CN210303099U

CN210303099U - Semiconductor air drying device

Info

Publication number: CN210303099U
Application number: CN201921139273.9U
Authority: CN
Inventors: 陈华烈
Original assignee: Yunnan Aneng Electrical Equipment Co Ltd
Current assignee: Yunnan Aneng Electrical Equipment Co Ltd
Priority date: 2019-07-19
Filing date: 2019-07-19
Publication date: 2020-04-14
Anticipated expiration: 2029-07-19

Abstract

The utility model relates to an air drying technical field just discloses a semiconductor air drying device, including the drying cabinet, the inside fixed mounting of drying cabinet has the heat insulating board, the inside of drying cabinet is separated for dry chamber and exothermic chamber through the heat insulating board, the inside fixed mounting in dry chamber has the semiconductor refrigeration piece, the top fixedly connected with heat-conducting plate of semiconductor refrigeration piece, the bottom of semiconductor refrigeration piece runs through the heat insulating board and extends to the bottom of exothermic chamber, the vent has all been seted up, two at the top of the drying cabinet left and right sides the vent all is linked together with the dry chamber, the equal fixed mounting in both sides has the ventilation fan about the dry chamber is inside, two the ventilation fan is located two one sides that the vent is relative respectively. The utility model discloses a can liquefy to the vapor in the air and collect, reduce humidity, carry out the drying to the air, convenient to use, job stabilization, drying efficiency is high, satisfies user's user demand.

Description

Semiconductor air drying device

Technical Field

The utility model relates to an air drying technical field specifically is a semiconductor air drying device.

Background

Air drying is to remove moisture in air, and has two major forms: the adsorption type compressed air dryer utilizes the principle of pressure swing adsorption, and when wet air passes through an adsorbent, moisture is adsorbed to obtain dry air; the freezing type compressed air dryer separates out moisture in wet air from air after condensation by utilizing the principle of cooling the air and reducing the temperature of the air to obtain dry air.

However, in the air drying device manufactured by using the semiconductor refrigerating sheet in the market at present, the use of the semiconductor refrigerating sheet is too simple when the air drying device is used, so that the drying effect of the air drying device is poor, the efficiency is low, the air drying requirement of a user cannot be met frequently, and the use of the user is influenced, so that the semiconductor air drying device is provided to solve the problems.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a not enough to prior art, the utility model provides a semiconductor air drying device possesses advantages such as drying effect is better, has solved the air drying device who utilizes semiconductor refrigeration piece to make, and is too simple to semiconductor refrigeration piece's use when using, and the drying effect that leads to air drying device is poor, and is inefficient, often can't reach user's air drying demand, influences user's problem of use.

(II) technical scheme

For realizing the better purpose of above-mentioned drying effect, the utility model provides a following technical scheme: a semiconductor air drying device comprises a drying box, wherein a heat insulation plate is fixedly arranged inside the drying box, the inside of the drying box is divided into a drying cavity and a heat release cavity through the heat insulation plate, semiconductor refrigeration sheets are fixedly arranged inside the drying cavity, a heat conduction plate is fixedly connected to the tops of the semiconductor refrigeration sheets, the bottoms of the semiconductor refrigeration sheets penetrate through the heat insulation plate and extend to the bottoms of the heat release cavity, ventilation openings are formed in the tops of the left side and the right side of the drying box and are communicated with the drying cavity, ventilation fans are fixedly arranged on the left side and the right side of the inside of the drying cavity and are respectively positioned on one side opposite to the two ventilation openings, cooling fins are fixedly connected to the bottoms of the semiconductor refrigeration sheets, heat dissipation devices are contacted with the bottoms of the cooling fins, and water outlets which are arranged at equal intervals are formed in the back, the back of the drying box is fixedly connected with a first water storage tank, and the drying cavity is communicated with the first water storage tank through a water outlet.

Preferably, the top of the heat conducting plate is wavy, and the water outlets correspond to the sunken parts of the heat conducting plate one to one.

Preferably, the heat dissipation device comprises a second water storage tank, the second water storage tank is fixedly installed on the inner top wall of the heat dissipation chamber, a water pump is fixedly installed on the inner top wall of the heat dissipation chamber, a water guide pipe is arranged between the water pump and the second water storage tank, the water pump is communicated with the second water storage tank through the water guide pipe, a heat exchange pipe is fixedly connected to the left side of the water pump, and the middle of the heat exchange pipe is in winding connection with the cooling fins and is in contact with the cooling fins.

Preferably, a water outlet is arranged at the right side of the first water storage tank.

Preferably, the inside of the heat release cavity is fixedly connected with an isolation plate, the top of the isolation plate is fixedly connected with the heat insulation plate, and the isolation plate is located between the semiconductor refrigeration piece and the second water storage tank.

Preferably, the bottoms of the front surface and the back surface of the drying box are respectively provided with a heat dissipation port which is uniformly distributed, and the heat dissipation ports are communicated with the inside of the heat release cavity.

(III) advantageous effects

Compared with the prior art, the utility model provides a semiconductor air drying device possesses following beneficial effect:

1. the semiconductor air drying device pumps external air into the drying box through the ventilation fan on the left side, then the semiconductor refrigeration sheet is electrified, the part of the semiconductor refrigeration sheet positioned at the top of the heat insulation plate is refrigerated, the part positioned at the bottom of the heat insulation plate is released heat, then the semiconductor refrigeration sheet is isolated through the heat insulation plate and is divided into the drying cavity and the heat release cavity, the mutual influence of the temperatures in the drying cavity and the heat release cavity is avoided, the heat conduction plate enables the water vapor in the air to be contacted with the heat conduction plate, liquefied and attached to the heat conduction plate to be gathered, then the water vapor flows into the first water storage tank through the water outlet to be stored, the ventilation fan on the right side discharges the dried air in the drying box, then the heat release part at the bottom of the semiconductor refrigeration sheet is subjected to heat dissipation treatment through the radiating fins and the heat dissipation device, the working stability of the semiconductor refrigeration sheet is, reduce humidity, carry out the drying to the air, convenient to use, job stabilization, drying efficiency is high, satisfies user's user demand.

2. This semiconductor air drying device through the wave heat-conducting plate, increases and the area of contact between the air to promote drying device's air drying efficiency, and the depressed part that forms on the wave heat-conducting plate, be convenient for collect the liquefied water, then the inside of leading-in first storage water tank through the delivery port at the back.

3. This semiconductor air drying device takes the inside recirculated cooling water of second storage water tank out through water pump circular telegram work, then lets recirculated cooling water flow in the heat-exchange tube, because heat-exchange tube and fin routing and with the fin contact to let recirculated cooling water take away the heat on the fin and cool off, promoted the cooling effect of the exothermic portion in semiconductor refrigeration piece bottom, avoid the semiconductor refrigeration piece overheated and cause the work unusual.

4. This semiconductor air drying device, through the left outlet of first storage water tank, be favorable to discharging the water that dry formed, retrieve, convenience of customers handles.

5. This semiconductor air drying device keeps apart semiconductor refrigeration piece and second storage water tank through the division board, prevents that the temperature of semiconductor refrigeration piece from influencing the inside recirculated cooling water cooling of second storage water tank.

6. This semiconductor air drying device through the thermovent, conveniently dispels the hot-air of heat release intracavity portion, improves the radiating effect.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic diagram of the right-side view structure of the present invention;

fig. 3 is an enlarged schematic view of a portion a in fig. 1 according to the present invention.

In the figure: 1. a drying oven; 2. a heat insulation plate; 3. a drying chamber; 4. a heat release cavity; 5. a semiconductor refrigeration sheet; 6. a heat conducting plate; 7. a vent; 8. a ventilating fan; 9. a heat sink; 10. a heat sink; 101. a second water storage tank; 102. a water pump; 103. a heat exchange pipe; 11. a water outlet; 12. a first water storage tank; 13. a water outlet; 14. a separator plate; 15. and a heat dissipation port.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, a semiconductor air drying device comprises a drying box 1, a heat insulation board 2 is fixedly installed inside the drying box 1, the inside of the drying box 1 is divided into a drying cavity 3 and a heat release cavity 4 by the heat insulation board 2, a semiconductor refrigeration sheet 5 is fixedly installed inside the drying cavity 3, a heat conduction plate 6 is fixedly connected to the top of the semiconductor refrigeration sheet 5, the bottom of the semiconductor refrigeration sheet 5 penetrates through the heat insulation board 2 and extends to the bottom of the heat release cavity 4, vents 7 are respectively arranged on the top of the left side and the right side of the drying box 1, the two vents 7 are both communicated with the drying cavity 3, ventilating fans 8 are fixedly installed on the left side and the right side of the inside of the drying cavity 3, the type of the ventilating fan 8 is KA1238HA2, the two ventilating fans 8 are respectively located on the opposite sides of the two vents 7, a heat dissipation sheet 9 is fixedly connected to the bottom of the, the back of the drying box 1 is provided with water outlets 11 which are arranged equidistantly, the back of the drying box 1 is fixedly connected with a first water storage tank 12, the drying cavity 3 is communicated with the first water storage tank 12 through the water outlets 11, outside air is pumped into the drying box 1 through a left ventilating fan 8, then the semiconductor refrigerating sheet 5 is electrified, the part of the semiconductor refrigerating sheet 5 positioned at the top of the heat insulation plate 2 is refrigerated, the part positioned at the bottom of the heat insulation plate 2 is released heat, then the part is isolated by the heat insulation plate 2 and is divided into the drying cavity 3 and the heat release cavity 4, the mutual influence of the temperature inside the drying cavity 3 and the heat release cavity 4 is avoided, the heat conduction plate 6 is low because the refrigerating temperature of the semiconductor refrigerating sheet 5, water vapor inside the air is in contact with the heat conduction plate 6, liquefied and attached to the heat conduction plate 6 to be gathered, then flows into the first water storage tank 12 through the water outlets, then carry out heat treatment through the exothermic part of fin 9 and heat abstractor 10 to semiconductor refrigeration piece 5 bottom, improve semiconductor refrigeration piece 5's job stabilization nature, the device can carry out the liquefaction to the vapor in the air and collect, reduces humidity, carries out the drying to the air, convenient to use, job stabilization, drying efficiency is high, satisfies user's user demand.

Further, the top of heat-conducting plate 6 is the wave, and delivery port 11 and the heat-conducting plate 6 depressed part one-to-one through wave heat-conducting plate 6, increase with the area of contact between the air to promote drying device's air drying efficiency, and the depressed part that forms on the wave heat-conducting plate 6, be convenient for collect the liquefied water, then the inside of leading-in first storage water tank 12 of delivery port 11 through the back.

Further, the heat dissipation device 10 comprises a second water storage tank 101, the second water storage tank 101 is fixedly installed on the inner top wall of the heat dissipation chamber 4, a water pump 102 is fixedly installed on the inner top wall of the heat dissipation chamber 4, the model of the water pump 102 is TL-B03H/2, a water guide pipe is arranged between the water pump 102 and the second water storage tank 101, the water pump 102 is communicated with the second water storage tank 101 through the water guide pipe, a heat exchange pipe 103 is fixedly connected to the left side of the water pump 102, the middle part of the heat exchange pipe 103 is in winding connection with the heat dissipation fin 9 and is in contact with the heat dissipation fin 9, circulating cooling water inside the second water storage tank 101 is pumped out through the power-on work of the water pump 102, then the circulating cooling water flows in the heat exchange pipe 103, because the heat exchange pipe 103 is in winding connection with the heat dissipation fin 9 and is in contact with the heat dissipation fin 9, the, the semiconductor refrigeration piece 5 is prevented from being overheated to cause abnormal work.

Furthermore, the water outlet 13 is arranged on the right side of the first water storage tank 12, and the water formed by drying is discharged and recovered through the water outlet 13 on the left side of the first water storage tank 12, so that the water is convenient for a user to treat.

Further, the inside fixedly connected with division board 14 of heat release chamber 4, the top and the heat insulating board 2 fixed connection of division board 14, division board 14 are located between semiconductor refrigeration piece 5 and second storage water tank 101, keep apart semiconductor refrigeration piece 5 and second storage water tank 101 through division board 14, prevent that the inside recirculated cooling water of second storage water tank 101 from cooling down is influenced to the temperature of semiconductor refrigeration piece 5.

Further, evenly distributed's thermovent 15 has all been seted up to the bottom at the front and the back of drying cabinet 1, and thermovent 15 is linked together with the inside in heat release chamber 4, through thermovent 15, conveniently dispels the hot-air in heat release chamber 4 inside, improves the radiating effect.

The working principle is as follows: the outside air is pumped into the drying box 1 through the ventilating fan 8 on the left side, then the semiconductor refrigerating sheet 5 is electrified, the part of the semiconductor refrigerating sheet 5 positioned at the top of the heat insulation plate 2 is refrigerated, the part positioned at the bottom of the heat insulation plate 2 is released heat, then the semiconductor refrigerating sheet is isolated by the heat insulation plate 2 and is divided into the drying cavity 3 and the heat release cavity 4, so that the mutual influence of the temperatures in the drying cavity 3 and the heat release cavity 4 is avoided, the heat conduction plate 6 increases the contact area with the air through the wavy heat conduction plate 6 due to the fact that the refrigerating temperature of the semiconductor refrigerating sheet 5 becomes low, thereby improving the air drying efficiency of the drying device, and the depression formed on the wavy heat conduction plate 6 is convenient for collecting liquefied water, then the liquefied water is guided into the first water storage tank 12 through the water outlet 11 on the back side, the ventilating fan 8 on the right side discharges the dried air in the drying box 1, and the circulating cooling, then let the recirculated cooling water flow in heat exchange tube 103, because heat exchange tube 103 with fin 9 wraparound and with fin 9 contact, thereby let the recirculated cooling water take away the heat on the fin 9 and cool off, the cooling effect of the heat release portion in semiconductor refrigeration piece 5 bottom has been promoted, avoid semiconductor refrigeration piece 5 overheated and cause the work anomaly, improve semiconductor refrigeration piece 5's job stabilization nature, the device can carry out the liquefaction to the vapor in the air and collect, reduce humidity, carry out the drying to the air, high durability and convenient use, stable operation, high drying efficiency, satisfy user's user demand.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A semiconductor air drying device, includes drying cabinet (1), its characterized in that: the inside fixed mounting of drying cabinet (1) has heat insulating board (2), the inside of drying cabinet (1) is separated for dry chamber (3) and heat release chamber (4) through heat insulating board (2), the inside fixed mounting of dry chamber (3) has semiconductor refrigeration piece (5), the top fixedly connected with heat-conducting plate (6) of semiconductor refrigeration piece (5), the bottom of semiconductor refrigeration piece (5) runs through heat insulating board (2) and extends to the bottom of heat release chamber (4), vent (7) have all been seted up at the top of the drying cabinet (1) left and right sides, two vent (7) all are linked together with dry chamber (3), the equal fixed mounting in the left and right sides of dry chamber (3) inside has ventilating fan (8), two ventilating fan (8) are located the relative one side of two vent (7) respectively, the bottom fixedly connected with fin (9) of semiconductor refrigeration piece (5), the bottom of the radiating fin (9) is contacted with a radiating device (10), the back of the drying box (1) is provided with water outlets (11) which are arranged at equal intervals, the back of the drying box (1) is fixedly connected with a first water storage tank (12), and the drying cavity (3) is communicated with the first water storage tank (12) through the water outlets (11).

2. A semiconductor air drying device as claimed in claim 1, wherein: the top of the heat conducting plate (6) is wavy, and the water outlets (11) correspond to the concave parts of the heat conducting plate (6) one by one.

3. A semiconductor air drying device as claimed in claim 1, wherein: heat abstractor (10) includes second storage water tank (101), second storage water tank (101) fixed mounting is on the interior roof of heat release chamber (4), fixed mounting has water pump (102) on the interior roof of heat release chamber (4), be provided with the aqueduct between water pump (102) and second storage water tank (101), be linked together through the aqueduct between water pump (102) and second storage water tank (101), the left side fixedly connected with heat exchange tube (103) of water pump (102), the middle part and fin (9) the wraparound of heat exchange tube (103) connect and with fin (9) contact.

4. A semiconductor air drying device as claimed in claim 1, wherein: a water outlet (13) is arranged on the right side of the first water storage tank (12).

5. A semiconductor air drying device as claimed in claim 1, wherein: the inside fixedly connected with division board (14) of exothermic chamber (4), the top and heat insulating board (2) fixed connection of division board (14), division board (14) are located between semiconductor refrigeration piece (5) and second storage water tank (101).

6. A semiconductor air drying device as claimed in claim 1, wherein: evenly distributed heat dissipation openings (15) are formed in the bottoms of the front face and the back face of the drying box (1), and the heat dissipation openings (15) are communicated with the inside of the heat release cavity (4).