CN106288584A - Semiconductor refrigerating box - Google Patents
Semiconductor refrigerating box Download PDFInfo
- Publication number
- CN106288584A CN106288584A CN201510288157.3A CN201510288157A CN106288584A CN 106288584 A CN106288584 A CN 106288584A CN 201510288157 A CN201510288157 A CN 201510288157A CN 106288584 A CN106288584 A CN 106288584A
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- Prior art keywords
- heat
- semiconductor
- cold
- refrigerating box
- semiconductor refrigerating
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 124
- 238000001816 cooling Methods 0.000 claims abstract description 56
- 238000005057 refrigeration Methods 0.000 claims abstract description 35
- 230000005855 radiation Effects 0.000 claims description 43
- 239000000758 substrate Substances 0.000 claims description 34
- 239000011159 matrix material Substances 0.000 claims description 16
- 230000009977 dual effect Effects 0.000 abstract description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001717 pathogenic effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention provides a kind of semiconductor refrigerating box.This semiconductor refrigerating box includes: have the casing of forward direction opening, defines multiple storage space in it in transverse direction；It is juxtaposed on multiple semiconductor refrigeration systems at the rear portion of casing in transverse direction, each semiconductor refrigeration system includes the one or more semiconductor chilling plates of himself, and the cold of the cold end of each semiconductor chilling plate in this semiconductor refrigeration system is fed to the biography device for cooling of the corresponding storage space in its front.The semiconductor refrigerating box of the present invention, owing to having the multiple storage spaces and multiple semiconductor refrigeration system being laterally set up in parallel, significantly improves the storing capacity of semiconductor refrigerating box；And the temperature in each storage space can be made equal or different, so that having multiple warm area in semiconductor refrigerating box, and then can be the application of semiconductor refrigerating box to Large Copacity many warm areas field, especially field, Large Copacity dual temperature district.
Description
Technical field
The present invention relates to refrigerator art, particularly relate to a kind of semiconductor refrigerating box.
Background technology
Semiconductor freezer, also referred to as thermoelectric refrigerator.It utilizes semiconductor chilling plate to pass through heat pipe heat radiation
And conduction technique and automatic pressure-transforming Variable flow control technology realize refrigeration, it is not necessary to refrigeration working medium and mechanical movement portion
Part, solves the application problem of the traditional mechanical refrigerator such as medium pollution and mechanical vibration.But, existing
Semiconductor freezer due to by factors such as cold and hot end heat exchange, noise, costs, general use low capacity Dan Wen
District, the special small-sized refrigerating case such as the most vehicle-mounted in application, medical.
Summary of the invention
One object of the present invention is intended to overcome at least one defect of existing semiconductor freezer, it is provided that a kind of
Semiconductor refrigerating box, it can form multiple warm area, and have bigger storing capacity.
A further object of the invention is intended to improve radiating efficiency, and makes semiconductor refrigerating box structure tight
Gather.
Another of the present invention further objective is that the uniformity of temperature profile made in each storage space.
To this end, the invention provides a kind of semiconductor refrigerating box.This semiconductor refrigerating box includes:
There is the casing of forward direction opening, in it, define multiple storage space in transverse direction；
It is juxtaposed on multiple semiconductor refrigeration systems at the rear portion of described casing in transverse direction, each described
Semiconductor refrigeration system includes the one or more semiconductor chilling plates of himself, and by this semiconductor refrigerating
In system, the cold of the cold end of each semiconductor chilling plate is fed to the biography device for cooling of the corresponding storage space in its front.
Alternatively, described semiconductor refrigerating box farther includes: the first heat abstractor, is configured to each institute
In stating semiconductor refrigeration system, the heat in each semiconductor chilling plate hot junction is dispersed into surrounding；And/or, many
Individual second heat abstractor, each described second heat abstractor is configured in a described semiconductor refrigeration system
The heat in each semiconductor chilling plate hot junction is dispersed into surrounding.
Alternatively, described first heat abstractor includes:
Multiple first heat conduction substrates, the front surface of each described first heat conduction substrate and a described quasiconductor system
The hot junction thermally coupled of each semiconductor chilling plate in cooling system, to absorb heat；
Many first horizontally extending heat radiation heat pipes, every described first heat radiation heat pipe both passes through described
Multiple first heat conduction substrates, to pass out the heat absorbed in each described first heat conduction substrate.
Alternatively, described many first heat radiation heat pipes be positioned at adjacent described first heat conduction substrate of each two it
Between section on be provided with the first radiating fin group；And/or
The end section of the both sides being positioned at the plurality of first heat conduction substrate of described many first heat radiation heat pipes
On be provided with the second radiating fin group.
Alternatively, described first heat abstractor also includes: at least one first cooling fan, each described
One cooling fan is configured to the heat in a described first radiating fin group is carried out forced convertion heat radiation.
Alternatively, described first radiating fin group and described second radiating fin group are respectively provided with multiple corresponding flat
The fin that between-line spacing is arranged；And spacing between each two adjacent fins in each described first radiating fin group
Less than spacing between each two adjacent fins in each described second radiating fin group.
Alternatively, each described second heat abstractor includes:
Second heat conduction substrate, the front surface of the second heat conduction substrate of each described second heat abstractor and an institute
The hot junction thermally coupled of each semiconductor chilling plate in stating semiconductor refrigeration system, to absorb heat；
Many second heat radiation heat pipes, the lower end of every described second heat radiation heat pipe is resisted against or embeds described second
In heat conduction substrate, with described second heat conduction substrate contact heat-exchanging；
3rd radiating fin group, has the fin that multiple corresponding parallel interval is arranged, is arranged at described many
On second heat radiation heat pipe；With
Second cooling fan, is configured to reach described 3rd radiating fin to from described many second heat radiation heat pipes
The heat of group carries out forced convertion heat radiation.
Alternatively, each described biography device for cooling is arranged in a storage space, comprising:
Conduction cooling matrix, the rear surface of the conduction cooling matrix of each described biography device for cooling and a described semiconductor refrigerating
The cold end thermally coupled of each semiconductor chilling plate in system, to absorb cold；
Many pass hot and cold tube, and the top section of every described biography hot and cold tube is resisted against or embeds described conduction cooling matrix
In, with by described conduction cooling matrix absorb cold pass out, and be delivered to every described biography hot and cold tube with
Its top section is at a distance of the compresses lower section of a distance；And
Top passes cold fins set and bottom passes cold fins set, respectively with the top section of biography hot and cold tube every described
With compresses lower section thermally coupled directly or indirectly.
Alternatively, each described biography device for cooling also includes: two pass air-cooler, are respectively configured on the most described
The cold that portion passes in cold fins set and the described bottom cold fins set of biography carries out forced convertion cold scattering.
Alternatively, described semiconductor refrigerating box farther includes: the first door body, is rotatably installed on described
Casing, in order to from the plurality of storage space of front closure of described casing；Or
Multiple second door body, each described second door body is rotatably installed on described casing, in order to from one
This storage space of the front closure of described storage space；Or
Folding door body, be installed on described casing, it has multiple door body unit, and each described door body unit is used
With from this storage space of front closure of a described storage space, and the described door body unit that each two is adjacent
It is pivotally connected.
The semiconductor refrigerating box of the present invention is owing to having the multiple storage spaces being laterally set up in parallel and multiple half
Conductor refrigeration system, significantly improves the storing capacity of semiconductor refrigerating box；And each storing can be made empty
Interior temperature is equal or different, so that having multiple warm area in semiconductor refrigerating box, and then can be half
The application of conductor refrigeration case to Large Copacity many warm areas field, especially field, Large Copacity dual temperature district.
Further, due to the special construction of the first heat abstractor in the semiconductor refrigerating box of the present invention, significantly
Improve the radiating efficiency of semiconductor refrigerating box, and the compact conformation of semiconductor refrigerating box can be made.
Further, due to the special construction of biography device for cooling each in the semiconductor refrigerating box of the present invention, can make
Temperature distribution in corresponding storage space is uniform.
According to below in conjunction with the accompanying drawing detailed description to the specific embodiment of the invention, those skilled in the art will
More understand the above-mentioned of the present invention and other purposes, advantage and feature.
Accompanying drawing explanation
Some describing the present invention the most by way of example, and not by way of limitation in detail are concrete
Embodiment.Reference identical in accompanying drawing denotes same or similar parts or part.Art technology
Personnel are it should be understood that what these accompanying drawings were not necessarily drawn to scale.In accompanying drawing:
Fig. 1 is the schematic elevational view of semiconductor refrigerating box according to an embodiment of the invention；
Fig. 2 is the schematic right-side view of semiconductor refrigerating box according to an embodiment of the invention；
Fig. 3 is the schematic rear view of semiconductor refrigerating box according to an embodiment of the invention；
Fig. 4 is the schematic right-side view of semiconductor refrigerating box according to an embodiment of the invention；
Fig. 5 is the schematic rear view of semiconductor refrigerating box according to an embodiment of the invention.
Detailed description of the invention
Fig. 1 is the schematic elevational view of semiconductor refrigerating box 100 according to an embodiment of the invention.Such as figure
Shown in 1, the semiconductor refrigerating box 100 that the embodiment of the present invention provides can include casing 20 and multiple quasiconductor system
Cooling system 30.This casing 20 defines multiple storage in having forward direction opening, and this casing 20 in transverse direction
Object space 21.Multiple semiconductor refrigeration systems 30 are juxtaposed on the rear portion of casing 20 in transverse direction, its
In, each semiconductor refrigeration system 30 includes: the one or more semiconductor chilling plates 31 of himself, with
And the cold of cold end of semiconductor chilling plate 31 each in this semiconductor refrigeration system 30 is fed to its front phase
Answer the biography device for cooling 32 of storage space 21.
In embodiments of the present invention, each semiconductor refrigeration system 30 can independent cooling so that storing up accordingly
Object space 21 is in a preset range temperature range, so that the temperature in multiple storage space 21 is equal
Or, say, that multiple semiconductor refrigeration systems 30 are formed in can making this semiconductor refrigerating box 100
Multiple warm areas, to preserve the article etc. corresponding with each warm area.
Fig. 2 is the schematic right-side view of semiconductor refrigerating box 100 according to an embodiment of the invention.Such as figure
Shown in 2, the rear wall of each storage space 21 can offer installing hole, to install a corresponding quasiconductor
One or more semiconductor chilling plates 31 of refrigeration system 30.The most each biography device for cooling 32 is arranged at a storage
In object space 21.In some further embodiments, a wind can be set in each storage space 21
Road cover plate, so that the rear wall of air duct cover board and this storage space 21 forms an air channel, passing device for cooling 32 can pacify
It is loaded in this air channel.
In the semiconductor refrigerating box 100 of the embodiment of the present invention, each biography device for cooling 32 can include conduction cooling base
Body 321, many biography hot and cold tubes 322, tops pass cold fins set 323 and the bottom cold fins set 324 of biography.Each
Each semiconductor chilling plate 31 in the conduction cooling matrix 321 of biography device for cooling 32 and a semiconductor refrigeration system 30
Cold end thermally coupled, to absorb cold.Specifically, after the conduction cooling matrix 321 of each biography device for cooling 32
In surface and a semiconductor refrigeration system 30 the cold end in contact of each semiconductor chilling plate 31 against.Enter one
Step ground, the contact surface of conduction cooling matrix 321 and semiconductor chilling plate 31 can smear heat-conducting silicone grease.Preferably,
Each conduction cooling matrix 321 can be the heat-conducting block being made up of aluminum.
The every top section passing hot and cold tube 322 is resisted against or embeds in conduction cooling matrix 321, with by conduction cooling base
In body 321 absorb cold pass out, and be delivered to every pass hot and cold tube 322 with its top section apart
The compresses lower section of one distance.In embodiments of the present invention, every passes hot and cold tube 322 can be sintered heat pipe, its
It is perfused with the cold-producing medium such as carbon dioxide, superconductive medium in internal cavities, its inwall can be attached with the gold of sintering
Belong to mealy structure, pass cold efficiency to improve.Further, many biography hot and cold tubes 322 can vertically be put down
Row extends.Passing hot and cold tube 322 and can be 3, the every length passing hot and cold tube 322 can be 60cm, diameter
For 8mm.
The top of each biography device for cooling 32 passes cold fins set 323 and bottom pass cold fins set 324 respectively with often
Root passes top section and the compresses lower section thermally coupled directly or indirectly of hot and cold tube 322, with to semiconductor refrigerating
Transmission cold in the storage space 21 of case 100.Specifically, the top of each biography device for cooling 32 passes cold fin
The corresponding parallel interval of multiple fins in group 323 it is arranged at the conduction cooling matrix 321 of this biography device for cooling 32
Front surface.Bottom is installed on many biographies with passing the corresponding parallel interval of multiple fins in cold fins set 324
The compresses lower section of hot and cold tube 322, so that each fin that bottom passes in cold fins set 324 is cold and hot with every biography
Pipe 322 contact heat-exchanging.
In order to improve cold scattering efficiency, the biography device for cooling 32 in the embodiment of the present invention also includes that two pass air-cooler,
It is respectively top and passes air-cooler 325 and bottom biography air-cooler 326.It is right that top biography air-cooler 325 can be configured to
The cold that top passes in cold fins set 323 carries out forced convertion cold scattering.Bottom passes air-cooler 326 and can be configured to
The cold passed bottom in cold fins set 324 carries out forced convertion cold scattering.In this embodiment, top passes cold
It can be all axial flow blower that blower fan 325 and bottom pass air-cooler 326, is respectively arranged in top and passes cold fins set 323
Pass in cold fins set 324 with bottom.
In embodiments of the present invention, when low-temperature receiver provides cold, the top of this biography device for cooling 32 passes cold fin
Group 323 and the every bottom cold fins set 324 of biography passing hot and cold tube 322 all can be to semiconductor refrigerating boxes 100
Transmission cold in one storage space 21.Due to the multidirectional of adopting heat pipes for heat transfer, when low-temperature receiver stops providing cold
During amount, biography device for cooling 32 is possible with every biography hot and cold tube 322 and makes each storage of semiconductor refrigerating box 100
Between thing, indoor temperature distribution is uniform, prevents cold air to be completely in the bottom of this storage space 21, hot-air
It is completely in the top of this storage space 21, causes upper and lower temperature difference indoor between this storing bigger.
In some embodiments of the invention, Fig. 3 is semiconductor refrigerating box according to an embodiment of the invention
The schematic rear view of 100, the semiconductor refrigerating box 100 of the embodiment of the present invention can farther include first and dissipate
Thermal 40, is configured to the heat in semiconductor chilling plate 31 hot junction each in each semiconductor refrigeration system 30
Amount is dispersed into surrounding.
Specifically, the first heat abstractor 40 includes multiple first heat conduction substrate 41 and horizontally extending
Many first heat radiation heat pipes 42.The front surface of each first heat conduction substrate 41 and a semiconductor refrigeration system
The hot junction thermally coupled of each semiconductor chilling plate 31 in 30, to absorb heat.Such as, each first heat conduction
The front surface of matrix 41 can be with the hot junction of each semiconductor chilling plate 31 in a semiconductor refrigeration system 30
Contact against.Further, each first heat conduction substrate 41 can be coated with the contact surface of semiconductor chilling plate 31
Smear heat-conducting silicone grease.Preferably, each first heat conduction substrate 41 can be the heat-conducting block being made up of aluminum.
Every first heat radiation heat pipe 42 both passes through multiple first heat conduction substrate 41, with by each first heat conduction base
The heat absorbed in body 41 passes out.In embodiments of the present invention, every first heat radiation heat pipe 42 can be to burn
Stagnation of pathogenic heat pipe, can be perfused with deionized water etc., its inwall can be attached with the metal powder of sintering in its internal cavities
End structure, to improve radiating efficiency.Every first heat radiation heat pipe 42 can be the long heat pipe of a diameter of 10mm；
And first heat radiation heat pipe 42 quantity can be 3 to 8, preferably 4,5.
In order to improve radiating efficiency further, be positioned at that each two is adjacent the of many first heat radiation heat pipes 42
The first radiating fin group 43 it is provided with on section between one heat conduction substrate 41.And/or, many first dissipate
It is provided with the second heat radiation in the end section of the both sides being positioned at multiple first heat conduction substrate 41 of heat pipe 42
Fins set 44.First radiating fin group 43 is respectively provided with multiple corresponding parallel with the second radiating fin group 44
Every the fin arranged.There is on each fin the poling hole for wearing the first heat radiation heat pipe 42, so that wing
Sheet is installed on every first heat radiation heat pipe 42.First radiating fin group 43 and the second radiating fin group 44 every
All offering the multiple through holes allowing air-flow to pass through on individual fin, such as manhole, to promote preferably sky
The logical heat radiation of air-flow.
In some embodiments of the invention, in each first radiating fin group 43 each two adjacent fins it
Between the spacing being smaller than in each second radiating fin group 44 between each two adjacent fins.Such as,
In each first radiating fin group 43, the spacing between each two adjacent fins is 1.5mm to 5mm；Each
Spacing 5mm to 20mm between each two adjacent fins in second radiating fin group 44.
In some embodiments of the invention, as in figure 2 it is shown, the first heat abstractor 40 also includes at least one
Individual first cooling fan 45, each first cooling fan 45 is configured in a first radiating fin group 43
Heat carry out forced convertion heat radiation.Each first cooling fan 45 can be axial flow blower, is arranged at one
In first radiating fin group 43.
In some embodiments of the invention, storage space 21 can be two, divides according to left and right in casing 20
The mode of cutting is set to dual temperature plot structure, and the space size of two storage spaces 21 in left and right may be the same or different.
Then semiconductor refrigeration system 30 is two, and the quantity of the first heat conduction substrate 41 of the first heat abstractor 40 is
Two.Owing to the quantity of the first heat conduction substrate 41 is two, and the first radiating fin group 43 and the first heat radiation
Blower fan 45 all can be one, and the second radiating fin group 44 is two, so that the first heat abstractor 40
One butterfly opening wing of outer image.First heat abstractor 40 mode of operation can be: works as semiconductor refrigerating
The storage space 21 of case 100 needs to accelerate refrigeration, i.e. semiconductor chilling plate 31 to be needed to accelerate heat radiation, with
When powerful heat spreader, each first cooling fan 45 can be opened, and carries out having of natural heat dissipation
Second radiating fin group 44 of big spacing of fin, carry out the first cooling fan 45 forced heat radiation there is winglet
First radiating fin group 43 of sheet spacing acts on jointly.When the storage space 21 of semiconductor refrigerating box 100 needs
Stably to freeze, when i.e. semiconductor chilling plate 31 needs stably to dispel the heat, each the first cooling fan can be closed
45, make the first radiating fin group 43 and the second radiating fin group 44 all carry out natural heat dissipation, and can reduce
The noise of semiconductor refrigerating box 100.
Fig. 4 is the schematic right-side view of semiconductor refrigerating box 100 according to an embodiment of the invention, Fig. 5
It it is the schematic rear view of semiconductor refrigerating box 100 according to an embodiment of the invention.The embodiment of the present invention
Semiconductor refrigerating box 100 may also include multiple second heat abstractor 50, each second heat abstractor 50 is joined
It is set to be dispersed into by the heat in semiconductor chilling plate 31 hot junction each in a semiconductor refrigeration system 30 around
Environment.Such as, in some embodiments, multiple second heat abstractors 50 can replace the first heat abstractor
40 heat radiations being used for multiple semiconductor refrigeration systems 30.In some alternate embodiment modes, Duo Ge
Two heat abstractors 50 also can be simultaneously used for dissipating of multiple semiconductor refrigeration system 30 with the first heat abstractor 40
Heat.
In some embodiments of the invention, as shown in Figure 4 and Figure 5, the semiconductor refrigerating box of this embodiment
In 100, each second heat abstractor 50 can include the second heat conduction substrate 51, many second heat radiation heat pipe 52,
3rd radiating fin group 53 and the second cooling fan 54.
Specifically, the second heat conduction substrate 51 of each second heat abstractor 50 and a semiconductor refrigeration system
The hot junction thermally coupled of each semiconductor chilling plate 31 in 30, to absorb heat.Such as, each second heat conduction
In the front surface of matrix 51 and a semiconductor refrigeration system 30, the hot junction of each semiconductor chilling plate 31 connects
Touch heat exchange.Preferably, each second heat conduction substrate 51 can be the heat-conducting block being made up of aluminum.
The lower end of every second heat radiation heat pipe 52 is resisted against or embeds in the second heat conduction substrate 51, with second
Heat conduction substrate 51 contact heat-exchanging.Every second heat radiation heat pipe 52 can be sintered heat pipe, can in its internal cavities
It is perfused with deionized water etc., its inwall can be attached with the metal dust structure of sintering, to improve radiating efficiency.
Further, the quantity of the second heat radiation heat pipe 52 can be 3 to 4, the length of every second heat radiation heat pipe 52
Spend in 35cm, a diameter of 10mm.
3rd radiating fin group 53 can have the fin that multiple corresponding parallel interval is arranged, and is arranged at many
On second heat radiation heat pipe 52.Second cooling fan 54 can be axial flow blower, is installed on the 3rd radiating fin group
On 53, it is configured to the heat to reaching the 3rd radiating fin group 53 from many second heat radiation heat pipes 52 and carries out by force
Heat loss through convection processed.
In some embodiments of the invention, semiconductor refrigerating box 100 also includes in order to before casing 20
Side seal closes the locking device of multiple storage space 21.Specifically, this locking device can be the first door body, its
It is rotatably installed on casing 20, in order to from the multiple storage space of front closure 21 of casing 20.Alternatively,
This locking device may also comprise multiple second door body, and each second door body is rotatably installed on casing 20, uses
With from this storage space 21 of the front closure of a storage space 21.Alternatively, this locking device is alternatively
Fold door body, be installed on casing 20.Fold door body can have multiple door body unit, each door body unit in order to
From this storage space 21 of the front closure of a storage space 21, and the door body unit pivot that each two is adjacent
Connect.
So far, although those skilled in the art will appreciate that and the most detailed illustrate and describing the present invention's
Multiple exemplary embodiments, but, without departing from the spirit and scope of the present invention, still can be according to this
Disclosure of invention directly determines or derives other variations or modifications of many meeting the principle of the invention.Cause
This, the scope of the present invention is it is understood that and regard as covering other variations or modifications all these.
Claims (10)
1. a semiconductor refrigerating box, including:
There is the casing of forward direction opening, in it, define multiple storage space in transverse direction；
It is juxtaposed on multiple semiconductor refrigeration systems at the rear portion of described casing in transverse direction, each described
Semiconductor refrigeration system includes the one or more semiconductor chilling plates of himself, and by this semiconductor refrigerating
In system, the cold of the cold end of each semiconductor chilling plate is fed to the biography device for cooling of the corresponding storage space in its front.
Semiconductor refrigerating box the most according to claim 1, farther includes:
First heat abstractor, is configured to each semiconductor chilling plate heat in each described semiconductor refrigeration system
The heat of end is dispersed into surrounding；And/or
Multiple second heat abstractors, each described second heat abstractor is configured to a described semiconductor refrigerating
In system, the heat in each semiconductor chilling plate hot junction is dispersed into surrounding.
Semiconductor refrigerating box the most according to claim 2, wherein, described first heat abstractor includes:
Multiple first heat conduction substrates, the front surface of each described first heat conduction substrate and a described quasiconductor system
The hot junction thermally coupled of each semiconductor chilling plate in cooling system, to absorb heat；
Many first horizontally extending heat radiation heat pipes, every described first heat radiation heat pipe both passes through described
Multiple first heat conduction substrates, to pass out the heat absorbed in each described first heat conduction substrate.
Semiconductor refrigerating box the most according to claim 3, wherein
District between described first heat conduction substrate adjacent in each two of described many first heat radiation heat pipes
The first radiating fin group it is provided with on Duan；And/or
The end section of the both sides being positioned at the plurality of first heat conduction substrate of described many first heat radiation heat pipes
On be provided with the second radiating fin group.
Semiconductor refrigerating box the most according to claim 4, wherein, described first heat abstractor also includes:
At least one first cooling fan, each described first cooling fan is configured to dissipate one described first
Heat in hot fins set carries out forced convertion heat radiation.
Semiconductor refrigerating box the most according to claim 4, wherein
Described first radiating fin group and described second radiating fin group are respectively provided with multiple corresponding parallel interval
The fin arranged；And
Each described first radiating fin group is smaller than each described between each two adjacent fins
Spacing between each two adjacent fins in two radiating fin groups.
Semiconductor refrigerating box the most according to claim 2, wherein, each described second heat abstractor bag
Include:
Second heat conduction substrate, the front surface of the second heat conduction substrate of each described second heat abstractor and an institute
The hot junction thermally coupled of each semiconductor chilling plate in stating semiconductor refrigeration system, to absorb heat；
Many second heat radiation heat pipes, the lower end of every described second heat radiation heat pipe is resisted against or embeds described second
In heat conduction substrate, with described second heat conduction substrate contact heat-exchanging；
3rd radiating fin group, has the fin that multiple corresponding parallel interval is arranged, is arranged at described many
On second heat radiation heat pipe；With
Second cooling fan, is configured to reach described 3rd radiating fin to from described many second heat radiation heat pipes
The heat of group carries out forced convertion heat radiation.
Semiconductor refrigerating box the most according to claim 1, wherein, each described biography device for cooling is arranged at
In one storage space, comprising:
Conduction cooling matrix, the rear surface of the conduction cooling matrix of each described biography device for cooling and a described semiconductor refrigerating
The cold end thermally coupled of each semiconductor chilling plate in system, to absorb cold；
Many pass hot and cold tube, and the top section of every described biography hot and cold tube is resisted against or embeds described conduction cooling matrix
In, with by described conduction cooling matrix absorb cold pass out, and be delivered to every described biography hot and cold tube with
Its top section is at a distance of the compresses lower section of a distance；And
Top passes cold fins set and bottom passes cold fins set, respectively with the top section of biography hot and cold tube every described
With compresses lower section thermally coupled directly or indirectly.
Semiconductor refrigerating box the most according to claim 8, wherein, each described biography device for cooling also includes:
Two pass air-cooler, are respectively configured paired described top and pass cold fins set and the described bottom cold fins set of biography
On cold carry out forced convertion cold scattering.
Semiconductor refrigerating box the most according to claim 1, farther includes:
First door body, is rotatably installed on described casing, in order to many described in the front closure from described casing
Individual storage space；Or
Multiple second door body, each described second door body is rotatably installed on described casing, in order to from one
This storage space of the front closure of described storage space；Or
Folding door body, be installed on described casing, it has multiple door body unit, and each described door body unit is used
With from this storage space of front closure of a described storage space, and the described door body unit that each two is adjacent
It is pivotally connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510288157.3A CN106288584A (en) | 2015-05-29 | 2015-05-29 | Semiconductor refrigerating box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510288157.3A CN106288584A (en) | 2015-05-29 | 2015-05-29 | Semiconductor refrigerating box |
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|---|---|
| CN106288584A true CN106288584A (en) | 2017-01-04 |
Family
ID=57655656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510288157.3A Pending CN106288584A (en) | 2015-05-29 | 2015-05-29 | Semiconductor refrigerating box |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110953787A (en) * | 2019-12-16 | 2020-04-03 | 周志坚 | Hotel refrigerator of low noise operation |
| CN115164494A (en) * | 2022-07-15 | 2022-10-11 | 青岛海容商用冷链股份有限公司 | Semiconductor refrigeration freezer and control method thereof |
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| CN115164494B (en) * | 2022-07-15 | 2024-06-07 | 青岛海容商用冷链股份有限公司 | Semiconductor refrigeration freezer and control method thereof |
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