CN206191739U - Heat exchanger semiconductor degree of depth dehumidifier in middle of area - Google Patents
Heat exchanger semiconductor degree of depth dehumidifier in middle of area Download PDFInfo
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- CN206191739U CN206191739U CN201620886291.3U CN201620886291U CN206191739U CN 206191739 U CN206191739 U CN 206191739U CN 201620886291 U CN201620886291 U CN 201620886291U CN 206191739 U CN206191739 U CN 206191739U
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Abstract
The utility model provides a heat exchanger semiconductor degree of depth dehumidifier in middle of area, through heat exchanger in the middle of setting up, the low temperature fluid passageway of middle heat exchanger is introduced in the low temperature air -out of the piece heat absorption fin that will refrigerate group, the hot flow passage of heat exchanger in the middle of introducing the high temperature air inlet, utilize the low temperature air -out of heat absorption fin group to carry out the precooling to the high temperature air inlet that heat absorption fin organized, thereby reduce high temperature air inlet temperature, hygrometry improves, make it to become the humid air or the saturated air that approach the saturation, reentrant heat absorption fin group, thereby increase substantially the moisture load of refrigeration piece, increase substantially the dehumidification efficiency.
Description
Technical field
The utility model is related to dehydrating unit design field, more particularly to a kind of band Intermediate Heat Exchanger semiconductor depth
Dehumidifier.
Background technology
Semiconductor refrigerating technology, also known as thermoelectric cooling technology, from the 1950's, fast development is got up.Semiconductor system
Cold, it produces refrigeration using the P-N junction of semi-conducting material composition by leading to upper direct current, can just make cold end within several seconds
Frosting；It does not have the complicated mechanical structure of compressor etc., and refrigerant is not needed more.
Although the Energy Efficiency Ratio of semiconductor refrigerating, i.e. refrigerating capacity and the ratio for being input into electric work, relatively low, fluorine profit is only used
1/10 or so of the vapour compression refrigeration system of high refrigerant；But the characteristics of semiconductor refrigerating technology has incomparable and
Advantage：1. mechanical motion, rapid without refrigerant, refrigeration；2. can be combined with modularization, refrigerating capacity can from milliwatt to
Multikilowatt, the refrigeration temperature difference is easy to use up to 30---150 DEG C, with extensive；3. can continuously adjust, change the confession of cooling piece
Piezoelectric voltage, refrigerating capacity can be with consecutive variations；4. lightweight, small volume can make miniature, submicron, small semiconductor refrigeration
Device.
Semiconductor refrigerating technology solves dehumidifying in cabinet in short space, such as industrial electro gas holder, family's wardrobe cabinet etc.
Mould proof, raising electric insulation grade prevents air breakdown aspect, with unique advantage.
As shown in figure 1, semiconductor demoistener in the market, semiconductor chilling plate 3 is passed through direct current, cooling piece during operation
Right side heat absorption, left side heat release, blower fan 14 by air press to cooling piece left side be in close contact radiating fin group 2 take away heat from
The discharge dehumidifier of air outlet 13 is external；Meanwhile, blower fan 14 causes negative pressure in chamber, attracts the air of air inlet 12 to flow into；From entering
The leaked-in air of air port 13, sub-fraction flows through the heat absorbing fins group 9 being in close contact with cooling piece right side, this sub-fraction air
Converged by the bulk air for not flowing through heat absorbing fins group with major part after cool-down dehumidification, then flow to radiating fin group.
As can be seen here, the ventilation of the heat absorbing fins group of existing semiconductor demoistener, with uncertainty, any one
Extraneous disturbance can cause the change of ventilation.Semiconductor demoistener, because refrigerating efficiency is relatively low, usual refrigerating capacity all compares
It is small, during with " w " for unit, the 1 power order of magnitude or the 2 power orders of magnitude of refrigerating capacity generally only 10, if the semiconductor system of passing through
The air mass flow of the heat absorbing fins group of cold is larger, and semiconductor chilling plate is not with regard to carrying out depth dehumidifying to air (by air phase
Less than 50% is reduced to humidity) ability；Because air is only reduced under dew-point temperature in temperature and can just leach water
Point, and when passing through the air mass flow of heat absorbing fins group of semiconductor chilling plate and being larger, the refrigerating capacity of cooling piece is initially used for sky
The absorption of sensible heat more than gas dew-point temperature, and when the air sensible more than the dew-point temperature is absorbed cooling piece refrigerating capacity
It is generally just depleted, the absorption of water vapor in air condensation heat is used for hence without unnecessary refrigerating capacity, no longer exist ability
Just water vapor in air is condensed into water, and now dehumidifying effect is zero.
Utility model content
In order to solve the above problems, the utility model provides a kind of band Intermediate Heat Exchanger semiconductor depth dehumidifier, bag
Include：
Housing, is provided with the first air inlet, the second air inlet and air outlet；
Semiconductor chilling plate, is arranged in the housing, and the side of the semiconductor chilling plate is provided with heat absorbing fins group, separately
Side is provided with radiating fin group；
Intermediate Heat Exchanger, is arranged in the housing, and the Intermediate Heat Exchanger is provided with cry-fluid passage and high-temperature stream
Body passage；
The outer humid air of dehumidifier is entered into the housing from the first air inlet and the second air inlet respectively from described；By institute
The humid air for stating the entrance of the first air inlet first flows through the high temperature fluid passage of the Intermediate Heat Exchanger and tentatively lowers the temperature precooling, then flows
Cool-down dehumidification is carried out through the heat absorbing fins group, the cry-fluid passage for passing through the Intermediate Heat Exchanger is used for high temperature fluid
The air of passage carries out cooling and realizes precooling, finally flows to the radiating fin group；The wet sky entered by second air inlet
Gas flows directly into the radiating fin group, and radiating fin group is flowed through together with the air from Intermediate Heat Exchanger cry-fluid passage
Heat absorption is discharged after heating up by the air outlet.
It is preferred that the Intermediate Heat Exchanger is using crossflow regenerator, counter-flow heat exchanger or fork contra-flow heat exchanger, it is described
Intermediate Heat Exchanger includes some cry-fluid passages and high temperature fluid passage, and the cry-fluid passage and the height
Warm fluid passage interlaced arrangement, cryogen flows with high temperature fluid in the passage of the cry-fluid passage and high temperature fluid
And realize exchanging heat by wallboard.
It is preferred that the air flow in the cry-fluid passage mutually hangs down with the air flow in the high temperature fluid passage
Directly, or, air flow in the cry-fluid passage intersects and adverse current with the air flow in the high temperature fluid passage,
Or, the air flow in the cry-fluid passage it is parallel with the air flow in the high temperature fluid passage and adverse current.
It is preferred that be provided with first on first air inlet with aerofoil, described first with being evenly equipped with multiple the on aerofoil
One through hole；Second is provided with second air inlet with aerofoil, described second on aerofoil with being evenly equipped with multiple second through holes.
It is preferred that the first through hole, second through hole are circular or rectangle.
It is preferred that the heat absorbing fins group lower section is provided with drip tray, the drip tray is connected with a water tank.
It is preferred that blower fan is provided between the outlet air end and the air outlet of the radiating fin group, for promoting housing
The flowing of interior air.
The utility model additionally provides a kind of band Intermediate Heat Exchanger semiconductor depth dehumidifier, including：
Housing, is provided with the first air inlet, the second air inlet, the first air outlet and the second air outlet；
Semiconductor chilling plate, is arranged in the housing, and the side of the semiconductor chilling plate is provided with heat absorbing fins group, separately
Side is provided with radiating fin group；
Intermediate Heat Exchanger, is arranged in the housing, and the Intermediate Heat Exchanger is provided with cry-fluid passage and high-temperature stream
Body passage；
The outer humid air of dehumidifier is entered into the housing from the first air inlet and the second air inlet respectively from described；
The high temperature fluid passage that the humid air entered by first air inlet first flows through the Intermediate Heat Exchanger is preliminary
Cooling, passing through the heat absorbing fins group carries out cool-down dehumidification, and the cry-fluid passage for passing through the Intermediate Heat Exchanger is used for
Air to high temperature fluid passage carries out precooling, is finally discharged by the first air outlet；
By the humid air of second air inlet entrance directly through the radiating fin group, the radiating fin group is entered
Row cooling, then discharged from second air outlet.
It is preferred that first air outlet is provided with the first blower fan, second air inlet is provided with the second blower fan.
It is preferred that the Intermediate Heat Exchanger is using crossflow regenerator, fork contra-flow heat exchanger or counter-flow heat exchanger, it is described
Intermediate Heat Exchanger includes some cry-fluid passages and high temperature fluid passage, and the cry-fluid passage and the height
Warm fluid passage interlaced arrangement, cryogen flows with high temperature fluid in the passage of the cry-fluid passage and high temperature fluid
And realize exchanging heat by wallboard.
It is preferred that the air flow in the cry-fluid passage mutually hangs down with the air flow in the high temperature fluid passage
Directly；Or, the air flow in the cry-fluid passage intersects and adverse current with the air flow in the high temperature fluid passage；
Or, the air flow in the cry-fluid passage it is parallel with the air flow in the high temperature fluid passage and adverse current.
It is preferred that be provided with first on first air inlet with aerofoil, described first with being evenly equipped with multiple the on aerofoil
One through hole；Second is provided with second air inlet with aerofoil, described second on aerofoil with being evenly equipped with multiple second through holes.
The utility model is allowed to compared with prior art, have the following advantages that and accumulate due to using above technical scheme
Pole effect：
1) the band Intermediate Heat Exchanger semiconductor depth dehumidifier that the utility model is provided, by the setting of Intermediate Heat Exchanger,
The low temperature air-out of the heat absorbing fins group of semiconductor refrigerating fin is introduced in the cry-fluid passage of Intermediate Heat Exchanger, will be by first
The high temperature air intake that air inlet enters is introduced in the high temperature fluid passage of Intermediate Heat Exchanger, using the low temperature air-out pair of heat absorbing fins group
The high temperature air intake of heat absorbing fins group carries out precooling, so as to the reduction of high temperature EAT, relative humidity be improved, makes close
In the humid air or saturated air of saturation, heat absorbing fins group is entered back into, so as to increase substantially the humidity load of cooling piece, significantly
Improve dehumidifying efficiency；
2) the band Intermediate Heat Exchanger semiconductor depth dehumidifier that the utility model is provided, by setting air distribution on air inlet
Plate realizes heat absorbing fins group, the accurate air distribution of radiating fin group, so that passing through the sensible heat of the air of heat absorbing fins group half
Accounting in conductor cooling piece refrigerating capacity is greatly reduced, accurately reduces, and the latent heat of phase change of water vapor in air freezes in cooling piece
Accounting in amount is effectively improved, accurately improved, it is ensured that the heat absorbing fins group of semiconductor chilling plate in low relative humidity (for example
40%) moisture is filtered under the conditions of from air, so as to the relative humidity in space residing for semiconductor demoistener is reduced into 50%
Hereinafter, effectively pressing down mycostatic generation.
Brief description of the drawings
With reference to accompanying drawing, by hereafter state detailed description, above-mentioned and other spy of the present utility model can be more clearly understood that
Seek peace advantage, wherein：
Fig. 1 is the structural representation of semiconductor demoistener in the prior art；
Fig. 2 is the principle schematic with Intermediate Heat Exchanger semiconductor depth dehumidifier in embodiment 1；
Fig. 3 is heat absorbing fins group, the structural representation of radiating fin group in the utility model；
Fig. 4 is the structural representation of Intermediate Heat Exchanger in embodiment 1；
Fig. 5 is the fractionation schematic diagram of Intermediate Heat Exchanger in embodiment 1；
Fig. 6 is the schematic diagram with Intermediate Heat Exchanger semiconductor depth dehumidifier in embodiment 2；
Fig. 7 is the A of Fig. 4 to schematic diagram；
Fig. 8 is the schematic diagram with Intermediate Heat Exchanger semiconductor depth dehumidifier in embodiment 3.
Specific embodiment
Referring to the accompanying drawing for showing the utility model embodiment, the utility model is described in more detail.However, this reality
Can in many different forms be realized with new, and should not be construed as and limited by the embodiment for herein proposing.Conversely, proposing
These embodiments be in order to reach fully and complete disclosure, and make those skilled in the art understand completely this practicality newly
The scope of type.In these accompanying drawings, for clarity, the size and relative size in layer and region are may be exaggerated.
Current semiconductor demoistener cooling piece, due to the semiconductor P-N junction physical characteristic of itself, its refrigerating efficiency compared with
It is low, general only 0.3 or so.
When semiconductor demoistener runs, if heat absorbing fins are assembled, wind is not accurate enough, passes through the air stream of heat absorbing fins group
Amount is bigger than normal, and semiconductor chilling plate to air with regard to not carrying out the energy of depth dehumidifying (relative air humidity is reduced into less than 50%)
Power；Because, air is only reduced in temperature and moisture can be just leached under its dew-point temperature；And work as and pass through semiconductor refrigerating
When the air mass flow of the heat absorbing fins group of piece is bigger than normal, the refrigerating capacity of semiconductor chilling plate is initially used for dew point during air cooling-down
The absorption of sensible heat more than temperature, and when the air sensible more than the dew-point temperature is absorbed semiconductor chilling plate refrigerating capacity
It is generally just depleted, it is used further to now reach saturation or the air reclaimed water steaming close to saturation hence without refrigerating capacity more than needed
The absorption of vapour condensation heat, no longer exists ability just water vapor in air and is condensed into water.
Even if the small air quantity accurate air distribution of semiconductor demoistener heat absorbing fins group can be realized, the water in a small amount of air is leached
Point, for cooling piece, flow through heat absorbing fins group air sensible heat account for refrigerating capacity ratio it is also too high, cause dehumidification rate low
Under.For example, cooling piece refrigerating capacity 15w, under 30 DEG C of 40%RH operating modes, moisture removal 7.6g/h is realized by precision air distribution；For
The refrigeration work consumption of water vapor in air condensation heat absorption also only has 5.3w, only accounts for the 35% of overall refrigerating effect 15w；And 65% refrigeration
Amount be used to absorb the sensible heat for flowing through heat absorbing fins group air, for dehumidifying and mould proof not direct meaning.
Regarding to the issue above, the utility model provides a kind of band Intermediate Heat Exchanger semiconductor depth dehumidifier, on the one hand
The accurate air distribution of heat absorbing fins group, radiating fin group is realized with aerofoil by being set on air inlet, it is ensured that semiconductor refrigerating
The heat absorbing fins group of piece filters moisture under the conditions of low relative humidity from air；On the other hand by heat absorbing fins group with enter
Heat exchanger is set between wind, by high temperature EAT reduction, relative humidity improve, make close to saturation humid air or
Saturated air, enters back into heat absorbing fins group, so as to increase substantially the humidity load of cooling piece, increases substantially dehumidifying efficiency.
Specific embodiment is further described below.
Embodiment 1
Reference picture 2, the utility model provides a kind of band Intermediate Heat Exchanger semiconductor depth dehumidifier, includes a housing
11, semiconductor chilling plate 3 is provided with housing 11, the side of semiconductor chilling plate 3 is provided with heat absorbing fins group 9, and opposite side sets
It is equipped with radiating fin group 2；The first air inlet a, the second air inlet b and air outlet 10 are provided with housing 11, extraneous humid air is certainly
Entered into housing 11 from the first air inlet and the second air inlet respectively.Intermediate Heat Exchanger 8 is additionally provided with housing 11, centre is changed
Hot device 8 is arranged between the first air inlet a and heat absorbing fins group 9, and Intermediate Heat Exchanger 8 is provided with cry-fluid passage and high-temperature stream
Body passage, the air for flowing through cry-fluid passage and high temperature fluid passage is mutually exchanged heat
Wherein, the high temperature fluid passage that the humid air for being entered by the first air inlet a first flows through Intermediate Heat Exchanger 8 tentatively drops
Temperature, passing through heat absorbing fins group 9 carries out cool-down dehumidification, and the cry-fluid passage for passing through Intermediate Heat Exchanger 8 is used for high-temperature stream
The air of body passage carries out precooling, finally flows to radiating fin group 2；The humid air entered by the second air inlet b flows directly into scattered
Hot fins set 2, flows through after radiating fin group heats up together with the air from Intermediate Heat Exchanger and is discharged by air outlet 10.
The utility model by setting Intermediate Heat Exchanger 8, by the low temperature air-out of the heat absorbing fins group 9 of semiconductor refrigerating fin
Introduce in the cry-fluid passage of Intermediate Heat Exchanger 8, the high temperature air intake that will be entered by the first air inlet a introduces Intermediate Heat Exchanger 8
High temperature fluid passage in, precooling is carried out to the high temperature air intake of heat absorbing fins group 9 using the low temperature air-out of heat absorbing fins group 9, from
And improve the reduction of high temperature EAT, relative humidity, the humid air or saturated air close to saturation are made, enter back into
Heat absorbing fins group 9, so as to increase substantially the humidity load of cooling piece, increases substantially dehumidifying efficiency.
In the present embodiment, as shown in Figure 3, heat absorbing fins group 9, radiating fin group 2 are specifically be arranged in parallel by multiple
Fin is constituted, and heat absorbing fins group 9, radiating fin group 2 are compressed on semiconductor chilling plate 3；When semiconductor chilling plate 3 is powered
After work, heat absorbing fins group 9 is absorbed heat, the heat release of radiating fin group 2, and humid air stream, by cool-down dehumidification, becomes low through heat absorbing fins group 9
Warm saturated air, then flows through the heat that radiating fin group 2 is taken away in radiating fin group 2.
First air inlet a is communicated with the first air intake passage, and heat absorbing fins group 9, Intermediate Heat Exchanger 8 are located at the first air intake passage
It is interior；Second air inlet b is communicated with the second air intake passage, and the first air intake passage and the second air intake passage are separate, and in radiating
The air intake of fins set 2 converges；The outlet air end of radiating fin group 2 is connected by an air-out passage with air outlet 10；Enter from first
The air entered by the air after cool-down dehumidification and from the second air intake passage that wind passage is come in flows through radiating fin group after converging
2, take away after the heat in radiating fin group 2 through discharging housing 11 from air outlet 10 by air-out passage.
In the utility model, Intermediate Heat Exchanger 8 is using cross-current type or counter-flow heat exchanger or pitches contra-flow heat exchanger, compared to
Parallel flow heat exchanger, with heat transfer efficiency it is high, unit volume heat exchange area is big, thermic load is big the characteristics of, be suitable to gas-gas and change
Heat.
In the present embodiment, reference picture 4-5 Intermediate Heat Exchangers 8 use crossflow regenerator, and it includes some low temperature streams
Body passage (i.e. A channel) and high temperature fluid passage (i.e. channel B), and cry-fluid passage and the crisscross cloth of high temperature fluid passage
Put, the air flow in cry-fluid passage is perpendicular with air flow in high temperature fluid passage；From the first air inlet a's
High temperature air flows through high temperature fluid passage, and the Cryogenic air from heat absorbing fins group 9 flows through cry-fluid passage, so that low
Heat exchange is realized between warm fluid passage and high temperature fluid passage.
Certainly, in other embodiments, Intermediate Heat Exchanger 8 can also use counter-flow heat exchanger, now cry-fluid passage
Interior air flow it is parallel with the air flow in high temperature fluid passage and adverse current.
Certainly, in other embodiments, Intermediate Heat Exchanger 8 can also use fork contra-flow heat exchanger, now cry-fluid passage
Interior air flow intersects and adverse current with the air flow in high temperature fluid passage.
In the present embodiment, first is provided with the first air inlet a with aerofoil 7, second is provided with the second air inlet b and is matched somebody with somebody
Aerofoil 4, first with aerofoil 7 and second with aerofoil 4 be used for realize to the first air inlet a, the intake of the second air inlet b it is accurate
Distribution.
Further, first with being provided with multiple first through hole on aerofoil 7, and second with being provided with multiple second on aerofoil 4
Through hole, wherein first through hole, the second through hole can be circular hole or rectangular opening etc., not be limited herein.The utility model can lead to
Overregulate first through hole, the setting quantity of the second through hole, size and flow through first with aerofoil 7 and second with aerofoil 4 adjusting air
Resistance, so as to come precise control first with aerofoil 7 and second with aerofoil 4 intake, so as to carry out precise control heat absorbing fins
The group 9, ventilation of radiating fin group 2；Can realize " increasing radiating fin group ventilation to reduce the work of radiating fin group
Temperature, the refrigerating efficiency for improving semiconductor chilling plate ", can realize that " reducing heat absorbing fins group ventilation makes the sensible heat of air again
Accounting in cooling piece refrigerating capacity is greatly reduced, accurately reduces, and the latent heat of phase change of water vapor in air is in cooling piece refrigerating capacity
In accounting effectively improve, it is reliable improve, so as to industry that will be where semiconductor demoistener is relative wet with family expenses space
Degree is reduced to less than 50%.
In the present embodiment, the lower section of heat absorbing fins group 9 is provided with drip tray 6, formed in heat absorbing fins group 9 for being collected
Condensed water；Drip tray 6 is also associated with a water tank 5, and the water in drip tray 6 is exhausted directly in water tank.
Blower fan 1 is provided between the outlet air end and air outlet 9 of radiating fin group 2, that is, is arranged in air-out passage, blower fan 1
Flowing for promoting air in housing.After blower fan 1 starts so that enclosure interior forms negative pressure, so that outside air is suitable
Entered into housing from the first air inlet, the second air inlet.
The operation principle with Intermediate Heat Exchanger semiconductor depth dehumidifier for being provided with regard to the utility model below is done further
Explanation：
After startup, blower fan 1 is run, and negative pressuren zone is produced in the suction inlet of blower fan 1, attracts the external air of semiconductor demoistener to flow into
In housing 11；
Under the suction of blower fan 1, the air intake of the first air inlet by the first accurate air distribution with aerofoil 7 micro-air stream
Improved through the zone of heat liberation heat release precooling of Intermediate Heat Exchanger 8, temperature reduction, relative humidity, enter back into heat absorbing fins group 9 and enter one
Step cool-down dehumidification leaches moisture, and the cold fluid pass for again passing through Intermediate Heat Exchanger 8 as low temperature saturated air absorbs heat and heats up, then
Outflow Intermediate Heat Exchanger 8；
Meanwhile, under the suction of blower fan 1, the air intake of the second air inlet after second with the Even air distribution of aerofoil 4 with come from
The air mixing of the cold fluid pass of Intermediate Heat Exchanger 8, then radiating fin group 2 is flowed into, absorb the heat of radiating fin group 2 and heat up, warp
After the boosting of blower fan 1 from outside the discharge machine of air outlet 10.
Embodiment 2
Reference picture 6-7, the present embodiment is the improvement carried out on the basis of embodiment 1, relative to the present embodiment of embodiment 1
There is following distinguishing feature：
In the present embodiment, the air intake direction of the first air inlet a perpendicular to the A shown in Fig. 6 to direction, the second air inlet
The air intake direction of b be then parallel to A shown in Fig. 6 to direction, and, the plane where flowing through radiating fin group air-flow is (i.e.
Plane shown in Fig. 6), and flow through heat absorbing fins group 9, plane (plane i.e. shown in Fig. 7) where the air-flow of Intermediate Heat Exchanger 8
It is orthogonal.
The utility model is configured by above-mentioned design to the airflow direction of housing, is conducive to being arranged in actual product
The arrangement in convenient internal each air channel.
Embodiment 3
Reference picture 8, the present embodiment is the improvement carried out on the basis of embodiment 1.
Specifically, in the present embodiment, band Intermediate Heat Exchanger semiconductor depth dehumidifier includes a housing 11, housing 11
Semiconductor chilling plate 3 is inside provided with, the side of semiconductor chilling plate 3 is provided with heat absorbing fins group 9, and opposite side is provided with radiating fin
Piece group 2；The first air inlet 15, the second air inlet 16, the first air outlet 17 and the second air outlet 18 are provided with housing 11.Housing
Intermediate Heat Exchanger 8 is additionally provided with 11, Intermediate Heat Exchanger 8 is arranged between the first air inlet 15 and heat absorbing fins group 9, and centre is changed
Hot device 8 is provided with cry-fluid passage and high temperature fluid passage, flows through the air phase of cry-fluid passage and high temperature fluid passage
Mutually exchanged heat.
In the present embodiment, the first blower fan 19 is provided with the first air outlet 17, second is provided with the second air inlet 16
Blower fan 20.
Heat absorbing fins group 9 and radiating fin group 2 are located in two independent air ducts respectively；
In the presence of the first blower fan 19, extraneous humid air enters from the first air inlet 15, first flows through Intermediate Heat Exchanger 8
High temperature fluid passage tentatively lower the temperature, passing through heat absorbing fins group 9 carries out cool-down dehumidification, passes through the low temperature of Intermediate Heat Exchanger 8
Fluid passage is used to carry out precooling to the air of high temperature fluid passage, is finally discharged by the first air outlet 17；
In the presence of the second blower fan 20, the external world enters from the second air inlet 16, directly through radiating fin group 2, is used for
Radiating fin group 2 is lowered the temperature, then is discharged from the second air outlet 18.
Those skilled in the art should be understood that the utility model can be realized without de- with many other concrete forms
From spirit or scope of the present utility model.Although having been described for embodiment of the present utility model, it should be understood that the utility model should not
Be limited to these embodiments, the utility model that those skilled in the art can define such as appended claims spirit and
Within the scope of make and changing and modifications.
Claims (12)
1. a kind of with Intermediate Heat Exchanger semiconductor depth dehumidifier, it is characterised in that including：
Housing, is provided with the first air inlet, the second air inlet and air outlet；
Semiconductor chilling plate, is arranged in the housing, and the side of the semiconductor chilling plate is provided with heat absorbing fins group, opposite side
It is provided with radiating fin group；
Intermediate Heat Exchanger, is arranged in the housing, and the Intermediate Heat Exchanger is provided with cry-fluid passage and high temperature fluid is logical
Road；
The outer humid air of dehumidifier is entered into the housing from first air inlet and the second air inlet respectively；By described first
The high temperature fluid passage that the humid air that air inlet enters first flows through the Intermediate Heat Exchanger is tentatively lowered the temperature precooling, is passed through described
Heat absorbing fins group carries out cool-down dehumidification, and the cry-fluid passage for passing through the Intermediate Heat Exchanger is used for high temperature fluid passage
Air carries out cooling and realizes precooling, finally flows to the radiating fin group；The humid air entered by second air inlet is direct
The radiating fin group is flowed to, the heat absorption of radiating fin group is flowed through together with the air from Intermediate Heat Exchanger cry-fluid passage and is risen
Discharged by the air outlet after temperature.
2. according to the band Intermediate Heat Exchanger semiconductor depth dehumidifier described in claim 1, it is characterised in that the Intermediate Heat Exchanger
Using crossflow regenerator, counter-flow heat exchanger or fork contra-flow heat exchanger, the Intermediate Heat Exchanger includes some low temperature
Fluid passage and high temperature fluid passage, and the cry-fluid passage and the high temperature fluid passage interlaced arrangement, cryogen
Flowed in the passage of the cry-fluid passage and high temperature fluid with high temperature fluid and realize exchanging heat by wallboard.
3. according to the band Intermediate Heat Exchanger semiconductor depth dehumidifier described in claim 1, it is characterised in that the cryogen is led to
Air flow in road is perpendicular with air flow in the high temperature fluid passage, or, in the cry-fluid passage
Air flow intersects and adverse current with the air flow in the high temperature fluid passage, or, the sky in the cry-fluid passage
Air-flow is to and adverse current parallel with the air flow in the high temperature fluid passage.
4. according to the band Intermediate Heat Exchanger semiconductor depth dehumidifier described in claim 1, it is characterised in that first air inlet
On be provided with first with aerofoil, described first on aerofoil with being evenly equipped with multiple first through hole；It is provided with second air inlet
Second matches somebody with somebody aerofoil, and described second with being evenly equipped with multiple second through holes on aerofoil.
5. according to the band Intermediate Heat Exchanger semiconductor depth dehumidifier described in claim 4, it is characterised in that the first through hole,
Second through hole is circular or rectangle.
6. according to the band Intermediate Heat Exchanger semiconductor depth dehumidifier described in claim 1, it is characterised in that the heat absorbing fins group
Lower section is provided with drip tray, and the drip tray is connected with a water tank.
7. according to the band Intermediate Heat Exchanger semiconductor depth dehumidifier described in claim 1, it is characterised in that the radiating fin group
Outlet air end and the air outlet between be provided with blower fan, the flowing for promoting air in housing.
8. a kind of with Intermediate Heat Exchanger semiconductor depth dehumidifier, it is characterised in that including：
Housing, is provided with the first air inlet, the second air inlet, the first air outlet and the second air outlet；
Semiconductor chilling plate, is arranged in the housing, and the side of the semiconductor chilling plate is provided with heat absorbing fins group, opposite side
It is provided with radiating fin group；
Intermediate Heat Exchanger, is arranged in the housing, and the Intermediate Heat Exchanger is provided with cry-fluid passage and high temperature fluid is logical
Road；
The outer humid air of dehumidifier is entered into the housing from first air inlet and the second air inlet respectively；
The high temperature fluid passage that the humid air entered by first air inlet first flows through the Intermediate Heat Exchanger is tentatively lowered the temperature,
Passing through the heat absorbing fins group carries out cool-down dehumidification, and the cry-fluid passage for passing through the Intermediate Heat Exchanger is used for high temperature
The air of fluid passage carries out precooling, is finally discharged by the first air outlet；
By the humid air of second air inlet entrance directly through the radiating fin group, the radiating fin group is dropped
Temperature, then discharged from second air outlet.
9. according to the band Intermediate Heat Exchanger semiconductor depth dehumidifier described in claim 8, it is characterised in that first air outlet
The first blower fan is provided with, second air inlet is provided with the second blower fan.
10. according to the band Intermediate Heat Exchanger semiconductor depth dehumidifier described in claim 8, it is characterised in that the intermediate heat transfer
Using crossflow regenerator, fork contra-flow heat exchanger or counter-flow heat exchanger, the Intermediate Heat Exchanger includes some described low device
Warm fluid passage and high temperature fluid passage, and the cry-fluid passage and the high temperature fluid passage interlaced arrangement, low temperature stream
Body is flowed in the passage of the cry-fluid passage and high temperature fluid with high temperature fluid and is realized exchanging heat by wallboard.
11. according to the band Intermediate Heat Exchanger semiconductor depth dehumidifier described in claim 8, it is characterised in that the cryogen
Air flow in passage is perpendicular with air flow in the high temperature fluid passage；Or, in the cry-fluid passage
Air flow and the high temperature fluid passage in air flow intersect and adverse current；Or, in the cry-fluid passage
Air flow it is parallel with the air flow in the high temperature fluid passage and adverse current.
12. according to the band Intermediate Heat Exchanger semiconductor depth dehumidifier described in claim 8, it is characterised in that first air intake
First is provided with mouthful with aerofoil, described first on aerofoil with being evenly equipped with multiple first through hole；Set on second air inlet
Have second with aerofoil, described second on aerofoil with being evenly equipped with multiple second through holes.
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| CN201620886291.3U CN206191739U (en) | 2016-08-15 | 2016-08-15 | Heat exchanger semiconductor degree of depth dehumidifier in middle of area |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106168389A (en) * | 2016-08-15 | 2016-11-30 | 浙江普林艾尔电器工业有限公司 | A kind of band Intermediate Heat Exchanger quasiconductor degree of depth dehumidifier |
| CN110004681A (en) * | 2019-04-16 | 2019-07-12 | 广东技术师范大学 | A kind of interior circulation clothes-drying machine and drying system |
-
2016
- 2016-08-15 CN CN201620886291.3U patent/CN206191739U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106168389A (en) * | 2016-08-15 | 2016-11-30 | 浙江普林艾尔电器工业有限公司 | A kind of band Intermediate Heat Exchanger quasiconductor degree of depth dehumidifier |
| CN106168389B (en) * | 2016-08-15 | 2022-06-24 | 浙江普林艾尔电器工业有限公司 | Semiconductor deep dehumidifier with intermediate heat exchanger |
| CN110004681A (en) * | 2019-04-16 | 2019-07-12 | 广东技术师范大学 | A kind of interior circulation clothes-drying machine and drying system |
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