CN106091472B - A kind of semiconductor depth dehumidifier - Google Patents
A kind of semiconductor depth dehumidifier Download PDFInfo
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- CN106091472B CN106091472B CN201610675560.6A CN201610675560A CN106091472B CN 106091472 B CN106091472 B CN 106091472B CN 201610675560 A CN201610675560 A CN 201610675560A CN 106091472 B CN106091472 B CN 106091472B
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- air
- air inlet
- radiating fin
- heat absorbing
- group
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47B—TABLES; DESKS; OFFICE FURNITURE; CABINETS; DRAWERS; GENERAL DETAILS OF FURNITURE
- A47B61/00—Wardrobes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
- F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
- F24F3/14—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
- H02B1/26—Casings; Parts thereof or accessories therefor
- H02B1/28—Casings; Parts thereof or accessories therefor dustproof, splashproof, drip-proof, waterproof or flameproof
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
- F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
- F24F3/14—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification
- F24F2003/144—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification by dehumidification only
Abstract
The present invention provides a kind of semiconductor depth dehumidifier, including shell, semiconductor chilling plate is equipped in shell, the side of semiconductor chilling plate is equipped with heat absorbing fins group, and the other side is equipped with radiating fin group；Shell is equipped with the first air inlet, the second air inlet and air outlet, the outer humid air of machine enters in shell from the first air inlet and the second air inlet, radiating fin group is flowed to again after first flowing through heat absorbing fins group by the humid air that the first air inlet enters, and humid air flows directly into radiating fin group outside the machine entered by the second air inlet；Shell is discharged by air outlet in air after flowing through radiating fin group；Intake of the intake of first air inlet less than the second air inlet.The present invention reduces accounting of the sensible heat for the air for passing through heat absorbing fins group in cooling piece refrigerating capacity substantially, accurately, accounting of the latent heat of phase change of water vapor in air in semiconductor chilling plate refrigerating capacity is effectively improved, is accurately improved, and guarantees that heat absorbing fins group filters out moisture under the conditions of low relative humidity from air.
Description
Technical field
The present invention relates to dehumidification device design field more particularly to a kind of semiconductor depth dehumidifiers.
Background technique
Semiconductor refrigerating technology, also known as thermoelectric cooling technology, from the 1950s, fast development is got up.Semiconductor system
Cold, it utilizes the P-N junction of semiconductor material composition, and logical upper direct current can produce refrigeration effect, can just make cold end within several seconds
Frosting；It does not have the mechanical structure of the complexity such as compressor, does not need refrigerant more.
Although the ratio of the Energy Efficiency Ratio of semiconductor refrigerating, i.e. refrigerating capacity and input electric work, relatively low, only using fluorine benefit
1/10 or so of the vapour compression refrigeration system of high refrigerant, but semiconductor refrigerating technology have the characteristics that it is incomparable with
Advantage: 1. rapid without mechanical movement, without refrigerant, refrigeration；2. can with modularization any combination, refrigerating capacity can from milliwatt to
Multikilowatt, the temperature difference of freezing is easy to use up to 30---150 DEG C, with extensive；3. can continuously adjust, change the confession of cooling piece
Piezoelectric voltage, refrigerating capacity can be with consecutive variations；4. it is light-weight, it is small in size, it can be made miniature, submicron, small semiconductor refrigeration
Device.
Semiconductor refrigerating technology is in short space, such as industrial electro gas holder, family's wardrobe cabinet etc., not big wet negative
Under conditions of lotus humid air continuously generates, solving interior mould proof, the raising electric insulation grade that dehumidifies of cabinet prevents breakdown aspect, has
Unique advantage.
It using semiconductor refrigerating, dehumidifies, succeeded and puts it over.How dehumidifying depth is further increased,
By relative humidity be reduced to 50% hereinafter, improve air drying property, prevent mould generate and development, become the urgent of market and be essential
It asks.
Mouldy is a kind of common natural phenomena, be may alternatively appear in food and wood furniture.The dampness such as wood furniture, clothing
After a long time, it is easy to cause mouldy.If moisture activity value is low, mould cannot absorb moisture and be difficult to develop；Water after being moistened
Activity value is divided to increase, mould is absorbed by moisture decomposition and the carbohydrate in edible food, fiber, carbons nutrient in turn, fast fast-growing
It is long even to overgrow.
The temperature and humidity conditions that mould occurs and inhibits:
| Temperature | Relative humidity | Vapour pressure | Go mouldy occurrence degree | |
| 1 | Lower than 23 DEG C | Less than 50% | Less than 17hpa | It is not susceptible to go mouldy |
| 2 | 23 DEG C~26 DEG C | 50%~60% | 17hpa~22hpa | It is difficult to go mouldy |
| 3 | 26 DEG C~29 DEG C | 60%~70% | 22hpa~27.5hpa | It can go mouldy |
| 4 | 29 DEG C~32 DEG C | 70%~85% | 27.5hpa~31hpa | It is easier to go mouldy |
| 5 | Higher than 32 DEG C | Greater than 85% | Higher than 31hpa | Easily go mouldy |
As can be seen from the above table, relative humidity is reduced to 50% hereinafter, mildew is just not susceptible to；And it will be entire empty
Between relative humidity be reduced to 50%, dehumidifier must have lower than filtering in 50% (such as 40%) relative humidities below
Except the ability of moisture in air.
Semiconductor demoistener currently on the market, as shown in fig. 1, semiconductor chilling plate 17 is passed through direct current when operation, makes
Air is pressed to and takes away heat with the radiating fin 12 being in close contact on the left of cooling piece by cold right side heat absorption, left side heat release, blower 11
Amount is external from the discharge dehumidifier of air outlet 18；Meanwhile blower 11 causes negative pressure intracavitary, and the air of air inlet 15 is attracted to flow into；
The air flowed into from air inlet 15, sub-fraction flow through the heat absorbing fins 16 with close contact on the right side of cooling piece, this sub-fraction
Air is converged after cool-down dehumidification with most of bulk air for not flowing through heat absorbing fins, then flows to radiating fin.It is this partly to lead
The ventilation quantity of the heat absorbing fins of body dehumidifier has uncertainty, any one extraneous disturbance can cause the change of ventilation quantity
Change, cannot accurate air distribution, can only dehumidify under the conditions of high humility such as 80%RH, and cannot relatively low humidity for example
It dehumidifies under the conditions of 40%RH, the depth of semiconductor refrigerating technology is caused to dehumidify " mould proof " function the problem of can not achieve.
Summary of the invention
To solve the above-mentioned problems, the present invention provides a kind of semiconductor depth dehumidifier, including shell, in the shell
It is provided with semiconductor chilling plate, the side of the semiconductor chilling plate is equipped with heat absorbing fins group, and the other side is equipped with radiating fin group；
The first air inlet, the second air inlet and air outlet are provided on the shell, the outer humid air of dehumidifier is from described respectively from first
Air inlet and the second air inlet enter in the shell, and first flow through the heat absorption fins by the humid air that the first air inlet enters
The radiating fin group is flowed to after piece group again, the radiating fin group is flowed directly by the humid air that the second air inlet enters；Stream
The shell is discharged via the air outlet in air after radiating fin group；Wherein, the intake of first air inlet
Less than the intake of the second air inlet.
Preferably, be provided with first on first air inlet with aerofoil, described first with being evenly equipped with multiple the on aerofoil
One through-hole；
Second is provided on second air inlet with aerofoil, described second with being evenly equipped with multiple second through-holes on aerofoil.
Preferably, the diameter or equivalent diameter of first through hole≤second through-hole diameter or equivalent diameter, described first is logical
The quantity in hole≤second through-hole quantity
Preferably, the first through hole and/or second through-hole are, the first through hole, second through-hole are circle
Shape, ellipse, rectangle, diamond shape, triangle or other polygons.
Preferably, being provided with drip tray below the heat absorbing fins group.
Preferably, the drip tray is connected with a water tank.
Preferably, blower is provided between the outlet air end and the air outlet of the radiating fin group, for pushing shell
The flowing of interior air.
The present invention due to using the technology described above, is allowed to compared with prior art, have the following advantages that and actively imitate
Fruit:
A kind of semiconductor depth dehumidifier provided by the invention, by the way that air inlet is divided into two air inlets, and to two into
The air quantity in air port is accurately distributed, is controlled, so that the air quantity for passing through heat absorbing fins group is less than the wind for passing through radiating fin group
Amount, so that accounting of the sensible heat for the air for passing through heat absorbing fins group in semiconductor chilling plate refrigerating capacity be made to be greatly reduced, accurately
It reduces, accounting of the latent heat of phase change of water vapor in air in cooling piece refrigerating capacity is effectively improved, accurately improved, and guarantees half
The heat absorbing fins of conductor cooling piece filter out moisture under the conditions of low relative humidity (such as 40%) from air, thus by semiconductor
Relative humidity in space locating for dehumidifier is reduced to 50% hereinafter, effectively to press down mycostatic generation.
Detailed description of the invention
In conjunction with attached drawing, by hereafter state detailed description, can be more clearly understood that above-mentioned and other feature of the invention and
Advantage, in which:
Fig. 1 is the structural schematic diagram of semiconductor demoistener in the prior art；
Fig. 2 is the structural schematic diagram of semiconductor depth dehumidifier provided by the invention；
Fig. 3 is the structural schematic diagram of heat absorbing fins group, radiating fin group in the present invention；
Fig. 4 is the first structural schematic diagram with scoreboard that through-hole is circular hole in the present invention；
Fig. 5 is the second structural schematic diagram with scoreboard that through-hole is circular hole in the present invention；
Fig. 6 is the first structural schematic diagram with scoreboard that through-hole is rectangular opening in the present invention；
Fig. 7 is the second structural schematic diagram with scoreboard that through-hole is rectangular opening in the present invention.
Specific embodiment
Referring to the attached drawing for showing the embodiment of the present invention, the present invention is described in more detail.However, the present invention can be with
Many different forms are realized, and should not be construed as being limited by the embodiment herein proposed.On the contrary, proposing that these embodiments are
In order to reach abundant and complete disclosure, and those skilled in the art is made to understand the scope of the present invention completely.These are attached
In figure, for clarity, the size and relative size in layer and region may be exaggerated.
Dehumidification operation is carried out using semiconductor refrigerating, it is crucial, it is the radiating fin group and heat absorption of semiconductor chilling plate
The Boiler pressure control of fins set is how to solve " radiating fin group needs Wind Volume and heat absorbing fins group to need small air quantity " in this way
Conflict.
Current semiconductor demoistener cooling piece, due to the physical characteristic of semiconductor P-N junction itself, refrigerating efficiency compared with
It is low, general only 0.3 or so；The refrigerating capacity of usual cooling piece is all smaller, when with " w " being unit, refrigerating capacity usually only 10
The 1 power order of magnitude or the 2 power orders of magnitude.When semiconductor demoistener is run, if heat absorbing fins group air distribution is not accurate enough, pass through
The air mass flow of heat absorbing fins group is bigger than normal, and semiconductor chilling plate is not with regard to carrying out depth dehumidifying (by relative air humidity to air
Be reduced to 50% or less) ability；This is because air, which is only reduced under its dew-point temperature in temperature, can just filter out water
Point；And when pass through the air mass flow of heat absorbing fins group of semiconductor chilling plate it is bigger than normal when, the refrigerating capacity of semiconductor chilling plate is first
For the absorption of sensible heat more than dew-point temperature during air cooling-down, and absorbing the air sensible for being located at dew-point temperature or more
When semiconductor chilling plate refrigerating capacity it is usually just depleted, be saturated because being used further to reach at this time without refrigerating capacity more than needed or
For person close to the absorption for the water vapor in air condensation heat being saturated, water will be condensed into for water vapor in air by no longer existing ability.
The present invention provides a kind of semiconductor depth dehumidifiers, by the way that air inlet is divided into two air inlets, so that passing through
The air quantity of heat absorbing fins group is less than the air quantity for passing through radiating fin group, controls the small air quantity for passing through heat absorbing fins group accurately
System, so that accounting of the sensible heat for the air for passing through heat absorbing fins group in cooling piece refrigerating capacity is made to be greatly reduced, accurately reduce, it is empty
Accounting of the latent heat of phase change of water vapour in cooling piece refrigerating capacity is effectively improved, is accurately improved in gas, guarantees semiconductor system
Cold heat absorbing fins group filters out moisture under the conditions of low relative humidity (such as 40%) from air, thus by semi-conductor dehumidifying
Relative humidity in space locating for machine is reduced to 50% hereinafter, effectively to press down mycostatic generation.
Specifically, semiconductor depth dehumidifier provided by the invention includes a shell 10 referring to Fig. 2, set in shell 10
It is equipped with semiconductor chilling plate 3, the side of semiconductor chilling plate 3 is provided with heat absorbing fins group 7, and the other side is provided with radiating fin group
2；Be provided with the first air inlet, the second air inlet and air outlet 9 on shell 10, extraneous humid air from respectively from the first air inlet and
Second air inlet enters in shell 10, and flows to again after first flowing through heat absorbing fins group 7 by the humid air that the first air inlet enters
Radiating fin group 2 flows directly into radiating fin group 2 by the humid air that the second air inlet enters；From the first air inlet and second
The air of air inlet passes through after flowing through radiating fin group 2 together by the discharge shell 10 of air outlet 9；Wherein, the air inlet of the first air inlet
Measure the intake less than the second air inlet.
As shown in Figure 3, specifically base is arranged by a substrate and multiple parallel intervals in heat absorbing fins group 7 and radiating fin group 2
On plate fin composition, heat absorbing fins group 7, radiating fin group 2 substrate side be compressed on semiconductor chilling plate 3；When partly leading
After body cooling piece 3 is powered on, the heat absorption of heat absorbing fins group 7,2 heat release of radiating fin group, humid air stream are dropped through heat absorbing fins group 7
Temperature dehumidifying, becomes low temperature saturated air, then flows through radiating fin group 2 and takes away heat in radiating fin group 2.
First air inlet is communicated with the first air intake passage, and heat absorbing fins group 7 is located in the first air intake passage；Second air inlet
It is communicated with the second air intake passage, the first air intake passage and the second air intake passage are mutually indepedent, and in the air intake of radiating fin group 2
Converge；The outlet air end of radiating fin group 2 is connected to by an air-out passage with air outlet 9；That comes in from the first air intake passage is dropped
Temperature dehumidifying after air and from the second air intake passage enter air converge after stream flow to radiating fin group 2, take away radiating fin
Through shell is discharged from air outlet 9 by air-out passage after heat in group 2.
It is provided with first on first air inlet and matches aerofoil 8, second is provided on the second air inlet with aerofoil 4, the first air distribution
Plate 8 and second matches aerofoil 4 for realizing the accurate distribution of the intake to the first air inlet, the second air inlet, in the present embodiment
In first accurately control small flow air with aerofoil 8 and enter, second with aerofoil 4 accurately control relatively large air mass flow into
Enter.The present invention is by the ventilation quantity that the Boiler pressure control for flowing through heat absorbing fins group is less than radiating fin group, to make to pass through heat absorption fins
Accounting of the sensible heat of the air of piece group in semiconductor chilling plate refrigerating capacity is greatly reduced, accurately reduces, water vapor in air
Accounting of the latent heat of phase change in cooling piece refrigerating capacity is effectively improved, is accurately improved.
Further, first with being provided with multiple first through hole on aerofoil 8, and second with being provided with multiple second on aerofoil 4
Through-hole, wherein first through hole, the second through-hole can be circular hole as shown in figs. 4-5, can also be rectangle as shown in figs. 6-7
Hole；In other embodiments, first through hole, the second through-hole can also be ellipse, diamond shape, triangle or other polygons, herein
With no restriction.The present invention can be matched by control first through hole, the setting quantity of the second through-hole, size accurately to control first
Aerofoil 8 and second matches the intake of aerofoil 4, to accurately to control the ventilation quantity of heat absorbing fins group 7, radiating fin group 2；Such as
In the present embodiment, first through hole is identical with the size of the second through-hole, the setting by control first with first through hole on aerofoil 8
Setting number of the number less than second with the second through-hole on aerofoil 4, to accurately control the ventilation quantity of the first air inlet less than the
The intake of two air inlets, the ventilation quantity for accurately controlling heat absorbing fins group 7 are less than the ventilation quantity of radiating fin group 2.In another example the
The diameter or equivalent diameter of one through-hole≤second through-hole diameter or equivalent diameter, quantity≤second through-hole of first through hole
Quantity so that the ventilation quantity of heat absorbing fins group 7 be less than radiating fin group 2 ventilation quantity.
When first is orifice plate with aerofoil 4 with aerofoil 8 and second, i.e. first through hole and the second through-hole is circular hole
When, by the setting of diameter and quantity to circular hole on orifice plate, adjust the resistance that air flows through orifice plate, so that it may accurate to adjust
Heat absorbing fins group, the ventilation quantity of radiating fin group are saved, heat absorbing fins group ventilation quantity can be accurately adjusted and radiating fin group is divulged information
The ratio of amount；It can be thus achieved and " increase radiating fin group ventilation quantity to reduce the operating temperature of radiating fin group, improve semiconductor
The refrigerating efficiency of cooling piece ", but may be implemented " reduce heat absorbing fins group ventilation quantity make the sensible heat of air in cooling piece refrigerating capacity
Accounting be greatly reduced, accurately reduce, accounting of the latent heat of phase change of water vapor in air in cooling piece refrigerating capacity obtains effectively
It improves, reliable raising, so that the relative humidity of industry and household space where semiconductor demoistener is reduced to 50% or less.
When first is seam plate with aerofoil 4 with aerofoil 8 and second, i.e. first through hole and the second through-hole is rectangle
Eye is stitched, when, by stitching the Length x Width of eye and the setting of quantity on opposite joint plate, the resistance that air flows through seam plate is adjusted, just
It can be accurately adjusted the ventilation quantity of heat absorbing fins group, radiating fin group, can accurately adjust heat absorbing fins group ventilation quantity and heat dissipation
The ratio of fins set ventilation quantity；Can be thus achieved " increase radiating fin group ventilation quantity with reduce radiating fin group operating temperature,
Improve semiconductor chilling plate refrigerating efficiency ", and may be implemented " reduce heat absorbing fins group ventilation quantity so that the sensible heat of air is being freezed
Accounting in piece refrigerating capacity is greatly reduced, accurately reduces, latent heat of phase change the accounting in cooling piece refrigerating capacity of water vapor in air
Than effectively improving, reliably improving, so that the relative humidity of industry and household space where semiconductor demoistener be reduced
To 50% or less.
The lower section of heat absorbing fins group 7 is provided with drip tray 6, for collecting the condensed water formed in heat absorbing fins group 7；Water receiving
Disk 6 is also connected with a water tank 5, and the water in drip tray 6 is exhausted directly in water tank.
It is provided with blower 1 between the outlet air end and air outlet 9 of radiating fin group 2, that is, is arranged in air-out passage, blower 1
For pushing the flowing of air in shell.After blower 1 starts, so that enclosure interior forms negative pressure, so that outside air is suitable
It is entered in shell from the first air inlet, the second air inlet.
The working principle of semiconductor depth dehumidifier provided by the invention is described further below:
Firstly, semiconductor chilling plate 3 is powered after starting, the heat absorbing fins group 7 on right side absorbs heat, the radiating fin on right side
Group 2 distributes heat；Blower 1 starts, so that extraneous humid air enters in shell from the first air inlet, the second air inlet respectively；
The humid air entered from the first air inlet flows uniformly through heat absorbing fins group 7 after first with aerofoil 8, by cool-down dehumidification, becomes
Radiating fin group 2 is flowed to after low temperature saturated air；The humid air entered from the second air inlet uniform flow after second with aerofoil 8
To radiating fin group 2；Low temperature saturated air in the first air intake passage and the humid air one in the second air intake passage
It rises and flows to radiating fin group 2, and cool down to radiating fin group 2, be finally discharged again from air outlet 9, so circulation reaches dehumidifying
Effect.
With regard to specific embodiment, the present invention is described further below:
Embodiment 1
In the present embodiment, semiconductor chilling plate power is 50W, refrigerating capacity 15W, heating capacity 65W；Pass through control the
One with aerofoil, the second quantity, size with through-hole on aerofoil, so that heat absorbing fins group air quantity is 2m3/ h, radiating fin air quantity are
50m3/h；Therefore, heat absorbing end ventilation quantity only has the 1/25 of radiating end, and the temperature difference of disengaging radiating fin group is 3.9 DEG C；Take this hair
Bright first matches the air distribution technology of aerofoil with aerofoil, second, can accurately control the ventilation quantity of heat absorbing fins group and radiating fin group,
Guarantee the effect on moisture extraction under low-moisture conditions.
Under (1) 30 DEG C of 60%RH operating condition
21.392 DEG C, enthalpy 71.302kJ/kg, water capacity 16.039g/kg of the air inlet dew point of heat absorbing fins group, handle enthalpy difference
For 15/ (2*1.2/3.6)=22.5kJ/kg, air state point that treated is 17.304 DEG C, enthalpy 48.802kJ/kg, water capacity
Dry for 12.367g/kg, moisture removal is 2*1.2 (16.039-12.367)=8.8g/h
(2) under 30 DEG C of 40%RH operating conditions
15 DEG C, enthalpy 57.402kJ/kg, water capacity 10.601g/kg of the air inlet dew point of heat absorbing fins group, processing enthalpy difference is 15/
(2*1.2/3.6)=22.5kJ/kg, air state point that treated are 12.3 DEG C, enthalpy 34.902kJ/kg, and water capacity is
8.907g/kg is dry, and moisture removal is 2*1.2 (10.601-8.907)=4.06g/h
If not using dehumidifier provided by the invention, the ventilation quantity of heat absorbing fins group will readily exceed 1g/s, that is, be greater than
3m3/ h, then the 15W refrigerating capacity of semiconductor chilling plate will be flowed through the air of heat absorbing fins group sensible heat it is depleted, semiconductor
The condensation heat absorption that cooling piece does not have refrigerating capacity to be used further to water vapor in air, no condensed water filter out
In the present embodiment, it using semiconductor depth dehumidifier provided by the invention, uses and is accurately carried out with aerofoil
Air distribution, the accurate small air quantity 2m for realizing heat absorbing fins group3/ h filters out moisture 4.06g/ under 30 DEG C of 40%RH operating conditions from air
H, the relative humidity in space is lower than 50% where guaranteeing semiconductor demoistener, so as to effectively dehumidify and press down mycostatic hair
Raw and development.
Embodiment 2
In the present embodiment, the power of semiconductor chilling plate is 50W, refrigerating capacity 15W, heating capacity 65W；Pass through control
First with aerofoil, the second quantity, size with through-hole on aerofoil, so that heat absorbing fins group air quantity is 1m3/ h, radiating fin air quantity
For 50m3/h；Therefore, heat absorbing fins group ventilation quantity only has the 1/50 of radiating fin group ventilation quantity, and the temperature difference for passing in and out radiating fin is
3.9℃.It takes of the invention first to match the air distribution technology of aerofoil with aerofoil, second, can accurately control heat absorbing fins group and heat dissipation
The ventilation quantity of fins set guarantees the effect on moisture extraction under low-moisture conditions.
(1) under 30 DEG C of 80%RH operating conditions
26.14 DEG C, enthalpy 85.44kJ/kg, water capacity 21.57g/kg of the air inlet dew point of heat absorbing fins group, handling enthalpy difference is
15/ (1*1.2/3.6)=45kJ/kg, air state point that treated are 14.408 DEG C, enthalpy 40.44kJ/kg, and water capacity is
10.242g/kg is dry, and moisture removal is 1*1.2 (21.57-10.242)=13.6g/h；
(2) under 30 DEG C of 60%RH operating conditions
21.392 DEG C of the air inlet dew point of heat absorbing fins group, enthalpy 71.302kJ/kg water capacity 16.039g/kg, processing enthalpy difference are
15/ (1*1.2/3.6)=45kJ/kg, air state point that treated are 8.672 DEG C, enthalpy 26.302kJ/kg, and water capacity is
6.97g/kg is dry, and moisture removal is 1*1.2 (16.039-6.97)=10.9g/h
(3) under 30 DEG C of 40%RH operating conditions
15 DEG C, enthalpy 57.402kJ/kg, water capacity 10.601g/kg of the air inlet dew point of heat absorbing fins group, processing enthalpy difference is 15/
(1*1.2/3.6)=45kJ/kg, air state point that treated are 1.695 DEG C, enthalpy 12.402kJ/kg, and water capacity is
4.269g/kg is dry, and moisture removal is 1*1.2 (10.601-4.269)=7.6g/h
In the present embodiment, it using semiconductor depth dehumidifier provided by the invention, uses and is accurately carried out with aerofoil
Air distribution, the accurate small air quantity 1m for realizing heat absorbing fins group3/ h filters out 7.6g/h water under 30 DEG C of 40%RH operating conditions from air
Point, the relative humidity in space is lower than 50% where guaranteeing semiconductor demoistener, so as to effectively dehumidify and press down mycostatic
Occurrence and development.
Those skilled in the art should be understood that the present invention can be implemented without departing from this with many other concrete forms
The spirit or scope of invention.Although the embodiment of the present invention has been described, it should be understood that the present invention should not be limited to these embodiments,
Those skilled in the art can make variation within spirit and scope of the invention as defined by the following claims and repair
Change.
Claims (7)
1. a kind of semiconductor depth dehumidifier, which is characterized in that including shell, it is provided with semiconductor chilling plate in the shell,
The side of the semiconductor chilling plate is equipped with heat absorbing fins group, and the other side is equipped with radiating fin group；Is provided on the shell
One air inlet, the second air inlet and air outlet, the outer humid air of dehumidifier respectively from first air inlet and the second air inlet into
Enter into the shell, and flows to the heat dissipation again after first flowing through the heat absorbing fins group by the humid air that the first air inlet enters
Fins set flows directly into the radiating fin group by the humid air that the second air inlet enters；Flow the sky after radiating fin group
The shell is discharged via the air outlet in gas；Wherein, air inlet of the intake of first air inlet less than the second air inlet
Amount.
2. according to semiconductor depth dehumidifier described in claim 1, which is characterized in that be provided with first on first air inlet
With aerofoil, described first with being evenly equipped with multiple first through hole on aerofoil；
Second is provided on second air inlet with aerofoil, described second with being evenly equipped with multiple second through-holes on aerofoil.
3. according to semiconductor depth dehumidifier as claimed in claim 2, which is characterized in that the diameter or equivalent diameter of first through hole≤
The diameter or equivalent diameter of second through-hole, quantity≤second through-hole quantity of the first through hole.
4. according to semiconductor depth dehumidifier described in claim 2 or 3, which is characterized in that the first through hole, described second are led to
Hole is circle, ellipse, rectangle, diamond shape, triangle or other polygons.
5. according to semiconductor depth dehumidifier described in claim 1, which is characterized in that be provided with and connect below the heat absorbing fins group
Water pond.
6. according to the semiconductor depth dehumidifier described in claim 5, which is characterized in that the drip tray is connected with a water tank.
7. according to semiconductor depth dehumidifier described in claim 1, which is characterized in that the outlet air end of the radiating fin group and institute
It states and is provided with blower between air outlet, for pushing the flowing of air in shell.
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| CN108963785A (en) * | 2018-09-28 | 2018-12-07 | 国网河南省电力公司南阳供电公司 | A kind of anti-condensation intelligent detection and control system of switchgear |
| CN109938495A (en) * | 2018-11-07 | 2019-06-28 | 杨皓 | A kind of wardrobe with energy-saving micro dehumidifier |
| CN110094809A (en) * | 2019-04-26 | 2019-08-06 | 北京智米科技有限公司 | A kind of dehumidifier |
| CN112928620B (en) * | 2021-02-08 | 2022-09-27 | 国网浙江省电力有限公司杭州市临安区供电公司 | High-efficient dehumidification switch board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN2465111Y (en) * | 2000-10-25 | 2001-12-12 | 张征宇 | Semiconductor dehumidifier |
| KR100549801B1 (en) * | 2004-02-03 | 2006-02-08 | 주식회사 신안그린테크 | Apparatus for air circulation and dehumification |
| CN1837452A (en) * | 2005-08-12 | 2006-09-27 | 俞宝良 | Semi-conductor dehumidifying clothes-drier and clothes-drying method |
| CN203036810U (en) * | 2013-01-08 | 2013-07-03 | 福州博峰智能电器有限公司 | Air channel structure of semiconductor dehumidifier |
| CN206019057U (en) * | 2016-08-15 | 2017-03-15 | 浙江普林艾尔电器工业有限公司 | A kind of semiconductor depth dehumidifier |
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Inventor after: Xue Shishan Inventor after: Ye Hailin Inventor after: ZhuGe Shuiming Inventor after: Su Xiaosheng Inventor after: Zeng Jinhui Inventor after: Langrunze Inventor before: Xue Shishan Inventor before: Ye Hailin Inventor before: ZhuGe Shuiming Inventor before: Geng Shibin Inventor before: Han Xu Inventor before: Su Xiaosheng Inventor before: Zeng Jinhui Inventor before: Yuan Li Inventor before: Langrunze |
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Denomination of invention: A semiconductor deep dehumidifier Effective date of registration: 20220628 Granted publication date: 20190301 Pledgee: Zhejiang Tailong Commercial Bank Co.,Ltd. Hangzhou Jiande sub branch Pledgor: HANGZHOU PREAIR ELECTRICAL APPLIANCE INDUSTRY CO.,LTD. Registration number: Y2022330001123 |
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