CN216953683U - Improve wind channel structure and gradevin of incasement temperature degree of consistency - Google Patents
Improve wind channel structure and gradevin of incasement temperature degree of consistency Download PDFInfo
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- CN216953683U CN216953683U CN202123124056.2U CN202123124056U CN216953683U CN 216953683 U CN216953683 U CN 216953683U CN 202123124056 U CN202123124056 U CN 202123124056U CN 216953683 U CN216953683 U CN 216953683U
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Abstract
The utility model relates to the field of refrigerated wine cabinets, in particular to an air duct structure for improving the temperature uniformity in a cabinet and a wine cabinet, wherein the air duct structure comprises an air guide pipe fitting and a circulating fan; an air duct cavity is arranged in the air guide pipe fitting; the air guide pipe fitting comprises an air inlet panel and an air guide back shell; the air inlet and outlet panel is provided with an air inlet and an air outlet, and the air outlet is positioned above the air inlet; the air duct cavity is communicated with the outside through the air inlet and the air outlet; the air inlet is provided with the circulating fan. Air enters the bottom of the air duct cavity from the air inlet and then flows out of the air outlet under the drainage action of the air duct cavity, so that the air does not generate local small airflow circulation near the circulating fan, and large airflow circulation can be formed outside the air outlet panel; the wine cabinet with the air duct structure is applied, the internal airflow circulation is more comprehensive, and the temperature distribution is more uniform.
Description
Technical Field
The utility model relates to the field of refrigerated wine cabinets, in particular to an air duct structure for improving temperature uniformity in a cabinet and a wine cabinet.
Background
In the existing wine cabinet products, the temperature uniformity of the products adopting an air cooling mode is greatly related to the structure of a box body, and the smaller the width-to-height ratio is, the poorer the temperature uniformity in the box body is, for example, the temperature deviation of different positions of JC-33C series (models of wine cabinets) reaches 3 ℃ when the products are unloaded.
In 2020, the certification standard of the European Union is upgraded, a refrigeration structure is redesigned in order to meet the certification standard, a refrigeration system moves down to match a heat pipe heat dissipation mode, the rotating speed of a fan needs to be reduced because the requirement of certification on noise is met, the uniformity of the temperature in a box is poorer, the temperature difference of different positions in no-load state even reaches 6 ℃, the performance index and the use effect of a product are seriously influenced, and a client cannot accept the temperature difference.
In the existing air cooling structure, the fan cover is provided with the middle air inlet, the upper air outlet and the lower air outlet, so that the small circulation of local air flow (namely, cold air just output to the cavity and sucked back by the fan) is easily caused, the cold energy cannot be timely emitted, and the temperature in the box cannot be reduced to the set temperature.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned drawbacks, the present invention provides an air duct structure for improving the temperature uniformity inside a cabinet, so that a large cold airflow circulation can be formed inside the wine cabinet using the air duct structure, thereby ensuring the temperature uniformity of the air inside a storage cavity.
In order to achieve the purpose, the utility model adopts the following technical scheme:
an air channel structure for improving the temperature uniformity in a box comprises an air guide pipe fitting and a circulating fan; an air duct cavity is arranged in the air guide pipe fitting; the air guide pipe fitting comprises an air inlet panel and an air guide back shell; the air inlet panel is provided with an air inlet and an air outlet, and the air outlet is positioned above the air inlet; the air guide back shell is provided with a concave cavity structure towards the rear side in a concave manner; the air inlet panel covers the opening part on the front side of the concave cavity structure; the air duct cavity is communicated with the outside through the air inlet and the air outlet; the air inlet is provided with the circulating fan.
Preferably, the air guide pipe fitting is of a split structure, and the air inlet panel and the air guide back shell are detachably assembled to form the air guide pipe fitting.
Preferably, a hollow window part is arranged at the position, opposite to the air inlet, of the air guide back shell; a semiconductor refrigeration component is arranged in the hollow window part; the semiconductor refrigeration assembly comprises: the cooling device comprises a radiator, a radiator cooler and a semiconductor refrigerating device; the radiator is installed in contact with the heating end of the semiconductor refrigerating device; the cold radiator is installed in contact with the refrigerating end of the semiconductor refrigerating device; the radiator is located outside the air guide back shell, and the cold diffuser is located in the air duct cavity.
Preferably, the cold diffuser comprises a cold guide plate, one side of the cold guide plate is attached to the refrigerating end of the semiconductor refrigerating device, and the other side of the cold guide plate is vertically connected with a plurality of fins; and cold dissipation gaps are arranged among the fins and are parallel to the airflow direction in the air duct cavity.
A wine cabinet comprising: the cabinet body, the finned radiating tube assembly and the air duct structure for improving the temperature uniformity in the box are arranged; a storage cavity is arranged in the cabinet body; the side wall of the storage cavity is provided with an air guide window part; the air duct structure is embedded in the air guide window part, the air inlet panel is arranged towards the inside of the storage cavity, and the air guide back shell is positioned outside the storage cavity; the finned radiating tube assembly is positioned at the upper section of the cabinet body and used for radiating the radiator; the air inlet is located at the lower section of the storage cavity, and the air outlet is located at the upper section of the storage cavity.
Preferably, the finned heat dissipation tube assembly comprises: a liquid flow tube and a first fin assembly; a heat dissipation cavity is arranged inside the heat radiator; the liquid flow pipes are arranged in the fin assembly in an arched penetrating manner; the liquid flow output end of the heat dissipation cavity is communicated with the liquid flow input end of the liquid flow pipe; and the liquid flow output end of the liquid flow pipe is communicated with the liquid flow input end of the heat dissipation cavity.
A wine cabinet comprising: the cabinet body, the air-cooled radiating assembly and the air channel structure for improving the temperature uniformity in the box are arranged; a storage cavity is arranged in the cabinet body; the side wall of the storage cavity is provided with an air guide window part; the air duct structure is embedded in the air guide window part, the air inlet panel is arranged towards the inside of the storage cavity, and the air guide back shell is positioned outside the storage cavity; the air-cooled heat dissipation assembly is positioned at the upper section of the cabinet body and used for dissipating heat of the radiator; the air inlet is located in the middle section of the storage cavity, and the air outlet is located in the upper section of the storage cavity.
Preferably, the air-cooled heat dissipating assembly includes: the air-cooled heat dissipation assembly comprises a heat dissipation fan; the heat sink is a second fin assembly; the heat conducting surface of the second fin assembly is attached to the heating end of the semiconductor refrigeration device, and the cooling fan is attached to any other side surface of the second fin assembly.
Preferably, the wine cabinet comprises at least two storage cavities, and the air duct structure is arranged in each storage cavity.
Preferably, the distance between the air inlet and the air outlet in the air duct structure is greater than two thirds of the height of the storage cavity.
The embodiment of the utility model has the following beneficial effects:
the air inlet and the air outlet arranged on the air duct structure are arranged in a staggered mode in the vertical direction, and the air outlet is located above the air inlet, so that air enters the bottom of the air duct cavity from the air inlet and then flows out of the air outlet under the drainage effect of the air duct cavity, and finally, air flow entering and exiting the air duct structure can flow in a staggered mode in the vertical direction, the phenomenon of small local air flow circulation near the circulating fan cannot occur, and large air flow circulation can be formed on the outer side of the air outlet panel; the air duct structure is applied to the box-type structure, so that the internal airflow circulation is more comprehensive, and the temperature distribution is more uniform.
Drawings
FIG. 1 is a schematic perspective view of the air duct structure according to an embodiment of the present invention;
FIG. 2 is a front view of the air duct structure of the embodiment of FIG. 1;
FIG. 3 is an exploded view of the air duct structure of the embodiment of FIG. 1;
FIG. 4 is a schematic cross-sectional view of the embodiment of FIG. 2 taken along plane A-A;
FIG. 5 is a schematic perspective view of the wine cabinet according to an embodiment of the present invention;
FIG. 6 is a schematic cross-sectional view of the embodiment of FIG. 5;
fig. 7 is a schematic sectional view of the wine cabinet according to an embodiment of the present invention.
Wherein: the air duct structure 100, the air inlet panel 110, the air inlet 111, the air outlet 112, the air guide back shell 120, the cavity structure 121, the hollow window portion 122, the circulating fan 130, the cabinet 140, the radiator 141, the cold sink 142, the semiconductor refrigeration device 143, the cold guide plate 144, the liquid flow pipe 145, the first fin assembly 146, the heat radiation fan 147, and the second fin assembly 148.
Detailed Description
The technical scheme of the utility model is further explained by the specific implementation mode in combination with the attached drawings.
In one embodiment of the present application, as shown in fig. 1 to 4, an air duct structure 100 for improving temperature uniformity in a cabinet includes an air guiding pipe and a circulating fan 130; an air duct cavity is arranged in the air guide pipe fitting; the air guide pipe fitting comprises an air inlet panel 110 and an air guide back shell 120; the air inlet panel is provided with an air inlet 111 and an air outlet 112, and the air outlet 112 is positioned above the air inlet 111; the air guide back shell 120 is provided with a concave cavity structure 121 towards the rear side; the air inlet panel 110 covers the opening part at the front side of the cavity structure 121; the air duct cavity is communicated with the outside through the air inlet and outlet 112 and the air outlet 112; the air inlet 111 is provided with the circulation fan 130.
The air inlet 111 and the air outlet 112 of the air duct structure 100 are arranged in a staggered manner in the vertical direction, and the air outlet 112 is located above the air inlet 111, so that air enters the bottom of the air duct cavity from the air inlet 111 and then flows out from the air outlet 112 under the drainage effect of the air duct cavity, and finally, the air flow entering and exiting the air duct structure 100 can flow in a staggered manner in the vertical direction, the phenomenon of small local air flow circulation near the circulating fan 130 is avoided, and large air flow circulation can be formed outside the air outlet panel; the internal airflow circulation of the box structure using the air duct structure 100 is more comprehensive, and the temperature distribution is more uniform.
Preferably, the air guide pipe fitting is a split structure, and the air inlet panel 110 and the air guide back shell 120 are detachably assembled into the air guide pipe fitting. The air inlet panel 110 and the air guide back shell 120 can be assembled by using a detachable structure in the prior art, wherein the detachable structure can be a screw and screw hole mounting structure, and can be a buckle mounting structure; the air guide pipe fitting can be produced in a split mode, production efficiency is improved, production cost is saved, and installation of the fan or cleaning of the air duct cavity can be facilitated.
Preferably, a hollow window 122 is formed at a position of the air guide back shell 120 opposite to the air inlet 111; a semiconductor refrigeration component is arranged in the hollow window part 122; the semiconductor refrigeration assembly comprises: a radiator 141, a cold sink 142, and a semiconductor cooling device 143; the radiator 141 is installed in contact with the heating end of the semiconductor refrigeration device 143; the cold radiator 142 is installed in contact with the refrigerating end of the semiconductor refrigerating device 143; the heat radiator 141 is located outside the air guide back shell 120, and the air diffuser 142 is located in the air duct cavity. The semiconductor refrigerating device 143 can refrigerate and cool the air flowing through the air duct structure 100, so that the outer side of the air outlet panel can realize large cold air circulation, and the inner part of the box-type structure can be cooled comprehensively and uniformly; the structure for refrigeration and heat dissipation in the air duct structure 100 is installed at the rear side of the air guide back shell 120, and when the air duct structure 100 is applied to the box-type structure, the refrigeration and heat dissipation structure does not occupy the storage space of the box-type structure, but is installed outside the storage space, so that the overall refrigeration and heat dissipation structure of the box-type structure is more compact and reasonable in design, and the refrigeration effect is also improved.
Specifically, the cold diffuser 142 includes a cold guiding plate 144, one side of the cold guiding plate 144 is attached to the cooling end of the semiconductor refrigeration device 143, and the other side of the cold guiding plate 144 is vertically connected with a plurality of fins; and cold dissipation gaps are arranged among the fins and are parallel to the airflow direction in the air duct cavity. The cold conducting plate 144 can rapidly and efficiently transmit the cold generated by the semiconductor refrigerating device 143 to the fins, and the fins can contact the air flowing through in a larger area, so as to rapidly cool the air flowing through the air duct cavity; the heat dissipation gap is arranged in the direction of the airflow, so that the contact area of the fins and the air can be increased, and the noise generated by air flowing can be reduced.
The box-type structure can be used for various air-cooled refrigerated cabinets, is more excellent, and can ensure that the air temperature in the wine cabinet is more uniformly distributed when the box-type structure is the wine cabinet, thereby obviously improving the refrigeration effect of the wine cabinet.
In another embodiment of the present application, as shown in fig. 5 and 6, when the semiconductor cooling module of the wine cabinet is installed at a position biased to the bottom of the cabinet body 140, and the heat dissipation structure associated with the heat sink 141 is implemented by using a finned heat dissipation tube assembly, the structure of the wine cabinet is as follows:
a wine cabinet comprising: the cabinet body 140, the finned heat dissipation tube assembly and the air duct structure 100 for improving the temperature uniformity in the box as described above; a storage cavity is arranged in the cabinet body 140; the side wall of the storage cavity is provided with an air guide window part; the air duct structure 100 is embedded in the air guide window part, the air inlet panel is arranged towards the inside of the storage cavity, and the air guide back shell 120 is positioned outside the storage cavity; the finned heat dissipation tube assembly is located at the upper section of the cabinet body 140, and is used for dissipating heat of the heat sink 141; the air inlet 111 is located at a lower section of the storage chamber, and the air outlet 112 is located at an upper section of the storage chamber.
It should be noted that, according to the height parameter of the storage cavity inside the wine cabinet in the vertical direction, the storage cavity is divided into an upper section part, a middle section part and a lower section part from top to bottom.
In this embodiment, since the fin heat dissipation assembly requires a large installation space, the fin heat dissipation assembly is installed in the space of the cabinet body 140 near the top of the rear side of the storage cavity, and the semiconductor refrigeration assembly can only be installed at the position near the bottom of the rear side of the storage cavity; at this moment, an air inlet 111 is formed in the lower section of the storage cavity and used for sucking air, air flows through the air channel structure 100 and is guided to the top of the storage cavity after being cooled, and flows out of an air outlet 112 formed in the upper section of the storage cavity, so that cold air flowing out of the air outlet 112 can gradually sink to the bottom of the storage cavity under the action of gravity and then is sucked into the air inlet 111, and the circulation is performed so that a large cold air flow circulation is formed in the storage cavity, and the temperature in the storage cavity is more uniform.
The finned heat dissipation tube assembly comprises: a liquid flow tube 145 and a first fin assembly 146; a heat dissipation cavity is arranged inside the heat radiator 141; the liquid flow pipes 145 are arranged in the fin assembly in an arched and penetrating manner; the liquid flow output end of the heat dissipation cavity is communicated with the liquid flow input end of the liquid flow pipe 145; and the liquid flow output end of the liquid flow pipe 145 is communicated with the liquid flow input end of the heat dissipation cavity. The liquid flow pipe 145 is internally provided with a liquid flow medium, according to the principle of gravity heat pipe, the liquid flow medium with high temperature flows upwards along the liquid flow pipe 145 to the position of the fin assembly for heat dissipation, the temperature of the liquid flow medium after heat dissipation is reduced, and the liquid flow medium flows back to the heat dissipation cavity under the action of gravity for heating, and the circulation is such that the heat at the heating end of the semiconductor refrigerating device 143 can be continuously dissipated to the outside of the cabinet body 140.
In another embodiment of the present application, as shown in fig. 7, when the semiconductor refrigeration assembly mounting position of the wine cabinet is biased to the top of the cabinet body 140, and the heat dissipation structure associated with the heat sink 141 is implemented by using an air-cooled heat dissipation structure, the structure of the wine cabinet is specifically as follows:
a wine cabinet comprising: the cabinet body 140, the air-cooled heat dissipation assembly and the air duct structure 100 for improving the temperature uniformity in the refrigerator are provided; a storage cavity is arranged in the cabinet body 140; the side wall of the storage cavity is provided with an air guide window part; the air duct structure 100 is embedded in the air guide window part, the air inlet panel is arranged towards the inside of the storage cavity, and the air guide back shell 120 is positioned outside the storage cavity; the air-cooled heat dissipation assembly is located at the upper section of the cabinet body 140, and is used for dissipating heat of the heat sink 141; the air inlet 111 is located at the middle section of the storage cavity, and the air outlet 112 is located at the upper section of the storage cavity.
It should be noted that, according to the height parameter of the storage cavity inside the wine cabinet in the vertical direction, the storage cavity is divided into an upper section part, a middle section part and a lower section part from top to bottom.
In this embodiment, because the installation space required by the air-cooled heat dissipation assembly is not very large relative to the fin heat dissipation assembly, the air-cooled heat dissipation assembly can be installed in any space of the cabinet body 140 at the rear side of the storage cavity, and the semiconductor refrigeration assembly is installed at the optimal position of the middle section part at the rear side of the storage cavity in order to maximize the refrigeration effect on the storage cavity; at this time, an air inlet 111 is formed in the middle section of the storage cavity for sucking air, the air is guided to the top of the storage cavity after being cooled by the air duct structure 100 and flows out of an air outlet 112 formed in the upper section of the storage cavity, cold air flowing out of the air outlet 112 gradually sinks to the bottom of the storage cavity along one side, far away from the air outlet panel, in the storage cavity under the action of gravity, and then rises to the air inlet 111 from the bottom along one side, where the air outlet panel is located, in the storage cavity under the action of suction force of the air inlet 111 and is sucked into the air duct structure 100, and large cold air flow circulation is formed in the storage cavity in such a circulating manner, so that the temperature in the storage cavity is more uniform.
The air-cooled heat dissipation assembly includes a heat dissipation fan 147; the heat sink 141 is a second fin assembly 148; the heat-conducting surface of the second fin assembly 148 is attached to the heating end of the semiconductor refrigeration device 143, and the heat dissipation fan 147 is attached to any other side surface of the second fin assembly 148. When the heat dissipation fan 147 works, the air around the second fin assembly 148 is driven to flow, and the heat generated by the heating end of the semiconductor refrigeration device 143 can be continuously dissipated to the outside of the cabinet body 140 by taking away the heat from the second fin assembly 148 during the air flowing process
The wine cabinet according to the above two embodiments may comprise at least two storage cavities, and each storage cavity is provided with the air duct structure 100 therein. The wine cabinet can be simultaneously provided with a plurality of storage cavities according to application requirements, and the air duct structure 100 is arranged in each storage cavity, so that the wine cabinet with larger storage space can be ensured to have uniform refrigeration storage effect. In order to form a larger cooling air circulation in the storage chamber that is more stable, it is preferable that the air duct structure 100 is applied to the wine cabinet, and a distance between the air inlet 111 and the air outlet 112 in the air duct structure 100 is greater than two-thirds of a height of the storage chamber.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
The relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
In the description of the present invention, it is to be understood that the orientation or positional relationship indicated by the orientation words such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal" and "top, bottom", etc. are usually based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and in the case of not making a reverse description, these orientation words do not indicate and imply that the device or element being referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be considered as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.
Spatially relative terms, such as "above … …," "above … …," "above … … surface," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and the terms have no special meanings unless otherwise stated, and therefore, the scope of the present invention should not be construed as being limited.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or described herein.
The technical principle of the present invention is described above in connection with specific embodiments. The description is made for the purpose of illustrating the principles of the utility model and should not be construed in any way as limiting the scope of the utility model. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without inventive step, and these embodiments will fall within the scope of the present invention.
Claims (10)
1. An air channel structure for improving the temperature uniformity in a box is characterized by comprising an air guide pipe fitting and a circulating fan;
an air duct cavity is arranged in the air guide pipe fitting; the air guide pipe fitting comprises an air inlet panel and an air guide back shell;
the air inlet panel is provided with an air inlet and an air outlet, and the air outlet is positioned above the air inlet;
the air guide back shell is provided with a concave cavity structure in a concave manner towards the rear side; the air inlet panel covers the opening part on the front side of the concave cavity structure;
the air duct cavity is communicated with the outside through the air inlet and the air outlet;
the air inlet is provided with the circulating fan.
2. The air duct structure for improving the temperature uniformity in the refrigerator as claimed in claim 1, wherein the air guiding pipe is a split structure, and the air inlet panel and the air guiding back shell are detachably assembled into the air guiding pipe.
3. The air duct structure for improving the temperature uniformity in the box body as claimed in claim 1, wherein a hollow window portion is formed at a position, opposite to the air inlet, of the air guide back shell;
a semiconductor refrigeration component is arranged in the hollow window part;
the semiconductor refrigeration assembly comprises: a radiator, a cold radiator and a semiconductor refrigerating device;
the radiator is installed in contact with the heating end of the semiconductor refrigerating device;
the cold radiator is installed in contact with the refrigerating end of the semiconductor refrigerating device;
the radiator is located outside the air guide back shell, and the cold diffuser is located in the air duct cavity.
4. The air duct structure for improving the temperature uniformity in the refrigerator according to claim 3, wherein the cold diffuser comprises a cold guide plate, one side of the cold guide plate is attached to the refrigerating end of the semiconductor refrigerating device, and the other side of the cold guide plate is vertically connected with a plurality of fins; and cold dissipation gaps are arranged among the fins and are parallel to the airflow direction in the air duct cavity.
5. A wine cabinet, comprising: the cabinet body, the finned heat dissipation tube assembly and the air duct structure for improving the temperature uniformity in the box as claimed in claim 3 or 4;
a storage cavity is arranged in the cabinet body;
the side wall of the storage cavity is provided with an air guide window part;
the air duct structure is embedded in the air guide window part, the air inlet panel is arranged towards the inside of the storage cavity, and the air guide back shell is positioned outside the storage cavity;
the finned radiating tube assembly is positioned at the upper section of the cabinet body and used for radiating heat of the radiator;
the air inlet is located at the lower section of the storage cavity, and the air outlet is located at the upper section of the storage cavity.
6. A wine cabinet as claimed in claim 5, wherein the finned heat dissipation tube assembly comprises: a liquid flow tube and a first fin assembly;
a heat dissipation cavity is arranged inside the heat radiator;
the liquid flow pipes are inserted into the fin assemblies in an arched manner;
the liquid flow output end of the heat dissipation cavity is communicated with the liquid flow input end of the liquid flow pipe; and the liquid flow output end of the liquid flow pipe is communicated with the liquid flow input end of the heat dissipation cavity.
7. A wine cabinet, comprising: the cabinet body, the air-cooled radiating assembly and the air duct structure for improving the temperature uniformity in the refrigerator as claimed in claim 3 or 4;
a storage cavity is arranged in the cabinet body;
the side wall of the storage cavity is provided with an air guide window part;
the air duct structure is embedded in the air guide window part, the air inlet panel faces the storage cavity, and the air guide back shell is positioned outside the storage cavity;
the air-cooled heat dissipation assembly is positioned at the upper section of the cabinet body and used for dissipating heat of the radiator;
the air inlet is located in the middle section of the storage cavity, and the air outlet is located in the upper section of the storage cavity.
8. A wine cabinet according to claim 7, wherein the air-cooled heat dissipation assembly comprises a heat dissipation fan; the heat sink is a second fin assembly;
the heat conducting surface of the second fin assembly is attached to the heating end of the semiconductor refrigerating device, and the cooling fan is attached to any other side surface of the second fin assembly.
9. A wine cabinet according to claim 5 or 7, wherein the wine cabinet includes at least two storage chambers, each storage chamber having the air duct structure therein.
10. A wine cabinet according to claim 5 or 7, wherein the air duct structure is arranged such that the distance between the air inlet and the air outlet is greater than two thirds of the height of the storage chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123124056.2U CN216953683U (en) | 2021-12-13 | 2021-12-13 | Improve wind channel structure and gradevin of incasement temperature degree of consistency |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123124056.2U CN216953683U (en) | 2021-12-13 | 2021-12-13 | Improve wind channel structure and gradevin of incasement temperature degree of consistency |
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| Publication Number | Publication Date |
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| CN216953683U true CN216953683U (en) | 2022-07-12 |
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| CN202123124056.2U Active CN216953683U (en) | 2021-12-13 | 2021-12-13 | Improve wind channel structure and gradevin of incasement temperature degree of consistency |
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| Country | Link |
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- 2021-12-13 CN CN202123124056.2U patent/CN216953683U/en active Active
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