CN106766527A - A kind of refrigerator with double refrigeration systems - Google Patents
A kind of refrigerator with double refrigeration systems Download PDFInfo
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- CN106766527A CN106766527A CN201611220123.1A CN201611220123A CN106766527A CN 106766527 A CN106766527 A CN 106766527A CN 201611220123 A CN201611220123 A CN 201611220123A CN 106766527 A CN106766527 A CN 106766527A
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- refrigerator
- micro
- refrigeration system
- hot
- loop
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- 238000005057 refrigeration Methods 0.000 title claims abstract description 99
- 239000004065 semiconductor Substances 0.000 claims abstract description 54
- 239000002826 coolant Substances 0.000 claims abstract description 23
- 230000005494 condensation Effects 0.000 claims abstract description 13
- 238000009833 condensation Methods 0.000 claims abstract description 13
- 239000003507 refrigerant Substances 0.000 claims description 36
- 238000001816 cooling Methods 0.000 claims description 12
- 230000000694 effects Effects 0.000 claims description 9
- 238000007710 freezing Methods 0.000 claims description 8
- 230000008014 freezing Effects 0.000 claims description 8
- 238000005192 partition Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 230000009977 dual effect Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 5
- 238000001704 evaporation Methods 0.000 description 4
- 230000008020 evaporation Effects 0.000 description 4
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
- F25D11/02—Self-contained movable devices, e.g. domestic refrigerators with cooling compartments at different temperatures
- F25D11/022—Self-contained movable devices, e.g. domestic refrigerators with cooling compartments at different temperatures with two or more evaporators
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B39/00—Evaporators; Condensers
- F25B39/04—Condensers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B5/00—Compression machines, plants or systems, with several evaporator circuits, e.g. for varying refrigerating capacity
- F25B5/02—Compression machines, plants or systems, with several evaporator circuits, e.g. for varying refrigerating capacity arranged in parallel
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
- F25D19/04—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors with more than one refrigeration unit
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2339/00—Details of evaporators; Details of condensers
- F25B2339/04—Details of condensers
Abstract
The invention discloses a kind of refrigerator with double refrigeration systems, the refrigerator includes semiconductor refrigeration system and compressor refrigeration system, two sets of refrigeration systems involved by refrigerator of the present invention share a micro-channel condenser, micro-channel condenser can lower the temperature to the coolant media in the loop of semiconductor refrigeration system first and compressor refrigeration system second servo loop simultaneously, and the micro-channel condenser in the present invention has dual condensation；Simultaneously, semiconductor refrigeration system changes the mode that conventionally employed blower fan is radiated to hot junction, hot junction is needed the heat that disperses to be transferred to micro-channel condenser through hot side heat to be radiated by it, solves the problems, such as in conventional semiconductors refrigeration system that hot-side heat dissipation area is small, heat exchange efficiency is low.
Description
Technical field
The present invention relates to household appliance technical field, more particularly to a kind of refrigerator with double refrigeration systems.
Background technology
Refrigerator makes food or other articles keep the container of constant low temperature cold conditions as a kind of, and it has turned into Modern Family
One of essential household electrical appliance.Conventional refrigerator refrigeration system mainly includes semiconductor refrigeration system and compressor cooling system
System, only has a set of refrigeration system in a usual refrigerator, but with the diversified degree more and more higher of user's request, nowadays
Through appearing in same refrigerator while being designed with the technical schemes of many set refrigeration systems.
With reference to shown in Fig. 1, it shows in the prior art while having semiconductor refrigeration system and compressor cooling
A kind of refrigerator of system, wherein, semiconductor refrigeration system is used for the refrigeration of refrigerator room, and compressor refrigeration system is used for freezer
The refrigeration of room, two systems are separate on hardware configuration.For ease of displaying, the compressor cooling system of refrigerator shown in Fig. 1
System only schematic presentation constitutes the evaporator 11 and evaporation fan 12 of compressor refrigeration system；In refrigerator in semiconductor refrigeration system
Involved semiconductor refrigerating module include set gradually hot junction blower fan 13, hot junction 14, semiconductor chilling plate 15, cold end 16,
Cold end blower fan 17.Two sets of refrigeration systems involved in the refrigerator can be independently refrigerator room and freezing compartment are carried out
Refrigeration, but there is problems with it：The radiating in the hot junction 14 of semiconductor refrigerating module in the semiconductor refrigeration system being independently arranged
Portion is only radiated by the blowing of hot junction blower fan 13, is so designed that mode in actual application, due to dissipating for hot junction 14
The Area comparison in hot portion is limited, and the radiating efficiency in hot junction 14 is relatively low, if the heat that hot junction produces cannot be taken away in time, semiconductor
The refrigeration of refrigeration system will be affected.
In view of this, it is necessary to provide a kind of improved refrigerator to solve the above problems.
The content of the invention
It is contemplated that at least solving one of technical problem that prior art is present, for achieving the above object, this hair
It is bright there is provided a kind of refrigerator with double refrigeration systems, its specific design mode is as follows.
A kind of refrigerator with double refrigeration systems, the refrigerator includes semiconductor refrigeration system and compressor refrigeration system,
Wherein, the semiconductor refrigeration system includes semiconductor refrigerating component and the radiating tube being connected with the semiconductor refrigerating component
Road component, the semiconductor refrigerating component has the hot junction for needing radiating, and the hot channel component includes and the hot junction phase
Even hot side heat and the micro-channel condenser to form the first loop is connected with the hot side heat；The compressor cooling system
System includes that compressor, capillary, evaporator, refrigerant pipe and the microchannel shared with the semiconductor refrigeration system condense
Device, the refrigerant pipe is sequentially communicated the compressor, micro-channel condenser, capillary, evaporator and forms second servo loop；Institute
The coolant media for being provided with the first loop and the second servo loop and being provided with transmitting heat is stated, the micro-channel condenser is used for
The coolant media radiating.
Further, the micro-channel condenser has the first refrigerant passage and the first refrigerant passage described in the second refrigerant passage
It is arranged in first loop, second refrigerant passage is arranged in the second servo loop.
Further, the micro-channel condenser include it is some it is reciprocal folding and microchannel tubing arranged in parallel and
Be arranged at the collector tube at some microchannel tubing two ends, some microchannel tubings successively with the body of the collector tube
Connection, the collector tube is internally provided with partition, and be isolated into for the collector tube and connect with first loop respectively by the partition
Second servo loop collector tube of the first logical loop collector tube to be connected with the second servo loop；Connect with first loop collector tube
Logical some microchannel tubings are collectively forming first refrigerant passage, and what is connected with the second servo loop collector tube is some micro- logical
Road pipeline is collectively forming second refrigerant passage.
Further, the refrigerator also includes the condensation fan being oppositely arranged with the micro-channel condenser, the semiconductor
When refrigeration system or the compressor refrigeration system run, the condensation fan startup is dropped with to the micro-channel condenser
Temperature.
Further, the hot channel component also includes being arranged between the hot side heat and micro-channel condenser being used to
Drive the driving valve of coolant media flowing in first loop.
Further, the coolant media in first loop is water.
Further, the hot side heat is embedded inside the hot junction.
Further, the hot side heat is set inside the hot junction with serpentine fashion.
Further, the hot side heat is made up of aluminum material.
Further, the refrigerator also includes being used to the refrigerator room of refrigeration effect and has been used to the freezing of refrigeration
Compartment, the semiconductor refrigeration system freezes for the refrigerator room, and the compressor refrigeration system is used for the freezer
Freeze room.
The beneficial effects of the invention are as follows：Two sets of refrigeration systems involved by refrigerator of the present invention share a microchannel condensation
Device, micro-channel condenser can be while cold in the loop of semiconductor refrigeration system first and compressor refrigeration system second servo loop
Medium is lowered the temperature.Wherein, semiconductor refrigeration system changes the mode that conventionally employed blower fan is radiated to hot junction, and it is by heat
The heat that end needs disperse is transferred to micro-channel condenser and is radiated through hot side heat, solves conventional semiconductors refrigeration system
The problem that middle hot-side heat dissipation area is small, heat exchange efficiency is low；Meanwhile, two sets of refrigeration systems share a micro-channel condenser, in knot
Compacter on structure, used as the essential composed component of compressor refrigeration system, in the present invention, it constitutes compression to condenser
The micro-channel condenser of machine cooling system can also play cooling refrigerant effect in semiconductor refrigeration system, i.e., micro- in the present invention
Multi-pass condenser has dual condensation.
Brief description of the drawings
Fig. 1 show the structural representation of double refrigeration system refrigerators in the prior art；
Fig. 2 show the structural representation of double refrigeration system refrigerators of the invention；
Fig. 3 show the cooperation schematic diagram of semiconductor refrigeration system and compressor refrigeration system；
Fig. 4 show the dimensional structure diagram of micro-channel condenser；
Fig. 5 show the planar structure schematic diagram of micro-channel condenser；
Fig. 6 show A-A ' directions schematic cross-section in Fig. 5；
Fig. 7 show the enlarged diagram of a parts in Fig. 6；
Fig. 8 show the cold end of semiconductor refrigerating component and the cool side heat pipes cooperation schematic diagram of hot channel component；
Fig. 9 show B-B ' directions schematic cross-section in Fig. 8.
In figure,
In the prior art, 11 is evaporator, and 12 is evaporation fan, and 13 is hot junction blower fan, and 14 is hot junction, and 15 is semiconductor refrigerating
Piece, 16 is cold end, and 17 is cold end blower fan；
In the present invention, 2 is refrigerating chamber, and 3 is refrigerating chamber, and 4 is condensation fan, and 21 is semiconductor refrigerating component, and 211 is hot junction, 212
It is semiconductor chilling plate, 213 is cold end, 214 cold end blower fans, and 22 is hot side heat, and 23 is micro-channel condenser, and 230 is micro- logical
Road pipeline, 231 is the first refrigerant passage, and 232 is the second refrigerant passage, and 233 is collector tube, and 2331 is the first loop collector tube,
2332 is second servo loop collector tube, and 234 is partition, and 235 is fin, and 24 to drive valve, and 25 is connecting pipe, and 31 is compression
Machine, 32 is capillary, and 33 is evaporator, and 330 is evaporation fan, and 34 is refrigerant pipe,
Specific embodiment
Below with reference to each implementation method shown in the drawings, the present invention will be described in detail, refer to Fig. 2 Fig. 9 and shows, it is this
Some better embodiments of the invention.
The refrigerator with reference to shown in Fig. 2, in the present embodiment with double refrigeration systems has two compartments for needing refrigeration, at it
In its some embodiment, refrigerator can have more compartments；In the present embodiment, refrigerator includes semiconductor refrigeration system and pressure
Contracting machine cooling system, two sets of refrigeration systems are respectively used to the refrigeration of chamber interior between two.With reference to shown in Fig. 2, Fig. 3, in the present invention,
Semiconductor refrigeration system includes semiconductor refrigerating component 21 and the hot channel component being connected with semiconductor refrigerating component 21, half
Conductor cooling assembly 21 has the hot junction 211 for needing radiating, and hot channel component includes the hot side heat 22 being connected with hot junction 211
And the micro-channel condenser 23 for forming the first loop is connected with hot side heat 22；Compressor refrigeration system include compressor 31,
Capillary 32, evaporator 33, refrigerant pipe 34 and the micro-channel condenser 23 shared with semiconductor refrigeration system, refrigerant pipe
34 are sequentially communicated compressor 31, micro-channel condenser 23, capillary 32, evaporator 33 and form second servo loop.In the present invention,
The coolant media for being provided with transmitting heat is provided with first loop and second servo loop（Not shown in figure）, coolant media is at two
Flowed in loop to realize the transfer of heat, in specific implementation process, coolant media can be with the first loop and second servo loop
It is identical can also be different；Micro-channel condenser 23 radiates for coolant media.
With reference to shown in Fig. 3, in the present embodiment, micro-channel condenser 23 has the first refrigerant passage 231 and the second refrigerant logical
Road 232, the first refrigerant passage 231 is arranged in the first loop, and the second refrigerant passage 232 is arranged in the second servo loop.
In specific implementation process, the first refrigerant passage 231 and the second refrigerant passage 232 are not connected mutually, but are physically being set
In same condenser（I.e. heretofore described micro-channel condenser 23）In, it is so designed that and realizes module in the structure of refrigerator
It is integrated, be easy to the production assembling process of refrigerator.
In the present invention, a kind of specific embodiment of micro-channel condenser 23 is with reference to shown in Fig. 4-Fig. 6.Micro-channel condenser
23 include some reciprocal foldings and microchannel tubing 230 arranged in parallel and are arranged at 230 liang of some microchannel tubings
The collector tube 233 at end；Wherein, the internal diameter of microchannel tubing 230 is small with respect to the internal diameter of hot side heat 22 and refrigerant pipe 34, so that
The shunting of coolant media in two loops is realized, radiating effect is effectively improved.In the present embodiment, some microchannel tubings 230 according to
The secondary body with collector tube 233 is connected, and collector tube 233 is internally provided with partition 234, and be isolated into collector tube 233 point by partition 234
Second servo loop collector tube 2332 not with the first loop collector tube 2331 of the first circuit communication to be connected with second servo loop；With
Some microchannel tubings 230 of the connection of primary Ioops collector tube 2331 are collectively forming the first refrigerant passage 231, with second servo loop liquid collecting
Some microchannel tubings 230 of the connection of pipe 2332 are collectively forming the second refrigerant passage 232.
In specific implementation process, the set-up mode of two collector tubes is identical, and in the present embodiment, micro-channel condenser 23 leads to
The connection of the first loop collector tube 2331 for crossing the two ends of microchannel tubing 230 is arranged in the first loop；Micro-channel condenser 23 leads to
The connection of second servo loop collector tube 2332 for crossing the two ends of microchannel tubing 230 is arranged in second servo loop.
In addition, with reference to shown in Fig. 4, Fig. 5, when microchannel tubing 230 is back and forth folded, being provided between adjacent two-layer certain
Gap, it is fixed in gap to be provided with some fin 235, be formed with heat dissipation channel between some fin 235（It is i.e. adjacent
Space in the middle of fin 235）, in specific implementation process, fin 235 uses the metal material of radiating effect better performances
Constitute, for example, can be aluminium etc..In addition, the setting of fin 235 can be to microchannel tubing 230 in micro-channel condenser 23
Certain supporting role is formed, so that reciprocal folding forms microchannel tubing 230 with more preferable mechanical strength.In addition,
The specific set-up mode of fin 235 may be referred to cellular in Fig. 4 in the present invention, it is also possible to reference to being parallel to each other in Fig. 5
Set-up mode, specifically can realize improve micro-channel condenser 23 radiating effect be principle.
In further embodiments, some microchannel tubings 230 for constituting micro-channel condenser 23 can be integrally formed, i.e.,
Some microchannel tubings 230 form a flat thin volume morphing side by side.
When semiconductor refrigeration system of the invention and compressor refrigeration system run, wherein entering microchannel in coolant media
With reference to shown in Fig. 7, the coolant media in the first loop is by the first loop collection for one end coolant media type of flow of condenser 23
Liquid pipe 2331 enters the first refrigerant passage 231, and coolant media in second servo loop enters the by second servo loop collector tube 2332
Two refrigerant passages 232, two loops are separate.
In the present invention, refrigerator also includes the condensation fan 4 being oppositely arranged with micro-channel condenser 23, semiconductor refrigerating system
When system or compressor refrigeration system run, condensation fan 4 starts lowers the temperature with to micro-channel condenser 23.Micro- with more than
In the refrigerator of multi-pass condenser 23, after condensation fan 4 starts, air passes through the heat dissipation channel formed by fin 235, by refrigerant
The heat that medium passes to fin 235 is taken away, so as to realize the cooling of the inside coolant media of micro-channel condenser 23.
With reference to Fig. 3, the hot channel component in the present invention also includes being arranged at hot side heat 22 and micro-channel condenser 23
Between be used to drive the driving valve 24 of coolant media flowing in the first loop.More specifically, hot side heat 22 and microchannel are cold
Connected by connecting pipe 25 between condenser 23, drive valve 24 to be arranged on connecting pipe 25, drive valve 24 to order about coolant media
In being flowed to realize hot junction 211 in the first loop that hot side heat 22, connecting pipe 25, micro-channel condenser 23 are collectively forming
The transfer of heat.
In order to preferably realize realizing the heat transfer in hot junction 211 to hot side heat 22, in the present embodiment, hot side heat
22 are embedded inside hot junction 211, i.e., hot junction 211 forms to hot side heat 22 and coats, with specific reference to the mode shown in Fig. 9, being embedded
So that hot junction 211 maximizes with the heat exchange area of hot side heat 22；In addition, in order to further increase hot junction 211 and hot side heat
22 heat exchange area, the hot side heat 22 in the present embodiment is set inside hot junction 211 with serpentine fashion, with specific reference to Fig. 8 institutes
Show.
Certainly, in some other embodiment, hot side heat 22 partly can also be in contact with hot junction 211, i.e. hot junction 211
Hot side heat 22 need not completely be coated；Hot side heat 22 can also otherwise be configured inside hot junction 211.
Hot side heat 22 is made up of aluminum material in the present embodiment, and aluminum material shaping is easy, transcalent advantage, when
So, hot side heat 22 can also be using other materials such as copper pipes.
Semiconductor refrigerating component 21 also include being set in turn in the semiconductor chilling plate 212 of the side of cold end 211, cold end 213,
Cold end blower fan 214, wherein semiconductor chilling plate 212 are realized cold end 213 as the basic element of character for freezing, cold end blower fan 214
Cold is transferred to chamber interior between refrigerator, and certainly, in the present invention, the cold end 213 of semiconductor refrigerating component 21 can also be using straight
Cold or other manner realizes the refrigeration to refrigerator inside compartment, is specifically not described in detail here.
In specific embodiment of the invention, with reference to shown in Fig. 2, two compartments of refrigerator are respectively and have been used to refrigeration work
Refrigerator room 2 and the freezing compartment 3 of refrigeration has been used to it, in specific implementation process, semiconductor refrigeration system is used
Freeze in refrigerator room 2, compressor refrigeration system freezes for freezing compartment 3.In view of the temperature of refrigeration is general more than 0 DEG C,
Coolant media in first loop can use water, and the specific heat capacity of water is high, low cost, can preferably realize semiconductor refrigerating system
The radiating in hot junction 211 in system, certainly, in some other embodiment, the coolant media in the first loop can also use other
Material.Coolant media in second servo loop may be referred to the coolant media that compressor refrigeration system of the prior art is used.
Additionally, in the present invention in compressor refrigeration system, evaporation fan 330 is provided with evaporator 33 matches, its
For the cold that evaporator 33 is produced to be transferred to the inside of refrigerating chamber 3 to realize freezing function；Certainly, implement at some other
In example, the concrete structure of compressor refrigeration system evaporator side can also use for reference the related knot of other conventional refrigerators in the present invention
Structure.
Two sets of refrigeration systems involved by refrigerator of the present invention share a micro-channel condenser, and micro-channel condenser can be same
When the refrigerant in the loop of semiconductor refrigeration system first and compressor refrigeration system second servo loop is lowered the temperature.Wherein, partly lead
System cooling system changes the mode that conventionally employed blower fan is radiated to hot junction, and hot junction is needed the heat for dispersing through hot junction heat by it
Pipe is transferred to micro-channel condenser and is radiated, and solves that hot-side heat dissipation area in conventional semiconductors refrigeration system is small, heat exchange effect
The low problem of rate；Meanwhile, two sets of refrigeration systems share a micro-channel condenser, compacter in structure, condenser conduct
The essential composed component of compressor refrigeration system, in the present invention, the microchannel condensation that it constitutes compressor refrigeration system
Device can also play cooling refrigerant effect in semiconductor refrigeration system, i.e. micro-channel condenser in the present invention has dual condensation
Effect.
It should be understood that, although the present specification is described in terms of embodiments, but not each implementation method only includes one
Individual independent technical scheme, this narrating mode of specification is only that for clarity, those skilled in the art will should say
Used as an entirety, technical scheme in each implementation method can also be through appropriately combined, and forming those skilled in the art can for bright book
With the other embodiment for understanding.
Those listed above is a series of to be described in detail only for feasibility implementation method of the invention specifically
Bright, they simultaneously are not used to limit the scope of the invention, all equivalent implementations made without departing from skill spirit of the present invention
Or change should be included within the scope of the present invention.
Claims (10)
1. a kind of refrigerator with double refrigeration systems, the refrigerator includes semiconductor refrigeration system and compressor refrigeration system, its
It is characterised by, the semiconductor refrigeration system includes semiconductor refrigerating component（21）And with the semiconductor refrigerating component（21）
Connected hot channel component, the semiconductor refrigerating component（21）With the hot junction for needing radiating（211）, the hot channel
Component includes and the hot junction（211）Connected hot side heat（22）And with the hot side heat（22）Connection is formed first time
The micro-channel condenser on road（23）；The compressor refrigeration system includes compressor（31）, capillary（32）, evaporator（33）、
Refrigerant pipe（34）And the micro-channel condenser shared with the semiconductor refrigeration system（23）, the refrigerant pipe（34）According to
The secondary connection compressor（31）, micro-channel condenser（23）, capillary（32）, evaporator（33）And form second servo loop；Institute
State the coolant media for being provided with the first loop and the second servo loop and being provided with transmitting heat, the micro-channel condenser（23）
For coolant media radiating.
2. there is the refrigerator of double refrigeration systems according to claim 1, it is characterised in that the micro-channel condenser（23）Tool
There is the first refrigerant passage（231）And second refrigerant passage（232）, first refrigerant passage（231）It is arranged at described first time
Lu Zhong, second refrigerant passage（232）It is arranged in the second servo loop.
3. there is the refrigerator of double refrigeration systems according to claim 2, it is characterised in that the micro-channel condenser（23）Bag
Include some reciprocal foldings and microchannel tubing arranged in parallel（230）And it is arranged at some microchannel tubings
（230）The collector tube at two ends（233）, some microchannel tubings（230）Successively with the collector tube（233）Body connect
It is logical, the collector tube（233）It is internally provided with partition（234）, the partition（234）By the collector tube（233）It is isolated into point
Not with the first loop collector tube of first circuit communication（2331）With the second servo loop liquid collecting connected with the second servo loop
Pipe（2332）；With first loop collector tube（2331）Some microchannel tubings of connection（230）It is collectively forming described first
Refrigerant passage（231）, with the second servo loop collector tube（2332）Some microchannel tubings of connection（230）It is collectively forming described
Second refrigerant passage（232）.
4. there is the refrigerator of double refrigeration systems according to claim 1,2 or 3, it is characterised in that the refrigerator also include with
The micro-channel condenser（23）The condensation fan being oppositely arranged（4）, the semiconductor refrigeration system or the compressor cooling
During system operation, the condensation fan（4）Start with to the micro-channel condenser（23）Lowered the temperature.
5. there is the refrigerator of double refrigeration systems according to claim 2, it is characterised in that the hot channel component also includes
It is arranged at the hot side heat（22）And micro-channel condenser（23）Between be used to drive cold media mass flow in first loop
Dynamic driving valve（24）.
6. there is the refrigerator of double refrigeration systems according to claim 1 or 5, it is characterised in that cold in first loop
Medium is water.
7. there is the refrigerator of double refrigeration systems according to claim 1,2,3 or 5, it is characterised in that the hot side heat
（22）It is embedded at the hot junction（211）It is internal.
8. refrigerator according to claim 7, it is characterised in that the hot side heat（22）In the hot junction（211）It is internal
Set with serpentine fashion.
9. refrigerator according to claim 8, it is characterised in that the hot side heat（22）It is made up of aluminum material.
10. there is the refrigerator of double refrigeration systems according to claim 1,2,3 or 5, it is characterised in that the refrigerator also includes
It has been used to the refrigerator room of refrigeration effect（2）And it has been used to the freezing compartment of refrigeration（3）, the semiconductor refrigeration system
For the refrigerator room（2）Refrigeration, the compressor refrigeration system is used for the freezing compartment（3）Refrigeration.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611220123.1A CN106766527A (en) | 2016-12-26 | 2016-12-26 | A kind of refrigerator with double refrigeration systems |
| PCT/CN2017/117964 WO2018121429A1 (en) | 2016-12-26 | 2017-12-22 | Refrigerator having double refrigeration systems |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201611220123.1A CN106766527A (en) | 2016-12-26 | 2016-12-26 | A kind of refrigerator with double refrigeration systems |
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| CN106766527A true CN106766527A (en) | 2017-05-31 |
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| CN201611220123.1A Pending CN106766527A (en) | 2016-12-26 | 2016-12-26 | A kind of refrigerator with double refrigeration systems |
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| CN (1) | CN106766527A (en) |
| WO (1) | WO2018121429A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018121429A1 (en) * | 2016-12-26 | 2018-07-05 | 青岛海尔股份有限公司 | Refrigerator having double refrigeration systems |
| CN110094894A (en) * | 2018-01-29 | 2019-08-06 | 青岛海尔股份有限公司 | Refrigerator |
| CN110094910A (en) * | 2018-01-29 | 2019-08-06 | 青岛海尔股份有限公司 | Refrigerator |
| CN110671859A (en) * | 2018-07-02 | 2020-01-10 | 青岛海尔股份有限公司 | Refrigerator with a door |
| CN112066581A (en) * | 2020-09-21 | 2020-12-11 | 珠海格力电器股份有限公司 | Refrigerating system and method and refrigerating equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114165982A (en) * | 2021-08-31 | 2022-03-11 | 佛山市顺德区美的饮水机制造有限公司 | Ice container assembly and multifunctional water dispenser with same |
| CN115031384A (en) * | 2022-06-15 | 2022-09-09 | 珠海格力电器股份有限公司 | Heat dissipation device, heat dissipation unit, heat dissipation control method and heat dissipation control device |
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Also Published As
| Publication number | Publication date |
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| WO2018121429A1 (en) | 2018-07-05 |
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