CN106152653A - Semiconductor refrigerating box and refrigerating method - Google Patents
Semiconductor refrigerating box and refrigerating method Download PDFInfo
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- CN106152653A CN106152653A CN201510129634.1A CN201510129634A CN106152653A CN 106152653 A CN106152653 A CN 106152653A CN 201510129634 A CN201510129634 A CN 201510129634A CN 106152653 A CN106152653 A CN 106152653A
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Abstract
The present invention provides a kind of semiconductor refrigerating box and refrigerating method.Semiconductor refrigerating box, including couveuse and the door body being connected on described couveuse, also include the semiconductor-on-insulator refrigeration module being positioned at described couveuse top and be positioned at the lower semiconductor refrigeration module of described couveuse bottom, described semiconductor-on-insulator refrigeration module includes semiconductor-on-insulator cooling piece, described lower semiconductor refrigeration module includes lower semiconductor cooling piece, described couveuse is provided with heat conduction inner bag, the cold end of described semiconductor-on-insulator cooling piece is connected with the top heat conduction of described heat conduction inner bag, and the cold end of described lower semiconductor cooling piece is connected with the bottom heat conduction of described heat conduction inner bag.Realize reducing the operation noise of semiconductor refrigerating box and reducing energy consumption.
Description
Technical field
The present invention relates to refrigerating plant, particularly relate to a kind of semiconductor refrigerating box and refrigerating method.
Background technology
At present, in fast food restaurant, typically require and some beverages or liquid milk product are carried out cold preservation, and refrigeration plant of the prior art generally uses compressor to freeze, but, this is by excessive for the volume causing refrigeration plant, and in order to meet the requirement of small size in prior art, semiconductor chilling plate is generally used to freeze, under normal circumstances, at the back of thermal-insulating body, multiple semiconductor chilling plate is set, and cryogenic temperature in order to realize in thermal-insulating body is uniform, fan is generally used to be sent in thermal-insulating body by the cold that semiconductor chilling plate produces, but, in actual use, fan will produce noise and need to consume more electricity when running, cause the noise of semiconductor refrigerating equipment of the prior art relatively big and energy consumption is higher.
Summary of the invention
The technical problem to be solved is: provide a kind of semiconductor refrigerating box and refrigerating method, solves the defect that in prior art, the noise of semiconductor refrigerating equipment is relatively big and energy consumption is higher, it is achieved reduce the operation noise of semiconductor refrigerating box and reduce energy consumption.
The technical scheme that the present invention provides is, a kind of semiconductor refrigerating box, including couveuse and the door body being connected on described couveuse, also include the semiconductor-on-insulator refrigeration module being positioned at described couveuse top and be positioned at the lower semiconductor refrigeration module of described couveuse bottom, described semiconductor-on-insulator refrigeration module includes semiconductor-on-insulator cooling piece, described lower semiconductor refrigeration module includes lower semiconductor cooling piece, described couveuse is provided with heat conduction inner bag, the cold end of described semiconductor-on-insulator cooling piece is connected with the top heat conduction of described heat conduction inner bag, the cold end of described lower semiconductor cooling piece is connected with the bottom heat conduction of described heat conduction inner bag.
Further, described semiconductor-on-insulator refrigeration module also includes intake air way, upper fan and upper radiating block, described upper radiating block abuts in the hot junction of described semiconductor-on-insulator cooling piece, and described upper fan is positioned in described intake air way, and the air outlet of described intake air way is towards described upper radiating block.
Further, the top of described couveuse is provided with cover body, forms windward chamber, described cover body is provided with exhaust outlet and inlet scoop between described cover body and described couveuse, described intake air way and described upper radiating block are positioned in described windward chamber, and the air inlet of described intake air way connects with described inlet scoop.
Further, the back of described cover body is provided with described inlet scoop, and the both sides of described cover body are provided with described exhaust outlet.
Further, described lower semiconductor refrigeration module also includes lower fan and lower radiating block, and described lower radiating block abuts in the hot junction of described lower semiconductor cooling piece, and described lower fan is fixed on described lower radiating block.
Further, the bottom of described couveuse is provided with base plate, forms leeward chamber, described base plate is provided with vent, described lower fan and described lower radiating block and is positioned in described leeward chamber between described base plate and described couveuse.
Further, described heat conduction inner bag is bent into by inverted T shape sheet material, wherein, described inverted T shape sheet material forms bottom section, two lateral region, dorsal area and top area, two described lateral region are positioned at the both sides of described bottom section, and described dorsal area is between described top area and described bottom section；Described lateral region is connected the described heat conduction inner bag of formation respectively with described dorsal area and described top area.
Further, described couveuse is additionally provided with the socket connecting described heat conduction inner bag internal cavity, described socket is provided with dismountable plug.
Further, it is additionally provided with first extended inward on the shell of described couveuse to intubate, be provided with second extended outward on described heat conduction inner bag to intubate, described first intubate intubate with described second be connected formation described socket, described first intubate on be provided with dismountable plug.
The present invention also provides for a kind of refrigerating method, uses above-mentioned semiconductor refrigerating box；Refrigerating method is:
Cold is directly passed to the bottom of heat conduction inner bag by the semiconductor-on-insulator cooling piece of semiconductor-on-insulator refrigeration module, heat conduction inner bag directly freeze article to be refrigerated heat conduction inner bag from bottom；
Cold is directly passed to the top of heat conduction inner bag by the lower semiconductor cooling piece of lower semiconductor refrigeration module, and the article to be refrigerated of lower section are freezed by the cold natural subsidence at heat conduction inner bag top；
Cold is conducted to both sides and back in bottom and the top of heat conduction inner bag, and the back of heat conduction inner bag and both sides released cold quantity are treated chilled goods and freezed.
nullThe semiconductor refrigerating box of present invention offer and refrigerating method，By arranging heat conduction inner bag in couveuse，And semiconductor chilling plate is set in the upper and lower of heat conduction inner bag，Wherein，The article to be refrigerated being placed on heat conduction interior plate are directly freezed from bottom by the cold that lower semiconductor cooling piece produces by heat conduction inner bag，The cold of lower semiconductor cooling piece can be treated the bottom of chilled goods fast and effectively and carry out fast-refrigerating，And the cold that the semiconductor-on-insulator cooling piece being positioned at heat conduction inner bag top produces is treated chilled goods from top and is freezed by the way of heat conduction inner bag top is with self-heating sedimentation，So that article to be refrigerated all have enough colds to freeze in upper and lower，And bottom heat conduction inner bag and top cold conducts to sidepiece and back，Freeze treating the outer wall of chilled goods，Realization is treated chilled goods and is carried out the most uniformly and quickly freezing，The cold that semiconductor chilling plate produces uses the mode from conduction of heat，Without using fan inside，Realize reducing the operation noise of semiconductor refrigerating box and reducing energy consumption.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in describing below is some embodiments of the present invention, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the structural representation of semiconductor refrigerating box embodiment of the present invention；
Fig. 2 is the explosive view of semiconductor refrigerating box embodiment of the present invention；
Fig. 3 is the sectional view of semiconductor refrigerating box embodiment of the present invention；
Fig. 4 is the expansion schematic diagram of heat-preservation liner in semiconductor refrigerating box embodiment of the present invention；
Fig. 5 is the partial sectional view of couveuse in semiconductor refrigerating box embodiment of the present invention.
Detailed description of the invention
For making the purpose of the embodiment of the present invention, technical scheme and advantage clearer, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is a part of embodiment of the present invention rather than whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art are obtained under not making creative work premise, broadly fall into the scope of protection of the invention.
As shown in Figure 1-Figure 3, the present embodiment semiconductor refrigerating box, including couveuse 1 and the door body 2 being connected on described couveuse 1, also include the semiconductor-on-insulator refrigeration module 3 being positioned at described couveuse 1 top and be positioned at the lower semiconductor refrigeration module 4 of described couveuse bottom, described semiconductor-on-insulator refrigeration module 3 includes semiconductor-on-insulator cooling piece 31, described lower semiconductor refrigeration module 4 includes lower semiconductor cooling piece 41, described couveuse 1 is provided with heat conduction inner bag 11, the cold end of described semiconductor-on-insulator cooling piece 31 is connected with the top heat conduction of described heat conduction inner bag 11, the cold end of described lower semiconductor cooling piece 41 is connected with the bottom heat conduction of described heat conduction inner bag 11.
Specifically, the couveuse 1 in the present embodiment semiconductor refrigerating box uses heat conduction inner bag 11, and wherein heat conduction inner bag 11 uses Heat Conduction Material to freeze, such as: use metal material, such as aluminum liner.And in order to realize Blower-free refrigeration in heat conduction inner bag 11, it is correspondingly arranged on semiconductor-on-insulator cooling piece 31 and lower semiconductor cooling piece 41 respectively in the upper and lower of heat conduction inner bag 11 respectively, is to illustrate as a example by the cold storage container 5 being placed on and being contained with milk in heat conduction inner bag 11 by article to be refrigerated below.In use, cold storage container 5 is placed in heat conduction inner bag 11, the bottom of cold storage container 5 is placed directly against the bottom of heat conduction inner bag 11, milk in cold storage container 5 directly can be freezed fast and effectively by the cold that lower semiconductor cooling piece 41 produces by the bottom of heat conduction inner bag 11, simultaneously, the cold of semiconductor-on-insulator cooling piece 31 generation being positioned at heat conduction inner bag 11 top uses the mode of natural subsidence from top to bottom to freeze cold storage container 5, the top of cold storage container 5 is first cooled down by the cold under natural subsidence, cold is in continuing sinking watching, the outer wall of cold storage container 5 will be freezed simultaneously；Meanwhile, cold also can be passed to sidepiece and back by the bottom of heat conduction inner bag 11 and top, and the outer wall of cold storage container 5 further will be freezed by heat conduction inner bag 11 from side, thus realize cold storage container 5 and catch a cold the most uniformly.During cold storage container 5 is freezed, it is not necessary to use blower fan, the operation noise of semiconductor refrigerating box can be reduced and reduce energy consumption.Wherein, it is provided with heat-conducting plate 311 between semiconductor-on-insulator cooling piece 31 and described heat conduction inner bag 11, and between lower semiconductor cooling piece 41 and described heat conduction inner bag 11, it being provided with heat-conducting plate 411, the cold being enabled to semiconductor chilling plate generation by heat-conducting plate 311 and heat-conducting plate 411 passes to heat conduction inner bag 11 more rapidly and uniformly.It addition, the present embodiment semiconductor refrigerating box is generally positioned on sales counter in fast service restaurant industry, corresponding, the bottom of couveuse 1 can be provided with supporting leg 6, and the height of supporting leg 6 is between 95mm-100mm.
Further, in order to improve the radiating efficiency in semiconductor chilling plate hot junction, semiconductor-on-insulator refrigeration module 3 also includes intake air way 34, upper fan 33 and upper radiating block 32, described upper heat radiation 32 pieces abuts in the hot junction of described semiconductor-on-insulator cooling piece 31, described upper fan 33 is positioned in described intake air way 34, and the air outlet of described intake air way 34 is towards described upper radiating block 32.Concrete, by intake air way 34, external world's cold wind is sucked and blows to radiating block 32 after the energising of upper fan 33, to guarantee that heat can be distributed by radiating block 32 as early as possible, guarantee that semiconductor-on-insulator cooling piece 31 can normally work, and use intake air way 34 to introduce cold wind, the air outlet of intake air way 34 is directly toward radiating block 32, the upper fan 33 that can use smaller size smaller and power realizes the radiating requirements of semiconductor-on-insulator cooling piece 31, such that it is able to reduce the upper fan noise of the present embodiment semiconductor refrigerating box, improve user's comfort；And owing to semiconductor-on-insulator refrigeration module 3 is positioned at the top of couveuse 1, in order to improve aesthetics, the top of described couveuse 1 is provided with cover body 12, windward chamber 120 is formed between described cover body 12 and described couveuse 1, exhaust outlet (not shown) and inlet scoop (not shown) it is provided with on described cover body 12, described intake air way 34 and described upper radiating block 32 are positioned in described windward chamber 120, and the air inlet of described intake air way 34 connects with described inlet scoop.Concrete, intake air way 34 and the structure of upper radiating block 32 of semiconductor-on-insulator refrigeration module 3 can be sheltered from by cover body 12 so that the outward appearance of the present embodiment semiconductor refrigerating box is more attractive in appearance.Preferably, the back of cover body 12 is provided with described inlet scoop, the both sides of described cover body 12 are provided with described exhaust outlet, inlet scoop and exhaust outlet are separated from each other, the hot blast avoiding cold wind and the discharge sucked interferes, meanwhile, cold wind sucks from the behind of the present embodiment semiconductor refrigerating box, can the noise impact on user that produces of less air draught.Wherein, the overall structure of intake air way 34 can use the version tapered into along air inlet to air outlet direction area of section, such as: the air inlet of intake air way 34 is bell-mouth structure of air, the area of air inlet is bigger, and the area of air outlet is less, intake air way 34 is made to export the cold airflow of higher speed, the radiating efficiency of radiating block 32 in quickening.
Further, described lower semiconductor refrigeration module 4 also includes lower fan 43 and lower radiating block 42, and described lower radiating block 42 abuts in the hot junction of described lower semiconductor cooling piece 41, and described lower fan 43 is fixed on described lower radiating block 42.Concrete, owing to lower semiconductor refrigeration module 4 is positioned at the bottom of couveuse 1, the powerful lower fan 43 meeting cooling requirements can be used to dispel the heat, and the bottom of couveuse 1 is provided with base plate 13, leeward chamber 130 is formed between described base plate 13 and described couveuse 1, being provided with vent (not shown) on described base plate 13, described lower fan 43 and described lower radiating block 42 are positioned in described leeward chamber 130.
Further, in order to optimize the heat conductivility of heat conduction inner bag 11, realize the quick conduction of cold, heat conduction inner bag 11 is bent into by inverted T shape sheet material 110, wherein, described inverted T shape sheet material 110 forms 111, two lateral region 112 of bottom section, dorsal area 113 and top area 114, and two described lateral region 112 are positioned at the both sides of described bottom section 111, and described dorsal area 113 is between described top area 114 and described bottom section 111；Described lateral region 112 is connected the described heat conduction inner bag 11 of formation respectively with described dorsal area 113 and described top area 114.Concrete, heat conduction inner bag 11 uses inverted T shape sheet material 110 to be bent into, lower semiconductor cooling piece 41 is connected with bottom section 111 heat conduction, semiconductor-on-insulator cooling piece 31 is connected with top area 114 heat conduction, in use, the cold of bottom section 111 can quickly be delivered at lateral region 112, and the cold of top area 114 can quickly be delivered at dorsal area 113, so that cold storage container 5 also can be freezed by lateral region 112 and dorsal area 113 more efficiently, it is more beneficial for cold storage container 5 and catches a cold uniformly.
nullThe present embodiment semiconductor refrigerating box，By arranging heat conduction inner bag in couveuse，And semiconductor chilling plate is set in the upper and lower of heat conduction inner bag，Wherein，The article to be refrigerated being placed on heat conduction interior plate are directly freezed from bottom by the cold that lower semiconductor cooling piece produces by heat conduction inner bag，The cold of lower semiconductor cooling piece can be treated the bottom of chilled goods fast and effectively and carry out fast-refrigerating，And the cold that the semiconductor-on-insulator cooling piece being positioned at heat conduction inner bag top produces is treated chilled goods from top and is freezed by the way of heat conduction inner bag top is with self-heating sedimentation，So that article to be refrigerated all have enough colds to freeze in upper and lower，And bottom heat conduction inner bag and top cold conducts to sidepiece and back，Freeze treating the outer wall of chilled goods，Realization is treated chilled goods and is carried out the most uniformly and quickly freezing，The cold that semiconductor chilling plate produces uses the mode from conduction of heat，Without using fan inside，Realize reducing the operation noise of semiconductor refrigerating box and reducing energy consumption.
Based on technique scheme, optionally, in order to the liquid process after output refrigeration reducing switch gate number of times, as shown in Figure 1 and Figure 5, it is additionally provided with the socket 10 connecting described heat conduction inner bag 11 internal cavity on described couveuse 1, described socket 10 is provided with dismountable plug 100.Concrete, the cold storage container 5 being contained with milk in heat conduction inner bag 11 can be exported by the pipeline through socket 10, thus without frequently switching on door body 2, reduces scattering and disappearing, to reduce energy consumption of cold.Wherein, it is additionally provided with first extended inward on the shell of couveuse 1 and intubates 101, it is provided with second extended outward on described heat conduction inner bag 11 and intubates 102, described first intubates 101 intubates 102 and is connected and forms described socket 10 with described second, described first intubates and is provided with dismountable plug on 101, wherein, scattered and disappeared by socket 10 to reduce cold, first intubates 101 is inserted in described second and intubates in 102, so that second intubate 102 and be clipped in first and intubate between 101 and the heat-insulation layer of couveuse 1, reduce heat conduction inner bag 11 and extraneous heat exchange amount.Furthermore it is possible to be respectively arranged with described socket 10 as required on the two side of couveuse 1.
The present invention also provides for a kind of refrigerating method, uses above-mentioned semiconductor refrigerating box；Refrigerating method is:
Cold is directly passed to the bottom of heat conduction inner bag by the semiconductor-on-insulator cooling piece of semiconductor-on-insulator refrigeration module, heat conduction inner bag directly freeze article to be refrigerated heat conduction inner bag from bottom；
Cold is directly passed to the top of heat conduction inner bag by the lower semiconductor cooling piece of lower semiconductor refrigeration module, and the article to be refrigerated of lower section are freezed by the cold natural subsidence at heat conduction inner bag top；
Cold is conducted to both sides and back in bottom and the top of heat conduction inner bag, and the back of heat conduction inner bag and both sides released cold quantity are treated chilled goods and freezed.
nullThe present embodiment refrigerating method，By arranging heat conduction inner bag in couveuse，And semiconductor chilling plate is set in the upper and lower of heat conduction inner bag，Wherein，The article to be refrigerated being placed on heat conduction interior plate are directly freezed from bottom by the cold that lower semiconductor cooling piece produces by heat conduction inner bag，The cold of lower semiconductor cooling piece can be treated the bottom of chilled goods fast and effectively and carry out fast-refrigerating，And the cold that the semiconductor-on-insulator cooling piece being positioned at heat conduction inner bag top produces is treated chilled goods from top and is freezed by the way of heat conduction inner bag top is with self-heating sedimentation，So that article to be refrigerated all have enough colds to freeze in upper and lower，And bottom heat conduction inner bag and top cold conducts to sidepiece and back，Freeze treating the outer wall of chilled goods，Realization is treated chilled goods and is carried out the most uniformly and quickly freezing，The cold that semiconductor chilling plate produces uses the mode from conduction of heat，Without using fan inside，Realize reducing the operation noise of semiconductor refrigerating box and reducing energy consumption.
Last it is noted that above example is only in order to illustrate technical scheme, it is not intended to limit；Although the present invention being described in detail with reference to previous embodiment, it will be understood by those within the art that: the technical scheme described in foregoing embodiments still can be modified by it, or wherein portion of techniques feature is carried out equivalent；And these amendments or replacement, do not make the essence of appropriate technical solution depart from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (10)
1. a semiconductor refrigerating box, including couveuse and the door body being connected on described couveuse, it is characterized in that, also include the semiconductor-on-insulator refrigeration module being positioned at described couveuse top and be positioned at the lower semiconductor refrigeration module of described couveuse bottom, described semiconductor-on-insulator refrigeration module includes semiconductor-on-insulator cooling piece, described lower semiconductor refrigeration module includes lower semiconductor cooling piece, described couveuse is provided with heat conduction inner bag, the cold end of described semiconductor-on-insulator cooling piece is connected with the top heat conduction of described heat conduction inner bag, the cold end of described lower semiconductor cooling piece is connected with the bottom heat conduction of described heat conduction inner bag.
Semiconductor refrigerating box the most according to claim 1, it is characterized in that, described semiconductor-on-insulator refrigeration module also includes intake air way, upper fan and upper radiating block, described upper radiating block abuts in the hot junction of described semiconductor-on-insulator cooling piece, described upper fan is positioned in described intake air way, and the air outlet of described intake air way is towards described upper radiating block.
Semiconductor refrigerating box the most according to claim 2, it is characterized in that, the top of described couveuse is provided with cover body, windward chamber is formed between described cover body and described couveuse, exhaust outlet and inlet scoop it is provided with on described cover body, described intake air way and described upper radiating block are positioned in described windward chamber, and the air inlet of described intake air way connects with described inlet scoop.
Semiconductor refrigerating box the most according to claim 3, it is characterised in that the back of described cover body is provided with described inlet scoop, the both sides of described cover body are provided with described exhaust outlet.
Semiconductor refrigerating box the most according to claim 1, it is characterized in that, described lower semiconductor refrigeration module also includes lower fan and lower radiating block, and described lower radiating block abuts in the hot junction of described lower semiconductor cooling piece, and described lower fan is fixed on described lower radiating block.
Semiconductor refrigerating box the most according to claim 5, it is characterized in that, the bottom of described couveuse is provided with base plate, forms leeward chamber between described base plate and described couveuse, it is provided with vent, described lower fan and described lower radiating block on described base plate to be positioned in described leeward chamber.
Semiconductor refrigerating box the most according to claim 1, it is characterized in that, described heat conduction inner bag is bent into by inverted T shape sheet material, wherein, described inverted T shape sheet material forms bottom section, two lateral region, dorsal area and top area, two described lateral region are positioned at the both sides of described bottom section, and described dorsal area is between described top area and described bottom section；Described lateral region is connected the described heat conduction inner bag of formation respectively with described dorsal area and described top area.
Semiconductor refrigerating box the most according to claim 1, it is characterised in that be additionally provided with the socket connecting described heat conduction inner bag internal cavity on described couveuse, described socket is provided with dismountable plug.
Semiconductor refrigerating box the most according to claim 8, it is characterized in that, it is additionally provided with first extended inward on the shell of described couveuse to intubate, it is provided with second extended outward on described heat conduction inner bag to intubate, described first intubate intubate with described second be connected formation described socket, described first intubate on be provided with dismountable plug.
10. a refrigerating method, it is characterised in that use the semiconductor refrigerating box as described in claim 1-9 is arbitrary；Refrigerating method is:
Cold is directly passed to the bottom of heat conduction inner bag by the semiconductor-on-insulator cooling piece of semiconductor-on-insulator refrigeration module, heat conduction inner bag directly freeze article to be refrigerated heat conduction inner bag from bottom；
Cold is directly passed to the top of heat conduction inner bag by the lower semiconductor cooling piece of lower semiconductor refrigeration module, and the article to be refrigerated of lower section are freezed by the cold natural subsidence at heat conduction inner bag top；
Cold is conducted to both sides and back in bottom and the top of heat conduction inner bag, and the back of heat conduction inner bag and both sides released cold quantity are treated chilled goods and freezed.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510129634.1A CN106152653A (en) | 2015-03-24 | 2015-03-24 | Semiconductor refrigerating box and refrigerating method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510129634.1A CN106152653A (en) | 2015-03-24 | 2015-03-24 | Semiconductor refrigerating box and refrigerating method |
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| CN201510129634.1A Pending CN106152653A (en) | 2015-03-24 | 2015-03-24 | Semiconductor refrigerating box and refrigerating method |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| GB1191450A (en) * | 1969-04-16 | 1970-05-13 | Siemens Ag | Thermally Insulating Containers. |
| CN2499771Y (en) * | 2001-08-30 | 2002-07-10 | 北京中农大话食品科技有限责任公司 | Special refrigerator for bagged drink |
| CN201116819Y (en) * | 2007-11-05 | 2008-09-17 | 广东富信电子科技有限公司 | Modified semiconductor refrigerator structure |
| CN201251254Y (en) * | 2008-08-01 | 2009-06-03 | 厦门蒙发利科技（集团）股份有限公司 | Heating and cooling air generating device |
| CN204594006U (en) * | 2015-03-24 | 2015-08-26 | 青岛海尔特种电冰柜有限公司 | semiconductor refrigerating box |
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2015
- 2015-03-24 CN CN201510129634.1A patent/CN106152653A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1191450A (en) * | 1969-04-16 | 1970-05-13 | Siemens Ag | Thermally Insulating Containers. |
| CN2499771Y (en) * | 2001-08-30 | 2002-07-10 | 北京中农大话食品科技有限责任公司 | Special refrigerator for bagged drink |
| CN201116819Y (en) * | 2007-11-05 | 2008-09-17 | 广东富信电子科技有限公司 | Modified semiconductor refrigerator structure |
| CN201251254Y (en) * | 2008-08-01 | 2009-06-03 | 厦门蒙发利科技（集团）股份有限公司 | Heating and cooling air generating device |
| CN204594006U (en) * | 2015-03-24 | 2015-08-26 | 青岛海尔特种电冰柜有限公司 | semiconductor refrigerating box |
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Application publication date: 20161123 |