CN204594006U - semiconductor refrigerating box - Google Patents
semiconductor refrigerating box Download PDFInfo
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- CN204594006U CN204594006U CN201520167156.9U CN201520167156U CN204594006U CN 204594006 U CN204594006 U CN 204594006U CN 201520167156 U CN201520167156 U CN 201520167156U CN 204594006 U CN204594006 U CN 204594006U
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Abstract
The utility model provides a kind of semiconductor refrigerating box.Semiconductor refrigerating box comprises incubator and is connected to the door body on described incubator, also comprise the semiconductor-on-insulator refrigeration module being positioned at described incubator top and the lower semiconductor refrigeration module being positioned at described incubator bottom, described semiconductor-on-insulator refrigeration module comprises semiconductor-on-insulator cooling piece, described lower semiconductor refrigeration module comprises lower semiconductor cooling piece, heat conduction inner bag is provided with in described incubator, the cold junction of described semiconductor-on-insulator cooling piece is connected with the top heat conduction of described heat conduction inner bag, and the cold junction of described lower semiconductor cooling piece is connected with the bottom heat conduction of described heat conduction inner bag.Realize the operation noise of reduction semiconductor refrigerating box and reduce energy consumption.
Description
Technical field
The utility model relates to refrigerating plant, particularly relates to a kind of semiconductor refrigerating box.
Background technology
At present, in fast food restaurant, usually need to refrigerate some beverages or liquid milk product, and refrigeration plant of the prior art adopts compressor to freeze usually, but, this will cause the volume of refrigeration plant excessive, and in order to meet the requirement of small size in prior art, usual employing semiconductor chilling plate freezes, under normal circumstances, at the back of thermal-insulating body, multiple semiconductor chilling plate is set, and in order to the cryogenic temperature realized in thermal-insulating body even, the cold that semiconductor chilling plate produces is sent in thermal-insulating body by usual employing fan, but, in actual use, fan will produce noise when running and need to consume more electricity, the noise causing semiconductor refrigerating equipment of the prior art is comparatively large and energy consumption is higher.
Summary of the invention
Technical problem to be solved in the utility model is: provide a kind of semiconductor refrigerating box, the comparatively large and defect that energy consumption is higher of the noise solving semiconductor refrigerating equipment in prior art, realizes reducing the operation noise of semiconductor refrigerating box and reduces energy consumption.
The technical scheme that the utility model provides is, a kind of semiconductor refrigerating box, comprise incubator and be connected to the door body on described incubator, also comprise the semiconductor-on-insulator refrigeration module being positioned at described incubator top and the lower semiconductor refrigeration module being positioned at described incubator bottom, described semiconductor-on-insulator refrigeration module comprises semiconductor-on-insulator cooling piece, described lower semiconductor refrigeration module comprises lower semiconductor cooling piece, heat conduction inner bag is provided with in described incubator, the cold junction of described semiconductor-on-insulator cooling piece is connected with the top heat conduction of described heat conduction inner bag, the cold junction of described lower semiconductor cooling piece is connected with the bottom heat conduction of described heat conduction inner bag.
Further, described semiconductor-on-insulator refrigeration module also comprises air inlet duct, upper fan and upper radiating block, described upper radiating block abuts in the hot junction of described semiconductor-on-insulator cooling piece, and described upper fan is arranged in described air inlet duct, and the air outlet of described air inlet duct is towards described upper radiating block.
Further, the top of described incubator is provided with cover body, forms windward chamber between described cover body and described incubator, described cover body is provided with exhaust outlet and inlet scoop, described air inlet duct and described upper radiating block are arranged in described windward chamber, and the air inlet of described air inlet duct is communicated with described inlet scoop.
Further, the back of described cover body is provided with described inlet scoop, and the both sides of described cover body are provided with described exhaust outlet.
Further, described lower semiconductor refrigeration module also comprises lower fan and lower radiating block, and described lower radiating block abuts in the hot junction of described lower semiconductor cooling piece, and described lower fan is fixed on described lower radiating block.
Further, the bottom of described incubator is provided with base plate, forms leeward chamber between described base plate and described incubator, and described base plate is provided with ventilating opening, and described lower fan and described lower radiating block are arranged in described leeward chamber.
Further, described heat conduction inner bag is bent into by inverted T shape sheet material, wherein, described inverted T shape sheet material forms bottom section, two lateral region, dorsal area and top area, two described lateral region are positioned at the both sides of described bottom section, and described dorsal area is between described top area and described bottom section; Described lateral region is connected to form described heat conduction inner bag with described dorsal area and described top area respectively.
Further, described incubator is also provided with the socket being communicated with described heat conduction inner bag internal cavity, described socket is provided with dismountable plug.
Further, the shell of described incubator is also provided with the first intubate extended inward, described heat conduction inner bag is provided with the second intubate extended outward, described first intubate and described second intubate are connected to form described socket, and described first intubate is provided with dismountable plug.
The semiconductor refrigerating box that the utility model provides, by arranging heat conduction inner bag in incubator, and semiconductor chilling plate is set in the upper and lower of heat conduction inner bag, wherein, the cold that lower semiconductor cooling piece produces directly is freezed to the article to be refrigerated be placed on heat conduction interior plate from bottom by heat conduction inner bag, fast-refrigerating is carried out in the bottom that the cold of lower semiconductor cooling piece can treat chilled goods fast and effectively, and the cold that the semiconductor-on-insulator cooling piece being positioned at heat conduction inner bag top produces is treated chilled goods in the mode of self-heating sedimentation from top by heat conduction inner bag top and is freezed, thus make article to be refrigerated all have enough cold refrigeration in upper and lower, and conduct to sidepiece and back with top cold bottom heat conduction inner bag, freeze with the outer wall treating chilled goods, realization is treated chilled goods and is carried out comparatively evenly and freeze fast, the cold that semiconductor chilling plate produces adopts from heat conducting mode, without the need to adopting fan inside, realization reduces the operation noise of semiconductor refrigerating box and reduces energy consumption.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of the utility model semiconductor refrigerating box embodiment;
Fig. 2 is the explosive view of the utility model semiconductor refrigerating box embodiment;
Fig. 3 is the sectional view of the utility model semiconductor refrigerating box embodiment;
Fig. 4 is the expansion schematic diagram of heat-preservation liner in the utility model semiconductor refrigerating box embodiment;
Fig. 5 is the partial sectional view of incubator in the utility model semiconductor refrigerating box embodiment.
Detailed description of the invention
For making the object of the utility model embodiment, technical scheme and advantage clearly, below in conjunction with the accompanying drawing in the utility model embodiment, technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
As shown in Figure 1-Figure 3, the present embodiment semiconductor refrigerating box, the door body 2 comprising incubator 1 and be connected on described incubator 1, also comprise the semiconductor-on-insulator refrigeration module 3 being positioned at described incubator 1 top and the lower semiconductor refrigeration module 4 being positioned at described incubator bottom, described semiconductor-on-insulator refrigeration module 3 comprises semiconductor-on-insulator cooling piece 31, described lower semiconductor refrigeration module 4 comprises lower semiconductor cooling piece 41, heat conduction inner bag 11 is provided with in described incubator 1, the cold junction of described semiconductor-on-insulator cooling piece 31 is connected with the top heat conduction of described heat conduction inner bag 11, the cold junction of described lower semiconductor cooling piece 41 is connected with the bottom heat conduction of described heat conduction inner bag 11.
Specifically, the incubator 1 in the present embodiment semiconductor refrigerating box adopts heat conduction inner bag 11, and wherein heat conduction inner bag 11 adopts Heat Conduction Material to freeze, such as: adopt metal material, as aluminum liner.And in order to realize Blower-free refrigeration in heat conduction inner bag 11, in the upper and lower of heat conduction inner bag 11, correspondence is provided with semiconductor-on-insulator cooling piece 31 and lower semiconductor cooling piece 41 respectively respectively, is be placed on the cold storage container 5 being contained with milk in heat conduction inner bag 11 to be described below for article to be refrigerated.In use, cold storage container 5 is placed in heat conduction inner bag 11, the bottom of cold storage container 5 is directly attached to the bottom of heat conduction inner bag 11, the cold that lower semiconductor cooling piece 41 produces directly can be freezed to the milk in cold storage container 5 fast and effectively by the bottom of heat conduction inner bag 11, simultaneously, the cold that the semiconductor-on-insulator cooling piece 31 being positioned at heat conduction inner bag 11 top produces adopts the mode of natural subsidence to freeze to cold storage container 5 from top to bottom, cold under natural subsidence first cools the top of cold storage container 5, cold is in continuation sinking watching, the outer wall of cold storage container 5 will be freezed simultaneously, meanwhile, cold also can be passed to sidepiece and back by the bottom of heat conduction inner bag 11 and top, and the further outer wall to cold storage container 5 from the side freezes by heat conduction inner bag 11, thus realizes cold storage container 5 and catch a cold comparatively uniformly.In the process of freezing to cold storage container 5, without the need to adopting blower fan, the operation noise of semiconductor refrigerating box can be reduced and reduce energy consumption.Wherein, heat-conducting plate 311 is provided with between semiconductor-on-insulator cooling piece 31 and described heat conduction inner bag 11, and between lower semiconductor cooling piece 41 and described heat conduction inner bag 11, being provided with heat-conducting plate 411, the cold that semiconductor chilling plate can be made to produce by heat-conducting plate 311 and heat-conducting plate 411 passes to heat conduction inner bag 11 more rapidly and uniformly.In addition, the present embodiment semiconductor refrigerating box is usually placed on sales counter in fast service restaurant industry, corresponding, and the bottom of incubator 1 can be provided with supporting leg 6, and the height of supporting leg 6 is between 95mm-100mm.
Further, in order to improve the radiating efficiency in semiconductor chilling plate hot junction, semiconductor-on-insulator refrigeration module 3 also comprises air inlet duct 34, upper fan 33 and upper radiating block 32, described upper heat radiation 32 pieces abuts in the hot junction of described semiconductor-on-insulator cooling piece 31, described upper fan 33 is arranged in described air inlet duct 34, and the air outlet of described air inlet duct 34 is towards described upper radiating block 32.Concrete, by air inlet duct 34 extraneous cold wind sucked after upper fan 33 is energized and blow to radiating block 32, to guarantee that heat can distribute by radiating block 32 as early as possible, guarantee that semiconductor-on-insulator cooling piece 31 can normally work, and adopt air inlet duct 34 to introduce cold wind, the air outlet of air inlet duct 34 is directly towards radiating block 32, the upper fan 33 of smaller size smaller and power can be adopted to realize the radiating requirements of semiconductor-on-insulator cooling piece 31, thus the upper fan noise of the present embodiment semiconductor refrigerating box can be reduced, improve user's comfort; And be positioned at the top of incubator 1 due to semiconductor-on-insulator refrigeration module 3, in order to improve aesthetics, the top of described incubator 1 is provided with cover body 12, windward chamber 120 is formed between described cover body 12 and described incubator 1, described cover body 12 is provided with exhaust outlet (not shown) and inlet scoop (not shown), described air inlet duct 34 and described upper radiating block 32 are arranged in described windward chamber 120, and the air inlet of described air inlet duct 34 is communicated with described inlet scoop.Concrete, the semiconductor-on-insulator refrigeration air inlet duct 34 of module 3 and the structure of upper radiating block 32 can be sheltered from by cover body 12, make the outward appearance of the present embodiment semiconductor refrigerating box more attractive in appearance.Preferably, the back of cover body 12 is provided with described inlet scoop, the both sides of described cover body 12 are provided with described exhaust outlet, inlet scoop and exhaust outlet are separated from each other out, the hot blast of cold wind and the discharge sucked is avoided mutually to disturb, meanwhile, cold wind sucks from the behind of the present embodiment semiconductor refrigerating box, can the noise that produces of less air draught on the impact of user.Wherein, the overall structure of air inlet duct 34 can adopt the version diminished gradually to air outlet direction area of section along air inlet, such as: the air inlet of air inlet duct 34 is bell-mouth structure of air, the area of air inlet is larger, and the area of air outlet is less, air inlet duct 34 is made to export the cold airflow of higher speed, the radiating efficiency of radiating block 32 in quickening.
Further again, described lower semiconductor refrigeration module 4 also comprises lower fan 43 and lower radiating block 42, and described lower radiating block 42 abuts in the hot junction of described lower semiconductor cooling piece 41, and described lower fan 43 is fixed on described lower radiating block 42.Concrete, because lower semiconductor refrigeration module 4 is positioned at the bottom of incubator 1, the powerful lower fan 43 meeting cooling requirements can be adopted to dispel the heat, and the bottom of incubator 1 is provided with base plate 13, leeward chamber 130 is formed between described base plate 13 and described incubator 1, described base plate 13 is provided with ventilating opening (not shown), described lower fan 43 and described lower radiating block 42 are arranged in described leeward chamber 130.
Further, in order to optimize the heat conductivility of heat conduction inner bag 11, realize the quick conduction of cold, heat conduction inner bag 11 is bent into by inverted T shape sheet material 110, wherein, described inverted T shape sheet material 110 forms the both sides that bottom section 111, two lateral region 112, dorsal area 113 and top area 114, two described lateral region 112 are positioned at described bottom section 111, and described dorsal area 113 is between described top area 114 and described bottom section 111; Described lateral region 112 is connected to form described heat conduction inner bag 11 with described dorsal area 113 and described top area 114 respectively.Concrete, heat conduction inner bag 11 adopts inverted T shape sheet material 110 to be bent into, lower semiconductor cooling piece 41 is connected with bottom section 111 heat conduction, semiconductor-on-insulator cooling piece 31 is connected with top area 114 heat conduction, in use, the cold of bottom section 111 can be delivered to lateral region 112 place fast, and the cold of top area 114 can be delivered to dorsal area 113 place fast, thus lateral region 112 and dorsal area 113 also can be freezed to cold storage container 5 more efficiently, be more conducive to cold storage container 5 and catch a cold uniformly.
The present embodiment semiconductor refrigerating box, by arranging heat conduction inner bag in incubator, and semiconductor chilling plate is set in the upper and lower of heat conduction inner bag, wherein, the cold that lower semiconductor cooling piece produces directly is freezed to the article to be refrigerated be placed on heat conduction interior plate from bottom by heat conduction inner bag, fast-refrigerating is carried out in the bottom that the cold of lower semiconductor cooling piece can treat chilled goods fast and effectively, and the cold that the semiconductor-on-insulator cooling piece being positioned at heat conduction inner bag top produces is treated chilled goods in the mode of self-heating sedimentation from top by heat conduction inner bag top and is freezed, thus make article to be refrigerated all have enough cold refrigeration in upper and lower, and conduct to sidepiece and back with top cold bottom heat conduction inner bag, freeze with the outer wall treating chilled goods, realization is treated chilled goods and is carried out comparatively evenly and freeze fast, the cold that semiconductor chilling plate produces adopts from heat conducting mode, without the need to adopting fan inside, realization reduces the operation noise of semiconductor refrigerating box and reduces energy consumption.
Based on technique scheme, optionally, in order to reduce switch gate number of times in the liquid process after exporting refrigeration, as shown in Figure 1 and Figure 5, described incubator 1 is also provided with the socket 10 being communicated with described heat conduction inner bag 11 internal cavity, described socket 10 is provided with dismountable plug 100.Concrete, the cold storage container 5 being contained with milk in heat conduction inner bag 11 can be exported by the pipeline through socket 10, thus without the need to frequent switch gate body 2, reduces scattering and disappearing, to reduce energy consumption of cold.Wherein, the shell of incubator 1 is also provided with the first intubate 101 extended inward, described heat conduction inner bag 11 is provided with the second intubate 102 extended outward, described first intubate 101 is connected to form described socket 10 with described second intubate 102, described first intubate 101 is provided with dismountable plug, wherein, scattered and disappeared by socket 10 to reduce cold, first intubate 101 is inserted in described second intubate 102, be clipped between the first intubate 101 and the heat-insulation layer of incubator 1 with the second intubate 102 made, reduce heat conduction inner bag 11 and extraneous heat exchange amount.In addition, described socket 10 can be respectively arranged with as required on the two side of incubator 1.
The utility model also provides a kind of refrigerating method, adopts above-mentioned semiconductor refrigerating box; Refrigerating method is:
Cold is directly passed to the bottom of heat conduction inner bag by the semiconductor-on-insulator cooling piece of semiconductor-on-insulator refrigeration module, is directly freezed to article to be refrigerated heat conduction inner bag from bottom by heat conduction inner bag;
Cold is directly passed to the top of heat conduction inner bag by the lower semiconductor cooling piece of lower semiconductor refrigeration module, and the to be refrigerated article of cold natural subsidence to below at heat conduction inner bag top freeze;
The bottom of heat conduction inner bag and top are to both sides and back conduction cold, and the back of heat conduction inner bag and both sides released cold quantity are treated chilled goods and freezed.
The present embodiment refrigerating method, by arranging heat conduction inner bag in incubator, and semiconductor chilling plate is set in the upper and lower of heat conduction inner bag, wherein, the cold that lower semiconductor cooling piece produces directly is freezed to the article to be refrigerated be placed on heat conduction interior plate from bottom by heat conduction inner bag, fast-refrigerating is carried out in the bottom that the cold of lower semiconductor cooling piece can treat chilled goods fast and effectively, and the cold that the semiconductor-on-insulator cooling piece being positioned at heat conduction inner bag top produces is treated chilled goods in the mode of self-heating sedimentation from top by heat conduction inner bag top and is freezed, thus make article to be refrigerated all have enough cold refrigeration in upper and lower, and conduct to sidepiece and back with top cold bottom heat conduction inner bag, freeze with the outer wall treating chilled goods, realization is treated chilled goods and is carried out comparatively evenly and freeze fast, the cold that semiconductor chilling plate produces adopts from heat conducting mode, without the need to adopting fan inside, realization reduces the operation noise of semiconductor refrigerating box and reduces energy consumption.
Last it is noted that above embodiment is only in order to illustrate the technical solution of the utility model, be not intended to limit; Although be described in detail the utility model with reference to previous embodiment, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein portion of techniques feature; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the spirit and scope of each embodiment technical scheme of the utility model.
Claims (9)
1. a semiconductor refrigerating box, comprise incubator and be connected to the door body on described incubator, it is characterized in that, also comprise the semiconductor-on-insulator refrigeration module being positioned at described incubator top and the lower semiconductor refrigeration module being positioned at described incubator bottom, described semiconductor-on-insulator refrigeration module comprises semiconductor-on-insulator cooling piece, described lower semiconductor refrigeration module comprises lower semiconductor cooling piece, heat conduction inner bag is provided with in described incubator, the cold junction of described semiconductor-on-insulator cooling piece is connected with the top heat conduction of described heat conduction inner bag, the cold junction of described lower semiconductor cooling piece is connected with the bottom heat conduction of described heat conduction inner bag.
2. semiconductor refrigerating box according to claim 1, it is characterized in that, described semiconductor-on-insulator refrigeration module also comprises air inlet duct, upper fan and upper radiating block, described upper radiating block abuts in the hot junction of described semiconductor-on-insulator cooling piece, described upper fan is arranged in described air inlet duct, and the air outlet of described air inlet duct is towards described upper radiating block.
3. semiconductor refrigerating box according to claim 2, it is characterized in that, the top of described incubator is provided with cover body, windward chamber is formed between described cover body and described incubator, described cover body is provided with exhaust outlet and inlet scoop, described air inlet duct and described upper radiating block are arranged in described windward chamber, and the air inlet of described air inlet duct is communicated with described inlet scoop.
4. semiconductor refrigerating box according to claim 3, is characterized in that, the back of described cover body is provided with described inlet scoop, and the both sides of described cover body are provided with described exhaust outlet.
5. semiconductor refrigerating box according to claim 1, it is characterized in that, described lower semiconductor refrigeration module also comprises lower fan and lower radiating block, and described lower radiating block abuts in the hot junction of described lower semiconductor cooling piece, and described lower fan is fixed on described lower radiating block.
6. semiconductor refrigerating box according to claim 5, it is characterized in that, the bottom of described incubator is provided with base plate, forms leeward chamber between described base plate and described incubator, described base plate is provided with ventilating opening, and described lower fan and described lower radiating block are arranged in described leeward chamber.
7. semiconductor refrigerating box according to claim 1, it is characterized in that, described heat conduction inner bag is bent into by inverted T shape sheet material, wherein, described inverted T shape sheet material forms bottom section, two lateral region, dorsal area and top area, two described lateral region are positioned at the both sides of described bottom section, and described dorsal area is between described top area and described bottom section; Described lateral region is connected to form described heat conduction inner bag with described dorsal area and described top area respectively.
8. semiconductor refrigerating box according to claim 1, is characterized in that, described incubator is also provided with the socket being communicated with described heat conduction inner bag internal cavity, described socket is provided with dismountable plug.
9. semiconductor refrigerating box according to claim 8, it is characterized in that, the shell of described incubator is also provided with the first intubate extended inward, described heat conduction inner bag is provided with the second intubate extended outward, described first intubate and described second intubate are connected to form described socket, and described first intubate is provided with dismountable plug.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520167156.9U CN204594006U (en) | 2015-03-24 | 2015-03-24 | semiconductor refrigerating box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520167156.9U CN204594006U (en) | 2015-03-24 | 2015-03-24 | semiconductor refrigerating box |
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| Publication Number | Publication Date |
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| CN204594006U true CN204594006U (en) | 2015-08-26 |
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| CN201520167156.9U Active CN204594006U (en) | 2015-03-24 | 2015-03-24 | semiconductor refrigerating box |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106152653A (en) * | 2015-03-24 | 2016-11-23 | 青岛海尔特种电冰柜有限公司 | Semiconductor refrigerating box and refrigerating method |
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2015
- 2015-03-24 CN CN201520167156.9U patent/CN204594006U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106152653A (en) * | 2015-03-24 | 2016-11-23 | 青岛海尔特种电冰柜有限公司 | Semiconductor refrigerating box and refrigerating method |
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