CN207113018U - A kind of twin-stage semi-conductor dehumidifying mechanism of heat pipe synergy - Google Patents
A kind of twin-stage semi-conductor dehumidifying mechanism of heat pipe synergy Download PDFInfo
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- CN207113018U CN207113018U CN201720875663.7U CN201720875663U CN207113018U CN 207113018 U CN207113018 U CN 207113018U CN 201720875663 U CN201720875663 U CN 201720875663U CN 207113018 U CN207113018 U CN 207113018U
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 122
- 238000001816 cooling Methods 0.000 claims description 17
- 230000005484 gravity Effects 0.000 claims description 10
- 230000000694 effects Effects 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 238000010521 absorption reaction Methods 0.000 claims description 4
- 239000008358 core component Substances 0.000 claims description 4
- 239000012530 fluid Substances 0.000 claims description 4
- 230000009466 transformation Effects 0.000 claims description 4
- 230000003416 augmentation Effects 0.000 claims description 2
- 239000004519 grease Substances 0.000 claims description 2
- 239000012774 insulation material Substances 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims description 2
- 238000007791 dehumidification Methods 0.000 abstract description 19
- 238000009833 condensation Methods 0.000 abstract description 10
- 230000005494 condensation Effects 0.000 abstract description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 5
- 238000005057 refrigeration Methods 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
- Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating
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Abstract
A kind of twin-stage semi-conductor dehumidifying mechanism of heat pipe synergy, including heat pipe, heat pipe cool end heat exchanger, heat pipe hot end heat exchanger, semiconductor refrigerating element, semiconductor cool end heat exchanger, semiconductor hot end heat exchanger etc.；With air heat-exchange and being connected to the hot and cold side of heat pipe in air channel, semiconductor cool end heat exchanger and semiconductor hot end heat exchanger are located in air channel with air heat-exchange and are connected twin-stage semiconductor chilling plate cold end and semiconductor twin-stage semiconductor chilling plate hot junction respectively for heat pipe cool end heat exchanger and heat pipe hot end heat exchanger；Air enters air channel after induced-draught fan is pressurized, after being tentatively cooled with the heat exchange of heat pipe cool end heat exchanger, it is delivered to semiconductor cool end heat exchanger and carries out dehumidification by condensation, dry air after dehumidifying tentatively heats up through superheater tube hot end heat exchanger, exchanged heat again with semiconductor hot end heat exchanger after rewarming, exhaust outlet is flowed through by exhaust blower pressurization and discharged；Cool at semiconductor cool end heat exchanger after the water condensed falls into drip tray and discharge；The utility model can significantly improve refrigerated dehumidification efficiency.
Description
Technical field
It the utility model is related to a kind of air dehumidifier, particularly a kind of twin-stage semi-conductor dehumidifying using heat pipe synergy
Mechanism.
Background technology
In social now industrial production and daily life, special occasions that dehydrating unit requires in degree of being air-dried
It is widely applied.Its cardinal principle is dehumidification by condensation, i.e., is produced when humid air runs into the cold wall face less than dew-point temperature
Condensate, air humidity content and relative humidity are reduced, realizes the dehumidifying to air.Conventional dehydrating unit uses vapour pressure mostly
Compression type refrigerating technology is carried out cooling air and dehumidified, but compression refrigerating system pipeline is complicated, and volume is big, and cost is high.Semiconductor
Refrigerated dehumidification technical pattern is simple, long lifespan, and cost is low to be widely applied, but is limited by semiconductor refrigerating efficiency and cold
The limitation of hot junction face thermal conduction resistance, its dehumidification rate be not high.It is to improve it to remove that heat pipe is used in into semiconductor refrigerating dehumidifying technology
One of effective way of wet efficiency.
A kind of Chinese patent (CN105098622A) refrigeration mode electric cabinet dehumidifier, heat-pipe radiator is connected to and partly led
The hot junction of body cooling piece accelerates radiating, but heat is directly discharged in environment by heat-pipe radiator, is not reused,
Capacity usage ratio is limited.Chinese patent (CN204757220U) a kind of semiconductor dehumidifying device with heat pipe, by heat pipe system
Into S types, one end is attached at semiconductor chilling plate cold end, and the other end is installed in air channel, and the effect of heat pipe mainly plays transmission and partly led
The effect of body cooling piece cold end cold.Although the cooling and rewarming that can realize air share an air channel, it is contemplated that hot
The presence of pipe thermal conduction resistance, the raising to dehumidification rate have no help.
Therefore, for these deficiencies present on prior art, the utility model proposes a kind of using heat pipe synergy
Using the dehumidifying technology new way of twin-stage semiconductor refrigerating element.
Semiconductor refrigerating element absorbs heat in cold end and produces refrigeration, and releases heat in hot junction.Semiconductor refrigerating
Device has the advantages of tradition machinery formula refrigeration is incomparable, as it is simple in construction, size is small, in light weight, cheap, work without making an uproar
Sound, refrigerating speed are fast, service life length, easy to maintain etc..In the utility model, using twin-stage semiconductor refrigerating element,
Under identical heat exchange area and operating condition, bigger cold and Geng Gao can be provided by being compared to conventional single stage semiconductor chip
Refrigerating efficiency, this to improve system dehumidification efficiency have positive effect.Heat exchange of heat pipe operation principle itself and structure in addition
Particularity so that the utility model can make full use of cold end and the hot junction of heat exchange of heat pipe, can further improve system
Dehumidification rate.
The content of the invention
To solve defect and deficiency present in above-mentioned prior art, the purpose of this utility model is to provide a kind of heat pipe
The twin-stage semi-conductor dehumidifying mechanism of synergy, can using twin-stage semiconductor refrigerating technology improve overall dehumidification rate while,
Using heat pipe working characteristics, fully using the temperature of dry air after dehumidification by condensation so that humid air exists in condensation segment and dry air
Rewarming section respectively obtains precooling and preheating, improves the utilization rate of internal system heat and cold, and two fans can be controlled dynamically in addition
System regulation air-treatment amount, further improves overall dehumidification rate.
In order to achieve the above object, the utility model uses following technical scheme：
A kind of twin-stage semi-conductor dehumidifying mechanism of heat pipe synergy, including inlet scoop 6, induced-draught fan 7, heat pipe 9, heat pipe cold end are changed
Hot device 8, heat pipe hot end heat exchanger 5, air channel 10, semiconductor refrigerating element 12, semiconductor cool end heat exchanger 11, semiconductor hot junction are changed
Hot device 3, exhaust blower 2, exhaust outlet 1 and drip tray 4；The induced-draught fan 7 is at inlet scoop 6, heat pipe cool end heat exchanger 8 and heat pipe
Hot end heat exchanger 5 is interior located at air channel 10 and is connected to the hot and cold side of heat pipe 9, semiconductor cool end heat exchanger 11 and semiconductor system
The cold end connection of cold element 12, semiconductor hot end heat exchanger 3 are connected with the hot junction of semiconductor refrigerating element 12, and drip tray 4 is located at
The lower section of semiconductor cool end heat exchanger 11, exhaust blower 2 is at exhaust outlet 1；The air channel 10 is that the material with certain degree of hardness encloses
The single channel air channel with single inlet and outlet that column forms, it is inlet scoop at tunnel inlet, is exhaust outlet at ducting outlet,
Shape is moved towards in air channel 10 will be so that inner air flows by inlet scoop 6, induced-draught fan 7, heat pipe cold successively respectively with arrangement form
Hold heat exchanger 8, semiconductor cool end heat exchanger 11, heat pipe hot end heat exchanger 5, semiconductor hot end heat exchanger 3, exhaust blower 2 and air draft
Mouth 1；Air enters air channel 10 after the supercharging of induced-draught fan 7, exchanges heat after being tentatively cooled, is delivered to heat pipe cool end heat exchanger 8
Semiconductor cool end heat exchanger 11 carries out dehumidification by condensation, and the dry air after dehumidifying tentatively heats up through superheater tube hot end heat exchanger 5, then with
Semiconductor hot end heat exchanger 3 exchanges heat after rewarming, is discharged after being pressurized by exhaust blower 2 by exhaust outlet 1, in semiconductor cool end heat exchanger
The water that cooling condenses at 11 is discharged after falling into drip tray 4.
The semiconductor refrigerating element 12 is twin-stage semiconductor refrigerating element, by the electricity for controlling semiconductor refrigerating element 7
Input parameter so that semiconductor refrigerating element 7 is respectively at maximum cooling capacity operating mode or maximum refrigerating efficiency operating mode or general work
Condition.
The core component of the twin-stage semiconductor refrigerating element is the one-shot forming twin-stage semiconductor of one and above quantity
Cooling piece group, connected by series, parallel, series-parallel system；Or the core component of the twin-stage semiconductor refrigerating element is two
Individual single-stage semiconductor chilling plate is fitted and connected.
The cold and hot end face of the twin-stage semiconductor refrigerating element exchanges heat with semiconductor cool end heat exchanger, semiconductor hot junction respectively
Device is fitted and connected, and the cold and hot end face of the twin-stage semiconductor refrigerating element scribbles heat-conducting silicone grease.
The semiconductor cool end heat exchanger 11 and semiconductor hot end heat exchanger 3 are the finned or rib with planar substrates
Plate heat interchanger, the base plane surface should be greater than the cold and hot end surfaces of semiconductor refrigerating element 11；The heat pipe cold end is changed
Hot device 8 and heat pipe hot end heat exchanger 5 are finned heat exchanger, and by extruding or are welded to connect respectively in the cold and hot both ends of heat pipe.
The heat pipe 9 is gravity assisted heat pipe, and the gravity assisted heat pipe is metal material by extruding, welding or sinter molding
One and above heat pipe heat；Internal face is provided with micro- fin with augmentation of heat transfer effect, is filled with inside the gravity assisted heat pipe
Phase transformation working fluid.
The gravity assisted heat pipe hot and cold side is each passed through air channel wall and is in air channel commitment positions and the connection of its underpart endotherm section
While humid air heat is absorbed, heat pipe top heat release section connection heat pipe hot end heat exchanger 5 can be carried out heat pipe cool end heat exchanger 8
Heat release carries out heat temperature raising to dry air；The heat absorption of the gravity assisted heat pipe, exothermic process pass through inside heat pipe working fluid
Phase transformation is completed, without additional driving force.
The section in the air channel 10 is square or circular, and internal face has insulation material attachment；Air channel arrangement form is straight
Line style, Back Word type or reentrant type.The induced-draught fan 7 and exhaust blower 2 are independently powered, independent control.
Also include humidity and air quantity control system, the humidity and air quantity control system and semiconductor refrigerating element 12, suction
Blower fan 7 is connected with the power supply of exhaust blower 2, in the case of different humidity and air quantity requirement, by gathering the sky in the inlet scoop of air channel
Air humidity degree and setting humidity and airflow value, to control the electricity input of induced-draught fan 7, exhaust blower 2 and semiconductor refrigerating element 12
Realize the regulation of humidity and air quantity.
The humidity and air quantity control system are by gathering air humidity and setting humidity and air quantity numerical value, according to set
The electricity of programme-control induced-draught fan, exhaust blower and semiconductor refrigerating element 12 is inputted to realize the regulation of humidity and air quantity；If to dry
Air air quantity demand is big, while opens induced-draught fan 7 and exhaust blower 2, and controls the electrical parameter of semiconductor refrigerating element 12 to be in maximum
Refrigerating capacity operating mode or maximum refrigerating efficiency operating mode；If it is desired to which dry air humidity is minimum, then induced-draught fan 7 is opened, closes exhaust blower 2,
And the electrical parameter of semiconductor refrigerating element 12 is controlled to be in maximum cooling capacity operating mode；If it is desired to dehumidifier energy-saving run, then unlatching is arranged
Blower fan 2, induced-draught fan 7 is closed, and control the electrical parameter of semiconductor refrigerating element 12 to be in maximum refrigerating efficiency operating mode.
The beneficial effects of the utility model are：Prior art is compared to, the utility model passes through in dehumidification by condensation process
It is front and rear add heat pipe cool end heat exchanger and heat pipe hot end heat exchanger respectively, using particular job characteristic of heat pipe, to partly leading
Before body cool end heat exchanger dehumidification by condensation process, precooling is carried out to humid air using heat pipe cool end heat exchanger, in semiconductor cooling
After holding heat exchanger dehumidification by condensation process, dry air is heated up using heat pipe hot end heat exchanger, increases energy utilization rate
Dehumidification rate is improved simultaneously, meanwhile, the configuration of inlet scoop and exhaust outlet two fans, it can be moved according to different dehumidification requirements
State adjustment control air-treatment amount and effect on moisture extraction.Also, the use of twin-stage semiconductor refrigerating element, further increase dehumidifying
Efficiency.
Brief description of the drawings
Fig. 1 is a kind of twin-stage semi-conductor dehumidifying mechanism schematic diagram of heat pipe synergy of the utility model.
Embodiment
The utility model is described in further detail with reference to the accompanying drawings and detailed description.
As shown in figure 1, a kind of twin-stage semi-conductor dehumidifying mechanism of heat pipe synergy of the utility model, including inlet scoop 6, air draught
Machine 7, heat pipe 9, heat pipe cool end heat exchanger 8, heat pipe hot end heat exchanger 5, air channel 10, semiconductor refrigerating element 12, semiconductor cold end
Heat exchanger 11, semiconductor hot end heat exchanger 3, exhaust blower 2, exhaust outlet 1 and drip tray 4.The induced-draught fan 7 is located at inlet scoop 6,
Heat pipe cool end heat exchanger 8 and heat pipe hot end heat exchanger 5 are located in air channel 10 and are connected to the hot and cold side of heat pipe 9, semiconductor
Cool end heat exchanger 11 is connected with the cold end of semiconductor refrigerating element 12, semiconductor hot end heat exchanger 3 and semiconductor refrigerating element 12
Hot junction connection, drip tray 4 is located at the lower section of semiconductor cool end heat exchanger 11, and exhaust blower 2 is at exhaust outlet 1.The air channel 10
The single channel air channel with single inlet and outlet formed for the material fence with certain degree of hardness, it is air draught at tunnel inlet
Mouthful, it is exhaust outlet at ducting outlet, duct cross-section can be the various suitable patterns such as square, circular, and internal face has thermal insulating material
Material attachment；Air channel 10 move towards shape and arrangement form will so that inner air flow successively respectively by inlet scoop 6, induced-draught fan 7,
Heat pipe cool end heat exchanger 8, semiconductor cool end heat exchanger 11, heat pipe hot end heat exchanger 5, semiconductor hot end heat exchanger 3, exhaust blower 2
With exhaust outlet 1；Air channel arrangement form can be linear pattern, Back Word type or reentrant type.Air is pressurized laggard inlet air by induced-draught fan 7
Road 10, exchanged heat with heat pipe cool end heat exchanger 8 after being tentatively cooled, be delivered to semiconductor cool end heat exchanger 11 and carry out dehumidification by condensation,
Dry air after dehumidifying tentatively heats up through superheater tube hot end heat exchanger 5, then with semiconductor hot end heat exchanger 3 exchange heat rewarming after, by
Exhaust blower 2 is discharged after being pressurized by exhaust outlet 1.After the water condensed that cools at semiconductor cool end heat exchanger 11 falls into drip tray 4
Discharge.
As shown in figure 1, in this embodiment, the excellent heat-conducting effect of heat pipe 9 and unique working characteristics are make use of, at it
Cold and hot both ends are connected to heat pipe cool end heat exchanger 8 and heat pipe hot end heat exchanger 6.When humid air by induced-draught fan 7 be pressurized into
After entering air channel 10, the humid air into air channel 10 of heat pipe cool end heat exchanger 8 absorbs heat so that humid air is tentatively cooled down, institute
The heat of absorption is conducted to heat pipe hot end heat exchanger 5 through superheater tube 9, and into air channel 10, the dry air after dehumidification by condensation is released
Heat so that air obtains preliminary heating.
Semiconductor refrigerating element 12 is twin-stage semiconductor chilling plate.Its primary structure is a pair of N-type and P-type semiconductor block 1
The semi-conductor electricity couple that should be welded into, when electric current flows through the galvanic couple pair of N-P semi-conducting materials composition, it can distinguish at material both ends
Produce heat absorption and exothermic phenomenon, with this be respectively semiconductor chilling plate cold end and hot junction.Twin-stage semiconductor chilling plate is in list
In the principle and architecture basics of level cooling piece, the cold end of upper level cooling piece is attached to the hot junction of next stage cooling piece, utilized
The cold of upper level cooling piece cold end balances heat caused by next stage cooling piece hot junction, is reached with this and improves refrigerating efficiency
Purpose.Based on same purpose, twin-stage semiconductor refrigerating element 12 can also use two pieces of single-stage semiconductor chilling plates fittings and
Into.
Claims (9)
- A kind of 1. twin-stage semi-conductor dehumidifying mechanism of heat pipe synergy, it is characterised in that：Including inlet scoop (6), induced-draught fan (7), heat Manage (9), heat pipe cool end heat exchanger (8), heat pipe hot end heat exchanger (5), air channel (10), semiconductor refrigerating element (12), semiconductor Cool end heat exchanger (11), semiconductor hot end heat exchanger (3), exhaust blower (2), exhaust outlet (1) and drip tray (4)；The induced-draught fan (7) inlet scoop (6) place, heat pipe cool end heat exchanger (8) and heat pipe hot end heat exchanger (5) are located in air channel (10) and is connected respectively The hot and cold side of heat pipe (9) is connected on, semiconductor cool end heat exchanger (11) is connected with the cold end of semiconductor refrigerating element (12), semiconductor Hot end heat exchanger (3) is connected with the hot junction of semiconductor refrigerating element (12), and drip tray (4) is located at semiconductor cool end heat exchanger (11) Lower section, exhaust blower (2) are located at exhaust outlet (1) place；The air channel (10) be the material fence with certain degree of hardness form with The single channel air channel of single inlet and outlet, it is inlet scoop at tunnel inlet, is exhaust outlet at ducting outlet, air channel (10) trend Shape will cause inner air flows successively respectively to be exchanged heat by inlet scoop (6), induced-draught fan (7), heat pipe cold end with arrangement form Device (8), semiconductor cool end heat exchanger (11), heat pipe hot end heat exchanger (5), semiconductor hot end heat exchanger (3), exhaust blower (2) and Exhaust outlet (1).
- A kind of 2. twin-stage semi-conductor dehumidifying mechanism of heat pipe synergy according to claim 1, it is characterised in that：It is described partly to lead Body cooling module (12) is twin-stage semiconductor refrigerating element, by controlling the electric input parameter of semiconductor refrigerating element (12), is made Obtain semiconductor refrigerating element (12) and be respectively at maximum cooling capacity operating mode or maximum refrigerating efficiency operating mode or general operating mode.
- A kind of 3. twin-stage semi-conductor dehumidifying mechanism of heat pipe synergy according to claim 2, it is characterised in that：The twin-stage The core component of semiconductor refrigerating element is the one-shot forming twin-stage semiconductor chilling plate group of one and above quantity, passes through string Connection, in parallel, series-parallel system connection；Or the core component of the twin-stage semiconductor refrigerating element is two single-stage semiconductor refrigeratings Piece is fitted and connected.
- A kind of 4. twin-stage semi-conductor dehumidifying mechanism of heat pipe synergy according to claim 2, it is characterised in that：It is described double The cold and hot end face of level semiconductor cooling module is fitted and connected with semiconductor cool end heat exchanger, semiconductor hot end heat exchanger respectively, institute The cold and hot end face for stating twin-stage semiconductor refrigerating element scribbles heat-conducting silicone grease.
- A kind of 5. twin-stage semi-conductor dehumidifying mechanism of heat pipe synergy according to claim 1, it is characterised in that：It is described partly to lead Body cool end heat exchanger (11) and semiconductor hot end heat exchanger (3) are the finned or cold face temperature etc. with planar substrates, The base plane surface should be greater than the cold and hot end surfaces of semiconductor refrigerating element (12)；The heat pipe cool end heat exchanger (8) and Heat pipe hot end heat exchanger (5) is finned heat exchanger, and by extruding or is welded to connect respectively in the cold and hot both ends of heat pipe.
- A kind of 6. twin-stage semi-conductor dehumidifying mechanism of heat pipe synergy according to claim 1, it is characterised in that：The heat pipe (9) it is gravity assisted heat pipe, the gravity assisted heat pipe is one and above heat pipe of the metal material by extruding, welding or sinter molding Group；Internal face is provided with micro- fin with augmentation of heat transfer effect, and phase transformation working fluid is filled with inside the gravity assisted heat pipe.
- A kind of 7. twin-stage semi-conductor dehumidifying mechanism of heat pipe synergy according to claim 6, it is characterised in that：The gravity Heat pipe hot and cold side is each passed through air channel wall and is in air channel commitment positions and its underpart endotherm section connection heat pipe cool end heat exchanger (8) While humid air heat is absorbed, heat pipe top heat release section connection heat pipe hot end heat exchanger (5) can carry out heat release to dry air Carry out heat temperature raising；The heat absorption of the gravity assisted heat pipe, exothermic process are completed by the phase transformation of inside heat pipe working fluid, without Additional driving force.
- A kind of 8. twin-stage semi-conductor dehumidifying mechanism of heat pipe synergy according to claim 1, it is characterised in that：The air channel (10) section is square or circular, and internal face has insulation material attachment；Air channel arrangement form is linear pattern, Back Word type or folding Return type；The induced-draught fan (7) and exhaust blower (2) are independently powered, independent control.
- A kind of 9. twin-stage semi-conductor dehumidifying mechanism of heat pipe synergy according to claim 1, it is characterised in that：Also include wet Degree and air quantity control system, the humidity and air quantity control system and semiconductor refrigerating element (12), induced-draught fan (7) and exhaust blower (2) power supply is connected, in the case of different humidity and air quantity requirement, by gather air humidity in the inlet scoop of air channel and Humidity and airflow value are set, to control the electricity input of induced-draught fan (7), exhaust blower (2) and semiconductor refrigerating element (12) to realize The regulation of humidity and air quantity.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201720875663.7U CN207113018U (en) | 2017-07-18 | 2017-07-18 | A kind of twin-stage semi-conductor dehumidifying mechanism of heat pipe synergy |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201720875663.7U CN207113018U (en) | 2017-07-18 | 2017-07-18 | A kind of twin-stage semi-conductor dehumidifying mechanism of heat pipe synergy |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111076314A (en) * | 2018-10-18 | 2020-04-28 | 财团法人工业技术研究院 | Thermoelectric dehumidifier |
| CN113048570A (en) * | 2019-12-27 | 2021-06-29 | 青岛海尔空调电子有限公司 | Air conditioner and control method thereof |
| CN114130168A (en) * | 2021-11-10 | 2022-03-04 | 北京京仪自动化装备技术股份有限公司 | Multistage dehumidification device, exhaust gas treatment system and dehumidification control method |
| CN115164494A (en) * | 2022-07-15 | 2022-10-11 | 青岛海容商用冷链股份有限公司 | Semiconductor refrigeration freezer and control method thereof |
-
2017
- 2017-07-18 CN CN201720875663.7U patent/CN207113018U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111076314A (en) * | 2018-10-18 | 2020-04-28 | 财团法人工业技术研究院 | Thermoelectric dehumidifier |
| CN113048570A (en) * | 2019-12-27 | 2021-06-29 | 青岛海尔空调电子有限公司 | Air conditioner and control method thereof |
| CN113048570B (en) * | 2019-12-27 | 2022-05-20 | 青岛海尔空调电子有限公司 | Air conditioner and control method thereof |
| CN114130168A (en) * | 2021-11-10 | 2022-03-04 | 北京京仪自动化装备技术股份有限公司 | Multistage dehumidification device, exhaust gas treatment system and dehumidification control method |
| CN114130168B (en) * | 2021-11-10 | 2023-08-04 | 北京京仪自动化装备技术股份有限公司 | Multistage dehumidification device, exhaust gas treatment system and dehumidification control method |
| CN115164494A (en) * | 2022-07-15 | 2022-10-11 | 青岛海容商用冷链股份有限公司 | Semiconductor refrigeration freezer and control method thereof |
| CN115164494B (en) * | 2022-07-15 | 2024-06-07 | 青岛海容商用冷链股份有限公司 | Semiconductor refrigeration freezer and control method thereof |
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Effective date of registration: 20240410 Address after: 710061 9th Floor, Building E3, West Yungu Phase I, Fengxi New City, Xixian New Area, Xi'an City, Shaanxi Province Patentee after: Shaanxi Smolec Technology Co.,Ltd. Country or region after: China Address before: 710049 No. 28, Xianning Road, Xi'an, Shaanxi Patentee before: XI'AN JIAOTONG University Country or region before: China |
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