WO2018121429A1

WO2018121429A1 - Refrigerator having double refrigeration systems

Info

Publication number: WO2018121429A1
Application number: PCT/CN2017/117964
Authority: WO
Inventors: 聂圣源; 刘建如; 李伟
Original assignee: 青岛海尔股份有限公司
Priority date: 2016-12-26
Filing date: 2017-12-22
Publication date: 2018-07-05
Also published as: CN106766527A

Abstract

A refrigerator having double refrigeration systems. The refrigerator comprises a semiconductor refrigeration system and a compressor refrigeration system. The two refrigeration systems share a microchannel condenser (23). The microchannel condenser (23) can cool a refrigerant medium in a first loop of the semiconductor refrigeration system and a refrigerant medium in a second loop of the compressor refrigeration system simultaneously, and has a double-condensation effect.

Description

Refrigerator with dual refrigeration system

The present application claims the priority of the Chinese patent application entitled "A refrigerator having a dual refrigeration system", the application date is December 26, 2016, the application number is 201611220123.1, the entire contents of which are incorporated herein by reference. .

Technical field

The invention relates to the field of household appliances, and in particular to a refrigerator having a dual refrigeration system.

Background technique

As a container that keeps food or other items in a constant low temperature, the refrigerator has become one of the essential household appliances in modern homes. Conventional refrigerator refrigeration systems mainly include semiconductor refrigeration systems and compressor refrigeration systems. Usually, a refrigerator has only one refrigeration system, but as the user needs are diversified, it has now appeared in the same refrigerator. At the same time, there are several technical solutions for the refrigeration system.

Referring to FIG. 1, there is shown a prior art refrigerator having a semiconductor refrigeration system and a compressor refrigeration system, wherein the semiconductor refrigeration system is used for refrigeration in a refrigerating compartment, and the compressor refrigeration system is used in a freezing compartment. Room cooling, the two systems are independent of each other in hardware structure. For convenience of display, the compressor refrigeration system of the refrigerator shown in FIG. 1 only schematically shows the evaporator 11 and the evaporation fan 12 constituting the compressor refrigeration system; the semiconductor refrigeration module involved in the semiconductor refrigeration system in the refrigerator includes heat set in sequence The end fan 13, the hot end 14, the semiconductor refrigerating sheet 15, the cold end 16, and the cold end fan 17. The two sets of refrigeration systems involved in the refrigerator can separately cool the refrigerating compartment and the freezing compartment separately, but the following problems exist: the heat dissipating part of the hot end 14 of the semiconductor refrigerating module in the separately arranged semiconductor refrigeration system only passes The heat of the hot end fan 13 is dissipated, so that the heat dissipation efficiency of the hot end 14 is low, and the heat generated by the hot end cannot be taken away in time. The cooling effect of the semiconductor refrigeration system will be affected.

In view of this, it is necessary to provide an improved refrigerator to solve the above problems.

Summary of the invention

The present invention is directed to at least one of the technical problems existing in the prior art. To achieve the above object, the present invention provides a refrigerator having a dual refrigeration system, the specific design of which is as follows.

A refrigerator having a dual refrigeration system, the refrigerator including a semiconductor refrigeration system and a compressor refrigeration system, wherein the semiconductor refrigeration system includes a semiconductor refrigeration component and a heat dissipation pipe assembly connected to the semiconductor refrigeration component, the semiconductor refrigeration The assembly has a hot end requiring heat dissipation, the heat pipe assembly including a hot end heat pipe connected to the hot end and a microchannel condenser connected to the hot end heat pipe to form a first loop; the compressor refrigeration system including compression a capillary, an evaporator, a refrigerant conduit, and a microchannel condenser shared with the semiconductor refrigeration system, the refrigerant conduit sequentially communicating the compressor, the microchannel condenser, the capillary, the evaporator, and forming a second loop; The first circuit and the second circuit are each provided with a cold medium for transferring heat, and the microchannel condenser is used for heat dissipation of the cold medium.

Further, the microchannel condenser has a first refrigerant passage and a second refrigerant passage. The first refrigerant passage is disposed in the first circuit, and the second refrigerant passage is disposed in the second circuit.

Further, the microchannel condenser includes a plurality of microchannel tubes reciprocally folded and disposed in parallel with each other, and a liquid collecting tube disposed at two ends of the plurality of microchannel tubes, and the plurality of microchannel tubes are sequentially connected to the tubes of the collecting tube In the body communication, a spacer is disposed inside the liquid collecting pipe, and the spacer isolates the liquid collecting pipe into a first circuit collecting pipe respectively communicating with the first circuit to communicate with the second circuit a second circuit collecting pipe; a plurality of microchannel pipes communicating with the first circuit collecting pipe together to form the first refrigerant channel, and a plurality of microchannel pipes communicating with the second circuit collecting pipe to form the The second refrigerant channel.

Further, the refrigerator further includes a condensation fan disposed opposite to the microchannel condenser, and the condensation fan is activated to cool the microchannel condenser when the semiconductor refrigeration system or the compressor refrigeration system is in operation .

Further, the heat dissipation duct assembly further includes a drive valve disposed between the hot end heat pipe and the microchannel condenser to drive the flow of the cold medium in the first circuit.

Further, the cold medium in the first loop is water.

Further, the hot end heat pipe is embedded inside the hot end.

Further, the hot end heat pipe is disposed in a serpentine manner inside the hot end.

Further, the hot end heat pipe is composed of an aluminum material.

Further, the refrigerator further includes a refrigerating compartment for refrigerating and a refrigerating compartment for freezing, the semiconductor refrigerating system is used for refrigerating compartment refrigeration, and the compressor refrigerating system is used for Freezing compartment refrigeration.

The utility model has the beneficial effects that the two refrigeration systems involved in the refrigerator of the invention share a microchannel condenser, and the microchannel condenser can simultaneously perform the cold medium in the first circuit of the semiconductor refrigeration system and the second circuit of the compressor refrigeration system. Cool down. Among them, the semiconductor refrigeration system changes the traditional way of using the fan to dissipate heat at the hot end, and the heat that needs to be dissipated at the hot end is transferred to the microchannel condenser through the hot end heat pipe to dissipate heat, which solves the heat dissipation area of the hot end in the conventional semiconductor refrigeration system. Small, low heat exchange efficiency; at the same time, two sets of refrigeration systems share a microchannel condenser, which is more compact in structure, and the condenser is an essential component of the compressor refrigeration system. In the present invention, it constitutes compression. The microchannel condenser of the mechanism cooling system can also function as a cooling refrigerant in the semiconductor refrigeration system, that is, the microchannel condenser in the present invention has double condensation.

DRAWINGS

1 is a schematic structural view of a refrigerator of a dual refrigeration system in the prior art;

2 is a schematic structural view of a refrigerator of a dual refrigeration system according to the present invention;

Figure 3 is a schematic view showing the cooperation of the semiconductor refrigeration system and the compressor refrigeration system;

Figure 4 is a schematic perspective view showing the structure of the microchannel condenser;

Figure 5 is a schematic plan view showing the structure of the microchannel condenser;

Figure 6 is a cross-sectional view taken along line A-A' of Figure 5;

Figure 7 is an enlarged schematic view showing a portion of Figure 6;

Figure 8 is a schematic view showing the cooperation between the cold end of the semiconductor refrigeration unit and the cold end heat pipe of the heat dissipating pipe assembly;

Figure 9 is a schematic cross-sectional view taken along the line B-B' in Figure 8.

In the picture,

In the prior art, 11 is an evaporator, 12 is an evaporating fan, 13 is a hot end fan, 14 is a hot end, 15 is a semiconductor refrigeration chip, 16 is a cold end, and 17 is a cold end fan;

In the present invention, 2 is a refrigerating chamber, 3 is a freezing chamber, 4 is a condenser fan, 21 is a semiconductor refrigeration unit, 211 is a hot end, 212 is a semiconductor refrigerating piece, 213 is a cold end, 214 is a cold end fan, and 22 is a hot end. Heat pipe, 23 is a microchannel condenser, 230 is a microchannel pipe, 231 is a first refrigerant channel, 232 is a second refrigerant channel, 233 is a liquid collecting pipe, 2331 is a first circuit collecting pipe, and 2332 is a second circuit set The liquid pipe, 234 is a septum, 235 is a heat sink, 24 is a driving valve, 25 is a connecting pipe, 31 is a compressor, 32 is a capillary, 33 is an evaporator, 330 is an evaporating fan, and 34 is a refrigerant pipe.

detailed description

The present invention will be described in detail below with reference to the embodiments shown in the drawings, which are illustrated in FIG. 2, which are preferred embodiments of the present invention.

Referring to FIG. 2, the refrigerator having the dual refrigeration system in this embodiment has two compartments requiring refrigeration, and in other embodiments, the refrigerator may have more compartments; in this embodiment, the refrigerator includes a semiconductor. Refrigeration system and compressor refrigeration system, two sets of refrigeration systems are used for cooling indoors. As shown in FIG. 2 and FIG. 3, in the present invention, the semiconductor refrigeration system includes a semiconductor refrigeration component 21 and a heat dissipation pipe assembly connected to the semiconductor refrigeration component 21. The semiconductor refrigeration component 21 has a hot end 211 that requires heat dissipation, and the heat dissipation pipe assembly includes The hot end heat pipe 22 connected to the hot end 211 and the microchannel condenser 23 communicating with the hot end heat pipe 22 form a first circuit; the compressor refrigeration system includes a compressor 31, a capillary tube 32, an evaporator 33, a refrigerant pipe 34, and semiconductor refrigeration The microchannel condenser 23 shared by the system, the refrigerant pipe 34 sequentially connects the compressor 31, the microchannel condenser 23, the capillary 32, and the evaporator 33 to form a second circuit. In the present invention, both the first circuit and the second circuit are provided with a cold medium (not shown) for transferring heat, and the cold medium flows in the two circuits to realize heat transfer, in the specific implementation process. The cold medium in the first loop and the second loop may be the same or different; the microchannel condenser 23 is used for cooling the heat of the medium.

Referring to FIG. 3, in the embodiment, the microchannel condenser 23 has a first refrigerant passage 231 and a second refrigerant passage 232. The first refrigerant passage 231 is disposed in the first circuit, and the second refrigerant passage 232 is disposed in the In the second loop. In a specific implementation process, the first refrigerant passage 231 and the second refrigerant passage 232 are not in communication with each other, but are physically disposed in the same condenser (ie, the microchannel condenser 23 in the present invention), and are thus designed in the refrigerator. The structure realizes the integration of modules, which is convenient for the production assembly process of the refrigerator.

In the present invention, a specific embodiment of the microchannel condenser 23 is shown in Figs. The microchannel condenser 23 includes a plurality of microchannel tubes 230 that are reciprocally folded and disposed in parallel with each other, and a liquid collection tube 233 disposed at both ends of the plurality of microchannel tubes 230. The inner diameter of the microchannel tubes 230 is opposite to the hot end heat tubes 22 and the refrigerant tubes 34. The inner diameter is small, thereby realizing the shunting of the cold medium in the two circuits, thereby effectively improving the heat dissipation effect. In this embodiment, a plurality of microchannel conduits 230 are in communication with the tube body of the liquid collection tube 233. The liquid collection tube 233 is internally provided with a spacer 234, and the spacer 234 isolates the liquid collection tube 233 into a first communication with the first circuit. The first circuit liquid collecting pipe 2331 is connected to the second circuit of the second circuit collecting pipe 2332; the plurality of microchannel pipes 230 communicating with the first circuit collecting pipe 2331 form a first refrigerant channel 231, and the second circuit collects liquid. The plurality of microchannel conduits 230 that are in communication with the tubes 2332 collectively form a second refrigerant passage 232.

In the specific implementation process, the two liquid collecting tubes are arranged in the same manner. In this embodiment, the microchannel condenser 23 is connected to the first circuit through the first circuit collecting tube 2331 at both ends of the microchannel pipe 230; the micro channel The condenser 23 is connected to the second circuit through a second circuit header 2332 at both ends of the microchannel pipe 230.

In addition, referring to FIG. 4 and FIG. 5, when the microchannel duct 230 is reciprocally folded, a certain gap is disposed between two adjacent layers, and a plurality of fins 235 are fixedly disposed in the gap, and a plurality of fins 235 are formed. There is a heat dissipation channel (ie, a gap between the adjacent fins 235). In a specific implementation process, the heat sink 235 is made of a metal material having a good heat dissipation performance, such as aluminum. In addition, the arrangement of the fins 235 in the microchannel condenser 23 can provide a certain supporting effect on the microchannel ducts 230, so that the reciprocating folding forms the microchannel ducts 230 with better mechanical strength. In addition, in the specific arrangement manner of the heat sink 235 in the present invention, reference may be made to the honeycomb shape in FIG. 4, or to the parallel arrangement in FIG. 5, in particular, the principle of improving the heat dissipation effect of the microchannel condenser 23 can be achieved.

In other embodiments, the plurality of microchannel conduits 230 that make up the microchannel condenser 23 may be integrally formed, i.e., the plurality of microchannel conduits 230 are side by side to form a flat, unitary configuration.

In the operation of the semiconductor refrigeration system and the compressor refrigeration system of the present invention, wherein the cold medium flows into the microchannel condenser 23 at the end of the cold medium flow, as shown in FIG. 7, the cold medium in the first circuit passes through the first circuit collector. 2331 enters the first refrigerant passage 231, and the cold medium in the second loop enters the second refrigerant passage 232 through the second loop header 2332, and the two loops are independent of each other.

In the present invention, the refrigerator further includes a condensing fan 4 disposed opposite the microchannel condenser 23, and the condensing fan 4 is activated to cool the microchannel condenser 23 when the semiconductor refrigeration system or the compressor refrigeration system is operating. In the refrigerator having the above microchannel condenser 23, after the condensation fan 4 is activated, the air passes through the heat dissipation passage formed by the fins 235, and the heat transferred from the cold medium to the fins 235 is carried away, thereby realizing the microchannel condenser 23 The internal cold medium is cooled down.

Referring to FIG. 3, the heat dissipating duct assembly of the present invention further includes a drive valve 24 disposed between the hot end heat pipe 22 and the microchannel condenser 23 for driving the flow of the cold medium in the first circuit. More specifically, the hot end heat pipe 22 and the microchannel condenser 23 are connected by a connecting pipe 25, and the driving valve 24 is disposed on the connecting pipe 25, and the driving valve 24 drives the cold medium at the hot end heat pipe 22, the connecting pipe 25, and the micro The channel condenser 23 flows in a first loop formed together to effect heat transfer in the hot end 211.

In order to better realize the heat transfer of the hot end 211 to the hot end heat pipe 22, in this embodiment, the hot end heat pipe 22 is embedded in the hot end 211, that is, the hot end 211 forms a coating on the hot end heat pipe 22, specifically Referring to FIG. 9, the heat exchange area of the hot end 211 and the hot end heat pipe 22 is maximized in the manner of embedding; in addition, in order to further increase the heat exchange area of the hot end 211 and the hot end heat pipe 22, in this embodiment, The hot end heat pipe 22 is disposed in a serpentine manner inside the hot end 211, as specifically shown in FIG.

Of course, in other embodiments, the hot end heat pipe 22 may also be partially in contact with the hot end 211, that is, the hot end 211 does not need to completely cover the hot end heat pipe 22; the hot end heat pipe 22 may also be inside the hot end 211. The way to set it up.

In the present embodiment, the hot end heat pipe 22 is made of an aluminum material, and the aluminum material is easy to form and has the advantage of being easy to conduct heat. Of course, the hot end heat pipe 22 can also be made of other materials such as copper pipes.

The semiconductor refrigeration unit 21 further includes a semiconductor refrigerating sheet 212, a cold end 213, and a cold end fan 214 which are sequentially disposed on one side of the cold end 211, wherein the semiconductor refrigerating sheet 212 serves as a basic component of cooling, and the cold end fan 214 realizes the cold end 213. The cooling amount is transferred to the interior of the refrigerator. Of course, in the present invention, the cold end 213 of the semiconductor refrigeration unit 21 can also be cooled by direct cooling or other means to the internal compartment of the refrigerator, which will not be described in detail herein.

In a specific embodiment of the present invention, referring to FIG. 2, the two compartments of the refrigerator are respectively a refrigerating compartment 2 for refrigerating and a freezing compartment 3 for freezing, in a specific implementation process. The semiconductor refrigeration system is used for refrigeration compartment 2 refrigeration, and the compressor refrigeration system is used for refrigeration compartment 3 refrigeration. In view of the fact that the temperature of the refrigerating is generally above 0 ° C, the cold medium in the first circuit can use water, the specific heat capacity of the water is high, and the cost is low, and the heat dissipation of the hot end 211 in the semiconductor refrigeration system can be better realized. Of course, in other implementations. In the example, the cold medium in the first circuit can also be made of other substances. The cold medium in the second circuit can refer to the cold medium used in the compressor refrigeration system of the prior art.

Further, in the compressor refrigeration system of the present invention, an evaporator fan 330 is provided which is matched with the evaporator 33 for transferring the amount of cold generated by the evaporator 33 to the inside of the freezing compartment 3 to realize the freezing function; In other embodiments, the specific structure of the evaporator side of the compressor refrigeration system of the present invention can also refer to the related structure of other conventional refrigerators.

The two sets of refrigeration systems involved in the refrigerator of the present invention share a microchannel condenser, and the microchannel condenser can simultaneously cool the refrigerant in the first circuit of the semiconductor refrigeration system and the second circuit of the compressor refrigeration system. Among them, the semiconductor refrigeration system changes the traditional way of using the fan to dissipate heat at the hot end, and the heat that needs to be dissipated at the hot end is transferred to the microchannel condenser through the hot end heat pipe to dissipate heat, which solves the heat dissipation area of the hot end in the conventional semiconductor refrigeration system. Small, low heat exchange efficiency; at the same time, two sets of refrigeration systems share a microchannel condenser, which is more compact in structure, and the condenser is an essential component of the compressor refrigeration system. In the present invention, it constitutes compression. The microchannel condenser of the mechanism cooling system can also function as a cooling refrigerant in the semiconductor refrigeration system, that is, the microchannel condenser in the present invention has double condensation.

It should be understood that, although the description is described in terms of embodiments, the embodiments are not intended to be construed as a single. The technical solutions in the embodiments may also be combined as appropriate to form other embodiments that can be understood by those skilled in the art.

The series of detailed descriptions set forth above are merely illustrative of the possible embodiments of the present invention, and are not intended to limit the scope of the present invention. Changes are intended to be included within the scope of the invention.

Claims

A refrigerator having a dual refrigeration system, the refrigerator including a semiconductor refrigeration system and a compressor refrigeration system, wherein the semiconductor refrigeration system includes a semiconductor refrigeration component and a heat dissipation pipe assembly connected to the semiconductor refrigeration component, The semiconductor refrigeration component has a hot end requiring heat dissipation, the heat pipe assembly including a hot end heat pipe connected to the hot end and a microchannel condenser connected to the hot end heat pipe to form a first loop; the compressor refrigeration system The utility model comprises a compressor, a capillary tube, an evaporator, a refrigerant pipeline and a microchannel condenser shared with the semiconductor refrigeration system, wherein the refrigerant pipeline sequentially communicates with the compressor, the microchannel condenser, the capillary, the evaporator and forms a second loop The first circuit and the second circuit are each provided with a cold medium for transferring heat, and the microchannel condenser is used for heat dissipation of the cold medium.
The refrigerator with a dual refrigeration system according to claim 1, wherein the microchannel condenser has a first refrigerant passage and a second refrigerant passage, and the first refrigerant passage is disposed in the first circuit. The second refrigerant passage is disposed in the second circuit.
A refrigerator with a dual refrigeration system according to claim 2, wherein said microchannel condenser comprises a plurality of microchannel tubes reciprocally folded and disposed in parallel with each other, and a liquid collecting tube disposed at both ends of said plurality of microchannel tubes, a plurality of the microchannel conduits are in communication with the tube body of the liquid collection tube, and the liquid collection tube is internally provided with a spacer, and the spacer isolates the liquid collection tube into respectively connected to the first circuit. a first circuit collector pipe is connected to the second circuit, and a plurality of microchannel pipes connected to the first circuit header are formed to form the first refrigerant channel, and the first A plurality of microchannel conduits connected by the second loop collector tube together form the second refrigerant passage.
A refrigerator with a dual refrigeration system according to claim 1, wherein said refrigerator further comprises a condensation fan disposed opposite said microchannel condenser, said semiconductor refrigeration system or said compressor refrigeration system being operated The condensation fan is activated to cool the microchannel condenser.
The refrigerator with dual refrigeration system according to claim 2, wherein the heat dissipation duct assembly further comprises a heat medium pipe disposed between the hot end heat pipe and the microchannel condenser for driving the flow of the cold medium in the first circuit. Drive valve.
A refrigerator having a dual refrigeration system according to claim 1, wherein the refrigerant medium in said first circuit is water.
A refrigerator with a dual refrigeration system according to claim 1, wherein said hot end heat pipe is embedded inside said hot end.
The refrigerator according to claim 7, wherein said hot end heat pipe is disposed in a serpentine manner inside said hot end.
The refrigerator according to claim 8, wherein said hot end heat pipe is made of an aluminum material.
A refrigerator with a dual refrigeration system according to claim 1, wherein said refrigerator further comprises a refrigerating compartment for refrigerating and a freezing compartment for freezing, said semiconductor refrigeration system being used for Refrigerated room refrigeration, which is used for refrigeration in the freezer compartment.