned alternately uses the thermal conductivity characteristic of a 1st and 2nd semiconductor part effectively, and shares the one part component.

  As a result, the operation and effect of the invention according to claim 2 or 3 can be achieved more reliably while the Peltier module is configured to be more compact.

According to the description of claim 4, the present invention provides the gaming machine control device according to claim 2 or 3,
The electrical control circuit member includes a wiring board (600) and a plurality of electrical elements (620 to 660) disposed on the wiring board,
The casing has a one-side casing member (400a) made of a transparent synthetic resin having the bottom wall and the opposing wall, and a plurality of electrical elements are arranged on at least a plurality of electrical elements in the wiring board. And the other casing member (400b) made of a transparent synthetic resin that is assembled to the one casing member so as to be included therein,
The opening is formed in the facing wall of the other casing member,
The heat sink is fastened from the inside to the opening of the casing by a plurality of screws (464) at the outer periphery thereof.
Each screw is opposed to an extended end portion of each boss (680) extending from the facing portion of the wiring board to each screw at a head portion with a predetermined gap. And

  According to this, if the predetermined gap is set so as to prevent unauthorized screwing of each screw, each screw is screwed off from the outer peripheral portion of the opening of the casing by some unauthorized act. However, each screw cannot abut on the tip of each corresponding boss at its head to be screwed off. As a result, it is possible to reliably prevent an illegal act due to screwing of each screw.

  In addition, the code | symbol in the bracket | parenthesis of each said means shows the correspondence with the specific means as described in embodiment mentioned later.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 shows an embodiment in which the present invention is applied to a pachinko gaming machine. The pachinko gaming machine is erected on an island in the pachinko hall, and the pachinko gaming machine includes a square annular machine frame 100 and a gaming machine main body 200 supported by the machine frame 100. .

  The gaming machine main body 200 includes a frame-shaped main body 210 and a game board (not illustrated) that is fitted in a hollow portion (not illustrated) of the frame-shaped main body 210. At the end, it is supported at the left end of the machine casing 100 so as to be rotatable in the front-rear direction from the front side. In FIG. 1, the left, right, upper, and lower sides of the machine frame 100 correspond to the left, right, upper, and lower sides of the pachinko gaming machine. In addition, the illustrated rear side and the illustrated front side of the machine frame 100 correspond to the front side and the rear side of the pachinko gaming machine, respectively.

  The gaming machine main body 200 includes a power panel A, a main control panel B, an image control panel C, and an audio control panel D. The power panel A is arranged at the lower left corner of the back of the gaming machine body 200. It is installed. The main control panel B is disposed at the center on the left side of the back surface of the gaming machine body 200, and the image control panel C and the sound control panel D are disposed on the back surface of the gaming machine body 200 on the right side of the main control panel B. It is installed.

  The power supply panel A accommodates a power supply 310 for supplying power to the main control panel B, the image control panel C, the sound control panel D and the like and a power supply 320 for supplying power to the cooling device 700 (described later) in a power supply casing 300 made of transparent synthetic resin. Configured. Both power sources 310 and 320 generate a DC voltage when an AC voltage is applied from a commercial power source (not shown). The generated voltage of the power supply 320 is a value suitable for driving a Peltier module 730 (described later).

  The main control panel B controls and controls the image control panel C, the sound control panel D, and the like so as to perform image display, sound display, and the like required in the gaming machine. As shown in FIGS. 2 and 3, the main control panel B includes a rectangular parallelepiped casing 400 made of a transparent synthetic resin material. The casing 400 includes a first casing member 400a and a second casing member 400b. Therefore, it is composed. The one-side casing member 400a is supported by the left-side center portion of the back surface of the gaming machine main body 200 by a rectangular support wall 410 (corresponding to the bottom wall of the casing 400). Thus, the one-side casing member 400a is supported with its upper wall 420 positioned on the upper side.

  The other casing member 400b is assembled to the one casing member 400a as a lid member via the wiring board 600 as follows. That is, the other-side casing member 400b is arranged so that the opposing wall 460 (corresponding to the cover wall of the casing 400) faces the support wall 410 of the one-side casing member 400a, and the inner central bent portion 471 (FIG. 2) of the lower wall 470 is formed. 2), the upper side wall 480 and the left side wall 490 are used to lock the one side casing member 400a to the central notch 451 (see FIG. 2) of the lower edge 450 of the one side casing member 400a. The upper wall 420 and the left wall 430 are assembled to the one-side casing member 400a so as to cover from the upper side and the left side. Note that the right wall 490a of the one-side casing member 400a faces the right wall 440 of the one-side casing member 400a.

  Further, the main control panel B includes a sealing element 500 made of a synthetic resin material. The sealing element 500 extends a plate-like column portion 520 from the substrate portion 510 so as to form a T shape, From both sides of the plate-like column part 520, the locking piece parts 530 and 540 are extended in a divergent form from the extending end side of the column part 520 toward the substrate part 510 while facing each other. ing.

  Thus, the sealing element 500 has an opening in the upper wall 480 of the other casing member 400b at the plate-like column portion 520 against the elasticity of the locking piece portions 530 and 540 from the extending end side. The portion 481 (see FIG. 2) and the opening 421 (corresponding to the opening 481) of the upper wall 420 of the one-side casing member 400a are inserted. After this insertion, both the locking piece portions 530 and 540 are restored to the original shape by their elasticity. As a result, the sealing element 500 is prevented from coming off from both the openings 421 and 481, and seals the casing members 400a and 400b on both sides in an inseparable manner as described above. In FIG. 2, each reference numeral 500 a is a spare sealing element having the same configuration as the sealing element 500. These spare sealing elements 500a are easily provided on the left wall 490 of the other casing member 400b.

  Further, the main control panel B has the above-described wiring board 600, and this wiring board 600 is configured by printing each wiring on a printed circuit board 610 with a predetermined wiring pattern (not shown). Yes. Thus, the wiring board 600 is formed in the upper and lower corners of the left side of the printed circuit board 610 in the upper and lower corners of the cylindrical protrusions 411 provided at the upper and lower corners of the left side of the support wall 410 of the one-side casing member 400a. Each screw 412 (in FIG. 2, only the lower screw 412 is shown) is fastened and supported, and provided at the upper right and lower corners of the support wall 410 at the upper and lower right intermediate portions of the printed circuit board 610. Upper and lower screws 412 (only the lower screw 412 is shown in FIG. 2) are fastened and supported in the female screw holes of the respective cylindrical protrusions 411. Thereby, the printed circuit board 610 of the wiring board 600 is supported in parallel to the support wall 410 of the one-side casing member 400a, and the right wall 440 of the one-side casing member 400a and the other-side casing member 400b are supported at the right side portion 611 thereof. It extends rightward from between the right wall 490a (see FIG. 1).

  The main control panel B includes a ROM 620, a CPU 630, a plurality of electronic components 640, a plurality of resistors 650, 660, and a plurality of one-side connector members 670a to 670d (see FIG. 1). Provided at the center of the wiring board 600. The CPU 630 is provided on the wiring board 600 on the left side of the ROM 620. The plurality of electronic components 640 are provided on the wiring board 600 on the upper side of the CPU 630. Each of the plurality of resistors 650 and 660 is provided on the wiring board 600 on the upper side of the ROM 620 and the lower side of the CPU 630.

  The one-side connector member 670a is provided at the lower end portion of the right extension 611 of the wiring board 600. The one-side connector member 670a is connected to the ROM 620, the CPU 630, and a plurality of electronic components via the wiring pattern of the wiring board 600. 640 or a plurality of resistors 650, 660. The one-side connector member 670a is coupled to the other-side connector member (not shown) that constitutes a connector together with the one-side connector member, and the ROM 620, the CPU 630, the plurality of electronic components 640, and the plurality of each are connected via the other-side connector member. Are connected to the power supply 310 of the power supply panel A. The other side connector member is connected to the power source 310 of the power panel A by wiring.

  As described later, the one-side connector member 670b constitutes a connector together with the other-side connector member 735 (see FIG. 2) connected to both lead wires 733 and 734 (see FIG. 2) of the cooling device 700. Each one-side connector member 670c and 670d constitutes each connector together with each other-side connector member connected to each wiring extending from the control panel such as the image control panel C or the voice control panel D.

  Further, the main control panel B has a cooling device 700 as shown in FIGS. 1 to 5, and this cooling device 700 is attached to the other casing member 400b as shown in FIGS. It is attached. Here, the attachment structure with respect to the other casing member 400b of the cooling device 700 will be described in detail.

  As shown in FIG. 3 or 4, the other casing member 400 b has an opening 461 and an annular wall 462, and the opening 461 is located on the right side of the ROM 620 in the wiring board 600 (see FIG. 2). ), The lid wall 460 is formed in a square hole shape. Further, the annular wall portion 462 is formed in a square ring shape on the back surface of the lid wall 460 so as to surround the opening portion 461, and the annular wall portion 462 is coaxial with the opening portion 461 from the lid wall 460 to the back surface side thereof. Protruding.

  The cooling device 700 is activated when a DC voltage is applied from the power source 320 of the power panel A, and cools the inside of the casing 400. As shown in FIG. 3 or FIG. 4, the cooling device 700 includes a metal plate heat sink 710, and the heat sink 710 radiates heat from the inside of the casing 400 to the outside. The heat sink 710 is fitted in the annular wall 462 so as not to be laterally displaceable from the inside of the upper casing member 400b so that the heat sink 710 faces the rear from the opening 461. Each screw 464 is fastened to the female screw hole of each cylindrical projection 463 via each through hole 711 (see FIG. 5) formed in each corner, so that it is supported in parallel to the opening 461. .

  Here, as shown in FIG. 3, each cylindrical projection 463 has an opening so as to face each of four columnar bosses 680 (only two columnar bosses 680 are shown in FIG. 3). Each of the inner corners of the annular wall 462 protrudes inward from the outer periphery of the portion 461. The four columnar bosses 680 extend from the portion of the wiring board 600 facing the cylindrical projections 463 toward the heads of the screws 464. However, a predetermined gap is provided between the boss 680 and the screw 464 facing each other, and this predetermined gap is set so that the screw 464 cannot be screwed out in the state shown in FIG. ing.

  The cooling device 700 includes a one-side ceramic substrate 720, a Peltier module 730, and another-side ceramic substrate 740 as shown in FIG. 4 or FIG. The one-side ceramic substrate 720 is firmly bonded to the back surface of the heat sink 710 with a high-temperature adhesive having excellent thermal conductivity on the front surface. Accordingly, the one-side ceramic substrate 720 conducts heat from the Peltier module 730 to the heat sink 710 while electrically insulating the Peltier module 730 (described later) from the heat sink 710. The one side ceramic substrate 720 is formed of a ceramic material having good electrical insulation and good thermal conductivity (good heat absorption capacity) together with the other side ceramic substrate 740.

  The Peltier module 730 is sandwiched between the one-side ceramic substrate 720 and the other-side ceramic substrate 740. The Peltier module 730 includes a π-type Peltier element 730a and a π-type Peltier element 730b that exhibit a so-called Peltier effect. Are alternately connected in series, and are arranged in a zigzag pattern between the opposing surfaces of the one-side ceramic substrate 720 and the other-side ceramic substrate 740 (see FIG. 5).

  As shown in FIG. 4 or FIG. 5, the Peltier element 730a has an N-type semiconductor portion (hereinafter also referred to as a semiconductor portion N), a one-side electrode portion 731 and a P-type semiconductor portion (hereinafter also referred to as a semiconductor portion P). The junction structure is formed so as to have a π-type shape. On the other hand, as shown in FIG. 4 or FIG. 5, the Peltier element 730 b is joined and configured to have a π shape with the semiconductor portion P, the other electrode portion 732, and the semiconductor portion N. The semiconductor part N and the semiconductor part P are joined to the one-side electrode part 731 and the other-side electrode part 732 by soldering.

  Here, both the one-side electrode portion 731 and the other-side electrode portion 732 are formed of an electrode plate made of an electrode material such as copper, and the one-side electrode portion 731 is formed on the other side of the other-side ceramic substrate. It is firmly bonded to the surface of 740 with a high-temperature adhesive having good thermal conductivity, while the other-side electrode portion 732 is strongly bonded to the back surface of the one-side ceramic substrate 720 with the above-mentioned high-temperature adhesive. It is glued to. In the present embodiment, the one-side electrode portion 731 is electrically insulated from the heat sink 710 by the one-side ceramic substrate 720 and conducts heat to the heat sink 710 through the one-side ceramic substrate 720. Since the heat dissipation capacity of the heat sink 710 is set large, the conduction heat from the Peltier element 730a to the heat sink 710 does not flow back to the Peltier element 730a via the ceramic substrate 720.

  The semiconductor portion N is formed in a prismatic shape with an N-type thermoelectric semiconductor material, while the semiconductor portion P is formed in a prismatic shape with a P-type thermoelectric semiconductor material. Note that each of the N-type thermoelectric semiconductor material and the P-type thermoelectric semiconductor material is configured using, for example, a material mainly composed of a bismuth-tellurium alloy. Note that the Peltier element 730b is connected so as to follow the Peltier element 730a, and in the Peltier element 730a, the one-side electrode portion 731 is arranged such that the semiconductor portion N is located on the positive side with respect to the semiconductor portion P. On the other hand, in the Peltier element 730b, the semiconductor part P is connected to the other electrode part 732 so as to be positioned on the positive side with respect to the semiconductor part N in terms of potential. Further, the semiconductor part P of the Peltier element 730b shares the semiconductor part P of the Peltier element 730a.

  When a DC voltage is applied to the Peltier element 730a configured as described above so that the semiconductor part N is on the positive side and the semiconductor part P is on the negative side, the DC current based on the DC voltage is It flows through the side electrode portion 731 and the semiconductor portion P sequentially. In such a state, electrons in the semiconductor part N move to the side away from the electrode part 731 in the semiconductor part N, while holes in the semiconductor part P move in the semiconductor part P. It moves to the side away from the electrode portion 731. For this reason, the Peltier element 730a exhibits an endothermic function in the electrode portion 731. In other words, when a direct current flows from the semiconductor portion N side to the semiconductor portion P side, the Peltier element 730a forms an NP junction portion with both the semiconductor portions N and P through the electrode portion 731 in that direction. The electrode portion 731 exhibits an endothermic function.

  On the other hand, when a DC voltage is applied to the Peltier element 730b configured as described above so that the semiconductor part P is on the positive side and the semiconductor part N is on the negative side, the direct current based on the DC voltage is P, the other electrode part 732 and the semiconductor part N sequentially flow. In such a state, the holes in the semiconductor part P move to the side closer to the other electrode part 732 in the semiconductor part P, while the electrons in the semiconductor part N move in the semiconductor part N. To move closer to the other electrode portion 732. For this reason, the Peltier element 730 b exhibits a heat generation function in the other-side electrode portion 732. In other words, when a direct current flows from the semiconductor part P side to the semiconductor part N side, the Peltier element 730b forms a PN junction with both semiconductor parts P and N through the other electrode part 732 in the direction. Thus, the other electrode portion 732 exhibits a heat generation function.

  According to the above, in the Peltier module 730, the semiconductor part P of each Peltier element 730a shares the semiconductor part P of each Peltier element 730b following this Peltier element 730a, so that each Peltier element 730a is a one-side electrode part. The heat absorbed at 731 is conducted so as to dissipate heat from the other electrode portion 732 of each Peltier element 730b to the one-side ceramic substrate 720. In the present embodiment, the total heat absorption capacity of the Peltier module 730 is selected to be larger than the total heat dissipation capacity in the casing 400.

  In the present embodiment, the Peltier module 730 has positive and negative side connection terminals 732a and 732b as shown in FIG. 5, and the positive side connection terminal 732a is a direct current among the Peltier elements of the Peltier module 730. It extends from between the semiconductor portion N of the Peltier element 730 a located on the current inflow end side and the ceramic substrate 720. On the other hand, the negative side connection terminal 732b extends in parallel to the positive side connection terminal 732a from between the semiconductor portion P of the Peltier element 730a located on the DC current outflow end side and the ceramic substrate 720 among the Peltier elements. Yes.

  Here, as illustrated in FIG. 4, on the surface of the positive connection terminal 732 a, the positive wiring 733 is connected to the right connection hole 712 of the heat sink 710 and the right side of the one-side ceramic substrate 720. The connection hole 721 is inserted and soldered, and a negative wiring 734 is provided on the surface of the negative connection terminal 732b at the connection end of the left connection hole 712 of the heat sink 710 and the one-side ceramic substrate. 720 is soldered into the left connection hole 721 of 720. Note that the positive lead wire 733 and the negative lead wire 734 extend from the one-side connector member 735 as described above.

  The other-side ceramic substrate 740 is firmly bonded to each one-side electrode portion 731 of the Peltier module 730 with the above-described adhesive, and the other-side ceramic substrate 740 transfers the heat in the casing 400 to each other side of the Peltier module 730. It plays a role of conducting to the electrode part 732.

  The image control panel C performs image display control necessary for a game by the gaming machine, and the sound control panel D performs image display control necessary for a game by the gaming machine.

  In the present embodiment configured as described above, in the main control panel B, the casing 400 is not formed with any heat radiating hole. For this reason, the ROM 620, the CPU 630, the plurality of electronic components 640, and the plurality of resistors 650, 660 are enclosed in the casing 400 together with the portions other than the right side portion 611 in the wiring board 600. .

  Therefore, unless the sealing of the casing 400 by the sealing element 500 is illegally released, an illegal modification action on the inside of the casing 400, for example, an action of illegally exchanging the ROM 620 or the CPU 630 with another ROM or CPU is performed. It becomes impossible. As a result, it is possible to reliably prevent a fraudulent act from being performed through the heat radiating hole of the casing as in the prior art.

  Moreover, what is necessary is just to cancel | release sealing with respect to the casing 400 by the sealing element 500, when test | inspecting each element inside the casing 400, for example, ROM620 and CPU630. After the inspection, the casing 400 is sealed in the same manner as described above by the spare sealing element 500a.

  In addition, when the gaming machine is in a game-ready state, the main control panel B, the image control panel C, the sound control panel D, and the like are all powered by the power supply 310 of the power supply panel A and put into operation. At this time, the cooling device 700 is powered by the power supply 320 of the power supply panel A and enters an operating state.

  In such a state, in the main controller B, the ROM 620, the CPU 630, the plurality of electronic components 640, and the plurality of resistors 650, 660 generate heat and dissipate heat in the casing 400 in accordance with the operation. Each wiring of the wiring board 600 also generates heat and dissipates heat in the casing 400 as the ROM 620, the CPU 630, the plurality of electronic components 640, and the plurality of resistors 650 and 660 are operated. Accordingly, the temperature inside the casing 400 increases with time.

  Here, when the cooling device 700 is in an operating state as described above, in the Peltier module 730, each Peltier element 730a absorbs heat by heat radiation into the casing 400 at the electrode portion 731, and this heat is absorbed. The Peltier elements 730a and the Peltier elements 730b sharing the semiconductor part P are conducted.

  Along with this, each Peltier element 730 b generates heat at the electrode portion 732 and radiates this heat from the opening 461 to the outside via the ceramic substrate 720 and the heat sink 710. For this reason, the inside of the casing 400 is cooled favorably, and the temperature rise inside the casing 400 can be satisfactorily suppressed. As a result, the ROM 620, the CPU 630, the plurality of electronic components 640, and the plurality of resistors 650, 660 can normally operate without causing malfunction due to a temperature rise.

  As a result, according to the present embodiment, even if the ROM 620, the CPU 630, the plurality of electronic components 640, and the plurality of resistors 650, 660 generate heat, the cooling device 700 can cool the inside of the casing 400 well, and Unauthorized modification of the ROM 620 and the CPU 630 inside the casing can be reliably prevented.

  Here, in the Peltier module 730, as described above, the alternately connected Peltier elements 730a and 730b effectively utilize the heat conduction characteristics of the semiconductor portions N and P made of the heat transfer semiconductor material, and a part of them. Since the constituent elements are shared, the above-described effects can be achieved more effectively while configuring the Peltier module 730 to be more compact.

  In addition, as described above, the heat dissipation capacity of the heat sink 710 is set to be large, and the total heat absorption capacity of the Peltier module 730 is selected to be larger than the total heat dissipation capacity in the casing 400. On the contrary, it is not heated by the heat generated.

  Further, as described above, since the inside of the casing 400 can be satisfactorily cooled only by the cooling device 700, the ROM 620, the CPU 630, the plurality of electronic components 640, and the plurality of resistors 650, 660 are cooled in the casing 400. There is no need to separately employ a heat sink for dissipating heat from the fan, the ROM 620, the CPU 630, the plurality of electronic components 640, and the plurality of resistors 650 and 660. As a result, the casing 400 can be configured more compactly.

  Further, as described above, a predetermined gap is set between the boss 680 and the screw 464 facing each other so that the screws 464 cannot be screwed off. For this reason, even if it is attempted to unscrew each screw 464 from each cylindrical protrusion 463 of the casing 400 by some wrongful act, each screw 464 hits the tip of each corresponding boss 680 at its head. It cannot touch and screw. As a result, fraudulent acts due to screwing of the screws 464 can be reliably prevented.

In carrying out the present invention, the following various modifications are possible without being limited to the above embodiment.
(1) Not limited to a ceramic substrate, an electrically insulating substrate such as an electrically insulating film having good thermal conductivity may be adopted.
(2) The other-side ceramic substrate 740 may be eliminated.
(3) Unlike the above embodiment, the Peltier module 730 may be arranged in a spiral along the ceramic substrate 720 while alternately connecting the Peltier elements 730a and 730b. In general, in the Peltier module 730, the Peltier element 730a and the Peltier element 730b may be arranged along the ceramic substrate 720 as long as a desired heat absorption capacity (or heat dissipation capacity) can be exhibited.
(4) In the Peltier module 730, the Peltier element 730a and the Peltier element 730b are not limited to the configuration in which they are alternately connected in series with each other,
(5) In implementing the present invention, the polarity of the DC voltage from the power supply 310 of the power supply panel 300 may be reversed and applied to the Peltier module 730. In this case, the PN junction at the PN junction of each Peltier element 730a and the NP junction at each Peltier element 730b are reversed. That is, in the Peltier module 730, the semiconductor part N and the semiconductor part P may be reversed for each Peltier element.
(6) In carrying out the present invention, the number of Peltier elements constituting the Peltier module 730 may be changed as appropriate.
(7) In carrying out the present invention, the cooling device 700 is not limited to the lid wall of the casing 400 (the opposing wall 460 of the other casing member 400b), but the upper wall of the casing 400 (the upper wall 420 of the one casing member 400a). And the opening formed in the upper wall 480) of the other casing member 400b may be attached from the inside.

  According to this, since the heat inside and outside the casing 400 easily moves upward, the heat generated in the casing 400 is easily radiated upward by the cooling device 700. For this reason, cooling in the casing 400 can be further promoted. Further, since the cooling device 700 is not attached to the lid wall of the cooling device 700, the inside of the casing 400 can be easily observed.

Further, unlike the above embodiment, the cooling device 700 has one of the left and right walls of the casing 400 (both the left wall 430 of the one-side casing member 400a and the left wall 490 of the other-side casing member 400b, or the one-side casing member 400a. The right wall 440 and the right wall 490a of the other casing member 400b) may be attached to the opening formed from the inside thereof. Furthermore, unlike the above-described embodiment, the cooling device 700 may be attached from the inside to an opening formed in a portion extending over both the lid wall and the peripheral wall of the casing 400.
(8) In carrying out the present invention, in the cooling device 700, each temperature sensor is attached to the heat sink 710 and the other-side ceramic substrate 740, and the temperature of the Peltier module 730 is adjusted according to the difference in the detected temperature of each temperature sensor. You may make it control appropriately with a controller. The temperature controller may be provided in the power supply panel A, or may be provided separately on the back surface of the gaming machine main body 200.
(9) In carrying out the present invention, the Peltier module 730 is not limited to the Peltier elements 730a and 730b, and may be composed of a plurality of dissimilar metals combined so as to exhibit the Peltier effect.
(10) In implementing the present invention, the cooling device 700 is not limited to the main control panel B, but is assembled to the casing of the power supply panel A, the effect control panel C, and the voice control panel D in the same manner as described in the above embodiment. It may be. In this case, as long as the casing of the power supply panel A, the image control panel C, and the sound control panel D is transparent, and the electronic parts that are the targets of unauthorized modification are accommodated in the casing, the same as in the above embodiment. The following effects can be achieved.
(11) In carrying out the present invention, the wiring board 600 is not essential as long as it is provided in the casing 400 so that an electronic component to be tampered with can be controlled.
(12) In implementing the present invention, the cooling device 700 may be supported by the opening 461 not by the heat sink 710 as in the above embodiment but by the other-side ceramic substrate 740. In this case, a support portion having an L-shaped cross section is extended from the outer peripheral portion of the other-side ceramic substrate 740 so as to enclose the outer peripheral portion of the heat sink 710, and each screw 464 is inserted through the support portion having the L-shaped cross section. Fastened to the female screw hole of the cylindrical protrusion 463. Note that the outer periphery of the heat sink 710 is cut out so that the heat sink 710 is enclosed by the L-shaped support portion of the other-side ceramic substrate 740. Accordingly, the cooling device 700 is supported by the other-side ceramic substrate 740 so as to be parallel to the opening 461 in a state where the heat sink 710 is opposed to the opening 461. Thereby, it is possible to prevent the one-side ceramic substrate 720 and the Peltier module 730 from falling off the heat sink 710 in the cooling device 700.

It is a back view which shows one Embodiment of the game machine to which this invention was applied. FIG. 2 is an enlarged exploded perspective view of a main control panel in FIG. 1. It is sectional drawing which follows the 3-3 line of FIG. It is sectional drawing which follows the 4-4 line | wire of FIG. 2 or FIG. It is an expansion perspective view which shows a cooling device in the state except the other side ceramic substrate.

Explanation of symbols

100 ... Machine frame, 200 ... Gaming machine body, 400 ... Casing,
400a ... one side casing member, 400b ... other side casing member,
420, 480 ... upper wall, 430, 490 ... left wall,
440, 490a ... right wall, 460 ... opposing wall, 461 ... opening,
464 ... Screws, 470 ... Lower wall, 600 ... Wiring board, 620 ... ROM, 630 ... CPU,
640 ... Electronic element, 650, 660 ... Resistor, 680 ... Boss, 700 ... Cooling device,
710 ... Heat sink, 720 ... One side ceramic substrate, 730 ... Peltier module,
731 ... One side electrode part, 732 ... Other side electrode part, N, P ... Semiconductor part.

Claims (4)

In a control device comprising a transparent casing supported by a bottom wall on the back surface of the gaming machine main body and an electrical control circuit member provided in the casing in a gaming machine in which the gaming machine main body is supported by a machine frame. ,
Comprising a cooling means having a Peltier module;
The cooling means is assembled so as to close the opening portion over the circumferential wall of the casing and the opposing wall provided in the casing so as to face the bottom wall or in one of the openings. A control device for a gaming machine. The cooling means is
A plate-shaped heat sink that is assembled along the opening of the casing and closes the opening;
A thermally conductive and electrically insulating substrate fixed along the back surface of the heat sink so as to face the opening through the heat sink;
The Peltier module is provided along the back surface of the electrical insulating substrate so as to face the heat sink via the electrical insulating substrate, and heat generated from the electrical control circuit member by feeding power to the electrical control circuit member. 2. The game according to claim 1, wherein when heat is generated by absorbing heat, the inside of the casing is cooled by dissipating heat from the heat generation from the opening through the electrical insulating substrate and the heat sink. Machine control device. The Peltier module includes a plurality of first electrode portions, a plurality of first semiconductor portions, a plurality of second semiconductor portions, and a plurality of second electrode portions,
The plurality of first electrode portions are sequentially arranged in a predetermined direction at intervals along the back surface of the electrically insulating substrate,
Each of the plurality of first semiconductor portions extends from the front end portion to the opposite side of the back surface of the electrical insulating substrate among the front and rear end portions in the predetermined direction of each of the plurality of first electrode portions. Extended,
The plurality of second semiconductor portions are parallel to the plurality of first semiconductor portions from the rear end portions in the predetermined direction of the plurality of first electrode portions, respectively, of the electrical insulating substrate. It extends to the opposite side of the back,
Each of the plurality of second electrode portions extends from the front first electrode portion for each of the first and second adjacent first electrode portions in the predetermined direction among the plurality of first electrode portions. It is connected across the extended end of the second semiconductor part and the extended end of the first semiconductor part extending from the first electrode part on the rear side,
The plurality of first semiconductor parts are both formed of one of an N-type thermally conductive semiconductor material and a P-type thermally conductive semiconductor material, and the plurality of second semiconductor parts are both of the N-type thermally conductive semiconductor material. 3. The gaming machine control device according to claim 2, wherein the gaming machine control device is formed of the other of the P-type heat conductive semiconductor material. The electrical control circuit member includes a wiring board and a plurality of electrical elements disposed on the wiring board,
The casing has a one-side casing member made of a transparent synthetic resin having the bottom wall and the opposing wall, and the plurality of electrical elements are disposed at least among the plurality of electrical elements in the wiring board. The other side casing member made of transparent synthetic resin assembled to the one side casing member so as to be included with the part,
The opening is formed in the facing wall of the other casing member,
The heat sink is fastened from the inside to the opening of the casing by a plurality of screws at the outer periphery thereof,
Each screw is opposed to an extended end portion of each boss extending from the facing portion of the wiring board to each screw at a head portion with a predetermined gap. The control device for gaming machines according to claim 2 or 3, characterized in that

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