CN106288585A - semiconductor refrigerating box - Google Patents
semiconductor refrigerating box Download PDFInfo
- Publication number
- CN106288585A CN106288585A CN201510290554.4A CN201510290554A CN106288585A CN 106288585 A CN106288585 A CN 106288585A CN 201510290554 A CN201510290554 A CN 201510290554A CN 106288585 A CN106288585 A CN 106288585A
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- CN
- China
- Prior art keywords
- cold
- semiconductor
- cooling
- heat
- refrigerating box
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 111
- 238000001816 cooling Methods 0.000 claims abstract description 69
- 238000005057 refrigeration Methods 0.000 claims abstract description 43
- 239000011159 matrix material Substances 0.000 claims description 19
- 230000005855 radiation Effects 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 14
- 238000005516 engineering process Methods 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention provides a kind of semiconductor refrigerating box.This semiconductor refrigerating box includes: have the casing of forward direction opening, defines multiple storage space in it in transverse direction；With multiple semiconductor refrigeration systems, each semiconductor refrigeration system includes the one or more semiconductor chilling plates of himself, the cold of the cold end of each semiconductor chilling plate in this semiconductor refrigeration system is fed to the biography device for cooling of a storage space, and the heat in semiconductor chilling plate hot junction each in this semiconductor refrigeration system is dispersed into the semiconductor refrigerating box of the heat abstractor present invention of surrounding owing to having the multiple storage spaces and multiple semiconductor refrigeration system being laterally set up in parallel, significantly improve the storing capacity of semiconductor refrigerating box；And the temperature in each storage space can be made equal or different, so that having multiple warm area in semiconductor refrigerating box, and then can be the application of semiconductor refrigerating box to Large Copacity many warm areas field.
Description
Technical field
The present invention relates to refrigerator art, particularly relate to a kind of semiconductor refrigerating box.
Background technology
Semiconductor freezer, also referred to as thermoelectric refrigerator.It utilizes semiconductor chilling plate to pass through heat pipe heat radiation
And conduction technique and automatic pressure-transforming Variable flow control technology realize refrigeration, it is not necessary to refrigeration working medium and mechanical movement portion
Part, solves the application problem of the traditional mechanical refrigerator such as medium pollution and mechanical vibration.But, existing
Semiconductor freezer due to by factors such as cold and hot end heat exchange, noise, costs, general use low capacity Dan Wen
District, the special small-sized refrigerating case such as the most vehicle-mounted in application, medical.
Additionally, in existing semiconductor freezer, pass device for cooling and only the cold of semiconductor chilling plate passed
It is delivered between storing indoor.Inventor finds, Temperature Distribution indoor between the storing of semiconductor freezer is inadequate
Uniformly.
Summary of the invention
One object of the present invention is intended to overcome at least one defect of existing semiconductor freezer, it is provided that a kind of
Semiconductor refrigerating box, it can form multiple warm area, and have bigger storing capacity.
A further object of the invention is intended to make the uniformity of temperature profile in each storage space.
To this end, the invention provides a kind of semiconductor refrigerating box, this semiconductor refrigerating box includes:
There is the casing of forward direction opening, in it, define multiple storage space in transverse direction；With
Multiple semiconductor refrigeration systems, each described semiconductor refrigeration system includes the one or more of himself
Semiconductor chilling plate, is fed to one by the cold of the cold end of each semiconductor chilling plate in this semiconductor refrigeration system
The biography device for cooling of individual storage space, and by semiconductor chilling plate hot junction each in this semiconductor refrigeration system
Heat is dispersed into the heat abstractor of surrounding.
Alternatively, after the plurality of semiconductor refrigeration system is juxtaposed on described casing in transverse direction
Portion, and the biography device for cooling of each described semiconductor refrigeration system is by each quasiconductor in this semiconductor refrigeration system
The cold of the cold end of cooling piece is fed to the storage space in this semiconductor refrigeration system front.
Alternatively, each described biography device for cooling is arranged in a storage space.
Alternatively, each described biography device for cooling includes:
Conduction cooling matrix, every in the conduction cooling matrix of each described biography device for cooling and a described semiconductor refrigeration system
The cold end thermally coupled of individual semiconductor chilling plate, to absorb cold；
Many pass hot and cold tube, and the top section of every described biography hot and cold tube is resisted against or embeds described conduction cooling matrix
In, with by described conduction cooling matrix absorb cold pass out, and be delivered to every described biography hot and cold tube with
Its top section is at a distance of the compresses lower section of a distance.
Alternatively, each described biography device for cooling also includes: top passes cold fins set, and it is cold with biography every described
The thermally coupled directly or indirectly of the top section of heat pipe.
Alternatively, each described biography device for cooling also includes: top passes air-cooler, is configured to pass described top
Cold in cold fins set carries out forced convertion cold scattering.
Alternatively, the rear surface of the conduction cooling matrix of each described biography device for cooling and a described semiconductor refrigerating system
System in each semiconductor chilling plate cold end in contact against；And
The top of each described biography device for cooling sets with passing the corresponding parallel interval of multiple fins in cold fins set
It is placed in the front surface of the conduction cooling matrix of this biography device for cooling.
Alternatively, each described biography device for cooling also includes: bottom passes cold fins set, is arranged at described many biographies
The compresses lower section of hot and cold tube.
Alternatively, each described biography device for cooling also includes: bottom passes air-cooler, is configured to pass described bottom
Cold in cold fins set carries out forced convertion cold scattering.
Alternatively, each described heat abstractor includes:
Heat conduction substrate, every in the heat conduction substrate of each described heat abstractor and a described semiconductor refrigeration system
The hot junction thermally coupled of individual semiconductor chilling plate, to absorb heat；
Many heat radiation heat pipes, the lower end of every described heat radiation heat pipe is resisted against or embeds in described heat conduction substrate,
With with described heat conduction substrate contact heat-exchanging；
Radiating fin group, has the fin that multiple corresponding parallel interval is arranged, is arranged at described many heat radiations
On heat pipe；With
Cooling fan, is configured to the heat to reaching described radiating fin group from described many heat radiation heat pipes and carries out
Forced convertion is dispelled the heat.
The semiconductor refrigerating box of the present invention is owing to having the multiple storage spaces being laterally set up in parallel and multiple half
Conductor refrigeration system, significantly improves the storing capacity of semiconductor refrigerating box；And each storing can be made empty
Interior temperature is equal or different, so that having multiple warm area in semiconductor refrigerating box, and then can be half
The application of conductor refrigeration case to Large Copacity many warm areas field, especially field, Large Copacity dual temperature district.
Further, owing to the semiconductor refrigerating box of the present invention passing the special construction of device for cooling, can make corresponding
Temperature distribution in storage space is uniform.
According to below in conjunction with the accompanying drawing detailed description to the specific embodiment of the invention, those skilled in the art will
More understand the above-mentioned of the present invention and other purposes, advantage and feature.
Accompanying drawing explanation
Some describing the present invention the most by way of example, and not by way of limitation in detail are concrete
Embodiment.Reference identical in accompanying drawing denotes same or similar parts or part.Art technology
Personnel are it should be understood that what these accompanying drawings were not necessarily drawn to scale.In accompanying drawing:
Fig. 1 is the schematic elevational view of semiconductor refrigerating box according to an embodiment of the invention；
Fig. 2 is the schematic rear view of semiconductor refrigerating box according to an embodiment of the invention；
Fig. 3 is the schematic right-side view of semiconductor refrigerating box according to an embodiment of the invention.
Detailed description of the invention
Fig. 1 is the schematic elevational view of semiconductor refrigerating box 100 according to an embodiment of the invention.Such as figure
Shown in 1, the semiconductor refrigerating box 100 that the embodiment of the present invention provides can include casing 20 and multiple quasiconductor system
Cooling system 30.This casing 20 defines multiple storage in having forward direction opening, and this casing 20 in transverse direction
Object space 21.Each semiconductor refrigeration system 30 comprises the steps that the one or more semiconductor refrigeratings of himself
Sheet 31, is fed to one by the cold of cold end of semiconductor chilling plate 31 each in this semiconductor refrigeration system 30
The biography device for cooling 32 of storage space 21, and by each semiconductor chilling plate in this semiconductor refrigeration system 30
The heat in 31 hot junctions is dispersed into the heat abstractor 33 of surrounding.
In embodiments of the present invention, each semiconductor refrigeration system 30 can work independently, so that storing up accordingly
Object space 21 is in a preset range temperature range, so that the temperature in multiple storage space 21 is equal
Or, say, that multiple semiconductor refrigeration systems 30 are formed in can making this semiconductor refrigerating box 100
Multiple warm areas, to preserve the article etc. corresponding with each warm area.
In some embodiments of the invention, storage space 21 can be two, divides according to left and right in casing 20
The mode of cutting is set to dual temperature plot structure, and the space size of two storage spaces 21 in left and right may be the same or different.
Fig. 2 is the schematic rear view of semiconductor refrigerating box 100 according to an embodiment of the invention.Such as figure
Shown in 2, for the ease of the assembling etc. of semiconductor refrigerating box 100, multiple semiconductor refrigeration systems 30 are transversely
Direction is juxtaposed on the rear portion of casing 20.And, the biography device for cooling 32 of each semiconductor refrigeration system 30
The cold of cold end of semiconductor chilling plate 31 each in this semiconductor refrigeration system 30 is fed to this quasiconductor system
The storage space 21 in cooling system 30 front.
In some embodiments of the invention, the rear wall of each storage space 21 can offer installing hole,
To install one or more semiconductor chilling plates 31 of a corresponding semiconductor refrigeration system 30.The most each
Passing device for cooling 32 to be arranged in a storage space 21, each heat abstractor 33 is mountable to a storing
The outside in space 21 and be in the rear of this storage space 21.In some further embodiments, can
In each storage space 21, an air duct cover board is set, so that air duct cover board and the rear wall of this storage space 21
Form an air channel, pass device for cooling 32 and be mountable in this air channel.
Fig. 3 is the schematic right-side view of semiconductor refrigerating box 100 according to an embodiment of the invention.Such as figure
Shown in 3, in the semiconductor refrigerating box 100 of the embodiment of the present invention, each biography device for cooling 32 can include conduction cooling
Matrix 321 and Duo Gen passes hot and cold tube 322.The conduction cooling matrix 321 of each biography device for cooling 32 and a quasiconductor
The cold end thermally coupled of each semiconductor chilling plate 31 in refrigeration system 30, to absorb cold.Specifically, often
The rear surface of the conduction cooling matrix 321 of individual biography device for cooling 32 is each with in a semiconductor refrigeration system 30 partly leads
The cold end in contact of body cooling piece 31 against.Further, conduction cooling matrix 321 and semiconductor chilling plate 31
Contact surface can smear heat-conducting silicone grease.Preferably, each conduction cooling matrix 321 can be the heat conduction being made up of aluminum
Block.
The every top section passing hot and cold tube 322 is resisted against or embeds in conduction cooling matrix 321, with by conduction cooling base
In body 321 absorb cold pass out, and be delivered to every pass hot and cold tube 322 with its top section apart
The compresses lower section of one distance.In embodiments of the present invention, every passes hot and cold tube 322 can be sintered heat pipe, its
It is perfused with the cold-producing medium such as carbon dioxide, superconductive medium in internal cavities, its inwall can be attached with the gold of sintering
Belong to mealy structure, pass cold efficiency to improve.Further, many biography hot and cold tubes 322 can vertically be put down
Row extends.Passing hot and cold tube 322 and can be 3, the every length passing hot and cold tube 322 can be 60cm, diameter
For 8mm.
In some embodiments of the invention, each biography device for cooling 32 also includes that top passes cold fins set 323,
Its with every pass hot and cold tube 322 top section thermally coupled directly or indirectly, with to semiconductor refrigerating box 100
Storage space 21 in transmission cold.Specifically, the top of each biography device for cooling 32 passes cold fins set 323
In the corresponding parallel interval of multiple fins be arranged at the front table of conduction cooling matrix 321 of this biography device for cooling 32
Face.
In embodiments of the present invention, when low-temperature receiver provides cold, the top of this biography device for cooling 32 passes cold fin
Group 323 and the every compresses lower section passing hot and cold tube 322 all can be to semiconductor refrigerating box 100 storing skies
Between transmission colds in 21.Due to the multidirectional of adopting heat pipes for heat transfer, when low-temperature receiver stops providing cold, pass cold
Device 32 is possible with every and passes hot and cold tube 322 and make Indoor Temperature between each storing of semiconductor refrigerating box 100
Degree is evenly distributed, and prevents cold air to be completely in the bottom of this storage space 21, and hot-air is completely in this
The top of storage space 21, causes upper and lower temperature difference indoor between this storing bigger.
In some embodiments of the invention, pass device for cooling 32 and can farther include the bottom cold fins set 324 of biography,
Its with every pass hot and cold tube 322 compresses lower section thermally coupled directly or indirectly, with further improve pass cold effect
Rate.Specifically, bottom passes cold fins set 324 and is arranged at the many compresses lower section passing hot and cold tube 322.The most just
Being to say, it is cold and hot that bottom is installed on many biographies with passing the corresponding parallel interval of multiple fins in cold fins set 324
The compresses lower section of pipe 322, so that each fin that bottom passes in cold fins set 324 passes hot and cold tube 322 with every
Contact heat-exchanging.
In order to improve cold scattering efficiency, the biography device for cooling 32 in the embodiment of the present invention also includes two blower fans, point
Do not pass air-cooler 325 for top and bottom passes air-cooler 326.Top passes air-cooler 325 and is configured to top
The cold passed in cold fins set 323 carries out forced convertion cold scattering.Bottom pass air-cooler 326 can be configured to under
The cold that portion passes in cold fins set 324 carries out forced convertion cold scattering.In this embodiment, top passes air-cooler
325 and bottom pass air-cooler 326 can be all axial flow blower, be respectively arranged in top biography cold fins set 323 He
Bottom passes in cold fins set 324.
In some embodiments of the invention, as it is shown on figure 3, in the semiconductor refrigerating box 100 of this embodiment,
Each heat abstractor 33 can include heat conduction substrate 331, many heat radiations heat pipe 332, radiating fin group 333 and
Cooling fan 334.
Specifically, every in the heat conduction substrate 331 of each heat abstractor 33 and a semiconductor refrigeration system 30
The hot junction thermally coupled of individual semiconductor chilling plate 31, to absorb heat.Such as, each heat conduction substrate 331
The hot junction contact heat-exchanging of each semiconductor chilling plate 31 in front surface and a semiconductor refrigeration system 30.Excellent
Selection of land, each heat conduction substrate 331 can be the heat-conducting block being made up of aluminum.
Every heat radiation heat pipe 332 lower end be resisted against or embed in heat conduction substrate 331, with heat conduction substrate 331
Contact heat-exchanging.Every heat radiation heat pipe 332 can be sintered heat pipe, can be perfused with deionized water in its internal cavities
Deng, its inwall can be attached with the metal dust structure of sintering, to improve radiating efficiency.Further, dissipate
The quantity of heat pipe 332 can be 3 to 4, every heat radiation heat pipe 332 length in 35cm, diameter
For 10mm.
Radiating fin group 333 can have the fin that multiple corresponding parallel interval is arranged, and is arranged at many heat radiations
On heat pipe 332.Cooling fan 334 can be axial flow blower, is installed in radiating fin group 333, is configured to
The heat reaching radiating fin group 333 from many heat radiation heat pipes 332 is carried out forced convertion heat radiation.
In some embodiments of the invention, semiconductor refrigerating box 100 also includes in order to before casing 20
Side seal closes the locking device of multiple storage space 21.Specifically, this locking device can be the first door body, its
It is rotatably installed on casing 20, in order to from the multiple storage space of front closure 21 of casing 20.Alternatively,
This locking device may also comprise multiple second door body, and each second door body is rotatably installed on casing 20, uses
With from this storage space 21 of the front closure of a storage space 21.Alternatively, this locking device is alternatively
Fold door body, be installed on casing 20.Fold door body can have multiple door body unit, each door body unit in order to
From this storage space 21 of the front closure of a storage space 21, and the door body unit pivot that each two is adjacent
Connect.
So far, although those skilled in the art will appreciate that and the most detailed illustrate and describing the present invention's
Multiple exemplary embodiments, but, without departing from the spirit and scope of the present invention, still can be according to this
Disclosure of invention directly determines or derives other variations or modifications of many meeting the principle of the invention.Cause
This, the scope of the present invention is it is understood that and regard as covering other variations or modifications all these.
Claims (10)
1. a semiconductor refrigerating box, including:
There is the casing of forward direction opening, in it, define multiple storage space in transverse direction；With
Multiple semiconductor refrigeration systems, each described semiconductor refrigeration system includes the one or more of himself
Semiconductor chilling plate, is fed to one by the cold of the cold end of each semiconductor chilling plate in this semiconductor refrigeration system
The biography device for cooling of individual storage space, and by semiconductor chilling plate hot junction each in this semiconductor refrigeration system
Heat is dispersed into the heat abstractor of surrounding.
Semiconductor refrigerating box the most according to claim 1, wherein
The plurality of semiconductor refrigeration system is juxtaposed on the rear portion of described casing in transverse direction, and
The biography device for cooling of each described semiconductor refrigeration system is by each quasiconductor in this semiconductor refrigeration system
The cold of the cold end of cooling piece is fed to the storage space in this semiconductor refrigeration system front.
Semiconductor refrigerating box the most according to claim 1, wherein
Each described biography device for cooling is arranged in a storage space.
Semiconductor refrigerating box the most according to claim 1, wherein, each described biography device for cooling includes:
Conduction cooling matrix, every in the conduction cooling matrix of each described biography device for cooling and a described semiconductor refrigeration system
The cold end thermally coupled of individual semiconductor chilling plate, to absorb cold；
Many pass hot and cold tube, and the top section of every described biography hot and cold tube is resisted against or embeds described conduction cooling matrix
In, with by described conduction cooling matrix absorb cold pass out, and be delivered to every described biography hot and cold tube with
Its top section is at a distance of the compresses lower section of a distance.
Semiconductor refrigerating box the most according to claim 4, wherein, each described biography device for cooling also includes:
Top passes cold fins set, and it connects with the direct or indirect underground heat of top section of every described biography hot and cold tube
Connect.
Semiconductor refrigerating box the most according to claim 5, wherein, each described biography device for cooling also includes:
Top passes air-cooler, is configured to that the cold in the cold fins set of biography of described top is carried out forced convertion and dissipates
Cold.
Semiconductor refrigerating box the most according to claim 5, wherein
The rear surface of the conduction cooling matrix of each described biography device for cooling is every with in a described semiconductor refrigeration system
The cold end in contact of individual semiconductor chilling plate against；And
The top of each described biography device for cooling sets with passing the corresponding parallel interval of multiple fins in cold fins set
It is placed in the front surface of the conduction cooling matrix of this biography device for cooling.
Semiconductor refrigerating box the most according to claim 4, wherein, each described biography device for cooling also includes:
Bottom passes cold fins set, is arranged at the described many compresses lower section passing hot and cold tube.
Semiconductor refrigerating box the most according to claim 8, wherein, each described biography device for cooling also includes:
Bottom passes air-cooler, is configured to that the cold in the cold fins set of biography of described bottom is carried out forced convertion and dissipates
Cold.
Semiconductor refrigerating box the most according to claim 1, wherein, each described heat abstractor includes:
Heat conduction substrate, every in the heat conduction substrate of each described heat abstractor and a described semiconductor refrigeration system
The hot junction thermally coupled of individual semiconductor chilling plate, to absorb heat；
Many heat radiation heat pipes, the lower end of every described heat radiation heat pipe is resisted against or embeds in described heat conduction substrate,
With with described heat conduction substrate contact heat-exchanging；
Radiating fin group, has the fin that multiple corresponding parallel interval is arranged, is arranged at described many heat radiations
On heat pipe；With
Cooling fan, is configured to the heat to reaching described radiating fin group from described many heat radiation heat pipes and carries out
Forced convertion is dispelled the heat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510290554.4A CN106288585A (en) | 2015-05-29 | 2015-05-29 | semiconductor refrigerating box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510290554.4A CN106288585A (en) | 2015-05-29 | 2015-05-29 | semiconductor refrigerating box |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106288585A true CN106288585A (en) | 2017-01-04 |
Family
ID=57655077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510290554.4A Pending CN106288585A (en) | 2015-05-29 | 2015-05-29 | semiconductor refrigerating box |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106288585A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107560264A (en) * | 2017-09-26 | 2018-01-09 | 上海创始实业（集团）有限公司 | Semiconductor chilling plate refrigerating box |
| CN110094914A (en) * | 2018-01-29 | 2019-08-06 | 青岛海尔股份有限公司 | Refrigerator |
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| CN201697409U (en) * | 2009-08-21 | 2011-01-05 | 张延红 | Multi-temperature region refrigerator with energy saving and environmental protection |
| CN203588992U (en) * | 2013-08-30 | 2014-05-07 | 广东新创意科技有限公司 | Hot end and cold end integrated heat dissipation structure for TEC chip |
| CN104534772A (en) * | 2015-01-06 | 2015-04-22 | 青岛海尔股份有限公司 | Semiconductor refrigerator |
| CN104654670A (en) * | 2015-02-03 | 2015-05-27 | 青岛海尔股份有限公司 | Heat exchange device and semiconductor cryogenic refrigerator with same |
| CN204693922U (en) * | 2015-05-29 | 2015-10-07 | 青岛海尔智能技术研发有限公司 | semiconductor refrigerating box |
-
2015
- 2015-05-29 CN CN201510290554.4A patent/CN106288585A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201697409U (en) * | 2009-08-21 | 2011-01-05 | 张延红 | Multi-temperature region refrigerator with energy saving and environmental protection |
| CN203588992U (en) * | 2013-08-30 | 2014-05-07 | 广东新创意科技有限公司 | Hot end and cold end integrated heat dissipation structure for TEC chip |
| CN104534772A (en) * | 2015-01-06 | 2015-04-22 | 青岛海尔股份有限公司 | Semiconductor refrigerator |
| CN104654670A (en) * | 2015-02-03 | 2015-05-27 | 青岛海尔股份有限公司 | Heat exchange device and semiconductor cryogenic refrigerator with same |
| CN204693922U (en) * | 2015-05-29 | 2015-10-07 | 青岛海尔智能技术研发有限公司 | semiconductor refrigerating box |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107560264A (en) * | 2017-09-26 | 2018-01-09 | 上海创始实业（集团）有限公司 | Semiconductor chilling plate refrigerating box |
| CN110094914A (en) * | 2018-01-29 | 2019-08-06 | 青岛海尔股份有限公司 | Refrigerator |
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