CN115164493A - Air-cooled semiconductor freezer and control method thereof - Google Patents
Air-cooled semiconductor freezer and control method thereof Download PDFInfo
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- CN115164493A CN115164493A CN202210830486.6A CN202210830486A CN115164493A CN 115164493 A CN115164493 A CN 115164493A CN 202210830486 A CN202210830486 A CN 202210830486A CN 115164493 A CN115164493 A CN 115164493A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 80
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000001816 cooling Methods 0.000 claims abstract description 97
- 238000005057 refrigeration Methods 0.000 claims abstract description 60
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 57
- 230000017525 heat dissipation Effects 0.000 claims abstract description 53
- 230000007246 mechanism Effects 0.000 claims abstract description 11
- 238000010257 thawing Methods 0.000 claims description 34
- 238000009413 insulation Methods 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 10
- 238000004321 preservation Methods 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 230000009977 dual effect Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 14
- 238000007599 discharging Methods 0.000 abstract description 7
- 238000005728 strengthening Methods 0.000 abstract 1
- 230000009471 action Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
- F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
- F25D17/04—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
- F25D17/06—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection by forced circulation
- F25D17/062—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection by forced circulation in household refrigerators
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
- F25D17/04—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
- F25D17/06—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection by forced circulation
- F25D17/08—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection by forced circulation using ducts
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D21/00—Defrosting; Preventing frosting; Removing condensed or defrost water
- F25D21/002—Defroster control
- F25D21/004—Control mechanisms
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D21/00—Defrosting; Preventing frosting; Removing condensed or defrost water
- F25D21/14—Collecting or removing condensed and defrost water; Drip trays
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D29/00—Arrangement or mounting of control or safety devices
- F25D29/005—Mounting of control devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/021—Control thereof
- F25B2321/0211—Control thereof of fans
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/021—Control thereof
- F25B2321/0212—Control thereof of electric power, current or voltage
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0251—Removal of heat by a gas
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0252—Removal of heat by liquids or two-phase fluids
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention provides an air-cooled semiconductor freezer and a control method thereof, the air-cooled semiconductor freezer comprises a door body, a freezer body and a refrigerating mechanism arranged on the freezer body, wherein the refrigerating mechanism comprises an accommodating cavity and a refrigerating mechanism arranged in the accommodating cavity: the refrigeration module comprises a double-stage semiconductor refrigeration element with a cold end and a hot end; the cold end heat exchanger is connected with the cold end; the hot end radiator is connected with the hot end and comprises a vertical fin type heat pipe and an L-shaped fin type heat pipe; the cooling fan is used for enabling air inside the cabinet body to flow to the cold-end heat exchanger; a first heat dissipation fan for making the external air flow to the vertical fin type heat pipe; the second heat dissipation fan is used for enabling the external air to flow to the L-shaped fin type heat pipe. The L-shaped fin type heat pipe is partially immersed in the water receiving tray. The invention utilizes the heat pipe to dissipate heat and strengthen heat exchange, improves refrigerating capacity and refrigerating efficiency, and the L-shaped finned heat pipe and the second heat dissipation fan are matched to take away heat and water vapor, thereby strengthening heat dissipation effect and simultaneously solving the problem of discharging defrosted water.
Description
Technical Field
The invention belongs to the technical field of refrigeration of refrigerators, and particularly relates to an air-cooled semiconductor freezer and a control method thereof.
Background
The air-cooled semiconductor refrigerator used in the current market is mostly concentrated on refrigerated cabinet products (the temperature in the refrigerator is higher than 0 ℃) and the refrigerated cabinet products (the temperature in the refrigerator is-6 to-18 ℃) are very few. When the freezer is realized by adopting a two-stage or multi-stage semiconductor refrigerating element, efficient cold and hot end heat exchangers must be configured, and particularly the heat dissipation of the hot end heat exchanger plays a key role; and based on the conventional hot junction heat exchanger for the freezer, the freezer will have the problem that thermoelectric module (i.e. semiconductor refrigeration component)'s radiating effect is relatively poor to and heat exchange efficiency and refrigeration efficiency are low more, can't satisfy the development demand of the high-efficient product of freezer. And the frosting problem can all appear on the surface of its cold junction heat exchanger, and the frosting can hinder the cold volume exchange of heat exchanger and freezer interior air, reduces refrigeration efficiency, increases the energy consumption of freezer, consequently needs to carry out periodic defrosting operation, need set up solitary drain pipe discharge defrosting water after the defrosting, and complicated and if defrosting water discharge in-process, the drain pipe easily appears the ice blocking phenomenon, discharge defrosting water that can not be fine.
Disclosure of Invention
The invention provides an air-cooled semiconductor freezer and a control method thereof, aiming at the technical problems, the air-cooled semiconductor freezer is simple in structure and convenient to use, heat pipe heat dissipation is utilized to strengthen heat exchange, refrigerating capacity and refrigerating efficiency are improved, an L-shaped finned heat pipe and a second cooling fan are matched to take away heat and water vapor, steam cooling of defrosting water is realized, the heat dissipation effect of a two-stage semiconductor refrigerating element is strengthened, and meanwhile, the problem of discharging the defrosting water is solved.
In order to achieve the purpose, the invention adopts the technical scheme that:
the utility model provides an air-cooled semiconductor freezer, its including the door body, the cabinet body and set up in refrigeration mechanism on the cabinet body, the cabinet mouth has been seted up on the cabinet body, door body coupling in cabinet mouth department is used for the switching cabinet mouth, refrigeration mechanism is including holding the chamber and setting up in holding the intracavity:
a refrigeration module, comprising:
a dual stage semiconductor refrigeration element comprising a cold end and a hot end;
a cold end heat exchanger connected with the cold end;
the hot end radiator is connected with the hot end and comprises a vertical finned heat pipe and an L-shaped finned heat pipe;
the cooling fan is used for enabling air inside the cabinet body to flow to the cold end heat exchanger and circulating between the cabinet body and the cold end heat exchanger;
the first heat dissipation fan is used for enabling external air to flow to the vertical fin type heat pipe;
and the second heat dissipation fan is used for enabling external air to flow to the L-shaped fin type heat pipe.
And the water receiving tray is arranged below the refrigeration module, and part of the L-shaped fin type heat pipe is immersed in the water receiving tray.
The air-cooled semiconductor freezer provided by the technical scheme has a simple structure and is convenient to control, air in the freezer body flows to the cold end heat exchanger to be cooled under the driving of the cooling fan, and the air in the freezer body circulates between the freezer body and the cold end heat exchanger; the L-shaped fin type heat pipe is immersed in the water receiving tray and is combined with a second cooling fan which enables external air to flow to the L-shaped fin type heat pipe to forcedly carry out convection air blowing, so that heat and water vapor are taken away, evaporative cooling of defrosting water can be realized, the heat dissipation effect of the hot end of the double-stage semiconductor refrigeration element is enhanced by utilizing the evaporative cooling effect of the defrosting water, and the problem of discharging the defrosting water in the water receiving tray is solved; meanwhile, when no defrosting water or a small amount of defrosting water exists, the refrigerating capacity and the refrigerating efficiency of the freezer can be effectively improved by utilizing the combined action of the vertical fin type heat pipe and the L-shaped fin type heat pipe.
In other embodiments of the present application, a cooling air duct is further disposed at one side of the accommodating cavity close to the cabinet body, a cooling air inlet and a cooling air outlet which are communicated with the cooling air duct are disposed on the cabinet body, the cooling fan and the cold end heat exchanger are located in the cooling air duct, and the cooling fan is disposed at the cooling air outlet; under the drive of the cooling fan, air from the cabinet body enters from the cooling air inlet, flows through the cold-end heat exchanger, is cooled by the cold-end heat exchanger and then is sent into the cabinet body from the cooling air outlet, and heat exchange is achieved.
In other embodiments of the present application, a heat insulation board is vertically arranged in the accommodating cavity, the two-stage semiconductor refrigeration element is mounted on the heat insulation board, the lower end of the heat insulation board extends to be connected with the bottom wall of the accommodating cavity, the upper end of the heat insulation board extends upwards and is connected to the cabinet body in a bent manner, the heat insulation board and the cabinet body surround to form the cooling air duct, and the cooling air outlet is located above the cooling air inlet; the cooling air duct is formed by enclosing the heat-insulating plate and the cabinet body, and is simple and convenient.
In other embodiments of the present application, the water receiving tray covers the bottom wall of the accommodating cavity and is connected to the cabinet, the lower end of the heat insulation board is connected to the bottom plate of the water receiving tray, and an overflow hole is formed in the lower portion of the heat insulation board; the defrosting water condensed by cooling at the cold end heat exchanger falls into the water receiving tray and flows to be in contact with the L-shaped finned heat pipe through the arrangement of the water overflow holes.
In other embodiments of the present application, a first heat dissipation air duct is further disposed in the accommodating cavity, the first heat dissipation air duct is located above the two-stage semiconductor refrigeration element, a first air inlet and a first air outlet which are communicated with the outside are disposed on a cavity wall of the accommodating cavity, the vertical fin heat pipe and the first heat dissipation fan are located in the first heat dissipation channel, and the first heat dissipation fan is located at the first air outlet; under the drive of a first cooling fan, air from the outside of the cabinet body enters from a first air inlet and flows through the vertical fin type heat pipe and then is discharged from a first air outlet, so that the purpose of taking away heat is achieved, and the cooling effect is improved.
In other embodiments of the present application, a second heat dissipation air duct is further disposed in the accommodating cavity, the second heat dissipation air duct is located below the two-stage semiconductor refrigeration element, a second air inlet and a second air outlet which are communicated with the outside are disposed on a cavity wall of the accommodating cavity, and the L-shaped fin heat pipe and the first heat dissipation fan are located in the first heat dissipation channel; under the drive of the second cooling fan, air from the outside of the cabinet body enters from the second air inlet and flows through the L-shaped finned heat pipe and then is discharged from the second air outlet, so that the purpose of taking away heat and water vapor is achieved, the cooling effect is improved, and the problem of discharging defrosting water is solved.
In other embodiments of the present application, the first air inlet is opened on an upper cavity wall of the accommodating cavity, the first air outlet and the second air outlet are opened on a side cavity wall of the accommodating cavity far away from the cabinet body, the first air outlet is located above the second air outlet, and the second air inlet is opened on a rear cavity wall of the accommodating cavity; the first heat dissipation air duct and the second heat dissipation air duct under the structure can ensure that external air can fully flow through the vertical fin type heat pipe and the L-shaped fin type heat pipe, and effectively improve the heat dissipation effect of the hot end of the double-stage semiconductor refrigeration element.
In other embodiments of the present application, the cabinet body includes a top plate, a bottom plate, a front plate, a rear plate, and a back plate, which are fixedly connected to form a box structure, the cabinet opening is disposed opposite to the back plate, a panel is surrounded on one side of the back plate away from the cabinet opening, the panel and the back plate surround to form the accommodating cavity, and the accommodating cavity is rectangular; the door body is a heat preservation door or a hollow glass door.
In some other embodiments of the present application, the cold-end heat exchanger is a finned heat sink having a planar substrate, the planar substrate is attached to the cold end, and a surface of the planar substrate is larger than a surface of the cold end; the hot end radiator also comprises a heat conducting plate which is jointed and connected with the hot end, the vertical fin type heat pipe and the L-shaped fin type heat pipe are arranged on the heat conducting plate, and one side of the heat conducting plate, which is far away from the double-stage semiconductor refrigeration element, is connected with the cavity wall of the accommodating cavity.
The invention also provides a control method for the air-cooled semiconductor freezer in any technical scheme, which is used for controlling the air-cooled semiconductor freezer to operate in a refrigeration mode or a defrosting mode and comprises a refrigeration mode control method and a defrosting mode control method;
the control method of the refrigeration mode comprises the following steps: controlling the double-stage semiconductor refrigerating element to reversely supply power, controlling the cooling fan, the first cooling fan and the second cooling fan to work simultaneously, and transmitting cooling capacity to the inside of the cabinet body by the cold end of the double-stage semiconductor refrigerating element;
the defrosting mode control method comprises the following steps: and controlling the double-stage semiconductor refrigeration element to supply power reversely, controlling the cooling fan to stop, and controlling the first cooling fan and the second cooling fan to work simultaneously, wherein the double-stage semiconductor refrigeration element releases heat to the cold-end heat exchanger to realize quick defrosting.
Compared with the prior art, the invention has the advantages and positive effects that:
the air-cooled semiconductor freezer cabinet provided by the invention has the advantages that the structure is simple, the control is convenient, the L-shaped fin type heat pipe immersed in the water receiving tray is combined with the second cooling fan which enables the external air to flow to the L-shaped fin type heat pipe to forcibly convect and blow, so that the heat and the water vapor are taken away, the evaporative cooling can be realized, the heat dissipation effect of the hot end of the two-stage semiconductor refrigerating element is enhanced, and the problem of discharging the defrosting water in the water receiving tray is solved; meanwhile, when no defrosting water exists or a small amount of defrosting water exists, the refrigerating capacity and the refrigerating efficiency of the freezer can be effectively improved by utilizing the combined action of the vertical fin type heat pipe and the L-shaped fin type heat pipe.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without limiting the invention. In the drawings:
fig. 1 is a schematic structural diagram of an air-cooled semiconductor freezer according to an embodiment of the present invention.
Wherein: an air-cooled semiconductor freezer 100; a door body 1; a cabinet body 2; a cooling air inlet 21; a cooling outlet 22; a top plate 23; a base plate 24; a back plate 25; a housing chamber 3; the first air intake 31; a first outlet 32; the second air intake opening 33; a second outlet 34; a panel 35; an insulation board 36; overflow holes 361; a two-stage semiconductor refrigeration element 41; a cold side heat exchanger 42; a substrate 421; a fin 422; a hot-side heat sink 43; a heat conducting plate 431; a vertical finned heat pipe 432; an L-shaped finned heat pipe 433; a cooling fan 5; a first heat radiation fan 6; a second heat radiation fan 7; a water pan 8.
Detailed Description
The technical solutions in the embodiments will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely a few embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "central," "lateral," "longitudinal," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings, which are based on the orientations and positional relationships indicated in the drawings, and are used for convenience in describing the present invention and for simplicity in description, but do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be construed as limiting the present invention.
The terms "first", "second" and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", "third" may explicitly or implicitly include one or more of the features.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1, in an exemplary embodiment of an air-cooled semiconductor freezer 100 according to the present invention, the air-cooled semiconductor freezer 100 includes a door 1, a cabinet body 2, and a refrigerating mechanism disposed on the cabinet body 2, wherein a cabinet opening is formed on the cabinet body 2, and the door 1 is connected to the cabinet opening for opening and closing the cabinet opening. In this embodiment, the door body 1 is a heat preservation door or a hollow glass door, and the heat preservation door can be provided with a window, so that the objects in the cabinet body 2 can be conveniently observed.
Specifically, with reference to fig. 1, the refrigeration mechanism includes a receiving cavity 3, and a refrigeration module, a cooling fan 5, a first cooling fan 6, a second cooling fan 7, and a water pan 8 that are disposed in the receiving cavity 3, the refrigeration module includes a two-stage semiconductor refrigeration element 41, a cold-end heat exchanger 42, and a hot-end heat sink 43, the two-stage semiconductor refrigeration element 41 includes a cold end and a hot end, the cold-end heat exchanger 42 is connected to the cold end of the two-stage semiconductor refrigeration element 41, and the hot-end heat sink 43 is connected to the hot end of the two-stage semiconductor refrigeration element 41. Preferably, in this embodiment, a plurality of two-stage semiconductor refrigeration elements 41 are provided, the plurality of two-stage semiconductor refrigeration elements 41 form a semiconductor refrigeration element group, the cold ends of all two-stage semiconductor refrigeration elements 41 are connected to the cold end heat exchanger 42, and the hot ends of all two-stage semiconductor refrigeration elements 41 are connected to the hot end radiator 43.
More specifically, the cold-side heat exchanger 42 is a finned heat sink having a planar substrate 421, the planar substrate 421 is attached to the cold side, and the surface of the planar substrate 421 is larger than that of the cold side. The hot end radiator 43 comprises a heat conducting plate 431, and a vertical finned heat pipe 432 and an L-shaped finned heat pipe 433 which are installed on the heat conducting plate 431, wherein one side of the heat conducting plate 431 is attached to the hot end of the double-stage semiconductor refrigerating element 41, and the side of the heat conducting plate 431 far away from the double-stage semiconductor refrigerating element 41 is connected to the cavity wall of the accommodating cavity 3. Preferably, the thermal conductive plate 431 is a metallic aluminum thermal conductive plate.
The water pan 8 is disposed below the refrigeration module, and a portion of the L-shaped fin heat pipe 433 is immersed in the water pan 8. The cooling fan 5 is used for making the air inside the cabinet 2 flow to the cold-end heat exchanger 42 and circulating between the inside of the cabinet 2 and the cold-end heat exchanger 42; the first heat dissipation fan 6 is used for making the external air flow to the vertical fin type heat pipe 432, thereby taking away the heat; the second heat dissipation fan 7 is used to make the external air flow to the L-shaped finned heat pipe 433, so as to take away heat and water vapor.
The air-cooled semiconductor freezer 100 provided by the embodiment has a simple structure and is convenient to control, and under the driving of the cooling fan 5, the air in the cabinet body 2 flows to the cold end heat exchanger 42 for cooling, and the air in the cabinet body 2 circulates between the cabinet body 2 and the cold end heat exchanger 42. Meanwhile, the L-shaped fin heat pipe 433 immersed in the water receiving tray 8 is combined with the second cooling fan 7 to forcibly convect and blow air, so that heat and water vapor are taken away, evaporative cooling of the defrosting water can be realized, and by utilizing the evaporative cooling effect of the defrosting water, the heat dissipation effect of the hot end of the two-stage semiconductor refrigeration element 41 is enhanced, and the problem of discharging the defrosting water in the water receiving tray 8 is solved; furthermore, when no defrosting water or a small amount of defrosting water exists, the refrigerating capacity and the refrigerating efficiency of the freezer can be effectively improved by the combined action of the vertical fin type heat pipe 432 and the L-shaped fin type heat pipe 433.
Further, with reference to fig. 1, a cooling air duct is further disposed on one side of the accommodating cavity 3 close to the cabinet 2, a cooling air inlet 21 and a cooling air outlet 22 communicated with the cooling air duct are disposed on the cabinet 2, the cooling fan 5 and the cold end heat exchanger 42 are disposed in the cooling air duct, and the cooling fan 5 is disposed at the cooling air outlet 22. Under the driving of the cooling fan 5, air from the cabinet 2 enters from the cooling air inlet 21, flows through the fin 422 channel of the cold end heat exchanger 42, is cooled and then is sent into the cabinet 2 from the cooling air outlet 22, so as to realize heat exchange.
In the above embodiment, the cooling air duct is formed by enclosing the insulation board 36 and the cabinet 2. Specifically, a heat insulation plate 36 is vertically arranged in the accommodating cavity 3, the two-stage semiconductor refrigeration element 41 is mounted on the heat insulation plate 36, the lower end of the heat insulation plate 36 extends to be connected with the bottom wall of the accommodating cavity 3, the upper end of the heat insulation plate 36 extends upwards and is connected to the cabinet body 2 in a bending mode, the heat insulation plate 36 and the cabinet body 2 surround to form a cooling air duct, and the cooling air outlet 22 is located above the cooling air inlet 21. The cooling air duct is formed by enclosing the heat insulation board 36 and the cabinet body 2, the structure is simple, the heat insulation performance of the heat insulation board 36 is high, and the power consumption of the freezer can be effectively reduced.
Referring to fig. 1, the water pan 8 covers the bottom wall of the accommodating cavity 3 and is connected to the cabinet 2, the lower end of the heat-insulating plate 36 is connected to the bottom plate 24 of the water pan 8, and an overflow hole 361 is formed in the lower portion of the heat-insulating plate 36. By arranging the overflow holes 361, the defrosted water condensed by cooling at the cold end heat exchanger 42 falls into the water pan 8 and flows to contact with the L-shaped finned heat pipe 433. In this embodiment, the water pan 8 and the bottom wall of the accommodating chamber 3 are integrally disposed.
With continued reference to fig. 1, in order to improve the heat dissipation effect, a first heat dissipation air duct and a second heat dissipation air duct are further disposed in the accommodating cavity 3. Specifically, the first heat dissipation air duct is located above the two-stage semiconductor refrigeration element 41, the cavity wall of the accommodating cavity 3 is provided with a first air inlet 31 and a first air outlet 32 which are communicated with the outside, and outside air enters the first heat dissipation air duct from the first air inlet 31 and is discharged from the first air outlet 32; the second heat dissipation air duct is located below the two-stage semiconductor refrigeration element 41, a second air inlet 33 and a second air outlet 34 which are communicated with the outside are arranged on the cavity wall of the accommodating cavity 3, and outside air enters the second heat dissipation air duct from the second air inlet 33 and is discharged from the second air outlet 34. Further, the air-cooled semiconductor freezer 100 further includes a control unit for controlling the two-stage semiconductor cooling device 41, the cooling fan 5, the first cooling fan 6, and the second cooling fan 7,
more specifically, in the present embodiment, the vertical finned heat pipe 432 and the first heat dissipation fan 6 are located in the first heat dissipation channel, and the first heat dissipation fan 6 is located at the first air outlet 32. The L-shaped finned heat pipe 433 and the second heat dissipation fan 7 are located in the second heat dissipation channel. Under the driving of the first heat dissipation fan 6, air from the outside of the cabinet 2 enters from the first air inlet 31, flows through the vertical fin heat pipe 432, and is exhausted from the first air outlet 32 to take away heat. Under the driving of the second heat dissipation fan 7, air from the outside of the cabinet 2 enters from the second air inlet 33, and after flowing through the L-shaped fin heat pipe 433, the air is discharged from the second air outlet 34 to take away heat and water vapor, so that the heat dissipation effect is enhanced, and the problem of discharging defrosted water is effectively solved, wherein the specific flow direction of the air refers to the arrow direction in fig. 1.
Preferably, in this embodiment, the first air inlet 31 is opened on an upper cavity wall of the accommodating cavity 3, the first air outlet 32 and the second air outlet 34 are opened on a side cavity wall of the accommodating cavity 3 far away from the cabinet body 2, the first air outlet 32 is located above the second air outlet 34, and the second air inlet 33 is opened on a rear cavity wall of the accommodating cavity 3. The first heat dissipation air duct and the second heat dissipation air duct in the structure can ensure that external air fully flows through the vertical fin type heat pipe 432 and the L-shaped fin type heat pipe 433, and effectively improve the heat dissipation effect of the hot end of the two-stage semiconductor refrigeration element 41.
Further, referring to fig. 1, the cabinet body 2 includes a top plate 23, a bottom plate 24, a front plate, a rear plate and a back plate 25 which are fixedly connected to form a box structure, the cabinet opening and the back plate 25 are oppositely disposed, a face plate 35 is enclosed on one side of the back plate 25 far away from the cabinet opening, and the face plate 35 and the back plate 25 surround the accommodating cavity 3 forming a rectangular structure. In the embodiment, the refrigeration mechanism is tightly attached to the back plate 25, so that the refrigeration mechanism is simple and convenient; and the top plate 23, the bottom plate 24, the front plate, the rear plate and the back plate 25 are all made of heat-insulating materials, so that the heat-insulating property of the cabinet body 2 is improved, and the energy consumption is further reduced.
The invention also provides a control method for the air-cooled semiconductor freezer 100 according to any one of the above technical schemes, the control method controls the air-cooled semiconductor freezer 100 to operate in a refrigeration mode or a defrosting mode, and the control method comprises a refrigeration mode control method and a defrosting mode control method;
the control method of the refrigeration mode comprises the following steps: the double-stage semiconductor refrigerating element 41 is controlled to supply power reversely, the cooling fan 5, the first cooling fan 6 and the second cooling fan 7 are controlled to work simultaneously, and the cold energy is transmitted to the inside of the cabinet body 2 by the cold end of the double-stage semiconductor refrigerating element 41;
the defrosting mode control method comprises the following steps: and controlling the double-stage semiconductor refrigeration element 41 to supply power reversely, controlling the cooling fan 5 to stop, and controlling the first cooling fan 6 and the second cooling fan 7 to work simultaneously, wherein the double-stage semiconductor refrigeration element 41 releases heat to the cold-end heat exchanger 42 to realize quick defrosting.
The above description is only a preferred embodiment of the present invention, and not intended to limit the present invention in other forms, and any person skilled in the art may apply the above modifications or changes to the equivalent embodiments with equivalent changes, without departing from the technical spirit of the present invention, and any simple modification, equivalent change and change made to the above embodiments according to the technical spirit of the present invention still belong to the protection scope of the technical spirit of the present invention.
Claims (10)
1. The utility model provides an air-cooled semiconductor freezer, its characterized in that, including the door body, the cabinet body and set up in refrigeration mechanism on the cabinet body, the cabinet mouth has been seted up on the cabinet body, door body coupling in cabinet mouth department is used for the switching cabinet mouth, refrigeration mechanism is including holding the chamber and setting up in holding the intracavity:
a refrigeration module, comprising:
a dual stage semiconductor refrigeration element comprising a cold end and a hot end;
a cold end heat exchanger connected with the cold end;
the hot end radiator is connected with the hot end and comprises a vertical finned heat pipe and an L-shaped finned heat pipe;
a cooling fan for circulating air inside the cabinet to the cold end heat exchanger and between the cabinet and the cold end heat exchanger;
the first heat dissipation fan is used for enabling external air to flow to the vertical fin type heat pipe;
and the second heat dissipation fan is used for enabling the external air to flow to the L-shaped finned heat pipe.
And the water receiving tray is arranged below the refrigeration module, and part of the L-shaped finned heat pipe is immersed in the water receiving tray.
2. An air-cooled semiconductor freezer as claimed in claim 1 wherein: it is close to hold the intracavity one side of the cabinet body still is provided with cooling air duct, set up the cooling air intake and the cooling air outlet with the cooling air duct intercommunication on the cabinet body, cooling fan with the cold junction heat exchanger is located in the cooling air duct, just cooling fan set up in cooling air outlet department.
3. An air-cooled semiconductor freezer as claimed in claim 2 wherein: the vertical heated board that is provided with in the holding intracavity, doublestage semiconductor refrigeration component installs on the heated board, the lower extreme of heated board extends to and is connected with the diapire that holds the chamber, and its upper end upwards extends and bend and be connected to on the cabinet body, the heated board with the cabinet body is around forming the cooling air duct, cooling air outlet is located the top of cooling air intake.
4. An air-cooled semiconductor freezer as claimed in claim 3 wherein: the water receiving tray covers the bottom wall of the accommodating cavity and is connected with the cabinet body, the lower end of the heat insulation board is connected to the bottom plate of the water receiving tray, and the lower portion of the heat insulation board is provided with an overflow hole.
5. An air-cooled semiconductor freezer as claimed in any one of claims 2 to 4, characterised in that: the double-stage semiconductor refrigeration device is characterized in that a first heat dissipation air channel is further arranged in the accommodating cavity and located above the double-stage semiconductor refrigeration element, a first air inlet and a first air outlet which are communicated with the outside are formed in the wall of the accommodating cavity, the vertical fin type heat pipe and the first heat dissipation fan are located in the first heat dissipation channel, and the first heat dissipation fan is located at the first air outlet.
6. An air-cooled semiconductor freezer as claimed in claim 5 wherein: the accommodating cavity is also internally provided with a second heat dissipation air channel which is positioned below the double-stage semiconductor refrigerating element, the cavity wall of the accommodating cavity is provided with a second air inlet and a second air outlet which are communicated with the outside, and the L-shaped finned heat pipe and the first heat dissipation fan are positioned in the first heat dissipation channel.
7. The air-cooled semiconductor freezer of claim 6, wherein: the first air inlet is arranged on the upper cavity wall of the containing cavity, the first air outlet and the second air outlet are arranged on the side cavity wall of the containing cavity far away from the cabinet body, the first air outlet is located above the second air outlet, and the second air inlet is arranged on the rear cavity wall of the containing cavity.
8. An air-cooled semiconductor freezer as claimed in claim 1 wherein: the cabinet body comprises a top plate, a bottom plate, a front plate, a rear plate and a back plate which are fixedly connected to form a box-type structure, the cabinet opening is arranged opposite to the back plate, a panel is arranged on one side of the back plate away from the cabinet opening in an enclosing manner, the panel and the back plate surround to form the accommodating cavity, and the accommodating cavity is rectangular; the door body is a heat preservation door or a hollow glass door.
9. The air-cooled semiconductor freezer of claim 1, wherein: the cold end heat exchanger is a finned radiator with a planar substrate, the planar substrate is attached to the cold end, and the surface of the planar substrate is larger than that of the cold end; the hot end radiator also comprises a heat conducting plate which is jointed and connected with the hot end, the vertical fin type heat pipe and the L-shaped fin type heat pipe are arranged on the heat conducting plate, and one side of the heat conducting plate, which is far away from the double-stage semiconductor refrigeration element, is connected with the cavity wall of the accommodating cavity.
10. A control method for the air-cooled semiconductor freezer as claimed in any one of claims 1 to 9, wherein the air-cooled semiconductor freezer is controlled to operate in a cooling mode or a defrosting mode, wherein the control method comprises a cooling mode control method and a defrosting mode control method;
the control method of the refrigeration mode comprises the following steps: controlling the double-stage semiconductor refrigerating element to reversely supply power, controlling the cooling fan, the first cooling fan and the second cooling fan to work simultaneously, and transmitting cooling capacity to the inside of the cabinet body by the cold end of the double-stage semiconductor refrigerating element;
the defrosting mode control method comprises the following steps: and controlling the double-stage semiconductor refrigeration element to supply power reversely, controlling the cooling fan to stop, and controlling the first cooling fan and the second cooling fan to work simultaneously, wherein the double-stage semiconductor refrigeration element releases heat to the cold-end heat exchanger to realize quick defrosting.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210830486.6A CN115164493A (en) | 2022-07-15 | 2022-07-15 | Air-cooled semiconductor freezer and control method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210830486.6A CN115164493A (en) | 2022-07-15 | 2022-07-15 | Air-cooled semiconductor freezer and control method thereof |
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| CN115164493A true CN115164493A (en) | 2022-10-11 |
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