CN205227943U - Semiconductor refrigeration condenser based on heat pipe cooling - Google Patents
Semiconductor refrigeration condenser based on heat pipe cooling Download PDFInfo
- Publication number
- CN205227943U CN205227943U CN201521023952.1U CN201521023952U CN205227943U CN 205227943 U CN205227943 U CN 205227943U CN 201521023952 U CN201521023952 U CN 201521023952U CN 205227943 U CN205227943 U CN 205227943U
- Authority
- CN
- China
- Prior art keywords
- fin
- hot
- heat pipe
- cold junction
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model discloses a semiconductor refrigeration condenser based on heat pipe cooling, including induced -draft fan and condenser body, the condenser body includes cold end heat radiator and hot end radiator, and cold end heat radiator and hot end radiator are the heat pipe cooling ware base plate, heat pipe and fin, base plate and fin pass through the heat pipe to be connected, is equipped with the deep bead subassembly that is used for covering cold junction fin and hot junction fin on the fin, is equipped with the separation net between cold junction fin and the hot junction fin, and cold end heat radiator's cold junction base plate and hot end radiator's hot junction base plate lie in the outside of deep bead subassembly, and the centre gripping has a plurality of semiconductor refrigeration pieces and a plurality of spacing block between cold junction base plate and the hot junction base plate, and the hot junction fin is equipped with fan bracket, the last induced -draft fan that installs of fan bracket outward. The utility model discloses semiconductor refrigeration condenser based on heat pipe cooling adopts the condenser structure of two heat pipes, has moisture and continuously condenses effectually, and the dewatering is effectual, and heat -sinking capability is good, running noise advantage such as little and energy -concerving and environment -protective.
Description
Technical field
The utility model relates to semiconductor refrigerating condenser technical field, is specially a kind of semiconductor refrigerating condenser based on heat pipe heat radiation.
Background technology
Semiconductor refrigerating condenser is in the following ways in the market:
A), hot junction extrusion profile radiator adds DC fan heat radiation, and fan (or very small-power fan) is not with by the little radiator of cold junction;
B), hot junction extrusion profile radiator adds DC fan heat radiation, cold junction cold drawing;
Because the air themperature controlling to contact with cold drawing in condensation process is that conveniently condensation vapor becomes aqueous water.Temperature for air controls to be only method instead of target.Gas cooled is in the process difficult to be reused, or the radiator in the guiding hot junction, air channel needing design complicated, and suitable low of its utilization rate, and complex structure, cost is high.
Utility model content
The utility model provides a kind of condenser structure adopting two heat pipe, and be convenient to moisture and continue condensation, have condensation effect good, water removal effect is good, and heat-sinking capability is good, efficiency is high, the semiconductor refrigerating condenser of the advantages such as the little and energy-conserving and environment-protective of running noise.
The utility model can be achieved through the following technical solutions:
Based on a semiconductor refrigerating condenser for heat pipe heat radiation, comprise extractor fan and condenser body, the below of described condenser body is provided with water spilage tray.Described condenser body comprises cold junction radiator and hot-side heat dissipation device, described cold junction radiator and hot-side heat dissipation device are heat-pipe radiator, comprise substrate, heat pipe and fin, described substrate is connected by heat pipe with fin, described fin is provided with the deep bead assembly for covering cold junction fin and hot side fin, and described cold junction fin and hot side fin are coated with clear water film.Separation net is provided with between described cold junction fin and hot side fin, the cold junction substrate of described cold junction radiator and the hot junction substrate of hot-side heat dissipation device are positioned at the outside of deep bead assembly, be clamped with multiple semiconductor chilling plate and multiple spacing block between described cold junction substrate and hot junction substrate, described spacing block is aluminium alloy spacing block.Be provided with blower tray outside described hot side fin, described blower tray is provided with extractor fan, described extractor fan is two, and two extractor fans are side by side up and down to be arranged on blower tray.In water spilage tray below the utility model effectively ensures to drop onto after condensation vapor in air is to fin based on the clear water film of the heat-pipe radiator structure of cold junction radiator in the semiconductor refrigerating condenser of heat pipe heat radiation and fin surface coating at once, thus effectively ensure that the low-temperature condition of cold junction, be convenient to the lasting condensation of moisture, hydrogenesis is effective, also improve water removal effect, water removal effect is good simultaneously; The utility model is based on the setting of multiple semiconductor chilling plate between cold junction radiator and the substrate of hot-side heat dissipation device in the semiconductor refrigerating condenser of heat pipe heat radiation, relative to traditional compressor condensation technology and scheme, semiconductor chilling plate refrigeration condensation environmental protection and energy saving more, and design is also convenient more flexibly, can customize arbitrary dimension power as required; The utility model is based on the setting of deep bead assembly on fin in the semiconductor refrigerating condenser of heat pipe heat radiation, form a semi-enclosed air channel, the air that fin through cold junction radiator was cooled all is drawn onto on the fin of hot-side heat dissipation device, cooled air can offset the caloric value in a part of semiconductor chilling plate hot junction, thus effectively improve the radiating efficiency in hot junction, heat-sinking capability is good, and efficiency is high; The utility model is based on the setting of deep bead assembly in the semiconductor refrigerating condenser of heat pipe heat radiation, form semi-enclosed air channel, cold junction cooled air is guided to flow to the radiating fin in hot junction on the one hand, improve the heat-sinking capability in hot junction, on the other hand relative to conventional solution, can the less radiator fan of actual air volume, effectively reduce the running noise of condenser, running noise is little.
Further, be provided with the heat insulation blowing agent for seal isolation in the space between described cold junction substrate and hot junction substrate, adopt heat insulation blowing agent to carry out the substrate in seal isolation cold junction and hot junction, effectively prevent hot reflux.
Further, described cold junction substrate and hot junction substrate are connected by fixed screw together with being locked by fixed screw, are convenient to dismounting and change.
Further, described deep bead assembly comprises top board, base plate and biside plate, and the width of described top board and base plate is less than the width of biside plate, described top board and base plate are equipped with auxiliary air inlet mouth, the setting of auxiliary air inlet mouth, is convenient to airflow convection, promotes condensation effect.
Further, the finned outer of described cold junction radiator is the open-position-side of deep bead assembly, and described open-position-side is wet air inlet.
The utility model, based on the semiconductor refrigerating condenser of heat pipe heat radiation, has following beneficial effect:
The first, be convenient to moisture and continue condensation, improve water removal effect, in water spilage tray below the utility model effectively ensures to drop onto after condensation vapor in air is to fin based on the clear water film of the heat-pipe radiator structure of cold junction radiator in the semiconductor refrigerating condenser of heat pipe heat radiation and fin surface coating at once, thus effectively ensure that the low-temperature condition of cold junction, be convenient to the lasting condensation of moisture, hydrogenesis is effective, also improves water removal effect simultaneously, and water removal effect is good;
The second, energy-conserving and environment-protective, the utility model is based on the setting of multiple semiconductor chilling plate between cold junction radiator and the substrate of hot-side heat dissipation device in the semiconductor refrigerating condenser of heat pipe heat radiation, relative to traditional compressor condensation technology and scheme, semiconductor chilling plate refrigeration condensation environmental protection and energy saving more, and design is also convenient more flexibly, can customize arbitrary dimension power as required;
Three, hot-side heat dissipation ability is good, efficiency is high, the utility model is based on the setting of deep bead assembly in the semiconductor refrigerating condenser of heat pipe heat radiation, form a semi-enclosed air channel, the air that fin through cold junction radiator was cooled all is drawn onto on the fin of hot-side heat dissipation device, and cooled air can offset the caloric value in a part of semiconductor chilling plate hot junction, thus effectively improves the radiating efficiency in hot junction, heat-sinking capability is good, and efficiency is high;
Four, running noise is little, the utility model is based on the setting of deep bead assembly in the semiconductor refrigerating condenser of heat pipe heat radiation, form semi-enclosed air channel, cold junction cooled air is guided to flow to the radiating fin in hot junction on the one hand, improve the heat-sinking capability in hot junction, on the other hand relative to conventional solution, can the less radiator fan of actual air volume, effectively reduce the running noise of condenser, running noise is little.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model based on the semiconductor refrigerating condenser of heat pipe heat radiation;
Fig. 2 is the structural representation of condenser body in Fig. 1;
Fig. 3 is the top view of condenser body in Fig. 1.
Detailed description of the invention
In order to make those skilled in the art person understand the technical solution of the utility model better, below in conjunction with embodiment and accompanying drawing, the utility model product is described in further detail.
As shown in Figure 1 to Figure 3, a kind of semiconductor refrigerating condenser based on heat pipe heat radiation, comprises extractor fan 5 and condenser body 1, and the below of described condenser body 1 is provided with water spilage tray (not shown).Described condenser body 1 comprises cold junction radiator and hot-side heat dissipation device, described cold junction radiator and hot-side heat dissipation device are heat-pipe radiator, comprise substrate, heat pipe and fin, namely be that described cold junction radiator comprises cold junction substrate 13, cool side heat pipes 14 and cold junction fin 15, described cold junction substrate 13 is connected by cool side heat pipes 14 with cold junction fin 15, described hot-side heat dissipation device comprises hot junction substrate 9, hot side heat 8 and hot side fin 7, described hot junction substrate 9 is connected by hot side heat 8 with hot side fin 7, described fin is provided with the deep bead assembly 2 for covering cold junction fin 15 and hot side fin 7, described cold junction fin 15 and hot side fin 7 are coated with clear water film.Separation net 16 is provided with between described cold junction fin 15 and hot side fin 7, the cold junction substrate 13 of described cold junction radiator and the hot junction substrate 9 of hot-side heat dissipation device are positioned at the outside of deep bead assembly 2, together with described cold junction substrate 13 and hot junction substrate 9 are locked by fixed screw 10, connected by fixed screw 10, be convenient to dismounting and change.Be clamped with multiple semiconductor chilling plate 11 and multiple spacing block 12 between described cold junction substrate 13 and hot junction substrate 9, described spacing block 12 is aluminium alloy spacing block 12.Be provided with blower tray 6 outside described hot side fin 7, described blower tray 6 is provided with extractor fan 5, described extractor fan 5 is two, and two extractor fans 5 are side by side up and down to be arranged on blower tray 6.In water spilage tray (not shown) below the utility model effectively ensures to drop onto after condensation vapor in air is to fin based on the clear water film of the heat-pipe radiator structure of cold junction radiator in the semiconductor refrigerating condenser of heat pipe heat radiation and fin surface coating at once, thus effectively ensure that the low-temperature condition of cold junction, be convenient to the lasting condensation of moisture, hydrogenesis is effective, also improve water removal effect, water removal effect is good simultaneously; The utility model is based on the setting of multiple semiconductor chilling plate 11 between cold junction radiator and the substrate of hot-side heat dissipation device in the semiconductor refrigerating condenser of heat pipe heat radiation, relative to traditional compressor condensation technology and scheme, semiconductor chilling plate 11 freezes condensation environmental protection and energy saving more, and design is also convenient more flexibly, can customize arbitrary dimension power as required; The utility model is based on the setting of deep bead assembly 2 on fin in the semiconductor refrigerating condenser of heat pipe heat radiation, form a semi-enclosed air channel, the air that fin through cold junction radiator was cooled all is drawn onto on the fin of hot-side heat dissipation device, cooled air can offset the caloric value in a part of semiconductor chilling plate 11 hot junction, thus effectively improve the radiating efficiency in hot junction, heat-sinking capability is good, and efficiency is high; The utility model is based on the setting of deep bead assembly 2 in the semiconductor refrigerating condenser of heat pipe heat radiation, form semi-enclosed air channel, cold junction cooled air is guided to flow to the radiating fin in hot junction on the one hand, improve the heat-sinking capability in hot junction, on the other hand relative to conventional solution, can the less radiator fan of actual air volume, effectively reduce the running noise of condenser, running noise is little.
As shown in Figures 2 and 3, the heat insulation blowing agent (not shown) for seal isolation is provided with in space between described cold junction substrate 13 and hot junction substrate 9, adopt heat insulation blowing agent (not shown) to carry out the substrate in seal isolation cold junction and hot junction, effectively prevent hot reflux.
As shown in Figure 1, described deep bead assembly 2 comprises top board 3, base plate and biside plate, and the width of described top board 3 and base plate is less than the width of biside plate, described top board 3 and base plate are equipped with auxiliary air inlet mouth 4, the setting of auxiliary air inlet mouth 4, is convenient to airflow convection, promotes condensation effect.Described cold junction fin 15 outside is the open-position-side of deep bead assembly 2, and described open-position-side is wet air inlet 17.
The above, be only preferred embodiment of the present utility model, not does any pro forma restriction to the utility model; The those of ordinary skill of all industry all can shown in by specification accompanying drawing and the above and implement the utility model swimmingly; But all those skilled in the art are not departing within the scope of technical solutions of the utility model, disclosed above technology contents can be utilized and make a little change, modify with differentiation equivalent variations, be Equivalent embodiments of the present utility model; Meanwhile, all according to substantial technological of the present utility model to the change of any equivalent variations that above embodiment is done, modify and differentiation etc., within the protection domain all still belonging to the technical solution of the utility model.
Claims (9)
1. the semiconductor refrigerating condenser based on heat pipe heat radiation, comprise extractor fan and condenser body, it is characterized in that: described condenser body comprises cold junction radiator and hot-side heat dissipation device, described cold junction radiator and hot-side heat dissipation device are heat-pipe radiator, comprise substrate, heat pipe and fin, described substrate is connected by heat pipe with fin, described fin is provided with the deep bead assembly for covering cold junction fin and hot side fin, separation net is provided with between described cold junction fin and hot side fin, the cold junction substrate of described cold junction radiator and the hot junction substrate of hot-side heat dissipation device are positioned at the outside of deep bead assembly, multiple semiconductor chilling plate and multiple spacing block is clamped with between described cold junction substrate and hot junction substrate, blower tray is provided with outside described hot side fin, described blower tray is provided with extractor fan.
2. the semiconductor refrigerating condenser based on heat pipe heat radiation according to claim 1, is characterized in that: be provided with the heat insulation blowing agent for seal isolation in the space between described cold junction substrate and hot junction substrate.
3. the semiconductor refrigerating condenser based on heat pipe heat radiation according to claim 2, is characterized in that: together with described cold junction substrate and hot junction substrate are locked by fixed screw.
4. the semiconductor refrigerating condenser based on heat pipe heat radiation according to claim 3, is characterized in that: described cold junction fin and hot side fin are coated with clear water film.
5. the semiconductor refrigerating condenser based on heat pipe heat radiation according to claim 4, is characterized in that: described extractor fan is two, and two extractor fans are side by side up and down to be arranged on blower tray.
6. the semiconductor refrigerating condenser based on heat pipe heat radiation according to claim 5, it is characterized in that: described deep bead assembly comprises top board, base plate and biside plate, the width of described top board and base plate is less than the width of biside plate, and described top board and base plate are equipped with auxiliary air inlet mouth.
7. the semiconductor refrigerating condenser based on heat pipe heat radiation according to claim 6, is characterized in that: the finned outer of described cold junction radiator is the open-position-side of deep bead assembly, and described open-position-side is wet air inlet.
8. the semiconductor refrigerating condenser based on heat pipe heat radiation according to claim 7, is characterized in that: described spacing block is aluminium alloy spacing block.
9. the semiconductor refrigerating condenser based on heat pipe heat radiation according to claim 8, is characterized in that: the below of described condenser body is provided with water spilage tray.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521023952.1U CN205227943U (en) | 2015-12-11 | 2015-12-11 | Semiconductor refrigeration condenser based on heat pipe cooling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521023952.1U CN205227943U (en) | 2015-12-11 | 2015-12-11 | Semiconductor refrigeration condenser based on heat pipe cooling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205227943U true CN205227943U (en) | 2016-05-11 |
Family
ID=55903000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521023952.1U Active CN205227943U (en) | 2015-12-11 | 2015-12-11 | Semiconductor refrigeration condenser based on heat pipe cooling |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205227943U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106123158A (en) * | 2016-08-15 | 2016-11-16 | 浙江普林艾尔电器工业有限公司 | A kind of semiconductor demoistener of heat absorbing fins group band thermal protection structure |
| CN107796140A (en) * | 2016-08-31 | 2018-03-13 | 青岛海尔智能技术研发有限公司 | Hot junction heat-exchanger rig and semiconductor refrigerating equipment for semiconductor refrigerating equipment |
| CN108376025A (en) * | 2018-05-07 | 2018-08-07 | 上海海洋大学 | A kind of enhanced heat exchange type computer radiator |
-
2015
- 2015-12-11 CN CN201521023952.1U patent/CN205227943U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106123158A (en) * | 2016-08-15 | 2016-11-16 | 浙江普林艾尔电器工业有限公司 | A kind of semiconductor demoistener of heat absorbing fins group band thermal protection structure |
| CN107796140A (en) * | 2016-08-31 | 2018-03-13 | 青岛海尔智能技术研发有限公司 | Hot junction heat-exchanger rig and semiconductor refrigerating equipment for semiconductor refrigerating equipment |
| CN108376025A (en) * | 2018-05-07 | 2018-08-07 | 上海海洋大学 | A kind of enhanced heat exchange type computer radiator |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203810612U (en) | Small semiconductor air conditioner | |
| CN204103251U (en) | A kind of for the dehydrating unit in electric distribution box | |
| CN205227943U (en) | Semiconductor refrigeration condenser based on heat pipe cooling | |
| CN104034145A (en) | Dehumidifying device of heat pump | |
| WO2018145504A1 (en) | Finned evaporator and refrigeration equipment | |
| CN205482030U (en) | Refrigerator capable of achieving energy-saving heat dissipation by utilizing residual cold circulation | |
| CN204043280U (en) | Defrosting system of refrigerator | |
| CN104976857B (en) | The moisture retention structure and refrigerator of a kind of wind cooling refrigerator for single system refrigeration modes | |
| CN210303099U (en) | Semiconductor air drying device | |
| CN205279781U (en) | Condenser | |
| CN209085365U (en) | Anti-freeze closed cooling tower | |
| CN208209467U (en) | A kind of Outdoor Terminal Case Intelligent dehumidifying device | |
| CN104595991A (en) | Condensate auxiliary heat dissipation device of air conditioner | |
| CN206211344U (en) | For the dehydrating unit and power distribution cabinet of power distribution cabinet | |
| CN206176876U (en) | Heat dissipation and ventilation device is forced to cooling operation platform unit | |
| CN206094652U (en) | Compound heat exchanger | |
| CN204790831U (en) | Automatic radiating complete machine cabinet heat pipe exchanger backplate | |
| CN205448398U (en) | Refrigeration system for chemiluminiscence test | |
| CN203940718U (en) | Heat pump dehydrating unit | |
| CN106681456A (en) | Aluminum radiator for CPU cooling | |
| CN208226308U (en) | The air channel structure of electric cabinet dehumidification device | |
| CN206875670U (en) | A kind of intelligent heat dissipation interchanger | |
| TWM522328U (en) | Refrigerating device | |
| CN101772230B (en) | Heating control cabinet of high-frequency hot roll | |
| CN209472605U (en) | A kind of heat dissipation type microwave power amplifier |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |