CN106123158A - A kind of semiconductor demoistener of heat absorbing fins group band thermal protection structure - Google Patents
A kind of semiconductor demoistener of heat absorbing fins group band thermal protection structure Download PDFInfo
- Publication number
- CN106123158A CN106123158A CN201610671799.6A CN201610671799A CN106123158A CN 106123158 A CN106123158 A CN 106123158A CN 201610671799 A CN201610671799 A CN 201610671799A CN 106123158 A CN106123158 A CN 106123158A
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- Prior art keywords
- heat absorbing
- air
- absorbing fins
- heat
- fins group
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
- F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
- F24F3/14—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/20—Casings or covers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
- F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
- F24F3/14—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification
- F24F2003/144—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification by dehumidification only
Abstract
The invention provides the semiconductor refrigerator of a kind of heat absorbing fins group band thermal protection structure, including housing, be provided with the first air inlet, the second air inlet and air outlet；Semiconductor chilling plate, is arranged in housing, and the side of semiconductor chilling plate is provided with heat absorbing fins group, and opposite side is provided with radiating fin group；Heat-insulating shield, is located in described heat absorbing fins group, and remove in heat-insulating shield and heat absorbing fins group air intake surface, outlet air surface and with the joint face of semiconductor chilling plate outside other sides fit tightly；Extraneous humid air enters in housing from the first air inlet and the second air inlet respectively, and the humid air entered by the first air inlet first flow through heat absorbing fins group after flow to radiating fin group again, the second air inlet the humid air entered flows directly into radiating fin group；Stream air after radiating fin group discharges housing via air outlet.The present invention setting by heat-insulating shield, decreases the loss of the refrigerating capacity of semiconductor chilling plate.
Description
Technical field
The present invention relates to dehydrating unit design field, particularly relate to the half of a kind of heat absorbing fins group band thermal protection structure
Conductor refrigeration machine.
Background technology
Semiconductor refrigerating technology, also known as freezing by thermoelectric action technology, from the 1950's, fast development is got up.Quasiconductor system
Cold, it utilizes the P-N junction that semi-conducting material forms, and logical upper unidirectional current can produce refrigeration, within several seconds, just can make cold end
Frosting；It does not has the frame for movement that compressor etc. is complicated, more need not cold-producing medium.
Although the Energy Efficiency Ratio of semiconductor refrigerating, i.e. refrigerating capacity and the ratio inputting electric work, relatively low, only use fluorine profit
About the 1/10 of the vapour compression refrigeration system of high cold-producing medium, but semiconductor refrigerating technology have unrivaled feature and
Advantage: 1. mechanical is moved, without cold-producing medium, refrigeration rapidly；2. can be with modularity combination in any, the temperature difference of freezing is up to 30---150
DEG C, easy to use, use extensively；3. can continuously adjust, change the supply voltage of cooling piece, refrigerating capacity can be with consecutive variations；
The most lightweight, volume is little, can make miniature, submicron, small semiconductor refrigerator.
Semiconductor refrigerating technology is at short space, and such as industrial electro gas holder, family's wardrobe cabinet etc., the most damp and the hottest
Under conditions of load tide humid air continuously generates, the mildew-resistant that dehumidifies in solving cabinet, raising electric insulation grade prevent from puncturing aspect,
There is the advantage of uniqueness.
But, semiconductor demoistener, owing to refrigerating efficiency is relatively low, usual refrigerating capacity is smaller, when being unit with " w ",
The 1 power order of magnitude of refrigerating capacity generally only 10 or the 2 power orders of magnitude, so refrigerating capacity ten parting of semiconductor chilling plate is expensive,
Must protect properly, use with caution;
Semiconductor demoistener in the market, the ventilation of its heat absorbing fins has uncertainty, the disturbance in any one external world
The change of ventilation can be caused, it is impossible to precisely air distribution, can only dehumidify under the conditions of high humility such as 80%RH, and can not be in phase
Dehumidifying under the conditions of relatively low humidity such as 40%RH, causing the degree of depth of semiconductor refrigerating technology to dehumidify " mildew-resistant " function can not be real
Existing problem.
And, the heat absorbing fins group of current semiconductor demoistener is in open air ambient, and contact leakage heat (is such as used
Bolt in fixing cooling piece heat absorbing fins can bring the heat of the bolt other end into heat absorbing fins) and external convection current leakage heat radiation
Leakage heat (heat that the such as convection current of heat absorbing fins group both sides leaks into radiation) easily causes the damage of semiconductor chilling plate refrigerating capacity
Lose.
Summary of the invention
In order to solve the problem in background technology, the invention provides partly leading of a kind of heat absorbing fins group band thermal protection structure
System cold, including
Housing, is provided with the first air inlet, the second air inlet and air outlet；
Semiconductor chilling plate, is arranged in described housing, and the side of described semiconductor chilling plate is provided with heat absorbing fins group, opposite side
It is provided with radiating fin group；
Heat-insulating shield, described heat-insulating shield is located in described heat absorbing fins group, and described heat-insulating shield and described suction
In hot fins set remove air intake surface, outlet air surface and with the joint face of described semiconductor chilling plate outside other sides closely paste
Close；
Extraneous humid air enters in described housing from the first air inlet and the second air inlet respectively from described, and by the first air intake
Mouthful enter humid air first flow through described heat absorbing fins group after flow to described radiating fin group again, by second air inlet enter wet
Air flows directly into described radiating fin group；Stream air after radiating fin group discharges described shell via described air outlet
Body.
It is preferred that the upper and lower end of described heat absorbing fins group is respectively air intake surface and outlet air surface.
It is preferred that the cross section, boundary of described heat-insulating shield takes the shape of the letter U, described heat-insulating shield is set by protective cover front and symmetry
Put and form in the protective cover side of both sides, described protective cover front；Described protective cover front is just being close to described heat absorbing fins group
Face, described protective cover side is close on the left and right side of described heat absorbing fins group, and described protective cover side is parallel to described suction
The heat absorbing fins of hot fins set.
It is preferred that the heat absorbing fins parallelogram in described heat absorbing fins group, described heat-insulating shield side also in
The parallelogram equivalently-sized with described heat absorbing fins.
It is preferred that described heat-insulating shield uses insulant foaming to make.
It is preferred that be provided with the first air distribution plate on described first air inlet, described first air distribution plate is evenly equipped with multiple
One through hole；It is provided with the second air distribution plate on described second air inlet, described second air distribution plate is evenly equipped with multiple second through hole.
It is preferred that described first through hole, described second through hole are circular or rectangle.
It is preferred that be provided with drip tray below described heat absorbing fins group, described drip tray connects a water tank.
It is preferred that be provided with blower fan between the outlet air end of described radiating fin group and described air outlet, it is used for promoting housing
The flowing of interior air.
Due to the fact that the above technical scheme of employing, be allowed to compared with prior art, have the following advantages that and actively imitate
Really:
(1) semiconductor refrigerator of a kind of heat absorbing fins group band thermal protection structure that the present invention provides, by heat absorbing fins group
Upper cover sets a heat-insulating shield, thus has effectively blocked the contact leakage heat of outer bound pair heat absorbing fins, convection current leakage heat, radiation leakage
Heat, thus decrease the loss of the refrigerating capacity of semiconductor chilling plate, and then be conducive to improving the effect on moisture extraction of heat absorbing fins group；
(2) semiconductor refrigerator of a kind of heat absorbing fins group band thermal protection structure that the present invention provides, by being divided into air inlet
Two air inlets, and distribute accurately being provided with air distribution plate at two air inlets, control so that pass through heat absorbing fins group
Air quantity is less than the air quantity passing through radiating fin group, so that passing through the sensible heat of the air of heat absorbing fins group in semiconductor chilling plate system
Accounting in cold is greatly reduced, accurately reduces, and the latent heat of phase change of water vapor in air accounting in cooling piece refrigerating capacity obtains
To being effectively improved, accurately improving, it is ensured that the heat absorbing fins of semiconductor chilling plate under the conditions of low relative humidity (such as 40%) from sky
Gas filters moisture, thus the relative humidity in space residing for semiconductor demoistener is reduced to less than 50%, mould with effectively suppression
The generation of bacterium.
Accompanying drawing explanation
In conjunction with accompanying drawing, by hereafter state detailed description, can be more clearly understood that the present invention above-mentioned and other feature and
Advantage, wherein:
Fig. 1 is the structural representation of the semiconductor refrigerator of heat absorbing fins group band thermal protection structure in embodiment 1；
Fig. 2 is that the A of Fig. 1 is to schematic diagram；
Fig. 3 is the structural representation of heat absorbing fins group in embodiment 1；
Fig. 4 is the structural representation of heat-insulating shield in embodiment 1；
Fig. 5 is the structural representation of the semiconductor refrigerator of heat absorbing fins group band thermal protection structure in embodiment 2；
Fig. 6 is that the A of Fig. 5 is to schematic diagram；
The structural representation of heat absorbing fins group in Fig. 7 position embodiment 2.
Detailed description of the invention
See the accompanying drawing illustrating the embodiment of the present invention, the present invention is described in more detail.But, the present invention can be with
Many multi-forms realize, and should not be construed as the embodiment by herein proposing and limited.On the contrary, proposing these embodiments is
In order to reach fully and complete disclosure, and those skilled in the art are made to understand the scope of the present invention completely.These are attached
In figure, for clarity sake, may be exaggerated layer and the size in region and relative size.
The cooling piece of current semiconductor refrigerator, due to the physical characteristic of quasiconductor P-N junction self, its refrigerating efficiency is relatively
Low, general only about 0.3；The generally refrigerating capacity of cooling piece is smaller, when being unit with " w ", and refrigerating capacity generally only 10
The 1 power order of magnitude or the 2 power orders of magnitude, so refrigerating capacity ten parting of semiconductor chilling plate is expensive.Must be from semiconductor refrigerating
Machine structure optimization is set out, and effectively controls the contact leakage heat of the heat absorbing fins group (module) of semiconductor refrigerator, such as, is used for
The bolt of fixing cooling piece heat absorbing fins module is brought the heat of the bolt other end into heat absorbing fins module as heat bridge and is formed
Contact leakage heat；With heat absorbing fins module-external cross-ventilation leakage heat radiation leakage heat, the such as sky of heat absorbing fins module both sides
Gas convection current and the heat of low-temp radiating leak into heat absorbing fins module.
When semiconductor chilling plate runs, its heat absorbing fins group (module) is higher than the high temperature ring of heat absorbing fins group temperature by temperature
Border is surrounded, and the heat of hot environment flows to this temperature of heat absorbing fins group " depression " by conduction, convection current, radiation mode, this
A little contact leakage heat and convection current leakage heat radiation leakage heat, cause the loss of the extremely valuable refrigerating capacity of semiconductor chilling plate.
Therefore, the invention provides the semiconductor refrigerator of a kind of heat absorbing fins group band thermal protection structure, including a housing,
The first air inlet, the second air inlet and air outlet it is provided with on housing；Semiconductor chilling plate, quasiconductor system it is provided with in housing
The side of cold is provided with heat absorbing fins group, and opposite side is provided with radiating fin group；It is covered with heat insulation protection in described heat absorbing fins group
Remove on cover, and heat-insulating shield and heat absorbing fins group air intake surface, outlet air surface and with the joint face of semiconductor chilling plate outside
Other sides fit tightly；Extraneous humid air is from entering in housing from the first air inlet and the second air inlet respectively, and by the
The humid air that one air inlet enters flows to radiating fin group after first flowing through heat absorbing fins group again, the second air inlet the wet sky entered
Gas flows directly into radiating fin group；Stream air after radiating fin group discharges described housing via air outlet.
On the one hand, the semiconductor refrigerator of the heat absorbing fins group band thermal protection structure that the present invention provides, by heat absorption fins
Sheet group upper cover sets a heat-insulating shield, thus has effectively blocked the contact leakage heat of outer bound pair heat absorbing fins, convection current leakage heat, radiation
Leakage heat, thus decrease the loss of the refrigerating capacity of semiconductor chilling plate, and then be conducive to improving the effect on moisture extraction of heat absorbing fins group.
On the other hand, the semiconductor refrigerator of the heat absorbing fins group band thermal protection structure that the present invention provides, by by air intake
Mouth is divided into two air inlets so that the air quantity passing through heat absorbing fins group is less than the air quantity passing through radiating fin group, makes to pass through heat absorption
The small air quantity of fins set is precisely controlled, so that passing through the sensible heat of the air of heat absorbing fins group in cooling piece refrigerating capacity
Accounting be greatly reduced, accurately reduce, the latent heat of phase change of water vapor in air accounting in cooling piece refrigerating capacity obtains effectively
Improve, accurately improve, it is ensured that the heat absorbing fins group of semiconductor chilling plate under the conditions of low relative humidity (such as 40%) from air
Filter moisture, thus the relative humidity in space residing for semiconductor demoistener is reduced to less than 50%, mycostatic effectively to press down
Occur.
Below detailed description of the invention is described further, specific as follows.
Embodiment 1
With reference to Fig. 1-4, the invention provides the semiconductor refrigerator of a kind of heat absorbing fins group band thermal protection structure, include a shell
Body, is provided with semiconductor chilling plate 3 in housing, the side of semiconductor chilling plate 3 is provided with heat absorbing fins group 7, and opposite side is arranged
There is radiating fin group 2.
As shown in Figure 3, heat absorbing fins group 7 and radiating fin group 2 are specifically arranged base by a substrate and multiple parallel interval
Fin composition on plate, heat absorbing fins group 7, the substrate side of radiating fin group 2 are compressed on semiconductor chilling plate 3；When half
Conductor cooling piece 3 is energized after work, and heat absorbing fins group 7 is absorbed heat, radiating fin group 2 heat release, and humid air stream is through heat absorbing fins group 7 quilt
Cool-down dehumidification, becomes low temperature saturated air, then flows through radiating fin group 2 and takes away the heat in radiating fin group 2.
In the present embodiment, housing 1 is provided with the first air inlet the 9, second air inlet 4 and air outlet 10, extraneous wet
Air is from entering in housing from the first air inlet 9 and the second air inlet 4 respectively, and the humid air entered by the first air inlet 9
First flow through heat absorbing fins group 7 by after cool-down dehumidification, then flow to radiating fin group 2, the second air inlet 4 humid air entered is direct
Flow to radiating fin group 2；Carry out heat absorbing fins group 9 and flow through radiating fin group 2 together with the air of the second air inlet and to radiating fin
After sheet group 2 is lowered the temperature, discharge housing 10 via air outlet 10.
In the present embodiment, heat absorbing fins group 7 is covered with heat-insulating shield 8, heat-insulating shield 8 and heat absorbing fins group 7
Upper removing air intake surface, outlet air surface and with the joint face of semiconductor chilling plate outside other sides fit tightly；At the present embodiment
In, owing to the upper end d of heat absorbing fins group 7 is air intake surface, the lower end e of heat absorbing fins group 7 is outlet air surface, the most only heat absorbing fins
The front c of group 7 and left and right side a, b need to fit tightly with heat-insulating shield, to completely cut off outer bound pair heat absorbing fins group 7 heat
Leak into.
Further, with reference to Fig. 3, the cross section of heat-insulating shield 8 takes the shape of the letter U, and heat-insulating shield 8 is by protective cover front and symmetry
It is arranged on the protective cover side composition of both sides, protective cover front；The size of the size of heat-insulating shield 8 and heat absorbing fins group 7 is mutually
Joining so that protective cover front is close to the front c of heat absorbing fins group, two protective cover sides are close to the left and right of heat absorbing fins group 7
On side a, b, and protective cover side is parallel to the heat absorbing fins in heat absorbing fins group 7.
Wherein, heat-insulating shield 8 is to use adiabator to carry out foaming to make, and wherein insulant concretely gathers
Urethane class insulant, does not limits；Heat-insulating shield closely covers to set and is fitted in heat absorbing fins group, thus blocks heat absorption
The front c of fins set 7 and the cross-ventilation of left and right side a, b and leaking into of radiations heat energy；Meanwhile, heat absorbing fins group 7 for
Other structures connect fixing connector connectors such as () such as screw rods, use the material system of the low thermal conductivity such as nylon, resin
Become, block the input of conductivity leakage heat.
In the present embodiment, it is also provided with the first air distribution plate 8 at the first air inlet 9, also can arrange at the second air inlet 4
There are the second air distribution plate, the first air distribution plate and the second air distribution plate for realizing the intake to first air inlet the 9, second air inlet 8
Accurate distribution.
Further, the first air distribution plate is provided with multiple first through hole, the second air distribution plate 4 is provided with multiple second and leads to
Hole, wherein the first through hole, the second through hole can be circular hole, it is possible to for rectangular opening, be not restricted.
The present invention can by controlling the first through hole, arrange quantity, the size of the second through hole accurately control the first air distribution
Plate and the intake of the second air distribution plate, thus accurately control heat absorbing fins group 7, the ventilation of radiating fin group 2.Concrete,
By to the diameter of through hole on air distribution plate and the setting of quantity, regulation air flows through the resistance of orifice plate, it is possible to accurately regulate suction
Hot fins set, the ventilation of radiating fin group, can accurately adjust heat absorbing fins group ventilation and radiating fin group ventilation
Ratio；I.e. can realize " increasing radiating fin group ventilation to reduce the operating temperature of radiating fin group, to improve semiconductor refrigerating
The refrigerating efficiency of sheet ", can realize again " reducing heat absorbing fins group ventilation and making sensible heat the accounting in cooling piece refrigerating capacity of air
Than being greatly reduced, accurately reduce, the latent heat of phase change of water vapor in air accounting in cooling piece refrigerating capacity effectively improves,
Reliable raising, thus the relative humidity of the industry at semiconductor demoistener place Yu domestic space is reduced to less than 50%.
In the present embodiment, the lower section of heat absorbing fins group 7 is provided with drip tray 6, is used for collecting in heat absorbing fins group 7 formation
Condensed water；Drip tray 6 is also associated with a water tank 5, and the water in drip tray 6 is exhausted directly in water tank.
In the present embodiment, it is provided with blower fan 1 between outlet air end and the air outlet 10 of radiating fin group 2, is i.e. arranged on out
In wind passage, blower fan 1 is the flowing of air in promoting housing.After blower fan 1 starts so that enclosure interior forms negative pressure, thus
Make outside air be obedient to the first air inlet, the second air inlet enters in housing.
The operation principle of semiconductor refrigerator of the heat absorbing fins group band the thermal protection structure below present invention provided do into
The explanation of one step:
First, after semiconductor chilling plate 3 energising starts, the heat absorbing fins group 7 on right side absorbs heat, the radiating fin group 2 on right side
Distribute heat；Fan 1 starts so that extraneous humid air enters in housing from first air inlet the 9, second air inlet 4 respectively；From
The humid air that first air inlet 9 enters flows uniformly through heat absorbing fins group 7 after the first air distribution plate, by cool-down dehumidification, becomes low
Radiating fin group 2 is flowed to after temperature saturated air；The humid air entered from the second air inlet 4 uniformly flows to after the second air distribution plate
Radiating fin group 2；From the low temperature saturated air in the first air intake passage with together with the humid air in the second air intake passage
Flowing to radiating fin group 2, and lower the temperature radiating fin group 2, discharge from air outlet 10, so circulation reaches the effect of dehumidifying
Really.
Embodiment 2
With reference to Fig. 5-7, the present embodiment is the amendment carried out on the basis of embodiment 1, there is following difference compared with Example 1
Place.
In the present embodiment, the heat absorbing fins in heat absorbing fins group 7 becomes parallelogram, and heat absorbing fins is designed by the present invention
Become parallelogram be for convenience the condensed water on fin smoothly along heat absorbing fins to dirty.
In the present embodiment, so that heat-insulating shield 8 is close to heat absorbing fins group 7, heat-insulating shield is parallel to heat absorption
The side of fin is also in the parallelogram equivalently-sized with heat absorbing fins.
In the present embodiment, other versions of the semiconductor refrigerator of heat absorbing fins group band thermal protection structure,
With reference to described in embodiment 1, here is omitted.
Those skilled in the art should be understood that the present invention can be implemented without departing from this with other concrete forms many
The spirit or scope of invention.Although having been described for embodiments of the invention, it should be understood that the present invention should not be limited to these embodiments,
Those skilled in the art as made change within spirit and scope of the invention that appended claims defines and can repair
Change.
Claims (9)
1. the semiconductor refrigerator of a heat absorbing fins group band thermal protection structure, it is characterised in that include
Housing, is provided with the first air inlet, the second air inlet and air outlet；
Semiconductor chilling plate, is arranged in described housing, and the side of described semiconductor chilling plate is provided with heat absorbing fins group, opposite side
It is provided with radiating fin group；
Heat-insulating shield, described heat-insulating shield is located in described heat absorbing fins group, and described heat-insulating shield and described suction
In hot fins set remove air intake surface, outlet air surface and with the joint face of described semiconductor chilling plate outside other sides closely paste
Close；
Extraneous humid air enters in described housing from the first air inlet and the second air inlet respectively from described, and by the first air intake
Mouthful enter humid air first flow through described heat absorbing fins group after flow to described radiating fin group again, by second air inlet enter wet
Air flows directly into described radiating fin group；Stream air after radiating fin group discharges described shell via described air outlet
Body.
2. according to the semiconductor refrigerator of the heat absorbing fins group band thermal protection structure described in claim 1, it is characterised in that described suction
The upper and lower end of hot fins set is respectively air intake surface and outlet air surface.
3. according to the semiconductor refrigerator of the heat absorbing fins group band thermal protection structure described in claim 2, it is characterised in that described every
The cross section, boundary of thermal shield takes the shape of the letter U, and described heat-insulating shield is by protective cover front and is symmetricly set on described protective cover front two
The protective cover side composition of side；Described protective cover front is close to the front of described heat absorbing fins group, and described protective cover side is tight
Being attached on the left and right side of described heat absorbing fins group, described protective cover side is parallel to the heat absorbing fins of described heat absorbing fins group.
4. according to the semiconductor refrigerator of the heat absorbing fins group band thermal protection structure described in claim 3, it is characterised in that described suction
Heat absorbing fins parallelogram in hot fins set, described heat-insulating shield side is also in equivalently-sized with described heat absorbing fins
Parallelogram.
5. according to the semiconductor refrigerator of the heat absorbing fins group band thermal protection structure described in claim 1, it is characterised in that described every
Thermal shield uses insulant foaming to make.
6. according to the semiconductor refrigerator of the heat absorbing fins group band thermal protection structure described in claim 1, it is characterised in that described
It is provided with the first air distribution plate on one air inlet, described first air distribution plate is evenly equipped with multiple first through hole；Described second air inlet
On be provided with the second air distribution plate, described second air distribution plate is evenly equipped with multiple second through hole.
7. according to the semiconductor refrigerator of the heat absorbing fins group band thermal protection structure described in claim 5, it is characterised in that described
One through hole, described second through hole are circular or rectangle.
8. according to the semiconductor refrigerator of the heat absorbing fins group band thermal protection structure described in claim 1, it is characterised in that described suction
Being provided with drip tray below hot fins set, described drip tray connects a water tank.
9. according to the semiconductor refrigerator of the heat absorbing fins group band thermal protection structure described in claim 1, it is characterised in that described scattered
It is provided with blower fan, the flowing of air in promoting housing between outlet air end and the described air outlet of hot fins set.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610671799.6A CN106123158A (en) | 2016-08-15 | 2016-08-15 | A kind of semiconductor demoistener of heat absorbing fins group band thermal protection structure |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610671799.6A CN106123158A (en) | 2016-08-15 | 2016-08-15 | A kind of semiconductor demoistener of heat absorbing fins group band thermal protection structure |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106839178A (en) * | 2017-03-23 | 2017-06-13 | 合肥开泰机电科技有限公司 | A kind of intelligent miniature dehumidifier |
| CN107036190A (en) * | 2017-04-07 | 2017-08-11 | 合肥开泰机电科技有限公司 | A kind of dehumidifying cabinet for spare parts device based on separating type cold heat exchange |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2465111Y (en) * | 2000-10-25 | 2001-12-12 | 张征宇 | Semiconductor dehumidifier |
| JP2006068727A (en) * | 2004-08-04 | 2006-03-16 | Kitano Construction Corp | Dehumidifying apparatus |
| JP3828548B2 (en) * | 2004-02-03 | 2006-10-04 | シナン・グリーン−テック・カンパニー・リミテッド | Air circulation and dehumidifier |
| CN205227943U (en) * | 2015-12-11 | 2016-05-11 | 广州市奥冷电子科技发展有限公司 | Semiconductor refrigeration condenser based on heat pipe cooling |
| CN206191787U (en) * | 2016-08-15 | 2017-05-24 | 浙江普林艾尔电器工业有限公司 | Heat absorption fin group takes hot protective structure's semiconductor dehumidifier |
-
2016
- 2016-08-15 CN CN201610671799.6A patent/CN106123158A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2465111Y (en) * | 2000-10-25 | 2001-12-12 | 张征宇 | Semiconductor dehumidifier |
| JP3828548B2 (en) * | 2004-02-03 | 2006-10-04 | シナン・グリーン−テック・カンパニー・リミテッド | Air circulation and dehumidifier |
| JP2006068727A (en) * | 2004-08-04 | 2006-03-16 | Kitano Construction Corp | Dehumidifying apparatus |
| CN205227943U (en) * | 2015-12-11 | 2016-05-11 | 广州市奥冷电子科技发展有限公司 | Semiconductor refrigeration condenser based on heat pipe cooling |
| CN206191787U (en) * | 2016-08-15 | 2017-05-24 | 浙江普林艾尔电器工业有限公司 | Heat absorption fin group takes hot protective structure's semiconductor dehumidifier |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106839178A (en) * | 2017-03-23 | 2017-06-13 | 合肥开泰机电科技有限公司 | A kind of intelligent miniature dehumidifier |
| CN106839178B (en) * | 2017-03-23 | 2019-10-08 | 合肥开泰机电科技有限公司 | A kind of intelligent miniature dehumidifier |
| CN107036190A (en) * | 2017-04-07 | 2017-08-11 | 合肥开泰机电科技有限公司 | A kind of dehumidifying cabinet for spare parts device based on separating type cold heat exchange |
| CN107036190B (en) * | 2017-04-07 | 2019-07-16 | 合肥开泰机电科技有限公司 | A kind of dehumidifying cabinet for spare parts device based on separating type cold heat exchange |
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