CN115164494B - Semiconductor refrigeration freezer and control method thereof - Google Patents
Semiconductor refrigeration freezer and control method thereof Download PDFInfo
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- CN115164494B CN115164494B CN202210830940.8A CN202210830940A CN115164494B CN 115164494 B CN115164494 B CN 115164494B CN 202210830940 A CN202210830940 A CN 202210830940A CN 115164494 B CN115164494 B CN 115164494B
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- 238000005057 refrigeration Methods 0.000 title claims abstract description 213
- 239000004065 semiconductor Substances 0.000 title claims abstract description 168
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000001816 cooling Methods 0.000 claims abstract description 19
- 238000001704 evaporation Methods 0.000 claims abstract description 10
- 238000009792 diffusion process Methods 0.000 claims abstract description 4
- 238000010257 thawing Methods 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 10
- 230000008020 evaporation Effects 0.000 claims description 6
- 230000005494 condensation Effects 0.000 claims description 3
- 238000009833 condensation Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 description 7
- 238000009413 insulation Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000005265 energy consumption Methods 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Abstract
The invention provides a semiconductor refrigeration freezer and a control method thereof, which comprises a freezer body and a refrigeration mechanism arranged on the freezer body, wherein the refrigeration mechanism comprises: the two-stage semiconductor refrigeration element group is arranged in the wall of the cabinet body; the cold end radiator is connected with the cold end of the two-stage semiconductor refrigeration element group and is positioned in the cabinet body; the cooling fan is arranged in the cabinet body and is close to the cold end radiator to realize cold energy diffusion; the single-stage semiconductor refrigeration element group is arranged at the outer side of the cabinet body; the condensing section and the evaporating section at two ends of the at least one flexible heat pipe are respectively connected with the cold end of the single-stage semiconductor refrigeration element group and the hot end of the two-stage semiconductor refrigeration element group; the hot end radiator is connected with the hot end of the single-stage semiconductor refrigeration element group and comprises a U-shaped fin type heat pipe; the two radiating fans are symmetrically arranged on the inner sides of the U-shaped fin type heat pipes. The invention has simple structure and convenient control, improves the refrigeration efficiency and can meet lower temperature requirements.
Description
Technical Field
The invention belongs to the technical field of refrigeration of a refrigerator, and particularly relates to a semiconductor refrigeration refrigerator and a control method thereof.
Background
The semiconductor refrigerating method is characterized by that it utilizes the Peltier effect of semiconductor material, when the direct current passes through the couple formed from two different semiconductor materials which are series-connected, the two ends of the couple can respectively absorb heat quantity and release heat quantity, and the refrigerating in a certain space can be implemented by means of heat-absorbing action on the cold end surface of said couple. Because it does not need to use the compressor and influence the refrigerant of the environment, therefore have advantages such as environmental protection, simple structure, etc., get the application in electronic cooling, small-scale freezer, sideboard, drink cabinet and refrigerator. However, compared to vapor compression refrigeration, semiconductor refrigeration efficiency is a major disadvantage, and particularly when lower refrigeration temperatures are obtained, improving the refrigeration efficiency is critical for its application.
The existing semiconductor refrigeration refrigerator and the like are concentrated on refrigeration products (the temperature in the refrigerator is higher than 0 ℃), the refrigeration structure is mainly based on the adoption of a single-stage semiconductor refrigeration element, the refrigeration capacity and the refrigeration temperature of the semiconductor refrigeration refrigerator can not meet the lower refrigeration temperature requirement, and the application and the development of the semiconductor refrigeration are seriously restricted. In order to realize the development of semiconductor refrigeration freezer products (the temperature in the freezer reaches-18 ℃ and below), the adoption of two-stage or multi-stage semiconductor refrigeration elements is a main technical route. However, the two-stage semiconductor refrigeration element still has the problems of low refrigeration capacity and low efficiency, and the conventional multi-stage semiconductor refrigeration element solves the problems of low refrigeration capacity and low refrigeration efficiency to a certain extent, but the adopted integral stacking mode has the defect of large volume, and is not suitable for the configuration of the small-sized freezer cabinet body.
Disclosure of Invention
Aiming at the technical problems, the invention provides the semiconductor refrigeration freezer and the control method thereof, the semiconductor refrigeration freezer has simple structure and convenient use, the flexible heat pipe is utilized to realize the serial refrigeration of the two-stage and single-stage semiconductor refrigeration element groups, the refrigeration temperature requirement of minus 18 ℃ is easy to be realized, and the refrigeration efficiency and the refrigeration capacity are improved; the arrangement of the flexible hose enables the arrangement of the refrigeration mechanism to be more flexible.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows:
The utility model provides a semiconductor refrigeration freezer, it includes the cabinet body and sets up the refrigeration mechanism on the cabinet body, refrigeration mechanism includes:
the two-stage semiconductor refrigeration element group is arranged in the wall of the cabinet body;
The cold end radiator is connected with the cold end of the two-stage semiconductor refrigeration element group and is positioned in the cabinet body;
the cooling fan is arranged in the cabinet body and is arranged close to the cold end radiator to realize cold energy diffusion;
the single-stage semiconductor refrigeration element group is arranged at the outer side of the cabinet body;
The condensing sections and the evaporating sections at the two ends of the at least one flexible heat pipe are respectively connected with the cold ends of the single-stage semiconductor refrigeration element group and the hot ends of the two-stage semiconductor refrigeration element group;
The hot end radiator is connected with the hot end of the single-stage semiconductor refrigeration element group and comprises a U-shaped fin type heat pipe;
The two radiating fans are symmetrically arranged on the inner sides of the U-shaped fin type heat pipes and used for enabling outside air to flow to the U-shaped fin type heat pipes.
According to the semiconductor refrigeration freezer provided by the technical scheme, the heat of the hot end of the two-stage semiconductor refrigeration element group is transferred to the cold end of the single-stage semiconductor refrigeration element group by the flexible heat pipe, so that the two are in a thermal serial state, namely serial refrigeration, the refrigeration temperature requirement of minus 18 ℃ is easy to realize, and the refrigeration efficiency and the refrigeration capacity of the semiconductor refrigeration freezer are improved; meanwhile, the flexible hose can realize flexible arrangement of the refrigerating mechanism by utilizing the characteristic of bending deformation of the flexible hose, and is convenient to flexibly install on the cabinet body.
In other embodiments of the present application, the semiconductor refrigeration freezer further comprises:
the first heat conduction block is in fit connection with the cold end of the single-stage semiconductor refrigeration element group, and the condensation section of the flexible heat pipe is arranged in the first heat conduction block;
the second heat conduction block is in fit connection with the hot end of the two-stage semiconductor refrigeration element group, and the evaporation section of the flexible heat pipe is arranged in the second heat conduction block; the heat of the hot end of the bipolar double-stage semiconductor refrigeration element group is conducted to the second heat conduction block through the first heat conduction block and the flexible heat pipe, so that the heat dissipation effect is improved, the refrigeration efficiency is improved, and the refrigeration energy consumption is reduced.
In other embodiments of the present application, the flexible heat pipe is an L-shaped flexible heat pipe.
In other embodiments of the present application, the first heat conducting block is mounted on a wall of the top of the cabinet, and the two-stage semiconductor refrigeration element group is mounted in a side wall of the cabinet and is located at an upper portion of the side wall.
In other embodiments of the present application, a drain hole communicated with the outside is formed at the bottom of the side wall of the bipolar semiconductor refrigeration element, so as to drain the defrost water.
In other embodiments of the present application, the cold-end radiator is a fin radiator with a planar substrate, the planar substrate is attached to the cold end of the two-stage semiconductor refrigeration element group, the surface of the planar substrate is larger than the surface of the cold end of the two-stage semiconductor refrigeration element group, the heat dissipation fins of the fin radiator are located in the cabinet body, and the air in the cabinet body is diffused in the cabinet body after being cooled by the heat dissipation fins under the driving of the cooling fan.
In other embodiments of the present application, the heat end radiator further includes a heat conducting plate, the heat conducting plate is attached to the heat end of the single-stage semiconductor refrigeration element group, and the U-shaped fin heat pipe is mounted on the heat conducting plate.
In other embodiments of the application, the cabinet body is provided with a cabinet opening, and a door body is arranged at the cabinet opening; the cabinet body comprises a top plate, a bottom plate, a front plate, a rear plate and a back plate which are fixedly connected to form a box-type structure, the cabinet opening is opposite to the back plate, and the two-stage semiconductor refrigeration element group is installed in the back plate.
In other embodiments of the present application, the door body is a thermal insulation door or a hollow glass door with a window.
In other embodiments of the present application, the flexible heat pipe further comprises a flexible heat insulation section connected between the condensing section and the evaporating section.
In other embodiments of the present application, the dual-stage semiconductor refrigeration element group includes at least one dual-stage semiconductor refrigeration element, and when a plurality of dual-stage semiconductor refrigeration elements are provided, the plurality of dual-stage semiconductor refrigeration elements are connected in parallel; the single-stage semiconductor refrigeration element group includes at least one single-stage semiconductor refrigeration element, and when a plurality of single-stage semiconductor refrigeration elements are provided, a plurality of single-stage semiconductor refrigeration elements are connected in parallel.
The invention also provides a control method for the semiconductor refrigeration freezer according to any one of the technical schemes, which is used for controlling the semiconductor refrigeration freezer to operate in a refrigeration mode or a defrosting mode, and comprises a refrigeration mode control method and a defrosting mode control method;
the refrigeration mode control method comprises the following steps: controlling the single-stage semiconductor refrigeration element group and the double-stage semiconductor refrigeration element group to simultaneously supply power in the forward direction, and controlling the cooling fan and the two radiating fans to simultaneously work;
the defrosting mode control method comprises the following steps: the cooling fan is controlled to stop, and when a small amount of frosting occurs, the two-stage semiconductor refrigeration element group is only controlled to reversely supply power, and at the moment, the two-stage semiconductor refrigeration element group releases heat to the cold-end radiator to defrost; when a large amount of frosting occurs, the single-stage semiconductor refrigeration element group and the double-stage semiconductor refrigeration element group are controlled to simultaneously supply power reversely, and the two radiating fans are controlled to simultaneously work, so that the double-stage semiconductor refrigeration element group releases heat to the cold-end radiator to accelerate defrosting.
Compared with the prior art, the invention has the advantages and positive effects that:
The semiconductor refrigeration freezer provided by the invention has a simple structure, realizes the serial connection refrigeration of the two-stage semiconductor refrigeration element group and the single-stage semiconductor refrigeration element group through the flexible hot end, can ensure that the refrigeration temperature requirement of minus 18 ℃ is easy to realize, and improves the refrigeration efficiency and the refrigeration capacity of the semiconductor refrigeration freezer; meanwhile, the flexible hose can be arranged flexibly to realize flexible arrangement of the refrigerating mechanism, and the installation flexibility is improved. The control method can control the semiconductor refrigeration freezer to operate in the refrigeration mode and the defrosting mode, has a good control effect, and can effectively ensure the reliable and stable operation of the semiconductor refrigeration freezer.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute a limitation on the application. In the drawings:
fig. 1 is a schematic structural diagram of a semiconductor refrigeration freezer according to an embodiment of the invention.
Wherein: a semiconductor refrigeration freezer 100; a cabinet body 1; a top plate 11; a bottom plate 12; a back plate 13; a door body 14; a drain hole 15; a two-stage semiconductor refrigeration element group 2; a cold end radiator 3; a substrate 31; a heat radiation fin 32; a cooling fan 4; a single-stage semiconductor refrigeration element group 5; a flexible heat pipe 6; a hot side heat sink 7; u-shaped fin heat pipes 71; a heat conductive plate 72; a heat radiation fan 8; a first heat conduction block 91; and a second heat conducting block 92.
Detailed Description
The technical solutions in the embodiments will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be understood that the terms "center", "lateral", "longitudinal", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
The terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", or a third "may explicitly or implicitly include one or more such feature.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In an exemplary embodiment of a semiconductor refrigeration freezer 100 of the present invention, shown in fig. 1, the semiconductor refrigeration freezer 100 includes a cabinet 1 and a refrigeration mechanism disposed on the cabinet 1. The refrigerating mechanism comprises a double-stage semiconductor refrigerating element group 2, a cold end radiator 3, a cooling fan 4, a single-stage semiconductor refrigerating element group 5, at least one flexible heat pipe 6, a hot end radiator 7 and two radiating fans 8.
Specifically, referring to fig. 1, a two-stage semiconductor refrigeration element group 2 is installed in a wall of a cabinet body 1, a cold end radiator 3 is connected with a cold end of the two-stage semiconductor refrigeration element group 2, the cold end radiator 3 is located in the cabinet body 1, a cooling fan 4 is installed in the cabinet body 1 and is arranged close to the cold end radiator 3 to achieve cold energy diffusion, and a good refrigeration effect is achieved; the single-stage semiconductor refrigeration element group 5 is arranged on the outer side of the cabinet body 1; the flexible heat pipe 6 comprises a condensing section, a flexible heat insulation section and an evaporation end which are sequentially arranged, wherein the flexible heat insulation section is connected between the condensing section and the evaporation section, and the condensing section and the evaporation section at two ends of the flexible heat pipe 6 are respectively connected with the cold end of the single-stage semiconductor refrigeration element group 5 and the hot end of the two-stage semiconductor refrigeration element group 2; the hot side heat sink 7 is connected to the hot side of the single-stage semiconductor refrigeration element group 5, and the hot side heat sink 7 includes a U-fin heat pipe 71. The two heat dissipation fans 8 are symmetrically arranged at the inner sides of the U-shaped fin heat pipes 71 to enable the external air to flow to the U-shaped fin heat pipes 71, so that heat at the U-shaped fin heat pipes 71 is taken away, the heat dissipation effect is further enhanced under the driving of the two heat dissipation fans 8, and the specific flow direction of the air is shown by the arrow direction in fig. 1. It should be noted that, the number of the flexible heat pipes 6 needs to be configured according to the specific size of the cabinet 1.
The semiconductor refrigeration freezer 100 provided in this embodiment separately arranges the two-stage semiconductor refrigeration element group 2 and the single-stage semiconductor refrigeration element group 5 and makes the two refrigeration elements overlap, which has obvious advantages in the application of semiconductor refrigeration freezer technology. Specifically, in this embodiment, the heat of the hot end of the two-stage semiconductor refrigeration element group 2 is transferred to the cold end of the single-stage semiconductor refrigeration element group 5 by using the flexible heat pipe 6, so that the two are in a thermal serial state, namely serial refrigeration, so that the refrigeration temperature requirement of-18 ℃ is easily achieved, and the refrigeration efficiency and the refrigeration capacity of the semiconductor refrigeration freezer 100 are improved; meanwhile, the flexible hose can realize flexible arrangement of the refrigerating mechanism by utilizing the characteristic of self-bending deformation, is convenient to flexibly install on the cabinet body 1, and solves the defects of the existing integral stacking mode.
Further, referring to fig. 1, the semiconductor refrigeration freezer 100 also includes a first heat conduction block 91 and a second heat conduction block 92. The first heat conduction block 91 is in fit connection with the cold end of the single-stage semiconductor refrigeration element group 5, and the condensation section of the flexible heat pipe 6 is arranged in the first heat conduction block 91; the second heat conducting block 92 is connected with the hot end of the two-stage semiconductor refrigeration element group 2 in a bonding mode, and the evaporation section of the flexible heat pipe 6 is arranged in the second heat conducting block 92. The heat of the hot end of the bipolar double-stage semiconductor refrigeration element group 2 is conducted to the second heat conduction block 92 through the first heat conduction block 91 and the flexible heat pipe 6, so that the heat dissipation effect is improved, the refrigeration efficiency is improved, and the refrigeration energy consumption is reduced. In this embodiment, the first heat conduction block 91 and the second heat conduction block 92 are both preferably metal aluminum heat conduction blocks.
With continued reference to fig. 1, the first heat conducting block 91 is mounted on a wall at the top of the cabinet body 1, the two-stage semiconductor refrigeration element group 2 is mounted in a side wall of the cabinet body 1 and is located at the upper part of the side wall, and a drain hole 15 communicated with the outside is formed at the bottom of the side wall where the two-stage semiconductor refrigeration element is located, so as to drain the defrost water. In this embodiment, the upper part of the side wall of the cabinet body 1 is provided with a receiving groove, and the two-stage semiconductor refrigeration element group 2 is installed in the receiving groove. Preferably, the flexible heat pipe 6 is an L-shaped flexible heat pipe.
In this embodiment, the hot-end heat sink 7 further includes a heat-conducting plate 72, the heat-conducting plate 72 is attached to the hot end of the single-stage semiconductor refrigeration component group 5, and the U-shaped fin heat pipe 71 is mounted on the heat-conducting plate 72. Preferably, the heat conductive plate 72 is a metallic aluminum heat conductive plate. The cold end radiator 3 is a fin type radiator with a plane substrate 31, the plane substrate 31 is attached and connected to the cold end of the two-stage semiconductor refrigeration element group 2, the surface of the plane substrate 31 is larger than the surface of the cold end of the two-stage semiconductor refrigeration element group 2, the radiating fins 32 of the fin type radiator are positioned in the cabinet body 1, under the driving of the cooling fan 4, air in the cabinet body 1 is cooled by the radiating fins 32 and then is diffused in the cabinet body 1, and therefore refrigeration is achieved, and the specific flow direction of the air is shown by an arrow in reference to fig. 1.
Further, with continued reference to fig. 1, in this embodiment, the cabinet body 1 is provided with a cabinet opening, a door body 14 is disposed at the cabinet opening, and the door body 14 is preferably a thermal insulation door or a hollow glass door with a window, so that objects in the cabinet body 1 can be conveniently observed. The cabinet body 1 comprises a top plate 11, a bottom plate 12, a front plate, a rear plate and a back plate 13 which are fixedly connected to form a box-type structure, a cabinet opening and the back plate 13 are arranged oppositely, and the two-stage semiconductor refrigeration element group 2 is installed in the back plate 13. In this embodiment, the top plate 11, the bottom plate 12, the front plate, the rear plate and the back plate 13 are all made of thermal insulation materials, so that the thermal insulation performance of the cabinet body 1 is improved, and the energy consumption is further reduced.
In the above-described embodiment, the two-stage semiconductor refrigeration element group 2 includes at least one two-stage semiconductor refrigeration element, and when a plurality of two-stage semiconductor refrigeration elements are provided, the plurality of two-stage semiconductor refrigeration elements are connected in parallel; the single-stage semiconductor refrigeration element group 5 includes at least one single-stage semiconductor refrigeration element, and when a plurality of single-stage semiconductor refrigeration elements are provided, the plurality of single-stage semiconductor refrigeration elements are connected in parallel. That is, the cold ends of the two-stage semiconductor refrigeration elements are connected and located on the same side to form the cold end of the two-stage semiconductor refrigeration element group 2, and the hot ends of the two-stage semiconductor refrigeration elements are connected and located on the same side to form the hot end of the two-stage semiconductor refrigeration element group 2; the cold ends of the single-stage semiconductor refrigeration elements are connected and positioned on the same side to form the cold end of the single-stage semiconductor refrigeration element group 5, and the hot ends of the single-stage semiconductor refrigeration elements are connected and positioned on the same side to form the hot end of the single-stage semiconductor refrigeration element group 5. The number of parallel-connection configurations of the single-stage semiconductor refrigeration element and the two-stage semiconductor refrigeration element is set according to the specific size of the cabinet 1.
The invention also provides a control method for the semiconductor refrigeration freezer 100 according to any one of the above technical schemes, which is used for controlling the semiconductor refrigeration freezer 100 to operate in a refrigeration mode or a defrosting mode, wherein the control method comprises a refrigeration mode control method and a defrosting mode control method;
The control method of the refrigeration mode comprises the following steps: the single-stage semiconductor refrigeration element group 5 and the double-stage semiconductor refrigeration element group 2 are controlled to simultaneously supply power positively, and the cooling fan 4 and the two cooling fans 8 are controlled to simultaneously work;
The defrosting mode control method comprises the following steps: the cooling fan 4 is controlled to stop, and when a small amount of frosting occurs, only the two-stage semiconductor refrigeration element group 2 is controlled to reversely supply power, and at the moment, the two-stage semiconductor refrigeration element group 2 releases heat and defrosts to the cold end radiator 3; when a large amount of frosting occurs, the single-stage semiconductor refrigeration element group 5 and the double-stage semiconductor refrigeration element group 2 are controlled to simultaneously supply power reversely, and the two cooling fans 8 are controlled to simultaneously work, so that the double-stage semiconductor refrigeration element group 2 releases heat to the cold-end radiator 3 to accelerate defrosting.
The present invention is not limited to the above-mentioned embodiments, and any equivalent embodiments which can be changed or modified by the technical content disclosed above can be applied to other fields, but any simple modification, equivalent changes and modification made to the above-mentioned embodiments according to the technical substance of the present invention without departing from the technical content of the present invention still belong to the protection scope of the technical solution of the present invention.
Claims (10)
1. The utility model provides a semiconductor refrigeration freezer, its characterized in that includes the cabinet body and sets up the refrigerating mechanism on the cabinet body, refrigerating mechanism includes:
the two-stage semiconductor refrigeration element group is arranged in the wall of the cabinet body;
The cold end radiator is connected with the cold end of the two-stage semiconductor refrigeration element group and is positioned in the cabinet body;
the cooling fan is arranged in the cabinet body and is arranged close to the cold end radiator to realize cold energy diffusion;
the single-stage semiconductor refrigeration element group is arranged at the outer side of the cabinet body;
The condensing sections and the evaporating sections at the two ends of the at least one flexible heat pipe are respectively connected with the cold ends of the single-stage semiconductor refrigeration element group and the hot ends of the two-stage semiconductor refrigeration element group;
The hot end radiator is connected with the hot end of the single-stage semiconductor refrigeration element group and comprises a U-shaped fin type heat pipe;
The two radiating fans are symmetrically arranged on the inner sides of the U-shaped fin type heat pipes and used for enabling outside air to flow to the U-shaped fin type heat pipes.
2. A semiconductor refrigeration freezer as claimed in claim 1 wherein: further comprises:
the first heat conduction block is in fit connection with the cold end of the single-stage semiconductor refrigeration element group, and the condensation section of the flexible heat pipe is arranged in the first heat conduction block;
and the second heat conduction block is connected with the hot end of the two-stage semiconductor refrigeration element group in a bonding way, and the evaporation section of the flexible heat pipe is arranged in the second heat conduction block.
3. A semiconductor refrigeration freezer as claimed in claim 2 wherein: the flexible heat pipe is an L-shaped flexible heat pipe.
4. A semiconductor refrigeration freezer as claimed in claim 2 or claim 3 wherein: the first heat conduction block is arranged on the box wall at the top of the cabinet body, and the two-stage semiconductor refrigeration element group is arranged in the side box wall of the cabinet body and is positioned at the upper part of the side box wall.
5. The semiconductor refrigeration freezer of claim 4, wherein: and the bottom of the side tank wall where the two-stage semiconductor refrigeration element group is positioned is provided with a drain hole communicated with the outside.
6. A semiconductor refrigeration freezer as claimed in claim 1 wherein: the cold end radiator is a fin type radiator with a planar substrate, the planar substrate is attached and connected to the cold end of the two-stage semiconductor refrigeration element group, the surface of the planar substrate is larger than the surface of the cold end of the two-stage semiconductor refrigeration element group, and radiating fins of the fin type radiator are located inside the cabinet body.
7. A semiconductor refrigeration freezer as claimed in claim 1 wherein: the hot end radiator also comprises a heat conducting plate, wherein the heat conducting plate is connected to the hot end of the single-stage semiconductor refrigeration element group in a fitting mode, and the U-shaped fin type heat pipe is arranged on the heat conducting plate.
8. A semiconductor refrigeration freezer as claimed in claim 1 wherein: the cabinet body is provided with a cabinet opening, and a door body is arranged at the cabinet opening; the cabinet body comprises a top plate, a bottom plate, a front plate, a rear plate and a back plate which are fixedly connected to form a box-type structure, the cabinet opening is opposite to the back plate, and the two-stage semiconductor refrigeration element group is installed in the back plate.
9. A semiconductor refrigeration freezer as claimed in claim 1 wherein: the two-stage semiconductor refrigeration element group comprises at least one two-stage semiconductor refrigeration element, and when a plurality of two-stage semiconductor refrigeration elements are arranged, the two-stage semiconductor refrigeration elements are connected in parallel; the single-stage semiconductor refrigeration element group includes at least one single-stage semiconductor refrigeration element, and when a plurality of single-stage semiconductor refrigeration elements are provided, a plurality of single-stage semiconductor refrigeration elements are connected in parallel.
10. A control method for a semiconductor refrigeration freezer according to any one of claims 1 to 9, controlling the semiconductor refrigeration freezer to operate in a cooling mode or a defrosting mode, characterized in that the control method comprises a cooling mode control method and a defrosting mode control method;
the refrigeration mode control method comprises the following steps: controlling the single-stage semiconductor refrigeration element group and the double-stage semiconductor refrigeration element group to simultaneously supply power in the forward direction, and controlling the cooling fan and the two radiating fans to simultaneously work;
the defrosting mode control method comprises the following steps: the cooling fan is controlled to stop, and when a small amount of frosting occurs, the two-stage semiconductor refrigeration element group is only controlled to reversely supply power, and at the moment, the two-stage semiconductor refrigeration element group releases heat to the cold-end radiator to defrost; when a large amount of frosting occurs, the single-stage semiconductor refrigeration element group and the double-stage semiconductor refrigeration element group are controlled to simultaneously supply power reversely, and the two radiating fans are controlled to simultaneously work, so that the double-stage semiconductor refrigeration element group releases heat to the cold-end radiator to accelerate defrosting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210830940.8A CN115164494B (en) | 2022-07-15 | Semiconductor refrigeration freezer and control method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210830940.8A CN115164494B (en) | 2022-07-15 | Semiconductor refrigeration freezer and control method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115164494A CN115164494A (en) | 2022-10-11 |
| CN115164494B true CN115164494B (en) | 2024-06-07 |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0289353A (en) * | 1988-09-27 | 1990-03-29 | Toshiba Corp | Boiling cooling device |
| CN2681057Y (en) * | 2003-12-10 | 2005-02-23 | 来学恩 | Heat pipe radiating micro electronic refrigerator |
| CN101344344A (en) * | 2008-08-25 | 2009-01-14 | 南京大学 | Heat pipe semiconductor refrigeration and cold accumulation system |
| CN204693920U (en) * | 2015-05-29 | 2015-10-07 | 青岛海尔智能技术研发有限公司 | Pass device for cooling and there is the semiconductor refrigerating box of this biography device for cooling |
| CN106288584A (en) * | 2015-05-29 | 2017-01-04 | 青岛海尔智能技术研发有限公司 | Semiconductor refrigerating box |
| CN106440601A (en) * | 2015-08-11 | 2017-02-22 | 卡孚特能源技术（深圳）有限公司 | Freezing type multistage semiconductor refrigeration refrigerator |
| CN207113018U (en) * | 2017-07-18 | 2018-03-16 | 西安交通大学 | A kind of twin-stage semi-conductor dehumidifying mechanism of heat pipe synergy |
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0289353A (en) * | 1988-09-27 | 1990-03-29 | Toshiba Corp | Boiling cooling device |
| CN2681057Y (en) * | 2003-12-10 | 2005-02-23 | 来学恩 | Heat pipe radiating micro electronic refrigerator |
| CN101344344A (en) * | 2008-08-25 | 2009-01-14 | 南京大学 | Heat pipe semiconductor refrigeration and cold accumulation system |
| CN204693920U (en) * | 2015-05-29 | 2015-10-07 | 青岛海尔智能技术研发有限公司 | Pass device for cooling and there is the semiconductor refrigerating box of this biography device for cooling |
| CN106288584A (en) * | 2015-05-29 | 2017-01-04 | 青岛海尔智能技术研发有限公司 | Semiconductor refrigerating box |
| CN106440601A (en) * | 2015-08-11 | 2017-02-22 | 卡孚特能源技术（深圳）有限公司 | Freezing type multistage semiconductor refrigeration refrigerator |
| CN207113018U (en) * | 2017-07-18 | 2018-03-16 | 西安交通大学 | A kind of twin-stage semi-conductor dehumidifying mechanism of heat pipe synergy |
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