CN117212920A - Semiconductor dehumidifier with multi-air-channel structure - Google Patents
Semiconductor dehumidifier with multi-air-channel structure Download PDFInfo
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- CN117212920A CN117212920A CN202311211317.5A CN202311211317A CN117212920A CN 117212920 A CN117212920 A CN 117212920A CN 202311211317 A CN202311211317 A CN 202311211317A CN 117212920 A CN117212920 A CN 117212920A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 97
- 238000007791 dehumidification Methods 0.000 claims abstract description 37
- 230000017525 heat dissipation Effects 0.000 claims description 40
- 238000004891 communication Methods 0.000 claims description 16
- 238000005057 refrigeration Methods 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 15
- 238000001816 cooling Methods 0.000 claims description 13
- 238000009434 installation Methods 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 30
- 230000005494 condensation Effects 0.000 abstract description 10
- 238000009833 condensation Methods 0.000 abstract description 10
- 239000006185 dispersion Substances 0.000 abstract description 2
- 230000009977 dual effect Effects 0.000 abstract 1
- 238000005728 strengthening Methods 0.000 abstract 1
- 230000002708 enhancing effect Effects 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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Abstract
The application belongs to the technical field of electrical equipment, and particularly relates to a semiconductor dehumidifier with a multi-air-channel structure. Including casing, semiconductor dehumidification subassembly, mounting bracket and fan subassembly, its first wind channel is as main wind channel, mainly its radiating effect, when fan subassembly during operation, the air current of first wind channel mainly gets into from first air intake, and flow out from the air outlet after the semiconductor dehumidification subassembly hot junction, thereby play the radiating effect, and in the outside air still can enter into the second wind channel from the second air intake under Bernoulli's law effect, and the air current in the second wind channel can be through the cold junction of semiconductor dehumidification subassembly after condensation dehumidification reentrant first wind channel flows, thereby play dehumidification effect, and this design can be with the radiating wind speed of cold junction can not be too high when having taken into account in high-speed wind, through setting up suitable cold junction wind speed and strengthening heat dispersion, dual condensation dehumidification performance of having strengthened.
Description
Technical Field
The application belongs to the technical field of electrical equipment, and particularly relates to a semiconductor dehumidifier with a multi-air-channel structure.
Background
The semiconductor dehumidifier utilizes the Pelt er effect between the semiconductor materials P type and N type semiconductors to realize refrigeration and dehumidification. When current passes through the two semiconductor materials, heat and cold are generated, and when the temperature difference between one end of the generated cold and the environment is large, water molecules in the air are condensed into water to achieve the dehumidification effect.
The air duct structure of the semiconductor dehumidifier is mainly a single air duct structure from the air inlet to the air outlet, and the fan is utilized to drive air flow to be condensed and dehumidified through the cold end and then guided out through the hot end, so that heat of the hot end can be taken away during dehumidification, and the heat dissipation effect is achieved. However, the disadvantage of this kind of single wind channel structure lies in that if fan wind speed is big under the same structure, then the radiating effect is better (high wind speed can take away heat soon), but condensation dehumidification effect is not good (the dwell time of air at the cold junction is not enough, and the wind speed is too big can take away the water that a fraction has been condensed in addition), if the wind speed is little, then the radiating effect is not good, but condensation dehumidification effect is also not good, because the heat dissipation is not good and leads to the temperature in the dehumidifier higher, the cold junction is difficult to reach lower temperature, be unfavorable for the hydrone in the humid air to condense on the cold junction, generally speaking, current single wind channel structure dehumidification is many times can not reach more ideal dehumidification performance.
Disclosure of Invention
The application aims to provide a semiconductor dehumidifier with a multi-air-channel structure, which can increase the wind speed of a cold end at the same time of increasing the wind speed of a hot end through the design of a multi-air-channel, thereby enhancing the heat radiation performance and the condensation dehumidification performance.
Based on the structure, the application provides a semiconductor dehumidifier with a multi-air-channel structure, which comprises a shell, a semiconductor dehumidification assembly, a mounting rack and a fan assembly, wherein a cavity is arranged in the shell, and at least a first air inlet, a second air inlet and an air outlet which are communicated with the cavity are arranged on the shell;
the mounting frame is arranged in the cavity and divides the cavity into a first air channel which is used for air inlet from the first air inlet and air outlet from the air outlet, and a second air channel which is used for air inlet from the second air inlet and communicated with the first air channel, and the fan assembly is arranged in the first air channel;
the semiconductor dehumidification assembly is arranged on the mounting frame, the hot end of the semiconductor dehumidification assembly faces or is located in the first air duct, and the cold end of the semiconductor dehumidification assembly is located in the second air duct.
The semiconductor dehumidifier with the multi-air-channel structure is characterized in that the mounting frame is provided with the communication port for enabling the second air channel to be communicated with the first air channel.
The semiconductor dehumidifier with the multi-air-channel structure comprises a semiconductor refrigeration piece, a first cold guide piece and a heat dissipation piece;
the first semiconductor refrigerating piece is arranged on the mounting frame, the first cold guide piece is connected with the cold end of the first semiconductor refrigerating piece and is positioned in the second air duct, and the heat dissipation piece is connected with the hot end of the first semiconductor refrigerating piece and is positioned in the second air duct.
The semiconductor dehumidifier with the multi-air-channel structure comprises a first air channel, a second air channel and a third air channel, wherein the outlet of the first air channel is positioned at one side of the second air channel;
the air outlet direction of the second air channel is perpendicular to the first air channel;
the first air duct comprises a lower air duct used for converging only the air flow entering from the first air inlet and an upper air duct used for converging the air flow entering from the first air inlet and the second air duct together, and the heat dissipation part is at least partially positioned in the upper air duct;
the cross-sectional area of the upper air duct is equal to or smaller than the cross-sectional area of the lower air duct.
The semiconductor dehumidifier with the multi-air-channel structure has the advantages that one side of the heat radiating piece, which is far away from the hot end of the semiconductor refrigerating piece, is propped against the inner wall of the shell.
The semiconductor dehumidifier with the multi-air-channel structure further comprises a second semiconductor refrigerating piece and a second cold guide piece, wherein the second semiconductor refrigerating piece is arranged on the mounting frame and positioned at the lower side of the first semiconductor refrigerating piece, the second cold guide piece is connected with the cold end of the second semiconductor refrigerating piece and positioned in the second air channel, and the hot end of the second semiconductor refrigerating piece is connected with the heat dissipation piece;
the communication port is positioned between the first semiconductor refrigeration piece and the second semiconductor refrigeration piece.
The semiconductor dehumidifier with the multi-air-channel structure is characterized in that the shell is further provided with a third air inlet communicated with the second air channel, the second air inlet is opposite to the first cold guide piece, and the third air inlet is opposite to the second cold guide piece.
The semiconductor dehumidifier with the multi-air-channel structure comprises a first cold guide piece and a second cold guide piece, wherein a guide air channel which is guided to a communication port is formed between the first cold guide piece and the second cold guide piece.
The semiconductor dehumidifier with the multi-air-channel structure comprises the connecting plate, the radiating fins and the air inlet opening, wherein the connecting plate is installed with the mounting frame, the radiating fins are arranged on one side of the connecting plate, the air inlet opening is formed in the connecting plate, and when the connecting plate is installed with the mounting frame, the air inlet opening is opposite to the communication opening.
The semiconductor dehumidifier with the multi-air-channel structure is characterized in that the lower side of the mounting frame is also provided with the water receiving groove opposite to the first cold guide piece and the second cold guide piece, and the water receiving groove is also provided with the water discharging pipe extending out of the shell.
The semiconductor dehumidifier with the multi-air-channel structure is characterized in that the upper side of the mounting frame is further provided with the upper baffle, the fan assembly is located above the upper baffle, the first cold guide piece is located below the upper baffle, the upper baffle is further provided with the clamping part extending to one side of the heat dissipation piece, and the clamping part is buckled with the upper side of the heat dissipation piece.
The embodiment of the application has the following beneficial effects:
the application provides a semiconductor dehumidifier with a multi-channel structure, wherein a first air channel is used as a main air channel, mainly has a heat dissipation effect, when a fan assembly works, air flow of the first air channel mainly enters from a first air inlet and flows out from an air outlet after passing through a hot end of the semiconductor dehumidification assembly, thereby having the heat dissipation effect, external air also enters into a second air channel from a second air inlet under the effect of Bernoulli's law, and air flow in the second air channel enters into the first air channel after condensation dehumidification is carried out on a cold end of the semiconductor dehumidification assembly, thereby having the dehumidification effect.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of a semiconductor dehumidifier with a multi-duct structure according to an embodiment of the present application;
FIG. 2 is another angular schematic view of FIG. 1;
FIG. 3 is a half cross-sectional view of the housing and mounting bracket;
FIG. 4 is a half cross-sectional view of FIG. 1;
fig. 5 is an exploded view of fig. 1.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
As shown in fig. 1 to 5, an embodiment of the present application provides a semiconductor dehumidifier with a multi-duct structure, which includes a housing 1, a semiconductor dehumidifying component 2, a mounting rack 3 and a fan component 4, wherein a cavity 101 is arranged in the housing 1, and at least a first air inlet 11, a second air inlet 12 and an air outlet 15 which are communicated with the cavity 101 are arranged on the housing 1; the installation frame 3 is arranged in the cavity 101 and separates the cavity into a first air channel 1011 which is fed with air from the first air inlet 11 and is discharged from the air outlet 15, and a second air channel 1012 which is fed with air from the second air inlet 12 and is communicated with the first air channel 1011, the fan assembly 4 is arranged in the first air channel 1011.
The semiconductor dehumidifying component 2 is disposed on the mounting frame 3, the hot end of the semiconductor dehumidifying component 2 faces or is located in the first air duct 1011, and the cold end of the semiconductor dehumidifying component 2 is located in the second air duct 1012. The air flow in the first air duct flows out from the air outlet after passing through the hot end of the semiconductor dehumidification component, so that the radiating effect is achieved, the external air can enter the second air duct from the second air inlet under the effect of Bernoulli's law, the air flow in the second air duct can enter the first air duct after condensation and dehumidification through the cold end of the semiconductor dehumidification component, the dehumidifying effect is achieved, the wind speed of the cold end is not too high when the design can radiate with high-speed wind, and the condensing and dehumidifying performance is doubly enhanced by setting proper cold end wind speed and enhancing the radiating performance.
In the embodiment of the present application, the mounting frame 3 is provided with a communication port 301 for communicating the second air duct 1012 with the first air duct 1011. The high-speed flowing air flow in the first air duct 1011 is utilized in the scheme, so that the air in the second air duct 1012 can enter the first air duct 1011 from the communication port 301 to form a second air flow, and the external air is introduced from the second air inlet to be condensed and dehumidified.
Specifically, in the embodiment of the present application, the specific structure of the semiconductor dehumidifying component 2 is as follows: the cooling device comprises a first semiconductor cooling piece 21, a first cooling guide piece 22 and a heat dissipation piece 23, wherein the first semiconductor cooling piece 21 is arranged on the mounting frame 3, the first cooling guide piece 22 is connected with the cold end of the first semiconductor cooling piece 21 and is positioned in the second air duct 1012, and the heat dissipation piece 23 is connected with the hot end of the first semiconductor cooling piece 21 and is positioned in the second air duct 1012. The first cold guide 22 is a fin, and is connected with the cold end of the first semiconductor refrigeration piece 21 to perform condensation dehumidification on air in the second air duct 1012.
The outlet of the second air duct 1012 is located at one side of the first air duct 1011, and since the first air duct 1011 is a vertical air duct penetrating up and down, the air outlet direction of the second air duct 1012 is perpendicular to the first air duct 1011, which is favorable for reducing the viscosity of the air, so that the air flow of the second air duct 1012 is mainly driven by the pressure difference, the air speed difference between the first air duct 1011 and the second air duct 1012 can be further increased, that is, the air speed of the first air duct 1011 can be set to be more greatly enhanced to dissipate the heat.
As one embodiment, the first air duct 1011 includes a lower air duct for converging only the air flow entering from the first air inlet 11 and an upper air duct for converging the air flow jointly entering from the first air inlet 11 and the second air duct 1012, and the heat dissipating member 23 is at least partially located in the upper air duct; in this way, the wind flow passing through the heat dissipation element 23 is larger, more heat can be taken away, and more preferably, the smaller the cross-sectional area is, the larger the wind speed is under the condition that the wind flow is equal, so that the cross-sectional area of the upper air channel is equal to or smaller than the cross-sectional area of the lower air channel, thereby being beneficial to the promotion of the wind speed in the upper air channel and the heat dissipation of the heat dissipation element 23 therein. According to the embodiment, the air duct is skillfully designed, so that the optimal air flow configuration is achieved, and the dehumidification performance is further improved.
In addition, in order to enhance the heat dissipation effect, the side of the heat dissipation element 23 away from the hot end of the semiconductor refrigeration sheet 21 abuts against the inner wall of the housing 1. The heat can be directly transferred to the shell 1, namely the shell 1 also plays a role in direct heat dissipation, which is equivalent to increasing the heat dissipation area, thereby enhancing the heat dissipation effect.
In the embodiment of the present application, the semiconductor dehumidification assembly 2 further includes a second semiconductor refrigeration sheet 24 and a second cooling guide member 25, the second semiconductor refrigeration sheet 24 is disposed on the mounting frame 3 and is located at the lower side of the first semiconductor refrigeration sheet 21, the second cooling guide member 25 is connected with the cold end of the second semiconductor refrigeration sheet 24 and is located in the second air duct 1012, and the hot end of the second semiconductor refrigeration sheet 24 is connected with the heat dissipation member 23; the communication port 301 is located between the first semiconductor refrigeration sheet 21 and the second semiconductor refrigeration sheet 24.
The housing 1 is further provided with a third air inlet 13 communicating with the second air duct 1012, the second air inlet 12 is opposite to the first cold guide 22, and the third air inlet 13 is opposite to the second cold guide 25. Namely, when the fan assembly 4 works, external air enters the shell 1 from three directions (upper left, lower left and lower) and is blown out from the air outlet 15 above the shell 1, the first air channel 1011 is from bottom to top, the first air speed is maximum, the effect of heat dissipation is mainly played, under the effect of Bernoulli's law, the external air also enters the first air channel 1011 from the communication port 301 after flowing through the corresponding cold guide piece from the second air inlet 12 positioned at the upper left and the third air inlet 13 positioned at the lower left, the air speed in the second air channel 1012 is relatively smaller, the effect of introducing an external space into the cold end to condense into water is mainly played, and the scheme can maximally increase the heat dissipation air speed, strengthen the heat dissipation performance and finally play a better condensing effect under the proper condensing air speed.
In addition, in the embodiment of the present application, a guiding air channel 1013 guiding to the communication port 301 is formed between the first cold guide 22 and the second cold guide 25. The guiding duct 1013 is inclined upward, and mainly serves to collect air entering from the upper left and lower left through the corresponding cold guide members to the guiding duct 1013 and enter the first duct 1011 through the communication port 301.
In the embodiment of the present application, the specific structure of the heat dissipation element 23 is: the heat dissipation element 23 comprises a connection plate 231 installed on the installation frame 3, and a heat dissipation fin 232 arranged on one side of the connection plate 231, wherein an air inlet 2311 is formed in the connection plate 231, and the air inlet 2311 is opposite to the communication port 301 when the connection plate 231 is installed on the installation frame 3. The structural arrangement of the connection plate 231 is advantageous in further restricting the air flow in the second air duct 1012 from entering the first air duct 1011 only from the communication port 301. The heat dissipation fins 232 are generally a plurality of pieces, and the plurality of pieces of heat dissipation fins 232 are disposed at intervals and all extend to abut against the inner wall of the back plate 112. The heat dissipation device is simple in structure, convenient to install and good in heat dissipation effect.
In this scheme, the backplate preferably adopts the good metal material of heat conductivity to make, utilizes its better heat absorption heat dispersion, and the one side absorbs the heat of radiating member 23 fast, and the another side can dispel the heat fast to promote the radiating effect advantageously.
In addition, a water receiving groove 31 opposite to the first cold guide 22 and the second cold guide 25 is further provided at the lower side of the mounting frame 3, and a drain pipe extending to the outside of the housing 1 is further provided on the water receiving groove 31. The condensed water generated in the condensation process of the first cold guide 22 and the second cold guide 25 can naturally fall down and be collected in the water receiving tank 31, and the condensed water can be conveniently discharged.
In the embodiment of the present application, an upper baffle 32 is further disposed on the upper side of the mounting frame 3, the fan assembly 4 is located above the upper baffle 32, the first cooling guide 22 is located below the upper baffle 32, and a fastening portion 321 extending to one side of the heat dissipation member 23 is further disposed on the upper baffle 32, and the fastening portion 321 is fastened to the upper side of the heat dissipation member 23.
The application provides a semiconductor dehumidifier with a multi-channel structure, wherein a first air channel is used as a main air channel, mainly has a heat dissipation effect, when a fan assembly works, air flow of the first air channel mainly enters from a first air inlet and flows out from an air outlet after passing through a hot end of the semiconductor dehumidification assembly, thereby having the heat dissipation effect, external air also enters into a second air channel from a second air inlet under the effect of Bernoulli's law, and air flow in the second air channel enters into the first air channel after condensation dehumidification is carried out on a cold end of the semiconductor dehumidification assembly, thereby having the dehumidification effect.
It should be understood that the terms "first," "second," and the like are used herein to describe various information, but such information should not be limited to these terms, which are used merely to distinguish one type of information from another. For example, a "first" message may also be referred to as a "second" message, and similarly, a "second" message may also be referred to as a "first" message, without departing from the scope of the application. Furthermore, references to orientations or positional relationships of the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," etc. are based on the orientation or positional relationships shown in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and thus should not be construed as limiting the present application.
While the foregoing is directed to the preferred embodiments of the present application, it should be noted that modifications and variations could be made by those skilled in the art without departing from the principles of the present application, and such modifications and variations are to be regarded as being within the scope of the application.
Claims (10)
1. The semiconductor dehumidifier with the multi-air-channel structure is characterized by comprising a shell (1), a semiconductor dehumidification assembly (2), a mounting rack (3) and a fan assembly (4), wherein a cavity (101) is arranged in the shell (1), and at least a first air inlet (11), a second air inlet (12) and an air outlet (15) which are communicated with the cavity (101) are arranged on the shell (1);
the mounting frame (3) is arranged in the cavity (101) and divides the cavity into a first air channel (1011) which is used for air intake from the first air inlet (11) and air outlet from the air outlet (15), and a second air channel (1012) which is used for air intake from the second air inlet (12) and is communicated with the first air channel (1011), and the fan assembly (4) is arranged in the first air channel (1011);
the semiconductor dehumidification assembly (2) is arranged on the mounting frame (3), the hot end of the semiconductor dehumidification assembly (2) faces towards or is located in the first air duct (1011), and the cold end of the semiconductor dehumidification assembly (2) is located in the second air duct (1012).
2. A semiconductor dehumidifier with a multi-duct structure according to claim 1, characterized in that the mounting frame (3) is provided with a communication port (301) for communicating the second duct (1012) with the first duct (1011).
3. A semiconductor dehumidifier with a multi-duct structure according to claim 1, characterized in that the semiconductor dehumidification assembly (2) comprises a first semiconductor cooling fin (21), a first cold guide (22) and a heat sink (23);
the first semiconductor refrigerating piece (21) is arranged on the mounting frame (3), the first cold guide piece (22) is connected with the cold end of the first semiconductor refrigerating piece (21) and is positioned in the second air duct (1012), and the heat dissipation piece (23) is connected with the hot end of the first semiconductor refrigerating piece (21) and is positioned in the second air duct (1012).
4. A semiconductor dehumidifier with a multi-duct structure according to claim 3, characterized in that the outlet of the second duct (1012) is located on one side of the first duct (1011);
the air outlet direction of the second air duct (1012) is perpendicular to the first air duct (1011);
the first air duct (1011) comprises a lower air duct for converging only the air flow entering from the first air inlet (11) and an upper air duct for converging the air flow jointly entering from the first air inlet (11) and the second air duct (1012), and the heat radiating piece (23) is at least partially positioned in the upper air duct;
the cross-sectional area of the upper air duct is equal to or smaller than the cross-sectional area of the lower air duct.
5. A semiconductor dehumidifier with a multi-channel structure according to any of claims 1-4, characterized in that the side of the heat sink (23) remote from the hot end of the semiconductor cooling fin (21) abuts against the inner wall of the housing (1).
6. A semiconductor dehumidifier with a multi-channel structure according to claim 4, characterized in that the semiconductor dehumidifying component (2) further comprises a second semiconductor refrigerating plate (24) and a second cold conducting member (25), the second semiconductor refrigerating plate (24) is arranged on the mounting frame (3) and is positioned at the lower side of the first semiconductor refrigerating plate (21), the second cold conducting member (25) is connected with the cold end of the second semiconductor refrigerating plate (24) and is positioned in the second air channel (1012), and the hot end of the second semiconductor refrigerating plate (24) is connected with the heat radiating member (23);
the communication port (301) is located between the first semiconductor refrigeration sheet (21) and the second semiconductor refrigeration sheet (24).
7. The semiconductor dehumidifier with the multi-air-channel structure according to claim 6, wherein a third air inlet (13) communicated with a second air channel (1012) is further arranged on the shell (1), the second air inlet (12) is opposite to the first cold guide (22), and the third air inlet (13) is opposite to the second cold guide (25);
a guiding air duct (1013) guiding to the communication port (301) is formed between the first cold guide (22) and the second cold guide (25).
8. The semiconductor dehumidifier with the multi-air-channel structure according to claim 7, wherein the heat dissipation member (23) comprises a connection plate (231) installed on the installation frame (3), and a heat dissipation fin (232) arranged on one side of the connection plate (231), an air inlet opening (2311) is formed in the connection plate (231), and when the connection plate (231) is installed on the installation frame (3), the air inlet opening (2311) is opposite to the communication opening (301).
9. The semiconductor dehumidifier with the multi-air-channel structure according to claim 7, wherein a water receiving groove (31) opposite to the first cold guide (22) and the second cold guide (25) is further arranged at the lower side of the mounting frame (3), and a water draining pipe extending out of the shell (1) is further arranged on the water receiving groove (31).
10. The semiconductor dehumidifier with the multi-air-channel structure according to claim 9, wherein an upper baffle (32) is further arranged on the upper side of the mounting frame (3), the fan assembly (4) is located above the upper baffle (32), the first cooling guide (22) is located below the upper baffle (32), and a fastening portion (321) extending to one side of the heat dissipation member (23) is further arranged on the upper baffle (32), and the fastening portion (321) is fastened to the upper side of the heat dissipation member (23).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311211317.5A CN117212920A (en) | 2023-09-19 | 2023-09-19 | Semiconductor dehumidifier with multi-air-channel structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311211317.5A CN117212920A (en) | 2023-09-19 | 2023-09-19 | Semiconductor dehumidifier with multi-air-channel structure |
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| Publication Number | Publication Date |
|---|---|
| CN117212920A true CN117212920A (en) | 2023-12-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311211317.5A Pending CN117212920A (en) | 2023-09-19 | 2023-09-19 | Semiconductor dehumidifier with multi-air-channel structure |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205690563U (en) * | 2016-05-25 | 2016-11-16 | 广州穗华能源科技有限公司 | Semiconductor refrigeration dehumidifier |
| CN106123158A (en) * | 2016-08-15 | 2016-11-16 | 浙江普林艾尔电器工业有限公司 | A kind of semiconductor demoistener of heat absorbing fins group band thermal protection structure |
| CN207218088U (en) * | 2017-09-14 | 2018-04-10 | 国网冀北电力有限公司张家口供电公司 | A kind of dewatering type dehumidifier |
| CN207422710U (en) * | 2017-11-03 | 2018-05-29 | 常州市盈能电气有限公司 | Semiconductor refrigerating air-conditioning |
-
2023
- 2023-09-19 CN CN202311211317.5A patent/CN117212920A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205690563U (en) * | 2016-05-25 | 2016-11-16 | 广州穗华能源科技有限公司 | Semiconductor refrigeration dehumidifier |
| CN106123158A (en) * | 2016-08-15 | 2016-11-16 | 浙江普林艾尔电器工业有限公司 | A kind of semiconductor demoistener of heat absorbing fins group band thermal protection structure |
| CN207218088U (en) * | 2017-09-14 | 2018-04-10 | 国网冀北电力有限公司张家口供电公司 | A kind of dewatering type dehumidifier |
| CN207422710U (en) * | 2017-11-03 | 2018-05-29 | 常州市盈能电气有限公司 | Semiconductor refrigerating air-conditioning |
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