CN204787401U - Semiconductor refrigeration device - Google Patents
Semiconductor refrigeration device Download PDFInfo
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- CN204787401U CN204787401U CN201520187092.9U CN201520187092U CN204787401U CN 204787401 U CN204787401 U CN 204787401U CN 201520187092 U CN201520187092 U CN 201520187092U CN 204787401 U CN204787401 U CN 204787401U
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- heat conduction
- inner bag
- semiconductor
- incubator
- cooling device
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Abstract
The utility model provides a semiconductor refrigeration device, including the insulation can and the door body, still including being located two the semiconductor refrigeration modules in insulation can upper portion and lower part respectively, the semiconductor refrigeration module includes the semiconductor refrigeration piece, the wind channel, the fan, radiator and baffle, the radiator is provided with fin group, fin group is including the multi -disc fin, the fan hides the positive terminal surface in fin group, the fin histotope is between baffle and wind channel, form the wind groove between two adjacent fin, wind groove and wind channel intercommunication, the fan, wind groove and wind channel form the cooling air flow path, the hot junction and the radiator heat conduction of semiconductor refrigeration piece are connected, are provided with the heat conduction inner bag in the insulation can, and the cold junction of one of them semiconductor refrigeration piece is connected with the upper portion heat conduction of heat conduction inner bag, and the cold junction of another semiconductor refrigeration piece is connected with the lower part heat conduction of heat conduction inner bag. The realization reduces semiconductor refrigeration device's operating noise and reduces the energy consumption.
Description
Technical field
The utility model relates to refrigerating plant, particularly relates to a kind of semiconductor cooling device.
Background technology
At present, in fast food restaurant, usually need to refrigerate some beverages or liquid milk product, and refrigeration plant of the prior art adopts compressor to freeze usually, but, this will cause the volume of refrigeration plant excessive, and in order to meet the requirement of small size in prior art, usual employing semiconductor chilling plate freezes, under normal circumstances, at the back of thermal-insulating body, multiple semiconductor chilling plate is set, and in order to the cryogenic temperature realized in thermal-insulating body even, the cold that semiconductor chilling plate produces is sent in thermal-insulating body by usual employing fan, but, in actual use, fan will produce noise when running and need to consume more electricity, the noise causing semiconductor cooling device of the prior art is comparatively large and energy consumption is higher.
Summary of the invention
Technical problem to be solved in the utility model is: provide a kind of semiconductor cooling device, the comparatively large and defect that energy consumption is higher of the noise solving semiconductor cooling device in prior art, realizes reducing the operation noise of semiconductor cooling device and reduces energy consumption.
The technical scheme that the utility model provides is, a kind of semiconductor cooling device, comprise incubator and be connected to the door body on described incubator, also comprise and lay respectively at two, described incubator upper and lower semiconductor refrigerating module, described semiconductor refrigerating module comprises semiconductor chilling plate, air channel, fan, radiator and baffle plate, described radiator is provided with groups of fins, described groups of fins comprises multi-disc fin, described fan hides the front end face in described groups of fins, described groups of fins is between described baffle plate and described air channel, described baffle plate hides in a side end face of described groups of fins, described air channel hides the opposite side end face in described groups of fins, wind groove is formed between fin described in adjacent two panels, described wind groove is communicated with described air channel, described fan, described wind groove and described air channel form cooling air stream, the hot junction of described semiconductor chilling plate is connected with described radiator heat conduction, heat conduction inner bag is provided with in described incubator, wherein the cold junction of semiconductor chilling plate described in one and the upper guide of described heat conduction inner bag thermally coupled, the cold junction of semiconductor chilling plate described in another and the lower guide of described heat conduction inner bag thermally coupled.
Further, heat-conducting plate is provided with between the cold junction of described semiconductor chilling plate and described heat conduction inner bag.
Further, the upper and lower of described incubator is respectively arranged with cover body, forms wind chamber between described cover body and described incubator, described cover body is provided with exhaust outlet and inlet scoop, described semiconductor refrigerating module is arranged in described wind chamber, and described air channel is connected with described exhaust outlet.
Further, the back of described cover body is provided with described inlet scoop.
Further, described inner bag is bent into by inverted T shape sheet material, wherein, described inverted T shape sheet material forms bottom section, two lateral region, dorsal area and top area, two described lateral region are positioned at the both sides of described bottom section, and described dorsal area is between described top area and described bottom section; Described lateral region is connected to form described inner bag with described dorsal area and described top area respectively.
Further, described incubator is also provided with the socket being communicated with described heat conduction inner bag internal cavity, described socket is provided with dismountable plug.
Further, the shell of described incubator is also provided with the first intubate extended inward, described heat conduction inner bag is provided with the second intubate extended outward, described first intubate and described second intubate are connected to form described socket, and described first intubate is provided with dismountable plug.
Further, described first intubate is inserted in described second intubate.
Further, the two side of described incubator is respectively arranged with described socket.
The semiconductor cooling device that the utility model provides, by arranging heat conduction inner bag in incubator, and semiconductor chilling plate is set in the upper and lower of heat conduction inner bag, the cold that the semiconductor chilling plate being positioned at heat conduction inner bag top produces is treated chilled goods in the mode of self-heating sedimentation from top by heat conduction inner bag top and is freezed, and the cold that the semiconductor chilling plate being positioned at heat conduction inner bag bottom produces directly is freezed to the cold storage container be placed on heat conduction interior plate from bottom by heat conduction inner bag, the cold of the semiconductor chilling plate of bottom can carry out fast-refrigerating to the bottom of cold storage container fast and effectively, simultaneously, cold can disperse by heat conduction inner bag rapidly and uniformly, thus make the article to be refrigerated in heat conduction inner bag all can comparatively evenly and freeze fast, the cold that semiconductor chilling plate produces adopts from heat conducting mode, without the need to adopting fan inside, realization reduces the operation noise of semiconductor cooling device and reduces energy consumption, in addition, for the fin in the radiator that dispels the heat to semiconductor chilling plate and fan, baffle plate and air channel form the heat dissipation channel of relative closure, extraneous cold wind is sucked by fan, flow in air channel along the path that the fin of radiator is formed, absorb the heat that radiator sheds, because radiator side is provided with baffle plate, therefore hot blast only can be discharged along air channel, realize carrying out pressure to the heat that radiator sheds to discharge, improve radiating efficiency, to meet the cooling requirements of semiconductor chilling plate, guarantee that semiconductor chilling plate produces enough colds and freezes, simultaneously, the power of fan can be reduced, and then further reduce energy consumption.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of the utility model semiconductor cooling device embodiment;
Fig. 2 is the explosive view of the utility model semiconductor cooling device embodiment;
Fig. 3 is the sectional view of the utility model semiconductor cooling device embodiment;
Fig. 4 is the expansion schematic diagram of heat-preservation liner in the utility model semiconductor cooling device embodiment;
Fig. 5 is the partial sectional view of incubator in the utility model semiconductor cooling device embodiment;
Fig. 6 is the structural representation of semiconductor-on-insulator refrigeration module in the utility model semiconductor cooling device embodiment;
Fig. 7 is the structural representation of upper radiator in the utility model semiconductor cooling device embodiment.
Detailed description of the invention
For making the object of the utility model embodiment, technical scheme and advantage clearly, below in conjunction with the accompanying drawing in the utility model embodiment, technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
As shown in Fig. 1-Fig. 7, the present embodiment semiconductor cooling device, the door body 2 comprising incubator 1 and be connected on described incubator 1, also comprise the semiconductor-on-insulator refrigeration module 3 being positioned at described incubator 1 top and the lower semiconductor refrigeration module 4 being positioned at described incubator bottom, described semiconductor-on-insulator refrigeration module 3 comprises semiconductor-on-insulator cooling piece 31, described lower semiconductor refrigeration module 4 comprises lower semiconductor cooling piece 41, heat conduction inner bag 11 is provided with in described incubator 1, the cold junction of described semiconductor-on-insulator cooling piece 31 is connected with the top heat conduction of described heat conduction inner bag 11, the cold junction of described lower semiconductor cooling piece 41 is connected with the bottom heat conduction of described heat conduction inner bag 11.
Specifically, the incubator 1 in the present embodiment semiconductor cooling device adopts heat conduction inner bag 11, and wherein heat conduction inner bag 11 adopts Heat Conduction Material to freeze, such as: adopt metal material, as aluminum liner.And in order to realize Blower-free refrigeration in heat conduction inner bag 11, in the upper and lower of heat conduction inner bag 11, correspondence is provided with semiconductor-on-insulator cooling piece 31 and lower semiconductor cooling piece 41 respectively respectively, is be placed on the cold storage container 5 being contained with milk in heat conduction inner bag 11 to be described below for article to be refrigerated.In use, cold storage container 5 is placed in heat conduction inner bag 11, the bottom of cold storage container 5 is directly attached to the bottom of heat conduction inner bag 11, the cold that lower semiconductor cooling piece 41 produces directly can be freezed to the milk in cold storage container 5 fast and effectively by the bottom of heat conduction inner bag 11, simultaneously, the cold that the semiconductor-on-insulator cooling piece 31 being positioned at heat conduction inner bag 11 top produces adopts the mode of natural subsidence to freeze to cold storage container 5 from top to bottom, cold under natural subsidence first cools the top of cold storage container 5, cold is in continuation sinking watching, the outer wall of cold storage container 5 will be freezed simultaneously, meanwhile, cold also can be passed to sidepiece and back by the bottom of heat conduction inner bag 11 and top, and the further outer wall to cold storage container 5 from the side freezes by heat conduction inner bag 11, thus realizes cold storage container 5 and catch a cold comparatively uniformly.In the process of freezing to cold storage container 5, without the need to adopting blower fan, the operation noise of semiconductor cooling device can be reduced and reduce energy consumption.Wherein, heat-conducting plate 311 is provided with between semiconductor-on-insulator cooling piece 31 and described heat conduction inner bag 11, and between lower semiconductor cooling piece 41 and described heat conduction inner bag 11, being provided with heat-conducting plate 411, the cold that semiconductor chilling plate can be made to produce by heat-conducting plate 311 and heat-conducting plate 411 passes to heat conduction inner bag 11 more rapidly and uniformly.In addition, the present embodiment semiconductor cooling device is usually placed on sales counter in fast service restaurant industry, corresponding, and the bottom of incubator 1 can be provided with supporting leg 6, and the height of supporting leg 6 is between 95mm-100mm.
Wherein, the similar of the semiconductor-on-insulator refrigeration module 3 in the present embodiment and lower semiconductor refrigeration module 4, above semiconductor refrigerating module 3 is example, in order to improve the radiating efficiency in semiconductor chilling plate hot junction, semiconductor-on-insulator refrigeration module 3 also comprises air channel 34, upper fan 33, upper radiator 32 and baffle plate 35, described upper heat radiation 32 pieces abuts in the hot junction heat conduction connection with it of described semiconductor-on-insulator cooling piece 31, described upper radiator 32 is provided with groups of fins, described groups of fins comprises multi-disc fin 321, described upper fan 33 hides the front end face in described groups of fins, described groups of fins is between described baffle plate 35 and described air channel 34, described baffle plate 35 hides the side end face in described groups of fins, described air channel 34 hides the opposite side end face in described groups of fins, wind groove is formed between fin 321 described in adjacent two panels, described wind groove is communicated with described air channel 34, described upper fan 33, described wind groove and described air channel 34 form cooling air stream.Concrete, upper fan 33 is energized, extraneous cold wind enters into described in adjacent two panels and forms wind groove between fin 321, because one end of upper radiator 32 is sheltered from by baffle plate 35, make the wind entering into wind groove can only enter into air channel 34, the heat shed by upper radiator 32 is forced to discharge, to guarantee that heat can distribute by upper radiator 32 as early as possible, guarantee that semiconductor-on-insulator cooling piece 31 can normally work, and adopt air channel 34 to introduce cold wind, the air outlet in air channel 34 is directly towards upper radiator 32, the upper fan 33 of smaller size smaller and power can be adopted to realize the radiating requirements of semiconductor-on-insulator cooling piece 31, thus the upper fan noise of the present embodiment semiconductor cooling device can be reduced, improve user's comfort, and be positioned at the top of incubator 1 due to semiconductor-on-insulator refrigeration module 3, in order to improve aesthetics, the top of described incubator 1 is provided with upper outlet body 12, windward chamber is formed between described upper outlet body 12 and described incubator 1, described upper outlet body 12 is provided with exhaust outlet (not shown) and inlet scoop (not shown), described air channel 34 and described upper radiator 32 are arranged in described windward chamber, and described air channel 34 is communicated with exhaust outlet.Concrete, the semiconductor-on-insulator refrigeration air channel 34 of module 3 and the structure of upper radiator 32 can be sheltered from by upper outlet body 12, make the outward appearance of the present embodiment semiconductor cooling device more attractive in appearance.Preferably, the back of upper outlet body 12 is provided with described inlet scoop, the both sides of described upper outlet body 12 are provided with described exhaust outlet, inlet scoop and exhaust outlet are separated from each other out, the hot blast of cold wind and the discharge sucked is avoided mutually to disturb, meanwhile, the wind that air channel 34 exports is discharged from the behind of the present embodiment semiconductor cooling device, littlely can fall apart thermogenetic noise to the impact of user.In addition, corresponding, described lower semiconductor refrigeration module 4 also comprises lower fan 43, lower radiator 42, lower air duct 44 and lower baffle plate 45, and the bottom of incubator 1 is provided with lower cover 13, leeward chamber is formed, described lower fan 43 between described lower cover 13 and described incubator 1.Described lower radiator 42 and lower air duct 44 are arranged in described leeward chamber.
Further, in order to optimize the heat conductivility of heat conduction inner bag 11, realize the quick conduction of cold, heat conduction inner bag 11 is bent into by inverted T shape sheet material 110, wherein, described inverted T shape sheet material 110 forms the both sides that bottom section 111, two lateral region 112, dorsal area 113 and top area 114, two described lateral region 112 are positioned at described bottom section 111, and described dorsal area 113 is between described top area 114 and described bottom section 111; Described lateral region 112 is connected to form described heat conduction inner bag 11 with described dorsal area 113 and described top area 114 respectively.Concrete, heat conduction inner bag 11 adopts inverted T shape sheet material 110 to be bent into, lower semiconductor cooling piece 41 is connected with bottom section 111 heat conduction, semiconductor-on-insulator cooling piece 31 is connected with top area 114 heat conduction, in use, the cold of bottom section 111 can be delivered to lateral region 112 place fast, and the cold of top area 114 can be delivered to dorsal area 113 place fast, thus lateral region 112 and dorsal area 113 also can be freezed to cold storage container 5 more efficiently, be more conducive to cold storage container 5 and catch a cold uniformly.
The present embodiment semiconductor cooling device, by arranging heat conduction inner bag in incubator, and semiconductor chilling plate is set in the upper and lower of heat conduction inner bag, the cold that the semiconductor chilling plate being positioned at heat conduction inner bag top produces is treated chilled goods in the mode of self-heating sedimentation from top by heat conduction inner bag top and is freezed, and the cold that the semiconductor chilling plate being positioned at heat conduction inner bag bottom produces directly is freezed to the cold storage container be placed on heat conduction interior plate from bottom by heat conduction inner bag, the cold of the semiconductor chilling plate of bottom can carry out fast-refrigerating to the bottom of cold storage container fast and effectively, simultaneously, cold can disperse by heat conduction inner bag rapidly and uniformly, thus make the article to be refrigerated in heat conduction inner bag all can comparatively evenly and freeze fast, the cold that semiconductor chilling plate produces adopts from heat conducting mode, without the need to adopting fan inside, realization reduces the operation noise of semiconductor cooling device and reduces energy consumption, in addition, for the fin in the radiator that dispels the heat to semiconductor chilling plate and fan, baffle plate and air channel form the heat dissipation channel of relative closure, extraneous cold wind is sucked by fan, flow in air channel along the path that the fin of radiator is formed, absorb the heat that radiator sheds, because radiator side is provided with baffle plate, therefore hot blast only can be discharged along air channel, realize carrying out pressure to the heat that radiator sheds to discharge, improve radiating efficiency, to meet the cooling requirements of semiconductor chilling plate, guarantee that semiconductor chilling plate produces enough colds and freezes, simultaneously, the power of fan can be reduced, and then further reduce energy consumption.
Based on technique scheme, optionally, in order to reduce switch gate number of times in the liquid process after exporting refrigeration, as shown in Figure 1 and Figure 5, described incubator 1 is also provided with the socket 10 being communicated with described heat conduction inner bag 11 internal cavity, described socket 10 is provided with dismountable plug 100.Concrete, the cold storage container 5 being contained with milk in heat conduction inner bag 11 can be exported by the pipeline through socket 10, thus without the need to frequent switch gate body 2, reduces scattering and disappearing, to reduce energy consumption of cold.Wherein, the shell of incubator 1 is also provided with the first intubate 101 extended inward, described heat conduction inner bag 11 is provided with the second intubate 102 extended outward, described first intubate 101 is connected to form described socket 10 with described second intubate 102, described first intubate 101 is provided with dismountable plug, wherein, scattered and disappeared by socket 10 to reduce cold, first intubate 101 is inserted in described second intubate 102, be clipped between the first intubate 101 and the heat-insulation layer of incubator 1 with the second intubate 102 made, reduce heat conduction inner bag 11 and extraneous heat exchange amount.In addition, described socket 10 can be respectively arranged with as required on the two side of incubator 1.
Last it is noted that above embodiment is only in order to illustrate the technical solution of the utility model, be not intended to limit; Although be described in detail the utility model with reference to previous embodiment, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein portion of techniques feature; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the spirit and scope of each embodiment technical scheme of the utility model.
Claims (9)
1. a semiconductor cooling device, comprise incubator and be connected to the door body on described incubator, it is characterized in that, also comprise and lay respectively at two, described incubator upper and lower semiconductor refrigerating module, described semiconductor refrigerating module comprises semiconductor chilling plate, air channel, fan, radiator and baffle plate, described radiator is provided with groups of fins, described groups of fins comprises multi-disc fin, described fan hides the front end face in described groups of fins, described groups of fins is between described baffle plate and described air channel, described baffle plate hides in a side end face of described groups of fins, described air channel hides the opposite side end face in described groups of fins, wind groove is formed between fin described in adjacent two panels, described wind groove is communicated with described air channel, described fan, described wind groove and described air channel form cooling air stream, the hot junction of described semiconductor chilling plate is connected with described radiator heat conduction, heat conduction inner bag is provided with in described incubator, wherein the cold junction of semiconductor chilling plate described in one and the upper guide of described heat conduction inner bag thermally coupled, the cold junction of semiconductor chilling plate described in another and the lower guide of described heat conduction inner bag thermally coupled.
2. semiconductor cooling device according to claim 1, is characterized in that, is provided with heat-conducting plate between the cold junction of described semiconductor chilling plate and described heat conduction inner bag.
3. semiconductor cooling device according to claim 1, it is characterized in that, the upper and lower of described incubator is respectively arranged with cover body, wind chamber is formed between described cover body and described incubator, described cover body is provided with exhaust outlet and inlet scoop, described semiconductor refrigerating module is arranged in described wind chamber, and described air channel is connected with described exhaust outlet.
4. semiconductor cooling device according to claim 3, is characterized in that, the back of described cover body is provided with described inlet scoop.
5. semiconductor cooling device according to claim 1, it is characterized in that, described inner bag is bent into by inverted T shape sheet material, wherein, described inverted T shape sheet material forms bottom section, two lateral region, dorsal area and top area, two described lateral region are positioned at the both sides of described bottom section, and described dorsal area is between described top area and described bottom section; Described lateral region is connected to form described inner bag with described dorsal area and described top area respectively.
6. semiconductor cooling device according to claim 1, is characterized in that, described incubator is also provided with the socket being communicated with described heat conduction inner bag internal cavity, described socket is provided with dismountable plug.
7. semiconductor cooling device according to claim 6, it is characterized in that, the shell of described incubator is also provided with the first intubate extended inward, described heat conduction inner bag is provided with the second intubate extended outward, described first intubate and described second intubate are connected to form described socket, and described first intubate is provided with dismountable plug.
8. semiconductor cooling device according to claim 7, is characterized in that, described first intubate is inserted in described second intubate.
9. semiconductor cooling device according to claim 6, is characterized in that, the two side of described incubator is respectively arranged with described socket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520187092.9U CN204787401U (en) | 2015-03-31 | 2015-03-31 | Semiconductor refrigeration device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520187092.9U CN204787401U (en) | 2015-03-31 | 2015-03-31 | Semiconductor refrigeration device |
Publications (1)
| Publication Number | Publication Date |
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| CN204787401U true CN204787401U (en) | 2015-11-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520187092.9U Expired - Fee Related CN204787401U (en) | 2015-03-31 | 2015-03-31 | Semiconductor refrigeration device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106152597A (en) * | 2015-03-31 | 2016-11-23 | 青岛海尔特种电冰柜有限公司 | Semiconductor cooling device and refrigerating method |
| CN107131706A (en) * | 2017-05-31 | 2017-09-05 | 安徽金诚天骏汽车零部件制造有限公司 | The mounting structure of semiconductor chilling plate and radiating tube |
| CN108379607A (en) * | 2018-05-08 | 2018-08-10 | 广东美的厨房电器制造有限公司 | Disinfection cabinet |
-
2015
- 2015-03-31 CN CN201520187092.9U patent/CN204787401U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106152597A (en) * | 2015-03-31 | 2016-11-23 | 青岛海尔特种电冰柜有限公司 | Semiconductor cooling device and refrigerating method |
| CN107131706A (en) * | 2017-05-31 | 2017-09-05 | 安徽金诚天骏汽车零部件制造有限公司 | The mounting structure of semiconductor chilling plate and radiating tube |
| CN108379607A (en) * | 2018-05-08 | 2018-08-10 | 广东美的厨房电器制造有限公司 | Disinfection cabinet |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151118 Termination date: 20190331 |
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| CF01 | Termination of patent right due to non-payment of annual fee |