CN106288583A - Pass device for cooling and there is the semiconductor refrigerating box of this biography device for cooling - Google Patents
Pass device for cooling and there is the semiconductor refrigerating box of this biography device for cooling Download PDFInfo
- Publication number
- CN106288583A CN106288583A CN201510288107.5A CN201510288107A CN106288583A CN 106288583 A CN106288583 A CN 106288583A CN 201510288107 A CN201510288107 A CN 201510288107A CN 106288583 A CN106288583 A CN 106288583A
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- Prior art keywords
- cooling
- heat pipe
- biography device
- cold
- heat
- Prior art date
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 94
- 238000001816 cooling Methods 0.000 title claims abstract description 76
- 238000005057 refrigeration Methods 0.000 claims description 33
- 239000011159 matrix material Substances 0.000 claims description 15
- 230000005855 radiation Effects 0.000 description 23
- 239000000758 substrate Substances 0.000 description 14
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229960004424 carbon dioxide Drugs 0.000 description 1
- 229910002090 carbon oxide Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001717 pathogenic effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
Abstract
The present invention relates to pass device for cooling and there is the semiconductor refrigerating box of this biography device for cooling.The invention provides a kind of biography device for cooling, comprising: one or more heat pipe, every heat pipe has top section and the compresses lower section with a top section distance apart, the top section of every heat pipe be configured to directly or indirectly with a low-temperature receiver thermally coupled, to absorb the cold of low-temperature receiver and to pass out, and it is delivered to the compresses lower section of every heat pipe；With upper fins group, itself and the top section thermally coupled directly or indirectly of every heat pipe.Additionally, present invention also offers a kind of semiconductor refrigerating box with this biography device for cooling.The present invention passes device for cooling and semiconductor refrigerating box owing to having the hot linked upper fins group with the top section of every heat pipe, the cold that can make low-temperature receiver transmits in the top and bottom of every heat pipe in storage space simultaneously, so that the uniformity of temperature profile in storage space.
Description
Technical field
The present invention relates to refrigerator art, particularly relate to a kind of pass device for cooling and there is this biography device for cooling
Semiconductor refrigerating box.
Background technology
Semiconductor freezer, also referred to as thermoelectric refrigerator.It utilizes semiconductor chilling plate to pass through heat pipe heat radiation
And conduction technique and automatic pressure-transforming Variable flow control technology realize refrigeration, it is not necessary to refrigeration working medium and mechanical movement portion
Part, solves the application problem of the traditional mechanical refrigerator such as medium pollution and mechanical vibration.But, existing
Semiconductor freezer due to by factors such as cold and hot end heat exchange, noise, costs, general use low capacity Dan Wen
District, the special small-sized refrigerating case such as the most vehicle-mounted in application, medical.And, existing semiconductor refrigerating
In refrigerator, pass device for cooling and only the cold of semiconductor chilling plate is delivered between storing indoor.Inventor finds,
Temperature Distribution indoor between the storing of semiconductor freezer is the most uniform.
Summary of the invention
One purpose of first aspect present invention is intended to overcome at least one defect of existing semiconductor freezer,
There is provided a kind of biography device for cooling for semiconductor refrigerating box, in it can make the storage space of semiconductor refrigerating box
Uniformity of temperature profile.
One purpose of second aspect present invention is to provide for a kind of quasiconductor system with above-mentioned biography device for cooling
Ice chest.
According to the first aspect of the invention, the invention provides a kind of biography cold charge for semiconductor refrigerating box
Putting, this biography device for cooling includes:
One or more heat pipe, every described heat pipe have top section and with described top section at a distance of one away from
From compresses lower section, the top section of every described heat pipe is configured to directly or indirectly with a low-temperature receiver heat even
Connect, to absorb the cold of described low-temperature receiver and to pass out, and be delivered to the compresses lower section of every described heat pipe；With
Upper fins group, itself and the top section thermally coupled directly or indirectly of every described heat pipe.
Alternatively, every described heat pipe is sintered heat pipe.
Alternatively, described biography device for cooling farther includes: conduction cooling matrix, and it is for thermally contacting with described low-temperature receiver；
And the top section of every described heat pipe is resisted against or embeds in described conduction cooling matrix.
Alternatively, it is arranged at described conduction cooling to the corresponding parallel interval of multiple fins in described upper fins group
One vertical side of matrix.
Alternatively, described biography device for cooling farther includes: top blower fan, is configured to described upper fins group
On cold carry out forced convertion cold scattering.
Alternatively, described biography device for cooling farther includes: lower fins group, under it is with every described heat pipe
The thermally coupled directly or indirectly of portion's section.
Alternatively, it is installed on described one to the corresponding parallel interval of multiple fins in described lower fins group
Or the compresses lower section of many heat pipes.
Alternatively, described biography device for cooling farther includes: bottom blower fan, is configured to described lower fins group
On cold carry out forced convertion cold scattering.
Alternatively, the quantity of described heat pipe is many, and many described heat pipes vertically extend in parallel.
According to the second aspect of the invention, the invention provides a kind of semiconductor refrigerating box, comprising:
Casing, defines one or more storage space in it；With
One or more semiconductor refrigeration systems, each described semiconductor refrigeration system includes himself one
Or multiple semiconductor chilling plate, and by the cold end of each semiconductor chilling plate cold in this semiconductor refrigeration system
Amount is fed to the biography device for cooling of a storage space；And
The biography cold charge of each described semiconductor refrigeration system is set to any of the above-described kind and passes device for cooling.
The present invention passes device for cooling and semiconductor refrigerating box owing to having the top section heat with every heat pipe even
The upper fins group connect, can make the cold of low-temperature receiver in the top and bottom of every heat pipe simultaneously in storage space
Transmission, so that the uniformity of temperature profile in storage space.
Further, due to the present invention pass device for cooling and semiconductor refrigerating box also have with under every heat pipe
Portion's section hot linked lower fins group, makes the uniformity of temperature profile in storage space further.
Further, due to the semiconductor refrigerating box of the present invention, there is multiple storage space and multiple quasiconductor system
Cooling system, significantly improves the storing capacity of semiconductor refrigerating box, and in each storage space can be made
Temperature is equal or different, so that having multiple warm area in semiconductor refrigerating box.
According to below in conjunction with the accompanying drawing detailed description to the specific embodiment of the invention, those skilled in the art will
More understand the above-mentioned of the present invention and other purposes, advantage and feature.
Accompanying drawing explanation
Some describing the present invention the most by way of example, and not by way of limitation in detail are concrete
Embodiment.Reference identical in accompanying drawing denotes same or similar parts or part.Art technology
Personnel are it should be understood that what these accompanying drawings were not necessarily drawn to scale.In accompanying drawing:
Fig. 1 is the schematic elevational view passing device for cooling according to an embodiment of the invention；
Fig. 2 is the schematic right-side view passing device for cooling according to an embodiment of the invention；
Fig. 3 is the schematic elevational view of semiconductor refrigerating box according to an embodiment of the invention；
Fig. 4 is the schematic right-side view of semiconductor refrigerating box according to an embodiment of the invention；
Fig. 5 is the schematic rear view of semiconductor refrigerating box according to an embodiment of the invention；
Fig. 6 is the schematic right-side view of semiconductor refrigerating box according to an embodiment of the invention；
Fig. 7 is the schematic rear view of semiconductor refrigerating box according to an embodiment of the invention.
Detailed description of the invention
Fig. 1 is the schematic elevational view passing device for cooling 32 according to an embodiment of the invention.Such as Fig. 1 institute
Show, the embodiment of the present invention provide the biography device for cooling 32 for semiconductor refrigerating box 100 can include one or
Many heat pipes 322, for transmitting the cold of low-temperature receiver.Specifically, every heat pipe 322 can have top section
And with top section at a distance of the compresses lower section of a distance.The top section of every heat pipe 322 be configured to directly or
Indirectly with a low-temperature receiver thermally coupled, to absorb the cold of low-temperature receiver and to pass out, and it is delivered to every heat pipe 322
Compresses lower section.Especially, the biography device for cooling 32 of the embodiment of the present invention may also include upper fins group 323,
Its top section thermally coupled directly or indirectly with every heat pipe 322, with to semiconductor refrigerating box 100
Transmission cold in storage space 21.
In embodiments of the present invention, when low-temperature receiver provides cold, the upper fins group 323 of this biography device for cooling 32
All can pass in semiconductor refrigerating box 100 a storage space 21 with the compresses lower section of every heat pipe 322
Pass cold.Due to the multidirectional of heat pipe 322 heat transfer, when low-temperature receiver stops providing cold, pass device for cooling 32
Being possible with every heat pipe 322 makes indoor temperature distribution between each storing of semiconductor refrigerating box 100 uniform,
Preventing cold air to be completely in the bottom of this storage space 21, hot-air is completely in this storage space 21
Top, causes upper and lower temperature difference indoor between this storing bigger.
In embodiments of the present invention, every heat pipe 322 can be sintered heat pipe, is perfused with two in its internal cavities
The cold-producing medium such as carbonoxide, superconductive medium, its inwall can be attached with the metal dust structure of sintering, to improve
Pass cold efficiency.The quantity of heat pipe 322 is many, and many heat pipes 322 vertically extend in parallel.Such as,
Heat pipe 322 can be 3, and the length of every heat pipe 322 can be 60cm, a diameter of 8mm.
In some embodiments of the invention, pass device for cooling 32 and can farther include lower fins group 324, its
With the compresses lower section thermally coupled directly or indirectly of every heat pipe 322, pass cold efficiency with further raising.
Fig. 2 is the schematic right-side view passing device for cooling 32 according to an embodiment of the invention.Such as Fig. 2 institute
Show, for the ease of with low-temperature receiver thermally coupled, in some embodiments of the invention, pass device for cooling 32 can enter one
Step includes conduction cooling matrix 321, and it is for thermally contacting with low-temperature receiver.The top section of every heat pipe 322 is resisted against
Or embed in conduction cooling matrix 321.Such as, the top section of every heat pipe 322 embeds this conduction cooling matrix 321
In.Low-temperature receiver can be one or more semiconductor chilling plate 31, a vertical side of this conduction cooling matrix 321 with
The cold end in contact heat exchange of one or more semiconductor chilling plates 31.Further, conduction cooling matrix 321 and half
The contact surface of conductor cooling piece 31 can smear heat-conducting silicone grease.Preferably, conduction cooling matrix 321 can be by aluminium
The heat-conducting block that material is made.
In some embodiments of the embodiment of the present invention, many in the upper fins group 323 of this biography device for cooling 32
The corresponding parallel interval of individual fin it is arranged at a vertical side of conduction cooling matrix 321.And, conduction cooling base
Another vertical side relative with this vertical side of body 321 can be used for and low-temperature receiver contact heat-exchanging.Lower fins
The corresponding parallel interval of multiple fins in group 324 it is installed on the lower region of one or more heat pipe 322
Section, so that each fin in lower fins group 324 and every heat pipe 322 contact heat-exchanging.
In order to improve cold scattering efficiency, the biography device for cooling 32 in the embodiment of the present invention also includes two blower fans, point
Wei top blower fan 325 and bottom blower fan 326.Top blower fan 325 can be configured to upper fins group 323
On cold carry out forced convertion cold scattering.It is cold that bottom blower fan 326 can be configured in lower fins group 324
Amount carries out forced convertion cold scattering.In this embodiment, top blower fan 325 and bottom blower fan 326 can be all axle
Flow fan, is respectively arranged in upper fins group 323 and lower fins group 324.
Fig. 3 is the schematic elevational view of semiconductor refrigerating box 100 according to an embodiment of the invention.Such as figure
Shown in 3, the embodiment of the present invention additionally provides a kind of semiconductor refrigerating box 100, this semiconductor refrigerating box 100
Generality can include casing 20 and semiconductor refrigeration system 30.One or more storage is defined in this casing 20
Object space 21.The quantity of semiconductor refrigeration system 30 can be one or more, each semiconductor refrigeration system
The 30 one or more semiconductor chilling plates 31 including himself, and by this semiconductor refrigeration system 30
The cold of each cold end of semiconductor chilling plate 31 is fed to the biography device for cooling of a storage space 21.Especially,
The biography device for cooling 32 that the biography cold charge of each semiconductor refrigeration system 30 is set in any of the above-described embodiment.
In some embodiments of the invention, storage space 21 can be multiple, semiconductor refrigeration system 30
Quantity is also multiple.In embodiments of the present invention, each semiconductor refrigeration system 30 can independent cooling, with
Corresponding storage space 21 is made to be in a preset range temperature range, so that in multiple storage space 21
Temperature equal or different, say, that multiple semiconductor refrigeration systems 30 can make this semiconductor refrigerating box
Multiple warm areas are formed, to preserve the article etc. corresponding with each warm area in 100.
In some embodiments of the invention, multiple storage spaces 21 are set up in parallel in transverse direction.Multiple
Semiconductor refrigeration system 30 can be juxtaposed on the rear portion of casing 20 in transverse direction, so that each quasiconductor
The biography device for cooling 32 of refrigeration system 30 is by cold for each semiconductor chilling plate 31 in this semiconductor refrigeration system 30
The cold of end is fed to the storage space 21 in this semiconductor refrigeration system 30 front.
Fig. 4 is the schematic right-side view of semiconductor refrigerating box 100 according to an embodiment of the invention.Such as figure
Shown in 4, the rear wall of each storage space 21 can offer installing hole, to install a corresponding quasiconductor
One or more semiconductor chilling plates 31 of refrigeration system 30.The most each biography device for cooling 32 is arranged at a storage
In object space 21.In some further embodiments, a wind can be set in each storage space 21
Road cover plate, so that the rear wall of air duct cover board and this storage space 21 forms an air channel, passing device for cooling 32 can pacify
It is loaded in this air channel.
Fig. 5 is the schematic rear view of semiconductor refrigerating box 100 according to an embodiment of the invention.This
The semiconductor refrigerating box 100 of bright embodiment can farther include the first heat abstractor 40, is configured to each half
In conductor refrigeration system 30, the heat in each semiconductor chilling plate 31 hot junction is dispersed into surrounding.
Specifically, the first heat abstractor 40 includes multiple first heat conduction substrate 41 and horizontally extending
Many first heat radiation heat pipes 42.The front surface of each first heat conduction substrate 41 and a semiconductor refrigeration system
The hot junction thermally coupled of each semiconductor chilling plate 31 in 30, to absorb heat.Such as, each first heat conduction
The front surface of matrix 41 can be with the hot junction of each semiconductor chilling plate 31 in a semiconductor refrigeration system 30
Contact against.Further, each first heat conduction substrate 41 can be coated with the contact surface of semiconductor chilling plate 31
Smear heat-conducting silicone grease.Preferably, each first heat conduction substrate 41 can be the heat-conducting block being made up of aluminum.
Every first heat radiation heat pipe 42 both passes through multiple first heat conduction substrate 41, with by each first heat conduction base
The heat absorbed in body 41 passes out.In embodiments of the present invention, every first heat radiation heat pipe 42 can be to burn
Stagnation of pathogenic heat pipe, can be perfused with deionized water etc., its inwall can be attached with the metal powder of sintering in its internal cavities
End structure, to improve radiating efficiency.Every first heat radiation heat pipe 42 can be the long heat pipe of a diameter of 10mm；
And first heat radiation heat pipe 42 quantity can be 3 to 8, preferably 4,5.
In order to improve radiating efficiency further, be positioned at that each two is adjacent the of many first heat radiation heat pipes 42
The first radiating fin group 43 it is provided with on section between one heat conduction substrate 41.And/or, many first dissipate
It is provided with the second heat radiation in the end section of the both sides being positioned at multiple first heat conduction substrate 41 of heat pipe 42
Fins set 44.First radiating fin group 43 is respectively provided with multiple corresponding parallel with the second radiating fin group 44
Every the fin arranged.There is on each fin the poling hole for wearing the first heat radiation heat pipe 42, so that wing
Sheet is installed on every first heat radiation heat pipe 42.First radiating fin group 43 and the second radiating fin group 44 every
All offering the multiple through holes allowing air-flow to pass through on individual fin, such as manhole, to promote preferably sky
The logical heat radiation of air-flow.
In some embodiments of the invention, in each first radiating fin group 43 each two adjacent fins it
Between the spacing being smaller than in each second radiating fin group 44 between each two adjacent fins.Such as,
In each first radiating fin group 43, the spacing between each two adjacent fins is 1.5mm to 5mm；Each
Spacing 5mm to 20mm between each two adjacent fins in second radiating fin group 44.
In some embodiments of the invention, the first heat abstractor 40 may also include at least one first heat radiation
Blower fan 45, each first cooling fan 45 is configured to carry out the heat in a first radiating fin group 43
Forced convertion is dispelled the heat.Each first cooling fan 45 can be axial flow blower, is arranged at first radiating fin
In sheet group 43.
In some embodiments of the invention, storage space 21 can be two, divides according to left and right in casing 20
The mode of cutting is set to dual temperature plot structure, and the space size of two storage spaces 21 in left and right may be the same or different.
Then semiconductor refrigeration system 30 is two, and the quantity of the first heat conduction substrate 41 of the first heat abstractor 40 is
Two.Owing to the quantity of the first heat conduction substrate 41 is two, and the first radiating fin group 43 and the first heat radiation
Blower fan 45 all can be one, and the second radiating fin group 44 is two, so that the first heat abstractor 40
One butterfly opening wing of outer image.First heat abstractor 40 mode of operation can be: works as semiconductor refrigerating
The storage space 21 of case 100 needs to accelerate refrigeration, i.e. semiconductor chilling plate 31 to be needed to accelerate heat radiation, with
When powerful heat spreader, each first cooling fan 45 can be opened, and carries out having of natural heat dissipation
Second radiating fin group 44 of big spacing of fin, carry out the first cooling fan 45 forced heat radiation there is winglet
First radiating fin group 43 of sheet spacing acts on jointly.When the storage space 21 of semiconductor refrigerating box 100 needs
Stably to freeze, when i.e. semiconductor chilling plate 31 needs stably to dispel the heat, each the first cooling fan can be closed
45, make the first radiating fin group 43 and the second radiating fin group 44 all carry out natural heat dissipation, and can reduce
The noise of semiconductor refrigerating box 100.
Fig. 6 is the schematic right-side view of semiconductor refrigerating box 100 according to an embodiment of the invention, Fig. 7
It it is the schematic rear view of semiconductor refrigerating box 100 according to an embodiment of the invention.The embodiment of the present invention
Semiconductor refrigerating box 100 may also include multiple second heat abstractor 50, each second heat abstractor 50 is joined
It is set to be dispersed into by the heat in semiconductor chilling plate 31 hot junction each in a semiconductor refrigeration system 30 around
Environment.Such as, in some embodiments, multiple second heat abstractors 50 can replace the first heat abstractor
40 heat radiations being used for multiple semiconductor refrigeration systems 30.In some alternate embodiment modes, Duo Ge
Two heat abstractors 50 also can be simultaneously used for dissipating of multiple semiconductor refrigeration system 30 with the first heat abstractor 40
Heat.
In some embodiments of the invention, as shown in Figure 6 and Figure 7, the semiconductor refrigerating box of this embodiment
In 100, each second heat abstractor 50 can include the second heat conduction substrate 51, many second heat radiation heat pipe 52,
3rd radiating fin group 53 and the second cooling fan 54.
Specifically, the second heat conduction substrate 51 of each second heat abstractor 50 and a semiconductor refrigeration system
The hot junction thermally coupled of each semiconductor chilling plate 31 in 30, to absorb heat.Such as, each second heat conduction
In the front surface of matrix 51 and a semiconductor refrigeration system 30, the hot junction of each semiconductor chilling plate 31 connects
Touch heat exchange.Preferably, each second heat conduction substrate 51 can be the heat-conducting block being made up of aluminum.
The lower end of every second heat radiation heat pipe 52 is resisted against or embeds in the second heat conduction substrate 51, with second
Heat conduction substrate 51 contact heat-exchanging.Every second heat radiation heat pipe 52 can be sintered heat pipe, can in its internal cavities
It is perfused with deionized water etc., its inwall can be attached with the metal dust structure of sintering, to improve radiating efficiency.
Further, the quantity of the second heat radiation heat pipe 52 can be 3 to 4, the length of every second heat radiation heat pipe 52
Spend in 35cm, a diameter of 10mm.
3rd radiating fin group 53 can have the fin that multiple corresponding parallel interval is arranged, and is arranged at many
On second heat radiation heat pipe 52.Second cooling fan 54 can be axial flow blower, is installed on the 3rd radiating fin group
On 53, it is configured to the heat to reaching the 3rd radiating fin group 53 from many second heat radiation heat pipes 52 and carries out by force
Heat loss through convection processed.
In some embodiments of the invention, semiconductor refrigerating box 100 also includes in order to before casing 20
Side seal closes the locking device of multiple storage space 21.Specifically, this locking device can be the first door body, its
It is rotatably installed on casing 20, in order to from the multiple storage space of front closure 21 of casing 20.Alternatively,
This locking device may also comprise multiple second door body, and each second door body is rotatably installed on casing 20, uses
With from this storage space 21 of the front closure of a storage space 21.Alternatively, this locking device is alternatively
Fold door body, be installed on casing 20.Fold door body can have multiple door body unit, each door body unit in order to
From this storage space 21 of the front closure of a storage space 21, and the door body unit pivot that each two is adjacent
Connect.
So far, although those skilled in the art will appreciate that and the most detailed illustrate and describing the present invention's
Multiple exemplary embodiments, but, without departing from the spirit and scope of the present invention, still can be according to this
Disclosure of invention directly determines or derives other variations or modifications of many meeting the principle of the invention.Cause
This, the scope of the present invention is it is understood that and regard as covering other variations or modifications all these.
Claims (10)
1. for a biography device for cooling for semiconductor refrigerating box, including:
One or more heat pipe, every described heat pipe have top section and with described top section at a distance of one away from
From compresses lower section, the top section of every described heat pipe is configured to directly or indirectly with a low-temperature receiver heat even
Connect, to absorb the cold of described low-temperature receiver and to pass out, and be delivered to the compresses lower section of every described heat pipe；With
Upper fins group, itself and the top section thermally coupled directly or indirectly of every described heat pipe.
Biography device for cooling the most according to claim 1, wherein
Every described heat pipe is sintered heat pipe.
Biography device for cooling the most according to claim 1, farther includes:
Conduction cooling matrix, it is for thermally contacting with described low-temperature receiver；And
The top section of every described heat pipe is resisted against or embeds in described conduction cooling matrix.
Biography device for cooling the most according to claim 3, wherein
It is arranged at described conduction cooling matrix to the corresponding parallel interval of multiple fins in described upper fins group
One vertical side.
Biography device for cooling the most according to claim 1, farther includes:
Top blower fan, is configured to the cold in described upper fins group is carried out forced convertion cold scattering.
Biography device for cooling the most according to claim 1, farther includes:
Lower fins group, itself and the compresses lower section thermally coupled directly or indirectly of every described heat pipe.
Biography device for cooling the most according to claim 6, wherein
Be installed on to the corresponding parallel interval of multiple fins in described lower fins group described one or more
The compresses lower section of heat pipe.
Biography device for cooling the most according to claim 6, farther includes:
Bottom blower fan, is configured to the cold in described lower fins group is carried out forced convertion cold scattering.
Biography device for cooling the most according to claim 1, wherein
The quantity of described heat pipe is many, and many described heat pipes vertically extend in parallel.
10. a semiconductor refrigerating box, including:
Casing, defines one or more storage space in it；With
One or more semiconductor refrigeration systems, each described semiconductor refrigeration system includes himself one
Or multiple semiconductor chilling plate, and by the cold end of each semiconductor chilling plate cold in this semiconductor refrigeration system
Amount is fed to the biography device for cooling of a storage space；And
The biography device for cooling of each described semiconductor refrigeration system is for according to according to any one of claim 1 to 9
Biography device for cooling.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510288107.5A CN106288583A (en) | 2015-05-29 | 2015-05-29 | Pass device for cooling and there is the semiconductor refrigerating box of this biography device for cooling |
| PCT/CN2015/093661 WO2016192298A1 (en) | 2015-05-29 | 2015-11-03 | Cold transfer device and semiconductor refrigeration box having cold transfer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510288107.5A CN106288583A (en) | 2015-05-29 | 2015-05-29 | Pass device for cooling and there is the semiconductor refrigerating box of this biography device for cooling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106288583A true CN106288583A (en) | 2017-01-04 |
Family
ID=57442216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510288107.5A Pending CN106288583A (en) | 2015-05-29 | 2015-05-29 | Pass device for cooling and there is the semiconductor refrigerating box of this biography device for cooling |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106288583A (en) |
| WO (1) | WO2016192298A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108168142A (en) * | 2018-03-06 | 2018-06-15 | 北京中热能源科技有限公司 | A kind of heat pipe-type semiconductor heat-exchange system |
| CN108168143A (en) * | 2018-03-06 | 2018-06-15 | 北京中热能源科技有限公司 | A kind of semiconductor heat exchanger |
| CN110966817A (en) * | 2018-09-28 | 2020-04-07 | 青岛海尔生物医疗股份有限公司 | Refrigerating box |
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|---|---|---|---|---|
| CN1495400A (en) * | 2002-08-23 | 2004-05-12 | 三星电子株式会社 | Combined refrigerator |
| CN201662759U (en) * | 2010-02-02 | 2010-12-01 | 鈤新科技股份有限公司 | Heat dissipation device capable of providing cold air |
| CN203588992U (en) * | 2013-08-30 | 2014-05-07 | 广东新创意科技有限公司 | Hot end and cold end integrated heat dissipation structure for TEC chip |
| CN104329867A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Cold transferring and heat dissipating modular component, assembling method and semiconductor refrigerator |
| CN204286181U (en) * | 2014-12-01 | 2015-04-22 | 青岛海尔特种电冰柜有限公司 | Heat abstractor and semiconductor refrigerating equipment |
| CN204693920U (en) * | 2015-05-29 | 2015-10-07 | 青岛海尔智能技术研发有限公司 | Pass device for cooling and there is the semiconductor refrigerating box of this biography device for cooling |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108168142A (en) * | 2018-03-06 | 2018-06-15 | 北京中热能源科技有限公司 | A kind of heat pipe-type semiconductor heat-exchange system |
| CN108168143A (en) * | 2018-03-06 | 2018-06-15 | 北京中热能源科技有限公司 | A kind of semiconductor heat exchanger |
| CN110966817A (en) * | 2018-09-28 | 2020-04-07 | 青岛海尔生物医疗股份有限公司 | Refrigerating box |
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