CN110966817A - Refrigerating box - Google Patents

Refrigerating box Download PDF

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Publication number
CN110966817A
CN110966817A CN201811140727.4A CN201811140727A CN110966817A CN 110966817 A CN110966817 A CN 110966817A CN 201811140727 A CN201811140727 A CN 201811140727A CN 110966817 A CN110966817 A CN 110966817A
Authority
CN
China
Prior art keywords
cold
fan
external
inner container
fin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811140727.4A
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Chinese (zh)
Inventor
王军
陈海涛
李林杰
王利鑫
李帆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qingdao Haier Biomedical Co Ltd
Qingdao Haite Biomedical Co Ltd
Original Assignee
Qingdao Haier Biomedical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qingdao Haier Biomedical Co Ltd filed Critical Qingdao Haier Biomedical Co Ltd
Priority to CN201811140727.4A priority Critical patent/CN110966817A/en
Publication of CN110966817A publication Critical patent/CN110966817A/en
Pending legal-status Critical Current

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D11/00Self-contained movable devices, e.g. domestic refrigerators
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors

Abstract

The invention relates to a refrigerating box, which comprises a box shell, a box door, an inner container and a refrigerating device, wherein a cold channel communicated with the inner container is foamed between the rear side wall of the inner container and the rear side wall of the box shell; the refrigerating device comprises an external radiator assembly, an external fan unit, an internal evaporator and an internal fan unit; the external radiator assembly comprises a cold guide block, a semiconductor refrigeration piece and an external radiator, the external radiator assembly is arranged on the cold channel, the cold end of the semiconductor refrigeration piece is pressed with the end face of one end of the cold guide block, the external radiator is connected with the hot end of the semiconductor refrigeration piece, and the external fan unit is arranged close to the external radiator; the other end of the cold guide block passes through a cold passage opening on the inner container and extends into the inner container; the inner evaporator is connected with the end face of the other end of the cold guide block and arranged in the inner container, and the inner fan set is arranged close to the inner evaporator. The internal evaporator is convenient to mount and dismount, and the cold end fan and the hot end fan of the semiconductor refrigerating sheet are forced to convect, so that the cooling speed in the refrigerating box is increased, and the temperature uniformity in the refrigerating box is enhanced.

Description

Refrigerating box
Technical Field
The invention belongs to the technical field of refrigeration equipment, and particularly relates to a refrigerating box.
Background
Freezers are used for extended use in the refrigeration of vaccines, pharmaceuticals and related products stored at temperatures between 2 ℃ and 8 ℃. Semiconductor Cooler (TEC) technology is well applied to refrigeration equipment, but for semiconductor refrigeration, a cold-guiding structure at a cold end side and a heat-conducting structure at a hot end side have different mounting structures due to different application conditions, and different degrees of refrigeration effect are generated. The inside evaporimeter in the refrigerator among the prior art is installed the lateral wall outside behind the inner bag more and is foamed in the foaming layer of box inside, causes the inside evaporimeter trouble or not convenient to detach when damaging.
Disclosure of Invention
The invention provides a refrigerator, which aims to solve the problem that an internal evaporator is inconvenient to disassemble in the prior art, is convenient to install and disassemble, and adopts forced convection fan heat exchange modes at the cold end and the hot end of a semiconductor refrigerating sheet, so that the cooling speed in the refrigerator is accelerated, and the temperature uniformity in the refrigerator is enhanced.
In order to solve the technical problems, the invention provides the following technical scheme for solving the problems:
a fridge, including the case shell, door, inner container set in case shell, and refrigerating plant, wherein there is a cold channel communicated with said inner container between the back sidewall of said inner container and back sidewall of the said case shell in a foaming way; the refrigerating device comprises an external radiator assembly, an external fan unit, an internal evaporator and an internal fan unit; the external radiator assembly comprises a cold guide block, a semiconductor refrigeration piece and an external radiator, the external radiator assembly is installed on the cold channel, the cold end of the semiconductor refrigeration piece is pressed with the end face of one end of the cold guide block, the external radiator is connected with the hot end of the semiconductor refrigeration piece, and the external fan unit is arranged close to the external radiator; the other end of the cold guide block penetrates through a cold passage opening formed in the inner container and extends into the inner container; the inner evaporator is connected with the end face of the other end of the cold guide block and arranged in the inner container, and the inner fan set is arranged close to the inner evaporator.
Furthermore, in order to reduce the influence on the service life of the refrigeration piece caused by the water vapor entering during the manual packaging of the semiconductor refrigeration piece as much as possible, the external radiator assembly further comprises a sheath, the sheath is sleeved at one end of the cold guide block, the semiconductor refrigeration piece is packaged in the sheath, and the cold end of the semiconductor refrigeration piece is pressed with the end face of one end of the cold guide block; the sheath is connected with the external radiator, so that the external radiator is connected with the hot end of the semiconductor refrigeration sheet.
In order to further improve the sealing performance of the package of the cold end face of the semiconductor refrigeration piece, the sheath and the cold guide block are integrally formed in an injection molding mode.
Further, the external radiator comprises an aluminum base, a pressing plate arranged above the aluminum base, a first fin, a second fin and a plurality of heat pipes arranged in parallel, each heat pipe penetrates through the pressing plate to be in contact with the aluminum base, one end of each heat pipe is arranged in the first fin in a penetrating mode, and the other end of each heat pipe is arranged in the second fin in a penetrating mode.
Furthermore, in order to improve the heat dissipation speed of the hot end of the semiconductor refrigeration piece, the outer fan set comprises an outer fan cover and two outer fans, wherein the outer fan cover is mounted on the rear side wall of the box shell, the first fin and the second fin are located on one side of the outer fan cover and supported by the outer fan cover, the two fans are correspondingly mounted on the other side of the outer fan cover through a first ventilation opening and a second ventilation opening which are formed in the outer fan cover, the first fin corresponds to the first ventilation opening, and the second fin corresponds to the second ventilation opening.
Furthermore, the internal evaporator comprises a fin, a refrigerant pipeline penetrating through the fin and a cold guide base, the cold guide base is communicated with a first end and a second end of the refrigerant pipeline extending out of the fin, circulating refrigerants are sealed in the refrigerant pipeline and the cold guide base, and the cold guide base is connected with the other end of the cold guide block; the fin is mounted to the inner bladder rear side wall.
Furthermore, in order to facilitate arrangement of the inner fan set, the refrigerator further comprises an air duct vertical plate mounted to the inner container, the inner evaporator is accommodated in a space between the rear side wall of the inner container and the air duct vertical plate, an air opening is formed in the air duct vertical plate, and the inner fan set penetrates through the air opening and is clamped at the air opening.
Furthermore, interior fan group is including interior fan guard with install interior fan in the interior fan guard, interior fan guard card is established wind gap department.
Furthermore, a clamping jaw is arranged on the circumferential edge of the inner fan cover, and the clamping jaw penetrates through the air opening and is clamped on the circumferential edge of the air opening.
Furthermore, in order to facilitate the disassembly of the external radiator assembly and the external fan unit, the outdoor unit further comprises a rear side plate detachably connected with the box shell, and the rear side plate is communicated with a space formed by the rear side wall of the box shell and the cold channel.
Compared with the prior art, the invention has the advantages and beneficial effects that: the internal evaporator is connected with the end face of the other end of the cold guide block and is arranged in the inner container instead of being positioned in the foaming layer of the box shell, so that the internal evaporator is convenient to detach and maintain; the semiconductor refrigerating sheet hot end is provided with an external radiator and an external fan unit, the cold end is provided with an internal evaporator and an internal fan unit, and the internal fan unit and the external fan unit are forced to convect, so that the cooling speed in the refrigerating box is effectively accelerated, and the temperature uniformity in the refrigerating box is enhanced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments of the present invention or the prior art will be briefly described below, and it is obvious that the drawings described below are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a front view of an embodiment of the cooler of the present invention;
FIG. 2 is a cross-sectional view taken along the line A-A in FIG. 1;
FIG. 3 is a partial enlarged view of portion B of FIG. 2;
FIG. 4 is an exploded view of an embodiment of the cooler of the present invention;
FIG. 5 is a partial enlarged view of portion C of FIG. 4;
FIG. 6 is a structural view of an inner evaporator in the refrigerator of the present invention;
FIG. 7 is an enlarged view of a portion D of FIG. 4;
FIG. 8 is a block diagram of an external heat sink assembly in the refrigerator of the present invention;
FIG. 9 is a cross-sectional view taken along the line E-E in FIG. 8;
FIG. 10 is an assembled view of the cold block and the sheath of the refrigerator of the present invention;
FIG. 11 is a cross-sectional view taken along the direction F-F in FIG. 10;
FIG. 12 is a structural view of an external radiator in the refrigerator of the present invention;
fig. 13 is a front view of an external heat sink in the refrigerator of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to realize the detachable assembly of the internal evaporator, meet the requirement of the user on the ultra-silent vibration of the product by utilizing the TEC technology and realize the control of the temperature in the refrigerating box, as shown in FIGS. 1 to 7, the invention relates to a refrigerating box 1000, which comprises a box shell 100, a box door 200, an inner container 300 arranged in the box shell 100 and a refrigerating device, wherein a cold channel 110 communicated with the inner container 300 is foamed between the rear side wall of the inner container 300 and the rear side wall 120 of the box shell 200; the refrigerating apparatus includes an external radiator assembly 600, an external fan unit, an internal evaporator 510, and an internal fan unit; the external radiator assembly 600 comprises a cold guide block 610, a semiconductor refrigeration piece 640 and an external radiator 630, the external radiator assembly 600 is installed on the cold channel 110, the cold end of the semiconductor refrigeration piece 640 is in press fit with the end face of one end of the cold guide block 610, the external radiator 630 is connected with the hot end of the semiconductor refrigeration piece 640, and the external fan set is arranged close to the external radiator 630; the other end of the cold guide block 610 passes through a cold passage opening (not labeled) formed on the inner container 300 and extends into the inner container 300; the internal evaporator 510 is connected with the end face of the other end of the cold guide block 610 and is arranged in the inner container 300, and the internal fan set is arranged close to the internal evaporator 510.
Specifically, in the present embodiment, as shown in fig. 3, the refrigeration system includes a cold guiding device 500 at the cold end of the semiconductor refrigeration sheet 640 and a heat dissipating device at the hot end, the cold guiding device 500 includes an internal evaporator 510 and an internal fan set, and the heat dissipating device includes an external heat sink 630 and an external fan set, the internal evaporator 510 is disposed in the inner container 300 instead of being foamed in the cabinet 100, so as to facilitate disassembly and maintenance; the cold generated by the semiconductor chilling plates 640 is transferred to the internal evaporator 510 through the cold guide block 610 (e.g., cold guide aluminum block), the cold emitted from the internal evaporator 510 is carried into the inner container 300 through the internal fan set, and the heat generated by the semiconductor chilling plates 640 is absorbed by the external heat sink 630 and then blown to the outside of the refrigerator 1000 through the external fan set. In this embodiment, the external heat sink assembly 600 is installed on the cold channel 110 through the foamed cold channel 110, so that the other end of the cold guide block 610 opposite to the end in contact with the cold end of the semiconductor chilling plate 640 extends into the inner container 300, and the cold energy is transferred into the inner container 300.
In order to avoid water vapor entering during manual packaging of the semiconductor refrigeration piece 640 and influence the service life of the semiconductor refrigeration piece 640, as shown in fig. 8 to 11, one surface of the semiconductor refrigeration piece 640 close to the inner container 300 is packaged, as shown in fig. 10, one end of the cold guide block 610 is sleeved with a sheath 620, the sheath 620 is made of PPS plastic, as shown in fig. 9, the semiconductor refrigeration piece 640 is packaged in the sheath 620, wherein the PPS sheath 620 is provided with a circumferential flanging, and a plurality of through holes 621 are formed in the circumferential flanging at intervals, in the embodiment, the cold guide block 610 and the PPS sheath 620 are of an integrated injection molding structure. As shown in fig. 12 and 13, in the present embodiment, the external heat sink 630 employs a sintered heat pipe technology, and includes an aluminum base, a pressing plate 633 disposed above the aluminum base, a first fin 631, a second fin 631', and a plurality of heat pipes 634 disposed in parallel, each heat pipe 634 passes through the pressing plate 633 and contacts with the aluminum base, wherein one end of each heat pipe 634 passes through the first fin 631 and the other end passes through the second fin 631', the aluminum base of the present embodiment includes an aluminum base 632 and an aluminum boss 635 disposed on the aluminum base 632, a threaded hole is formed on the aluminum base 632, as shown in fig. 9, when the external heat sink 630, the cold conducting block 610, and the PPS sheath 620 are assembled together, the screw passes through the through hole 621 and the threaded hole on the aluminum base 632 to tighten the screw, at this time, the aluminum boss 635 is embedded into the sheath 620 and is in press-contact with the hot end of the semiconductor chilling block 640, wherein a gap where the sheath 620 contacts, and the hot end face and the cold end face of the semiconductor refrigeration sheet 640 are coated with heat-conducting glue.
In order to increase the heat dissipation speed of the hot end of the semiconductor refrigeration sheet 640, as shown in fig. 3, 4 and 7, the external fan set includes two external fans 700 and an external fan cover 800, in this embodiment, the external fan cover 800 has a vertical plate (not labeled), an upper transverse plate, a lower transverse plate 820 and left and right transverse plates at one side of the vertical plate, which are respectively butted with the four edges of the vertical plate, and the left and right transverse plates have outward flanges, such as flanges 810, the upper transverse plate, the lower transverse plate 820 and the left and right transverse plates and the vertical plate enclose a certain space, and the vertical plate is mounted on the rear side wall 120 of the case 100 through the flanges; two ventilation openings 830 are formed in the vertical plate, the first fin 631 and the second fin 631 'of the external heat sink 630 are accommodated in the space and are partially supported by the horizontal plate, wherein the first fin 631 corresponds to one ventilation opening and the second fin 631' corresponds to the other ventilation opening 830, the two external fans 700 are installed on the other side of the vertical plate through screws, one external fan corresponds to one ventilation opening and the other external fan 700 corresponds to the other ventilation opening 830, and heat brought out by the external fans is exhausted to the external environment through the chromium-plated fan cover 420 installed on the installation opening 410 of the rear side plate 400 of the refrigeration box 1000. In the present embodiment, as shown in fig. 3, a cold channel 110 is foamed between the rear sidewall 120 of the cabinet 100 and the rear sidewall of the inner container 300, a through hole (not labeled) is formed in the aluminum substrate 632, a screw is driven into the wall of the cold channel 110 through the through hole to realize the installation of the external heat sink assembly 600, and at this time, one end of the cold guide block 610 extends into the inner container 300 through a cold channel opening of the inner container 300 communicated with the cold channel 110.
As shown in fig. 3 to 6, in order to realize rapid and uniform transfer of the cooling capacity of the semiconductor cooling fins 640 transferred by the cooling guide block 610 into the inner container 300, the internal evaporator 510 adopts a gravity assisted heat pipe technique, and includes fins 512, a cooling medium pipeline passing through the fins 512, and a cooling guide base (e.g., a cooling guide aluminum base). In this embodiment, in order to facilitate the filling of the refrigerant into the interior evaporator 510, a filling pipe 518 is provided to communicate with one end of the cooling guide base, the cooling guide base includes a plug 515 for blocking an outlet of the second connecting pipe 513, a third connecting pipe 517 for communicating the first connecting pipe 514 and the filling pipe 518, and a cooling guide plate 516 for communicating the plug 515 and the third connecting pipe 517, an inlet of the filling pipe 518 is closed after the filling of the refrigerant through the inlet of the filling pipe 518 is completed, and the refrigerant circulates through the filling pipe 518, the third connecting pipe 517, the first connecting pipe 514, the copper loop 511, the second connecting pipe 513, the plug 515, and the cooling guide plate 516. In order to guide the cold energy of the cold guide block 610 into the internal evaporator 510, as shown in fig. 6, the cold guide sheet 516 is welded between the third connecting pipe 517 and the pipe plug 515, and a screw hole is opened on the cold guide sheet 516, and a screw passes through the corresponding screw hole and the screw hole 611 on the cold guide block 610, so as to realize the press-fit contact between the cold guide sheet 516 and the cold guide block 610, wherein a surface of the cold guide sheet 516 contacting the cold guide block 610 is coated with a heat conductive adhesive (for example, the thickness of the heat conductive adhesive is 0.1 mm), and the fin 512 is mounted on an inner side wall, for example, a rear side wall, of the inner container 300 through the fin mounting bracket 519. In addition, in order to realize the installation of the inner fan set, an air duct vertical plate 540 is arranged in the inner container 300, the internal evaporator 511 is accommodated between one side of the air duct vertical plate 540 and the rear side wall of the inner container 300, an air opening 541 is formed in the air duct vertical plate 540, and the inner fan set is installed on the air duct vertical plate 540 through the air opening 541 from the other side of the air duct vertical plate 540. As shown in fig. 3 and 5 in particular, the inner fan set includes an inner fan guard 530 and an inner fan 520 installed in the inner fan guard 530, a plurality of claws 531 are disposed on a circumferential edge of the inner fan guard 530 (e.g., a square guard), and the claws 531 are clamped on a circumferential edge of the air opening 541 when the inner fan guard 530 passes through the air opening 541.
As shown in fig. 3 and 4, in this embodiment, the refrigerator 1000 further includes a detachable rear panel 400, and a space formed between the rear panel 400 and the rear wall 120 of the cabinet 100 is communicated with the cooling passage 110 to facilitate heat dissipation. When inside evaporimeter 510 needs the maintenance, with wind channel riser 540 dismantle the back alright dismantle inside evaporimeter 510, the installation and dismantle conveniently, and when outside radiator assembly 600 needs the maintenance, through dismantling posterior lateral plate 400 can, convenient and easy operation. In this embodiment, the forced convection fans are used inside and outside the refrigerator 1000 to exchange heat, so as to accelerate the cooling speed in the refrigerator, enhance the temperature uniformity in the whole box, and maintain the temperature difference between the cold end surface and the hot end surface of the semiconductor cooling fins 640 in a dynamic balance state. The inner fan 520 and the outer fan 700 in this embodiment may be a dc constant speed fan, a dc variable speed fan, or an ac fan.
In addition, as shown in FIGS. 2 and 4, in the present embodiment, a shelf assembly 900 is also disposed within the cooler 1000 and will not be described in detail herein; the door 200 is provided with a display screen 210 through a display screen cover 220, which is installed at a viewing port (not shown) formed in the door 200, for displaying other parameters such as temperature or humidity fed back by a temperature sensor or a humidity sensor in the refrigerator 1000.
In the refrigeration container 1000 of the present embodiment, the internal evaporator 510 is press-fit connected to the end surface of the other end of the cooling guide block 610 by screws, so that the assembly and disassembly are simplified, and the maintenance and replacement of the internal evaporator 510 are facilitated; the external radiator assembly 600 is installed on a cold channel between the rear side wall of the inner container 300 and the rear side wall 120 of the box shell 200 through screws, and the rear side plate 400 is detachable, so that the external radiator assembly 600 is convenient to maintain and replace; the hot end of the semiconductor refrigeration sheet 640 is provided with an external radiator 630 and an external fan 700, the cold end is provided with an internal evaporator 510 and an internal fan 520, and the internal and external fans are forced to convect, so that the cooling speed in the refrigeration box 1000 is effectively accelerated, and the temperature uniformity in the refrigeration box 1000 is enhanced.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims (10)

1. A fridge, including the case shell, door, inner container set in case shell, and refrigerating plant, wherein there is a cold channel communicated with said inner container between the back sidewall of said inner container and back sidewall of the said case shell in a foaming way; the refrigerating device comprises an external radiator assembly, an external fan unit, an internal evaporator and an internal fan unit; the external radiator assembly comprises a cold guide block, a semiconductor refrigeration piece and an external radiator, the external radiator assembly is installed on the cold channel, the cold end of the semiconductor refrigeration piece is pressed with the end face of one end of the cold guide block, the external radiator is connected with the hot end of the semiconductor refrigeration piece, and the external fan unit is arranged close to the external radiator; the other end of the cold guide block penetrates through a cold passage opening on the inner container and extends into the inner container; the inner evaporator is connected with the end face of the other end of the cold guide block and arranged in the inner container, and the inner fan set is arranged close to the inner evaporator.
2. The cooler of claim 1, wherein said external heat sink assembly further comprises a jacket disposed about an end of said cold block, said semiconductor chilling plate being enclosed within said jacket and having a cold end press-fit with an end surface of said end of said cold block; the sheath is connected with the external radiator, so that the external radiator is connected with the hot end of the semiconductor refrigeration sheet.
3. The cooler of claim 2, wherein said jacket is injection molded integrally with said chill block.
4. The cooler of any one of claims 1-3, wherein said external heat sink comprises an aluminum base, a pressure plate disposed above said aluminum base, a first fin, a second fin, and a plurality of heat pipes arranged in parallel, each heat pipe passing through said pressure plate in contact with said aluminum base, and each heat pipe having one end passing through said first fin and the other end passing through said second fin.
5. The refrigeration container as claimed in any one of claims 1 to 3, wherein said outer fan unit comprises an outer fan cover mounted on the rear side wall of said housing, and two outer fans, said outer radiator assembly being located on one side of said outer fan cover, said two outer fans being mounted on the other side of said outer fan cover through a first ventilation opening and a second ventilation opening formed in said outer fan cover, respectively, wherein said first fin corresponds to said first ventilation opening, and said second fin corresponds to said second ventilation opening.
6. The refrigeration container as claimed in any one of claims 1 to 3, wherein said internal evaporator comprises a fin, a refrigerant line passing through said fin, and a cooling guide base, said cooling guide base communicating a first end and a second end of said refrigerant line extending out of said fin, said refrigerant line and said cooling guide base enclosing a circulating refrigerant therein, said cooling guide base being connected to the other end of said cooling guide block; the fin is mounted to the inner bladder rear side wall.
7. The refrigerator as claimed in any one of claims 1 to 3, further comprising an air duct vertical plate mounted to the inner container, wherein the internal evaporator is accommodated in a space between the rear sidewall of the inner container and the air duct vertical plate, and an air opening is formed in the air duct vertical plate, and the internal fan set passes through the air opening and is clamped at the air opening.
8. The cooler of claim 7, wherein said inner fan assembly comprises an inner fan guard and an inner fan mounted within said inner fan guard, said inner fan guard being positioned in a locked position at said air opening.
9. The cooler of claim 8, wherein a circumferential edge of said inner fan guard is provided with a detent that passes through said air opening and is trapped at a circumferential edge of said air opening.
10. The cooler of any one of claims 1-3, further comprising a rear panel removably attached to said cabinet, said rear panel forming a space with a rear wall of said cabinet that is in communication with said cold aisle.
CN201811140727.4A 2018-09-28 2018-09-28 Refrigerating box Pending CN110966817A (en)

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Application Number Priority Date Filing Date Title
CN201811140727.4A CN110966817A (en) 2018-09-28 2018-09-28 Refrigerating box

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CN110966817A true CN110966817A (en) 2020-04-07

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114941919A (en) * 2022-04-12 2022-08-26 纯钧新材料(深圳)有限公司 Refrigeration transfer box

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Publication number Priority date Publication date Assignee Title
JPH10185466A (en) * 1996-12-24 1998-07-14 Showa Alum Corp Heat pipe type heat sink
CN104329867A (en) * 2014-03-28 2015-02-04 海尔集团公司 Cold transferring and heat dissipating modular component, assembling method and semiconductor refrigerator
CN106288583A (en) * 2015-05-29 2017-01-04 青岛海尔智能技术研发有限公司 Pass device for cooling and there is the semiconductor refrigerating box of this biography device for cooling
CN107246755A (en) * 2017-06-23 2017-10-13 珠海格力电器股份有限公司 Semiconductor refrigeration box
CN207197029U (en) * 2017-07-31 2018-04-06 沈阳海尔电冰箱有限公司 A kind of high-efficiency and energy-saving type semiconductor freezer
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114941919A (en) * 2022-04-12 2022-08-26 纯钧新材料(深圳)有限公司 Refrigeration transfer box

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