CN205641667U - Semiconductor condenser - Google Patents
Semiconductor condenser Download PDFInfo
- Publication number
- CN205641667U CN205641667U CN201620329558.9U CN201620329558U CN205641667U CN 205641667 U CN205641667 U CN 205641667U CN 201620329558 U CN201620329558 U CN 201620329558U CN 205641667 U CN205641667 U CN 205641667U
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- Prior art keywords
- semiconductor
- conduction
- chilling plate
- heat
- semiconductor chilling
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Abstract
The utility model relates to a semiconductor condenser, include at least one semiconductor refrigeration piece, heat radiation structure, lead the cold junction and construct and shell structure, shell structure includes lagging casing and heat insulating board, the lagging casing is equipped with one and holds the recess, holds the recess and has an opening, the heat insulating board is installed and is being held the opening part of recess for heat insulating board and hold between the recess and to form a confined and hold the chamber, set up the through -hole that runs through its internal and external surface on the heat insulating board, heat radiation structure set up in the outside of heat insulating board, it sets up in holding the chamber to lead the cold junction structure, every semiconductor refrigeration piece inlays to be established in the through -hole of heat insulating board, the cold effect face connection of every semiconductor refrigeration piece is led the cold junction and is constructed, and heat radiation structure is connected to the fuel factor face of every semiconductor refrigeration piece. The utility model discloses can reduce air conditioning and leak, can take away the heat of fuel factor face fast to the cooling that reduces cold effect face leaks, can avoid simultaneously producing the heat exchange at the during operation between fuel factor face and the cold effect face.
Description
Technical field
This utility model relates to a kind of condenser, particularly to a kind of semiconductor cooling condenser, it is adaptable to refrigerator,
Refrigerator-freezer, the small-type refrigeration appliance such as red wine cabinet.
Background technology
At present, the use of semiconductor chilling plate is more and more extensive.Semiconductor chilling plate, is also thermoelectric cooling
Sheet, is a kind of heat pump.Its advantage is not have slide unit, applies and is restricted in some spaces, reliably
Property require height, without cold-producing medium pollution occasion.But semiconductor chilling plate is because of its volumetric constraint, its thermal effect
Answer face and cold effect surface relatively, operationally easily produce heat exchange each other, thus affect system
Cold efficiency.
Utility model content
In order to overcome the deficiencies in the prior art, the purpose of this utility model is to provide a kind of refrigerating efficiency high
Semiconductor cooling condenser, it can reduce cool air leakage, can quickly take away the heat in heat effect face, and reduce cold
The cooling of effect surface leaks, simultaneously it can be avoided that operationally produce heat between heat effect face and cold effect surface and hand over
Change.
For solving the problems referred to above, the technical scheme that the purpose of this utility model is used is as follows:
A kind of semiconductor cooling condenser, including at least one semiconductor chilling plate, radiator structure, conduction structure and
Shell structure;It is characterized in that:
Described shell structure includes that lagging casing and thermal insulation board, described lagging casing are provided with a pockets, institute
State pockets and there is an opening;Described thermal insulation board is arranged on the opening part of described pockets so that heat insulation
The receiving chamber of a closing is formed between plate and pockets;Offer on described thermal insulation board and run through appearance in it
The through hole in face, the quantity of described through hole is identical with the quantity of described semiconductor chilling plate;
Described radiator structure is arranged at the outside of the thermal insulation board of described shell structure;Described conduction structure is arranged
In the receiving chamber of described shell structure;Described each semiconductor chilling plate is embedded one at described thermal insulation board
In through hole;The cold effect surface of each semiconductor chilling plate connects conduction structure, the heat of each semiconductor chilling plate
Effect surface connects radiator structure.
As preferably, the quantity of described radiator structure is identical with the quantity of described semiconductor chilling plate;Each scattered
Heat structure includes radiator;Described radiator includes thermally contacting part, radiating piece and being connected to thermally contact part and dissipate
At least one heat pipe between warmware;The heat effect face of each thermo-contact part and a semiconductor chilling plate is even
Connect.
As preferably, described radiator structure also includes at least one fan being fixedly mounted on radiating piece.
As preferably, each fan is fixedly mounted on radiating piece by two cableties.
As preferably, each radiating piece is provided with two fans symmetrically.
As preferably, described radiating piece is all for the structure being made up of several aluminium flakes, and described thermo-contact part is copper
Block, described heat pipe is copper pipe.
As preferably, described conduction structure includes conduction cooling plate and conduction cooling pipe, and the one side of described conduction cooling plate is with every
The cold effect surface contact of individual semiconductor chilling plate;Described conduction cooling pipe is embedded on described conduction cooling plate, described conduction cooling
One end of pipe is positioned in receiving chamber, and its other end is protruding through described shell structure.
As preferably, described conduction cooling plate is copper coin;Described conduction cooling pipe is copper pipe.
As preferably, the quantity of described semiconductor chilling plate is two, and the quantity of described radiator structure is two,
The quantity of described conduction structure is one.
As preferably, it is detachably secured between described thermal insulation board with described lagging casing and is connected, institute
State to be detachably secured between radiator with described thermal insulation board and be connected.
Compared to existing technology, the beneficial effects of the utility model are:
1, this utility model is freezed by semiconductor chilling plate, is directly transmitted to cold on copper coin and copper pipe, then
Pass on the medium inside copper pipe, and the medium circulation inside copper pipe is walked about, thus taken away by medium cold
It is communicated to the position of required refrigeration.Cold guide apparatus insulation shell of the present utility model is wrapped in so that it is reduce
Cool air leakage.Semiconductor chilling plate of the present utility model heat effect face thermal insulation board separate, prevent heat radiation
The heat that structure and chip send is conducted to copper coin, simultaneously it can be avoided that between heat effect face and cold effect surface
Heat exchange is produced during work.
2, due to semiconductor chilling plate freeze time, another side is heating, so needing with radiator structure,
Radiator structure of the present utility model uses copper pipe and adds the fan of air-cooled forced convertion so that it is can quickly take away
Heat.
In sum, this utility model can reduce cool air leakage, can quickly take away the heat in heat effect face,
And the cooling reducing cold effect surface leaks, simultaneously it can be avoided that between heat effect face and cold effect surface operationally
Produce heat exchange, there is the advantage that refrigerating efficiency is high.
With detailed description of the invention, this utility model is described in further detail below in conjunction with the accompanying drawings.
Accompanying drawing explanation
Fig. 1 is the explosive view of the semiconductor cooling condenser described in embodiment 1.
Fig. 2 is the axonometric chart of the semiconductor cooling condenser described in embodiment 1.
Fig. 3 is the front view of the semiconductor cooling condenser described in embodiment 1.
Wherein, 1, semiconductor chilling plate;2, radiator structure;21, radiator;211, thermo-contact part;212、
Radiating piece;213, heat pipe;22, fan;23, cableties;3, conduction structure;31, conduction cooling plate;32、
Conduction cooling pipe;4, shell structure;41, lagging casing;42, thermal insulation board;421, through hole.
Detailed description of the invention
Embodiment 1:
With reference to Fig. 1-3, a kind of semiconductor cooling condenser described in the present embodiment, including two semiconductor chilling plates 1,
Radiator structure 2, conduction structure 3 and shell structure 4;
Described shell structure 4 includes that lagging casing 41 and thermal insulation board 42, described lagging casing 41 are provided with an appearance
Receiving groove, described pockets has an opening;Described thermal insulation board 42 is arranged on the opening of described pockets
Place so that form the receiving chamber of a closing between thermal insulation board 42 and pockets;On described thermal insulation board 42
Offer the through hole 421 running through its surfaces externally and internally, the quantity of described through hole 421 and described semiconductor chilling plate 1
Quantity identical;
Described radiator structure 2 is arranged at the outside of the thermal insulation board 42 of described shell structure 4;Described conduction cooling knot
Structure 3 is arranged in the receiving chamber of described shell structure 4;Described each semiconductor chilling plate 1 is embedded described
In one through hole 421 of thermal insulation board 42;The cold effect surface of each semiconductor chilling plate 1 connects conduction structure 3,
The heat effect face of each semiconductor chilling plate 1 connects radiator structure 2.
As preferably, the quantity of described radiator structure 2 is identical with the quantity of described semiconductor chilling plate 1;Often
Individual radiator structure 2 includes radiator 21;Described radiator 21 includes thermally contacting part 211, radiating piece 212 and
It is connected to thermally contact at least one heat pipe 213 between part 211 and radiating piece 212;Each thermo-contact part
211 are connected with the heat effect face of a semiconductor chilling plate 1.Described radiator structure 2 also includes being fixedly mounted on
Two fans 22 on radiating piece 212.Each fan 22 is fixedly mounted on radiating piece by two cableties 23
On 212.Two fans 22 are installed on each radiating piece 212 symmetrically.Described radiating piece 212 is all served as reasons
The structure of several aluminium flakes composition, described thermo-contact part 211 is copper billet, and described heat pipe 213 is copper pipe.
Described conduction structure 3 includes conduction cooling plate 31 and conduction cooling pipe 32, and the one side of described conduction cooling plate 31 is with every
The cold effect surface contact of individual semiconductor chilling plate 1;Described conduction cooling pipe 32 is embedded on described conduction cooling plate 31,
One end of described conduction cooling pipe 32 is positioned in receiving chamber, and its other end is protruding through described shell structure 4.
Described conduction cooling plate 31 is copper coin;Described conduction cooling pipe 32 is copper pipe.
The quantity of described semiconductor chilling plate 1 is two, and the quantity of described radiator structure 2 is two, described
The quantity of conduction structure 3 is one.With dismountable between described thermal insulation board 42 and described lagging casing 41
Mode is fixing to be connected, and is detachably secured and is connected between described radiator 21 and described heat sink.
Embodiment 2:
The feature of the present embodiment is: the quantity of described semiconductor chilling plate is one, the number of described radiator structure
Amount is one, and the quantity of described conduction structure is one.Other are same as in Example 1.
Other embodiments:
As preferably, the quantity of described semiconductor chilling plate is more than three, and the quantity of described radiator structure is
More than three.
As preferably, described heat pipe is aluminum heat pipe or rustless steel heat pipe.As preferably, described heat conduction
The inside sealing inner chamber of pipe is provided with gas, liquid, metallic particles or non-metallic particle.Described heat pipe
It is shaped as U-shaped, Z-shaped, L-shaped or " one " font.
As preferably, described radiating piece and/or thermo-contact part are by metal heat-conducting material or nonmetallic heat conductive material system
Form.As preferably, described metal heat-conducting material is aluminum, copper or rustless steel;Described nonmetallic heat conductive material
Material is graphite, pottery or diamond.
Above-mentioned embodiment is only preferred implementation of the present utility model, it is impossible to limit this practicality with this new
The scope of type protection, any unsubstantiality that those skilled in the art is done on the basis of this utility model
Change and replacement belong to this utility model scope required for protection.
Claims (10)
1. a semiconductor cooling condenser, including at least one semiconductor chilling plate, radiator structure, conduction structure
And shell structure;It is characterized in that:
Described shell structure includes that lagging casing and thermal insulation board, described lagging casing are provided with a pockets, institute
State pockets and there is an opening;Described thermal insulation board is arranged on the opening part of described pockets so that heat insulation
The receiving chamber of a closing is formed between plate and pockets;Offer on described thermal insulation board and run through appearance in it
The through hole in face, the quantity of described through hole is identical with the quantity of described semiconductor chilling plate;
Described radiator structure is arranged at the outside of the thermal insulation board of described shell structure;Described conduction structure is arranged at
In the receiving chamber of described shell structure;Described each semiconductor chilling plate is embedded and leads at one of described thermal insulation board
Kong Zhong;The cold effect surface of each semiconductor chilling plate connects conduction structure, the thermal effect of each semiconductor chilling plate
Face is answered to connect radiator structure.
Semiconductor cooling condenser the most according to claim 1, it is characterised in that the number of described radiator structure
Measure identical with the quantity of described semiconductor chilling plate;Each radiator structure includes radiator;Described radiator bag
Include thermo-contact part, radiating piece and be connected to thermally contact at least one heat pipe between part and radiating piece;Each
The heat effect face of thermo-contact part and a semiconductor chilling plate connects.
Semiconductor cooling condenser the most according to claim 2, it is characterised in that described radiator structure also wraps
Include at least one fan being fixedly mounted on radiating piece.
Semiconductor cooling condenser the most according to claim 3, it is characterised in that each fan passes through two
Cableties are fixedly mounted on radiating piece.
Semiconductor cooling condenser the most according to claim 4, it is characterised in that symmetrical on each radiating piece
Two fans are installed.
Semiconductor cooling condenser the most according to claim 2, it is characterised in that described radiating piece is all served as reasons
The structure of several aluminium flakes composition, described thermo-contact part is copper billet, and described heat pipe is copper pipe.
Semiconductor cooling condenser the most according to claim 1, it is characterised in that described conduction structure includes
Conduction cooling plate and conduction cooling pipe, the one side of described conduction cooling plate contacts with the cold effect surface of each semiconductor chilling plate;
Described conduction cooling pipe is embedded on described conduction cooling plate, and one end of described conduction cooling pipe is positioned in receiving chamber, its other end
Protruding through described shell structure.
Semiconductor cooling condenser the most according to claim 7, it is characterised in that described conduction cooling plate is copper coin;
Described conduction cooling pipe is copper pipe.
Semiconductor cooling condenser the most according to claim 1, it is characterised in that described semiconductor chilling plate
Quantity be two, the quantity of described radiator structure is two, and the quantity of described conduction structure is one.
Semiconductor cooling condenser the most according to claim 1, it is characterised in that described thermal insulation board and institute
State and between lagging casing, be detachably secured connection, with can between described radiator and described thermal insulation board
The mode of dismounting is fixing to be connected.
Priority Applications (1)
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CN201620329558.9U CN205641667U (en) | 2016-04-18 | 2016-04-18 | Semiconductor condenser |
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CN201620329558.9U CN205641667U (en) | 2016-04-18 | 2016-04-18 | Semiconductor condenser |
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CN205641667U true CN205641667U (en) | 2016-10-12 |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107477755A (en) * | 2017-09-20 | 2017-12-15 | 苏州三冷暖工程有限公司 | A kind of refrigeration of cubicle and the method for producing fresh air |
CN107525203A (en) * | 2017-09-20 | 2017-12-29 | 苏州三冷暖工程有限公司 | A kind of refrigeration aeration device suitable for small space |
CN108097475A (en) * | 2017-12-28 | 2018-06-01 | 江苏省肿瘤医院 | A kind of semiconductor temperature centrifuge |
CN108713920A (en) * | 2018-07-06 | 2018-10-30 | 深圳米露丝科技有限公司 | A kind of sitting board structure |
CN109469992A (en) * | 2018-12-06 | 2019-03-15 | 广州强睿电子有限公司 | A kind of Portable movable semiconductor refrigerating stick |
CN110094898A (en) * | 2019-05-08 | 2019-08-06 | 洪诗婷 | A kind of small-sized quick semiconductor cooling device |
-
2016
- 2016-04-18 CN CN201620329558.9U patent/CN205641667U/en active Active
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107477755A (en) * | 2017-09-20 | 2017-12-15 | 苏州三冷暖工程有限公司 | A kind of refrigeration of cubicle and the method for producing fresh air |
CN107525203A (en) * | 2017-09-20 | 2017-12-29 | 苏州三冷暖工程有限公司 | A kind of refrigeration aeration device suitable for small space |
CN108097475A (en) * | 2017-12-28 | 2018-06-01 | 江苏省肿瘤医院 | A kind of semiconductor temperature centrifuge |
CN108713920A (en) * | 2018-07-06 | 2018-10-30 | 深圳米露丝科技有限公司 | A kind of sitting board structure |
CN109469992A (en) * | 2018-12-06 | 2019-03-15 | 广州强睿电子有限公司 | A kind of Portable movable semiconductor refrigerating stick |
CN110094898A (en) * | 2019-05-08 | 2019-08-06 | 洪诗婷 | A kind of small-sized quick semiconductor cooling device |
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